Entries |
Document | Title | Date |
20080245846 | HEAT CYCLE-ABLE CONNECTION - A method of creating an electrical connection involves providing a pair of contacts each on one of two different chips, the pair of contacts defining a volume therebetween, the volume containing at least two compositions each having melting points, the compositions having been selected such that heating to a first temperature will cause a change in at least one of the at least two compositions such that the change will result in a new composition having a new composition melting point of a second temperature, greater than the first temperature and the melting point of at least a first of the at least two compositions, and heating the pair of contacts and the at least two compositions to the first temperature. | 10-09-2008 |
20080302860 | AIR BEARING GAP CONTROL FOR INJECTION MOLDED SOLDER HEADS - An air bearing gap control arrangement for injection molded solder filler heads. Also provided is a method of providing for a gap control for injection molded solder filler heads utilizing an air bearing arrangement. Provided is a C-ring seal, at the lower or dispensing region of the solder filler head structure, wherein the C-shape is open at the leading edge thereof. Hereby, a prevalent leading edge gap is tightly controlled by means of pressurized air in order to form an air bearing. Downstream of this leading edge is the molten solder, which is contained within a very narrow gap height between the solder filler head and the mold. As the solder fills the pits or recesses which are formed in the mold surface, air will rush out or be displaced from the pits towards the air bearing and is then expelled, while the deposited solder remains in place. | 12-11-2008 |
20090008431 | Solderable EMI Gasket and Grounding Pad - Apparatus, which is useful as both a conductive gasket and a grounding pad, which has a compressible elastomeric substrate having at least one side surface and two ends, a conductive elastomeric layer adjacent to all of the side surfaces of the compressible substrate, and a metal layer adjacent to the conductive layer. | 01-08-2009 |
20090014502 | METHOD AND APPARATUS FOR PLACING CONDUCTIVE BALLS - An improved placing method and placing apparatus are provided for placing conductive balls in a predetermined pattern onto a base unit. In the placing method for placing balls having conductivity in a predetermined pattern onto one surface of the base unit, an arrangement member has one surface, another surface opposite to the one surface of the arrangement member and positioning openings, wherein the positioning openings are arranged corresponding to the pattern such that the openings are through from the one surface to the another surfaces of the arrangement member so that the balls are inserted therein. The another surface of the arrangement member is positioned opposite to the one surface of the base unit. The arrangement member has two or more line members of which the core axes are substantially aligned. The transfer device is arranged in a manner that the line members are substantially in a horizontal position to contact with the balls supplied to one surface of the arrangement member, and then the transfer device is horizontally moved with respect to the one surface of the arrangement member. Then, the balls are placed on the one surface of the base unit through the positioning openings. | 01-15-2009 |
20090050677 | METHOD OF WELDING ELECTRONIC COMPONENTS ON PCBS - An exemplary method of welding electronic components on PCBs is disclosed. Firstly, a metal tray including a number of supporting areas is provided. At least one through hole is formed in each of the supporting areas. Secondly, solder pastes are applied onto welding pads of PCBs. Thirdly, electronic components are mounted on the welding pads. Fourthly, PCBs are placed on the metal tray in a manner that each printed circuit board is placed in a corresponding supporting area and the welding pads being above the through hole. Finally, the solder pastes are heated to weld the electronic components on the printed circuit board. By doing so, the heat can pass through the through holes in each supporting area directly and fully melt the solder paste. As a result, welding defects can be reduced. | 02-26-2009 |
20090120998 | HEATING AND PRESSURIZING APPARATUS FOR USE IN MOUNTING ELECTRONIC COMPONENTS, AND APPARATUS AND METHOD FOR MOUNTING ELECTRONIC COMPONENTS - A heating and pressurizing apparatus ( | 05-14-2009 |
20090134204 | Soldering Method and Semiconductor Module Manufacturing Method - A soldering method for soldering a semiconductor element to each of bonding portions defined at a plurality of locations on a circuit board is disclosed. The soldering method includes laying out the bonding portions in a non-linear manner in at least three locations on the circuit board, placing the semiconductor elements on the bonding portions with solder in between, placing a weight on the at least three semiconductor elements, which are laid out in a non-linear manner, so that the weight extends over the semiconductor elements, and soldering the semiconductor elements to the bonding portions by melting the solder while pressurizing the semiconductor elements with the weight. This reduces variations in thickness of the solder at the plurality of bonding portions when soldering the plurality of semiconductor elements to the circuit board. | 05-28-2009 |
20090152329 | Method and apparatus for mounting at least two types of electronic components - Provided is a method and apparatus for mounting a plurality of electronic components. The method comprises mounting a first electronic component on a substrate; forming a mask on the substrate to expose the first electronic component and a region of the substrate on which a solder paste is to be applied; forming a guide on a portion of the mask disposed around the first electronic component; applying the solder paste onto the substrate by using a squeezer contacting a portion of the mask disposed around the region of the substrate on which the solder paste is to be applied; removing the guide and the mask; and mounting a second electronic component on the solder paste. | 06-18-2009 |
20090166396 | MICROBALL ATTACHMENT USING SELF-ASSEMBLY FOR SUBSTRATE BUMPING - Electronic devices and methods for fabricating electronic devices are described. One method includes providing a substrate with a plurality of bonding pads thereon, and providing a plurality of solder microballs, the microballs including a coating thereon. The method also includes flowing the solder microballs onto the substrate and positioning the solder microballs on the bonding pads. The method also includes heating the solder microballs to reflow and form a joint between the solder microballs and the bonding pads. Other embodiments are described and claimed. | 07-02-2009 |
20090200362 | METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGE - In a lead-free solder, a semiconductor package and a method of manufacturing the semiconductor package, the lead-free solder includes about 3.5 percent by weight to about 6 percent by weight of silver, about 0.05 percent by weight to about 0.5 percent by weight of copper and a remainder of tin. The lead-free solder is employed in the semiconductor package. The lead-free solder has high impact resistance and high heat resistance to reduce failures of the semiconductor package. | 08-13-2009 |
20100116869 | Electrical Microfilament to Circuit Interface - Devices and methods for electrical interconnection for microelectronic circuits are disclosed. One method of electrical interconnection includes forming a bundle of microfilaments, wherein at least two of the microfilaments include electrically conductive portions extending along their lengths. The method can also include bonding the microfilaments to corresponding bond pads of a microelectronic circuit substrate to form electrical connections between the electrically conductive portions and the corresponding bond pads. A microelectronic circuit can include a bundle of microfilaments bonded to corresponding bond pads to make electrical connection between corresponding bonds pads and electrically-conductive portions of the microfilaments. | 05-13-2010 |
20100155456 | METHOD AND PROCESS FOR REDUCING UNDERCOOLING IN A LEAD-FREE TIN-RICH SOLDER ALLOY - Briefly, a novel material process is disclosed wherein one or more nucleation modifiers are added, in trace amounts, to a lead-free tin-rich solder alloy to produce a solder composition with reduce or suppressed undercooling temperature characteristics. The modifier being a substance which facilitates the reduction of extreme anisotropic properties associated with body-centered-tetragonal tin based lead-free solder. The addition of the nucleation modifiers to the solder alloy does not materially effect the solder composition's melting point. As such, balls of solder with the nucleated composition freeze while other solder balls within the array remain in the melt. This effectively enables one substrate to be pinned to another substrate by one or more predetermined solder balls to secure the package while the remaining solder joints are in the liquid state. Further, the addition of a trace amount of nucleation sites within the composition facilitates control over the number, size, and orientations of primary intermetallic compounds in tin rich crystallite grains. Moreover, trace amounts of one or more solid and/or insoluble nucleating modifiers within a given volume of solder reduces the size of average crystallites within the composition. | 06-24-2010 |
20100163605 | BALL IMPLANTATION METHOD AND SYSTEM APPLYING THE METHOD - A ball-implantation method and a system applying the method are provided. To begin with, solder balls are implanted onto a flux applied to each of the ball pads on a substrate plate. Then, a vibration force of preset magnitude is exerted on the substrate plate, inducing vibration and causing any solder balls that have deviated from positions corresponding to the ball pads exposed from the openings of a solder mask provided on the substrate plate to return to the correct orientation and be kept therein by the vibration force and gravity. Subsequently, the ball implantation process is completed using a reflow process to solder the implanted solder balls. Using this method and the system thereof, the problem of missing or misaligned solder balls that occurs after the reflow process is solved, thereby dispensing with rework and improving the production yield and product reliability. | 07-01-2010 |
20100230475 | ELECTRICAL INTERCONNECT FORMING METHOD - An electrical interconnect forming method. The electrical interconnect includes a first substrate comprising a first electrically conductive pad, a second substrate comprising a second electrically conductive pad, and an interconnect structure electrically and mechanically connecting the first electrically conductive pad to the second electrically conductive pad. The interconnect structure comprises a non-solder metallic core structure, a first solder structure, and a second solder structure. The first solder structure electrically and mechanically connects a first portion of the non-solder metallic core structure to the first electrically conductive pad. The second solder structure electrically and mechanically connects a second portion of the non-solder metallic core structure to the second electrically conductive pad. | 09-16-2010 |
20110049221 | METHOD OF JOINING A CHIP ON A SUBSTRATE - A method and apparatus for making chip assemblies is disclosed that prevent or reduce the cracking and delamination of ultra low-k dielectrics in the back-end-of-line in Si chips that can occur during the chip assembly process. The method and apparatus apply pressure to the top and bottom surfaces of a substrate during the chip bonding process so that the bending and warping of the assembled modules are reduced. The reduced bending and warping prevent or reduce the cracking and delamination of ultra low-k dielectrics. | 03-03-2011 |
20110278350 | Metal foil interconnection of electrical devices - An electrical assembly ( | 11-17-2011 |
20110290862 | LOW PROFILE AND COMPACT SURFACE MOUNT CIRCULATOR ON BALL GRID ARRAY - A surface mount circulator. The novel circulator includes a substrate, a predetermined number of microstrip lines disposed on a first surface of the substrate, a ground layer and a predetermined number of electrical contacts disposed on the second surface of the substrate, and a mechanism for coupling each microstrip line to one of the electrical contacts. In an illustrative embodiment, the circulator uses edge wrap metallization to wrap a microstrip line down a side of the substrate to connect with a corresponding contact. A ball grid array can then be used to connect the signal contacts and ground at the second surface of the substrate with a circuit board. The circulator also includes a magnet on first surface of the substrate over a resonator circuit connecting the microstrip lines and a pole piece on the second surface of the substrate beneath the ground to provide magnetic bias to the substrate. | 12-01-2011 |
20120012645 | ELECTRONIC COMPONENT MOUNTING SYSTEM AND ELECTRONIC COMPONENT MOUNTING METHOD - Disclosed are an electronic component mounting system and an electronic component mounting method capable of reducing the space occupied by equipment and equipment cost and ensuring high connection reliability. An electronic component mounting system ( | 01-19-2012 |
20120055978 | Contacting Means and Method for Contacting Electrical Components - A method is provided for connecting at least two components, in which a sintering preform is used. This preform includes a carrier having a surface that has at least one structuring element containing hardened paste, wherein the hardened paste contains: (a) metal particles having a coating that contains at least one organic compound; and (b) at least one sintering aid selected from the group consisting of (b1) organic peroxides, (b2) inorganic peroxides, (b3) inorganic acids, (b4) salts of organic acids, wherein the organic acids have 1-4 carbon atoms, (b5) esters of organic acids, wherein the organic acids have 1-4 carbon atoms, and (b6) carbonyl complexes. The surface of the carrier having the hardened paste is not reactive to the constituents of the paste. | 03-08-2012 |
20120080508 | LINEAR CELL STRINGING - Techniques for linear cell stringing are disclosed. In some embodiments, a plurality of sets of solar cells are linearly positioned, a plurality of tabbing ribbon segments are placed in contact with the plurality of sets of solar cells, and the plurality of sets of solar cells and corresponding plurality of tabbing ribbon segments are soldered together to form a plurality of solar cell strings. In some cases, the plurality of solar cell strings is substantially simultaneously formed in parallel. | 04-05-2012 |
20120118938 | WIRING METHOD AND DEVICE - To permanently apply lead terminals to corresponding electrodes of electronic or electro-optic components, the following steps are carried out: a. providing a frame including at least one tensioned wire, b. providing a holding jig including at least one seat in which a respective one of the components can be removably and temporarily retained, c. applying the components to the seats with the respective electrodes aligned along a respective longitudinal direction; in this way a row of aligned components is obtained, each component having a corresponding electrode aligned to the subsequent one in the row, d. applying the holding jig to the frame and orienting the same so that the longitudinal direction corresponds to the direction of the tensioned wire, the tensioned wire being thereby brought substantially in contact with (all) the electrode(s) aligned to each other on a corresponding row of components, e. electrically and mechanically bonding the tensioned wire to the corresponding electrodes; in this way all components are simultaneously bonded to the wire, and f. cutting the wire to separate the components from each other thereby forming a respective lead terminal for each electrode. | 05-17-2012 |
20120153008 | JOINED STRUCTURE, METHOD FOR PRODUCING THE SAME, AND ANISOTROPIC CONDUCTIVE FILM USED FOR THE SAME - A joined structure of the present invention including a first substrate having a wiring thereon, any one of a second substrate and an electronic part, and an anisotropic conductive film containing conductive particles, wherein the first substrate and any one of the second substrate and the electronic part are electrically joined via the anisotropic conductive film, and wherein the conductive particles pressure-bonded to the wiring of the first substrate protrude from both edges of the wiring in a width direction, and an interval of the wiring is 3.5 times or more larger than an average particle diameter of the conductive particles which are not pressure-bonded to the wiring. | 06-21-2012 |
20120267422 | SOLDERING ASSISTANCE DEVICE AND SOLDERING METHOD THEREOF - A soldering assistance device is used for soldering a multi-pin electronic element with a row of pins on a PCB. The row of pins includes an outer pin at two ends thereof. The soldering assistance device includes a holding portion and a soldering portion connected to the holding portion. The soldering portion is adjacent to the outer pin. An interval between the soldering portion and the outer pin is less than an interval between each two adjacent pins of the row of pins. The soldering portion is made of a metal which is easy to solder. A soldering method using the soldering assistance device is also provided. | 10-25-2012 |
20120318851 | CHIP BONDING PROCESS - A chip bonding process includes the following steps. At least one chip is transferred onto a carrier, and a negative pressure environment is provided. Heat is provided to the at least one chip and/or the carrier, and a positive pressure is applied onto the at least one chip. | 12-20-2012 |
20130105558 | Bonding Structure Manufacturing Method, Heating And Melting Treatment Method, And System Therefor | 05-02-2013 |
20130119118 | METHOD FOR MANUFACTURING SEMICONDUCTOR LASER APPARATUS, SEMICONDUCTOR LASER APPARATUS, AND OPTICAL APPARATUS - This method for manufacturing a semiconductor laser apparatus includes steps of forming a first semiconductor laser device having a first electrode, forming a second semiconductor laser device having a second electrode, forming a first solder layer with a first melting point through a first barrier layer on a third electrode, forming a second solder layer with a second melting point through a second barrier layer on a fourth electrode, bonding the first electrode to the third electrode through a first reaction solder layer, a melting point of which rises to a third melting point higher than the second melting point by reacting the first electrode with the first solder layer, and bonding the second electrode to the fourth electrode by applying heat of a first heating temperature to melt the second solder layer with the second melting point after the step of bonding the first electrode to the third electrode. | 05-16-2013 |
20130334292 | Printed Circuit Boards - A printed circuit board to which a localised solder connection is to be made, the surface of said printed circuit board having a continuous or non-continuous coating of a composition comprising a halo-hydrocarbon polymer at a thickness of from 1 nm to 10 μm. | 12-19-2013 |
20140263582 | LOW COST INTERPOSER AND METHOD OF FABRICATION - A method for making an interposer is provided. A conductive layer is formed by contacting a replicate such that a shape of a surface of the conductive layer conforms to a shape of the contacted portion of the replicate. The conductive layer is formed to have a base and a plurality of conductive posts projecting away from the base. Each conductive post is formed to have a post end opposite the base. A dielectric layer is formed to cover the base and to separate adjacent ones of the posts from each other. The posts are for forming vias. Conductive material is removed from the conductive layer to insulate at least one post from at least one other post. | 09-18-2014 |
20150008253 | TRANSIENT LIQUID PHASE BONDING PROCESS FOR DOUBLE SIDED POWER MODULES - A double-sided bonding process using transient liquid phase (TLP) bonding structure. A first side of an electronic device is processed to partially complete bonding. A second side of the electronic device is processed to complete bonding. The first side completes bonding during the processing of the second side. This reduces the time needed for the bonding process of both sides. This process allows for various TLP bonding parameters while being compatible with conventional fabrication systems. | 01-08-2015 |
20160183368 | POLYAMIDE FILMS AND PROCESS FOR PREPARATION | 06-23-2016 |