Class / Patent application number | Description | Number of patent applications / Date published |
228176000 | Combined | 69 |
20080197171 | BOND HEAD LINK ASSEMBLY FOR A WIRE BONDING MACHINE - A bond head assembly for use with a bonding machine includes a wire bonding tool and a link mechanism coupled between the wire bonding tool and the wire bonding machine. The link mechanism includes a frame, a plurality of arm links pivotably connected to the frame, and a tool support member supporting the wire bonding tool and pivotably connected to each of the arm links. | 08-21-2008 |
20080217380 | Method and apparatus to relieve residual stress or distortion in a heat processed article - The application discloses a method and apparatus to apply pressure to a heated or weld region of a workpiece to relieve residual stress and distortion. In illustrated embodiments, heat is supplied via a probe that traverses a workpiece to heat a region of the workpiece. Pressure is applied to the heated region following the application of heat. In illustrated embodiments, pressure is supplied via a roller assembly, which is configured to traverse the workpiece to apply pressure to the heated or weld regions. | 09-11-2008 |
20080217381 | Method for Bonding Work pieces and Micro-Structured Component - For forming very strong bond joints suited for manufacturing micro-structured components consisting of plurality of individual layers, a bonding method is proposed by which a bonding arrangement of the work pieces is formed that comprises at least one metallic bonding layer interposed therein between and by which the bonding arrangement is heated to a bonding temperature below the melting temperature of the at least one bonding layer. In accordance with the invention, the at least one bonding layer is deposited using a chemical or electrolytic method. | 09-11-2008 |
20080237309 | Methods and Systems for Mitigating Residual Tensile Stresses - Residual tensile stresses can be mitigated through methods and systems provided by the present invention. Such a method can include securing a metal member ( | 10-02-2008 |
20080290142 | METHOD AND PROCESS FOR REDUCING UNDERCOOLING IN A LEAD-FREE TIN-RICH SOLDER ALLOY - Briefly, a novel material process is disclosed wherein one or more nucleation modifiers are added, in trace amounts, to a lead-free tin-rich solder alloy to produce a solder composition with reduce or suppressed undercooling temperature characteristics. The modifier being a substance which facilitates the reduction of extreme anisotropic properties associated with body-centered-tetragonal tin based lead-free solder. The addition of the nucleation modifiers to the solder alloy does not materially effect the solder composition's melting point. As such, balls of solder with the nucleated composition freeze while other solder balls within the array remain in the melt. This effectively enables one substrate to be pinned to another substrate by one or more predetermined solder balls to secure the package while the remaining solder joints are in the liquid state. Further, the addition of a trace amount of nucleation sites within the composition facilitates control over the number, size, and orientations of primary intermetallic compounds in tin rich crystallite grains. Moreover, trace amounts of one or more solid and/or insoluble nucleating modifiers within a given volume of solder reduces the size of average crystallites within the composition. | 11-27-2008 |
20080296352 | BONDING METHOD FOR CYLINDRICAL TARGET - The present invention generally comprises a method and apparatus for bonding a cylindrical sputtering target to a backing tube. The cylindrical sputtering target may be disposed over the outside surface of the backing tube and melted bonding material may be vacuum pulled through the gap formed between the sputtering target and the backing tube. By vacuum pulling the melted bonding material through the gap, the amount of air bubbles or pockets present within the bonding material between the sputtering target and the backing tube may be reduced. | 12-04-2008 |
20080296353 | Multi-angle, articulated-jig-supported, beam-end component welding - Adjustable, elongate, beam-offset jig structure for assisting in welding a pair of beam-end, column-interface components to the opposite ends of an elongate beam. The jig structure includes spaced, adjustable head-stock and tail-stock structures, each capable of holding such a component adjacent a beam end for adjustment to an infinite number of different, pre-weld angular-offset dispositions relative to such a beam end in order to accommodate planned horizontal and vertical beam offsets which will be encountered when such beams are installed in a building frame. A computer-controlled, robotic welder is preferably provided adjacent each end of the jig structure to implement appropriate welding when any and all offset angles have been jig-established. | 12-04-2008 |
20080302859 | METHOD OF REFLOW SOLDERING A PRINTED CIRCUIT BOARD WHEREIN AN ELECTROCONDUCTIVE COATING MATERIAL IS USED - A reflow soldering method for use with circuit patterns and land patterns formed by an electoconductive coating material. Reflow soldering is performed in an air atmosphere within a range of 150°-190° C. and with a preheating time set within a range of 60±30 sec. Alternatively, preheating is performed in a nitrogen atmosphere. | 12-11-2008 |
20090020590 | PROCESS FOR MAKING INTERCONNECT SOLDER Pb-FREE BUMPS FREE FROM ORGANO-TIN/TIN DEPOSITS ON THE WAFER SURFACE - A method is provided for making of interconnect solder bumps on a wafer or other electronic device without depositing any significant amount of tin or other solder component from the solder onto the wafer surface which tin can cause shorts or other defects in the wafer. The method is particularly useful for well-known C4NP interconnect technology. In one aspect of the invention, a reducing gas flow rate is used to remove oxides from the solder surfaces and wafer pad surfaces and is of a sufficient determined or pre-determined flow and/or chamber or mold/wafer spacing to provide a gas velocity across the solder surfaces and wafer pad surfaces so that Sn or other contaminants do not deposit on the wafer surface during solder transfer. In another aspect, the transfer contact is performed below the melting point of the solder and subsequently heated to above the melting temperature while in transfer contact. The heated solder in contact with the wafer pads is transferred to the wafer pads. | 01-22-2009 |
20090120997 | SATURABLE ABSORBER COMPONENT AND METHOD FOR MANUFACTURING A SATURABLE ABSORBER COMPONENT - The invention relates to a saturable absorber component comprising an absorbent material located between a front mirror and a rear mirror as well as a method for manufacturing a saturable absorber component. | 05-14-2009 |
20090159646 | CONDUCTIVE BALL REMOVING METHOD, CONDUCTIVE BALL MOUNTING METHOD, CONDUCTIVE BALL REMOVING APPARATUS, AND CONDUCTIVE BALL MOUNTING APPARATUS - In a method of removing conductive balls that are left on a mask provided on a substrate having pads thereon, the method includes: (a) making a sheet member close to the mask using a contacting mechanism such that a gap between the sheet member and the mask is set small than a diameter of the conductive balls. The conductive balls are removed in such a manner that the conductive balls are adhered onto the sheet member. | 06-25-2009 |
20090230174 | SELF-ASSEMBLY OF ELEMENTS USING MICROFLUIDIC TRAPS - A self-assembly process is disclosed for integrating free standing microcomponents onto a template having a plurality of binding sites, an interconnect network, and trapping structures disposed downstream of the binding sites. The self-assembly is accomplished by flowing a fluid medium containing the microcomponents over the template such that some of the microcomponents are trapped at binding sites. The template may be simultaneously (or subsequently) heated to melt a binder such as a solder spot at each of the binding sites, and then cooled to connect the trapped microcomponents to the interconnect network. In one embodiment, removable blocking elements are disposed upstream of some of the binding sites, for example formed from photoresist. After assembling a first set of microcomponents, the blocking elements are removed, and a second set of microcomponents in a fluid medium are flowed over the template for assembly into the newly unblocked binding sites. | 09-17-2009 |
20090242614 | METHOD AND TOOL FOR REPOSITIONING SOLDER FILL HEAD - A tool and method is provided for repositioning a solder injection head. The tool includes a first moveable platform positioned on a first side of a workpiece chuck and a second moveable platform positioned on a second side of the workpiece chuck. A solder injection head has a seal configured to seal molten solder within the solder injection head when contacting a surface of the first moveable platform or the second moveable platform. The method includes moving a workpiece chuck and a starting platform to a position such that the starting platform is at a finishing position and a finishing platform is in a starting position. | 10-01-2009 |
20100065614 | PIPE-JOINING METHOD AND APPARATUS FOR PRODUCING UNDERWATER PIPELINES, AND UNDERWATER-PIPELINE-LAYING VESSEL COMPRISING SUCH AN APPARATUS - A method of joining pipes ( | 03-18-2010 |
20100072263 | Method and Apparatus for Forming Planar Alloy Deposits on a Substrate - A method for forming alloy deposits at selected areas on a receiving substrate includes the steps of: providing an alloy carrier including at least a first decal including a first plurality of openings and a second decal including a second plurality of openings, the first and second decals being arranged such that each of the first plurality of openings is in alignment with a corresponding one of the second plurality of openings; filling the first and second plurality of openings with molten alloy; cooling the molten alloy to thereby form at least first and second plugs, the first plug having a first surface and a second surface substantially parallel to one another, the second plug having a third surface and a fourth surface substantially parallel to one another; removing at least one of the first and second decals to at least partially expose the first and second plugs; aligning the alloy carrier with the receiving substrate so that the first and second plugs correspond to the selected areas on the receiving substrate; and transferring the first plug to a first of the selected areas and the second plug to a second of the selected areas. | 03-25-2010 |
20100089979 | SELECTIVE SOLDER STOP - A method for producing a surface on a component, which has regions having different wettabilities with respect to a solder. The method includes forming a first metallic layer on the component and forming a second metallic layer on the first metallic layer, the second metallic layer preventing oxidation of the first metallic layer. The method furthermore includes removing the second metallic layer with the aid of a laser in a predefined surface region for exposing the first metallic layer, and oxidizing the exposed first metallic layer on the surface, which results in a wettability with respect to a solder in the predefined surface region that is less than in a surface region adjacent to the predefined surface region. | 04-15-2010 |
20100102107 | METHOD FOR COATING TWO ELEMENTS HYBRIDIZED BY MEANS OF A SOLDERING MATERIAL - This method of coating the area of hybridization of a component constituted by two elements associated with one another by means of a soldering material, comprises depositing in proximity to said component a coating substance capable of filling by capillarity the volume defined between the hybridized elements of said component. On the periphery of the hybridization area on the lower element of said component is defined an area ( | 04-29-2010 |
20100133324 | METHOD AND APPARATUS FOR COATING PIPES - Method and apparatus for coating a pipe ( | 06-03-2010 |
20100176185 | WELDING REPAIR METHOD FOR FULL HOOP STRUCTURES - A unique heat treat method for relieving stresses caused by a repairing weld joint in a full hoop part heat treats locally, at the location of the weld joint, and at a diametrically opposed location. By providing the diametrically opposed heat treat location, the present invention relieves stresses caused by the weld joint, without creating any additional residual stress in the weld joint. | 07-15-2010 |
20100230473 | Al/AlN JOINT MATERIAL, BASE PLATE FOR POWER MODULE, POWER MODULE, AND MANUFACTURING METHOD OF Al/AlN JOINT MATERIAL - A base plate for a power module includes: a metal plate, a ceramic base plate joined to the metal plate, and a release agent provided in a joint surface between the metal plate and the ceramic base plate. A remaining amount of the release agent is less than 5 as an amount of boron measured by fluorescence X-ray analysis, and a crystal grain straining region in the joint surface is equal to or less than 40%, or an amount of crystal grain straining in the joint surface is equal to or less than 0.03%. | 09-16-2010 |
20100230474 | ELECTRICAL INTERCONNECT FORMING METHOD - An electrical interconnect forming method. The electrical interconnect includes a first substrate comprising a first electrically conductive pad, a second substrate comprising a second electrically conductive pad, and an interconnect structure electrically and mechanically connecting the first electrically conductive pad to the second electrically conductive pad. The interconnect structure comprises a non-solder metallic core structure, a first solder structure, and a second solder structure. The first solder structure electrically and mechanically connects a first portion of the non-solder metallic core structure to the first electrically conductive pad. The second solder structure electrically and mechanically connects a second portion of the non-solder metallic core structure to the second electrically conductive pad. | 09-16-2010 |
20100243716 | Enhanced Connector Cradle Having a Cooling Shell for Preferential Cooling of Wafers - A method, system and apparatus for preferential cooling of an electrical circuit board via a cradle having a cooling shell. An enhanced connector cradle enables the secure and precise placement of a connector on a circuit board by using a cooling component which selectively enables only the connector leads to reach reflow temperature levels. The cradle aligns and securely connects the circuit board to the connector via a comb structure of the cradle to form a single connector unit. Heat is applied to the single connector unit to initiate bond formation. The cradle selectively minimizes the heat to the circuit board and other board components by enabling the circulation of de-ionized water through the cooling component during the heating process. As a result, the cradle restricts reflow temperature levels to the connector leads. The cradle mechanism is removed from the board after the connector is securely bonded to the board. | 09-30-2010 |
20110011920 | PHOSPHORUS-COPPER BASE BRAZING ALLOY - A solid phos-copper base or silver-phos-copper base brazing alloy component for forming a brazed joint with a raised shoulder, little to no black oxide, and improved corrosion resistance. The brazing alloys of the present invention are visually distinguishable from copper and copper alloy parts. The solid brazing components of the present invention may be used in forming brazed joints at low brazing temperatures and result in a joint that is strong, ductile, smooth and corrosion resistant. The solid brazing components are provided in the form of wire, strip, foil or preform, and thus are advantageously used in a wide variety of brazing applications including copper tubing. The brazing components of the present invention are made of an alloy having a liquidus temperature above 840° F. and consist essentially of about 4-9% phosphorus, about 0.1-10% tin, up to about 4% antimony, about 0.1-15% nickel, up to about 3% silicon, up to about 18% silver, up to about 3% manganese, with the balance being copper. Exemplary embodiments include about 6-15% silver and/or 5-8% nickel. | 01-20-2011 |
20110024483 | METHOD OF ASSEMBLING GOLD ALLOY PARTS - The invention relates to a method of assembling gold alloy parts that enables identical or different gold alloys, particularly gold alloys of different colors, to be assembled. | 02-03-2011 |
20110108609 | Methods of fabricating graphene using alloy catalyst - Methods of fabricating graphene using an alloy catalyst may include forming an alloy catalyst layer including nickel on a substrate and forming a graphene layer by supplying hydrocarbon gas onto the alloy catalyst layer. The alloy catalyst layer may include nickel and at least one selected from the group consisting of copper, platinum, iron and gold. When the graphene is fabricated, a catalyst metal that reduces solubility of carbon in Ni may be used together with Ni in the alloy catalyst layer. An amount of carbon that is dissolved may be adjusted and a uniform graphene monolayer may be fabricated. | 05-12-2011 |
20110127316 | THERMODE CLEANING METHOD - A method for cleaning a thermode tip including applying an energy pulse to the thermode tip. The energy pulse involves raising the temperature of the thermode tip higher than the working temperature of the thermode tip. A method for cleaning a thermode tip may include periodically performing a predetermined number of soldering cycles at a working temperature; and applying an energy pulse to the thermode tip. | 06-02-2011 |
20110139858 | CARRIER FOR MANUFACTURING SUBSTRATE AND METHOD OF MANUFACTURING SUBSTRATE USING THE SAME - Disclosed herein is a carrier for manufacturing a substrate, including: two insulation layers, each being provided on one side thereof with a first metal layer and on the other side thereof with a second metal layer; and a third metal layer having a lower melting point than the first metal layer and formed between the two first metal layers respectively formed on the two insulation layers such that the two first metal layers are attached to each other. The carrier is advantageous in that the carrier can be separated by heating the third metal layer, so that the size of a substrate does not change at the time of separating the carrier, thereby maintaining the compatibility between a substrate and manufacturing facilities. | 06-16-2011 |
20110139859 | METHOD FOR REMOVING BRAZING RESIDUES FROM ALUMINUM ARTICLES - In a method of preparing an aluminum surface, flux is applied to the aluminum surface and the aluminum surface is brazed. Residual flux and metal oxides are removed from the aluminum surface using an aqueous fluid having a pH between about 5 and about 9. | 06-16-2011 |
20110147439 | Microelectronic device substrate fabrication - The present disclosure relates to forming a plurality of through silicon vias guard rings proximate the scribes streets of a microelectronic device wafer. The microelectronic device wafer includes a substrate wherein the through silicon via guard ring is fabricated by forming vias extending completely through the substrate. The through silicon via guard rings act as crack arresters, such that defects caused by cracks resulting from the dicing of the microelectronic wafer are substantially reduced or eliminated. | 06-23-2011 |
20110163152 | METHOD OF FORMING SOLDER DAM - A method of forming a solder dam on a lead of an electronic component includes forming the looped solder dam surrounding a target lead, to which the solder dam is to be formed, of a plurality of leads connected to the electronic component, by fitting a C-shaped fitted member to the target lead at a predetermined location. | 07-07-2011 |
20110290861 | METHOD FOR PRODUCING A BLADE PLATING ON A BLADE FOR A TURBOMACHINE - The invention relates to a method for producing a blade tip plating ( | 12-01-2011 |
20110315745 | CARRIER FOR MANUFACTURING SUBSTRATE AND METHOD OF MANUFACTURING SUBSTRATE USING THE SAME - Disclosed herein is a carrier for manufacturing a substrate, including: two insulation layers, each being provided on one side thereof with a first metal layer and on the other side thereof with a second metal layer; and a third metal layer having a lower melting point than the first metal layer and formed between the two first metal layers respectively formed on the two insulation layers such that the two first metal layers are attached to each other. The carrier is advantageous in that the carrier can be separated by heating the third metal layer, so that the size of a substrate does not change at the time of separating the carrier, thereby maintaining the compatibility between a substrate and manufacturing facilities. | 12-29-2011 |
20120125981 | Thermal Gradient Reflow for Forming Columnar Grain Structures for Solder Bumps - A method includes heating a package structure including a first work piece and a second work piece to melt a plurality of solder bumps between the first and the second work pieces; and after the step of heating, allowing the plurality of solder bumps to solidify. During the step of solidifying, a first side of the package structure is maintained at a first temperature higher than a melting temperature of the plurality of solder bumps by using a heating source. During the step of solidifying, a second side of the package structure is maintained at a second temperature lower than the melting temperature by using a cooling source, wherein the second side is opposite the first side. | 05-24-2012 |
20120205424 | Methods and Systems Involving Soldering - A method includes applying solder to conductive pads of a semiconductor device, applying solder to conductive pads of a substrate, aligning the solder on the semiconductor device with the solder on the substrate such that portions of the solder on the semiconductor device contact corresponding portions of the solder on the substrate, heating the semiconductor device and the substrate to liquefy the solder, and exerting an oscillating force operative to oscillate the semiconductor device relative to the substrate at a frequency. | 08-16-2012 |
20120280023 | SOLDERING METHOD AND RELATED DEVICE FOR IMPROVED RESISTANCE TO BRITTLE FRACTURE - A lead-free solder joint is formed between a tin-silver-copper solder alloy (SAC), SACX, or other commonly used Pb-free solder alloys, and a metallization layer of a substrate. Interaction of the SAC with the metallization layer forms an intermetallic compound (IMC) that binds the solder mass to the metallization layer. The IMC region is substantially free of any phosphorous-containing layers or regions. | 11-08-2012 |
20120305631 | INJECTION MOLDED SOLDER PROCESS FOR FORMING SOLDER BUMPS ON SUBSTRATES - Solder bumps of uniform height are provided on a substrate through the use of injection molded solder. Copper pillars or ball limiting metallurgy are formed over I/O pads within the channels of a patterned layer of photoresist. Solder is injected over the pillars or BLM, filling the channels. The solder, which does not contain flux, is allowed to solidify. It forms a plurality of solder structures (bumps) of equal heights. Solder injection and solidification are preferably carried out in a nitrogen environment or a forming gas environment. Molten solder can be injected in channels formed in round wafers without spillage using a carrier assembly that accommodates such wafers and a fill head. | 12-06-2012 |
20130001278 | BRAZE MATERIALS AND PROCESSES THEREFOR - Braze materials and processes for using braze materials, such as for use in the manufacturing, coating, repair, and build-up of superalloy components. The braze material contains a plurality of first particles of a metallic material having a melting point, and a plurality of second particles comprising at least one nonmetallic material chosen from the group consisting of oxides, carbides, and nitrides of at least one metal. The nonmetallic material is more susceptible to heating by microwave radiation than the metallic material of the first particles, and the nonmetallic material is present in the braze material in an amount sufficient to enable the first particles to completely melt when the first and second particles are subjected to heating by microwave radiation. | 01-03-2013 |
20130015234 | Method of Forming a Package Substrate - In accordance with an embodiment, a method comprises providing a substrate having a conductive material thereon, forming a ground plane, a first trace rail, and a first perpendicular trace from the conductive material, and forming an insulator material over the ground plane, the first trace rail, and the first perpendicular trace. The ground plane is between the first trace rail and an area of the substrate over which will be a die. The first trace rail extends along a first outer edge of the ground plane, and the first perpendicular trace is coupled to the first trace rail and extends perpendicularly from the first trace rail. | 01-17-2013 |
20130082089 | CURABLE FLUX COMPOSITION AND METHOD OF SOLDERING - A curable flux composition is provided, comprising, as initial components: a resin component having at least two oxirane groups per molecule; a carboxylic acid; a fluxing agent represented by formula I: | 04-04-2013 |
20130082090 | METHODS OF FORMING CONNECTION BUMP OF SEMICONDUCTOR DEVICE - Methods of forming connection bumps for semiconductor devices in which rewiring patterns are formed. The method includes preparing a semiconductor substrate on which a pad is partially exposed through a passivation film, forming a seed layer on the pad and passivation film, forming a photoresist pattern including an opening pattern comprising a first opening that exposes a portion of the seed layer on the pad and a second opening that exposes a portion of the seed layer on the passivation film and is separated from the first opening, performing a first electroplating to form filler layers in the opening patterns, performing a second electroplating to form a solder layer on the filler layers, removing the photoresist pattern and performing a reflow process to form a collapsed solder layer that electrically connects the filler layers to each other and a solder bump on the filler layer formed in the second opening. | 04-04-2013 |
20130082091 | METHOD TO FORM SOLDER ALLOY DEPOSITS ON SUBSTRATES - Method of forming a solder alloy deposit on a substrate comprising i) provide a substrate including a surface bearing electrical circuitry that includes at least one inner layer contact area, ii) form a solder mask layer on the substrate surface and patterned to expose at least one contact area, iii) contact the entire substrate area including the solder mask layer and the at least one contact area with a solution to provide a metal seed layer on the substrate surface, iv) form a structured resist layer on the metal seed layer, v) electroplate a first solder material layer containing tin onto the conductive layer, vi) electroplate a second solder material layer onto the first solder material layer, vii) remove the structured resist layer and etch away an amount of the metal seed layer sufficient to remove the metal seed layer from the solder mask layer area and reflow the substrate. | 04-04-2013 |
20130175326 | Hotbar Device and Methods for Assembling Electrical Contacts to Ensure Co-Planarity - Devices and methods for assembling co-planar electrical contacts in a connector are provided herein. In one aspect, an exemplary method of assembly comprises depositing solder in a connector plug enclosure, positioning electrical contacts on the solder deposits, advancing the hotbar toward the enclosure contacting each of the electrical contacts so as to planarize a top surface of each of the electrical contacts with the enclosure and melting the solder with the heated hotbar to solder the electrical contacts to the enclosure. In one aspect, an exemplary hotbar device includes a magnet for releasably coupling the electrical contacts to the hotbar. In another aspect, the hotbar includes metallic portions for heating the electrical contacts and insulated ceramic portions for contacting the enclosure. In another aspect, an electrically conductive hotbar includes side portions that extend away from the bottom heating surface facilitating more uniform current flow through the hotbar. | 07-11-2013 |
20130186941 | INDUCTION BONDING - The described embodiment relates generally to the field of inductive bonding. More specifically an inductive heater designed for use in assembling electronics is disclosed. A number of methods for shaping a magnetic field are disclosed for the purpose of completing an inductive bonding process without causing harm to unshielded adjacent electrical components. | 07-25-2013 |
20130186942 | GOLD REMOVAL FROM ELECTRONIC COMPONENTS - In some embodiments, a method removes gold plating on an electronic component. The method includes forming a gold and solder mixture on the electronic component via a first incrementally controlled heating procedure; incrementally cooling the electronic component via a first cooling procedure; wicking part or all of the gold and solder mixture from the electronic component to a metallic screen via a second incrementally controlled heating procedure; and incrementally cooling the electronic component via a second cooling procedure. | 07-25-2013 |
20130214034 | METHOD AND APPARATUS FOR COATING PIPES - Method and apparatus for coating a pipe or a pipe section with a layer of at least one polymer. The method includes providing the pipe or the pipe section having an outer surface defining the periphery of the pipe or the pipe section; applying on the outer surface of the pipe or pipe section a layer of at least one polymer material in melt stage using a nozzle, which is mounted on a carriage capable of travelling along the periphery of the pipe or the pipe section; and moving the carriage along at least a part of the periphery during the application of the polymer material to form a layer on the surface of the pipe or the pipe section that is particularly useful for coating field joints in pipelines. | 08-22-2013 |
20130248584 | PROCESS FOR MAKING A HEAT RADIATING STRUCTURE FOR HIGH-POWER LED - A process of making a heat radiating structure for high-power LED comprises: (1) providing a PCB board, a heat conducting plate and a heat radiating plate; (2) providing a first locating hole and a first fixation hole penetrating the PCB board, and welding a copper plate to one side of the PCB board; while soldering an electrode welding leg to the other side of the PCB board; (3) providing a second locating hole and a second fixation hole penetrating the heat conducting plate; (4) using a fixation column to pierce through both of the fixation holes for connecting together the PCB board and the heat conducting plate; (5) using a heat conducting column to pierce through both of the locating holes; (6) placing the integral piece of the heat conducting plate and the PCB board on a pressing equipment to adjust the height of the heat conducting column. | 09-26-2013 |
20130256389 | REFLOW OVEN AND METHODS OF TREATING SURFACES OF THE RELFOW OVEN - A reflow oven used to join electronic components to a substrate includes a chamber housing having surfaces that are in contact with heated air mixed with contaminants, including flux, and an intermediate layer selectively applied to the surfaces of the chamber housing. The reflow oven may include fabricating the intermediate layer with a foam material, including foaming polymers, e.g., epoxy, polyurethane, polyester, and silicone, or a non-foam material, including non-foaming polymers, e.g., polytetrafluoroethylene and polyimide. A method of treating surfaces of a reflow oven exposed to contaminants, including flux, is further disclosed. | 10-03-2013 |
20130270326 | ALLOY FORMATION CONTROL OF TRANSIENT LIQUID PHASE BONDING - A bonding structure enabling fast and reliable methods to fabricate a substantially homogeneous bondline with reduced dependency of a thickness limitation is disclosed. Also, this system creates a bondline targeted for performance in power electronics. This system is highly adaptable as various structures and fabrication options may be implemented. This enables diverse fabrication selection and creates less dependency on outside conditions. The disclosed system is at least applicable to wafer-to-wafer, die-to-wafer, die-to-substrate, or die-to-die bonding. | 10-17-2013 |
20130270327 | IMPROVEMENTS OF LONG TERM BONDLINE RELIABILITY OF POWER ELECTRONICS OPERATING AT HIGH TEMPERATURES - Alloy formation systems and methods and a mechanism, strategy and design for power electronics having high operating temperatures. The system creates a bondline targeted for performance in power electronics. The system provides for sequential alloy growth in high temperature operating power electronics. The system is at least applicable to wafer-to-wafer, die-to-wafer, die-to-substrate, or die-to-die bonding. | 10-17-2013 |
20130270328 | PROCESS FOR DIRECT BONDING TWO ELEMENTS COMPRISING COPPER PORTIONS AND PORTIONS OF DIELECTRIC MATERIALS - A process of assembly by direct bonding of a first and second element, each having a surface including copper portions separated by a dielectric material, the process includes: polishing the surfaces such that the surfaces to be assembled allow assembly by bonding; forming a diffusion barrier selectively in copper portions of the first and second elements, wherein the surface of the diffusion barrier of the first and second elements is level with the surface, to within less than 5 nanometers; and bringing the two surfaces into contact, such that the copper portions of one surface cover at least partly the copper portions of the other surface, and such that direct bonding is obtained between the surfaces. | 10-17-2013 |
20130327815 | Polymer Composition for Microelectronic Assembly - Embodiments in accordance with the present invention encompass polymer compositions that are useful in the assembly of microelectronic components onto a variety of substrate materials. Such polymer compositions providing for both holding the microelectronic components at desired positions on a substrate, providing fluxing for the solder bonding of such components to the substrate and remaining in place as an underfill for such components. | 12-12-2013 |
20140061284 | Hermetically Sealed Polymer Capacitors with High Stability at Elevated Temperatures - A process for providing an improved hermetically sealed capacitor which includes the steps of applying a solder and a flux to an interior surface of a case; flowing the solder onto the interior surface; remove flux thereby forming a flux depleted solder; inserting the capacitive element into the casing; reflowing the flux depleted solder thereby forming a solder joint between the case and the solderable layer; and sealing the case. | 03-06-2014 |
20140091130 | METHOD AND APPARATUS FOR COUPLING A LASER DIODE TO A MAGNETIC WRITER - A write head includes a cavity configured to couple a laser diode to the write head. A bottom of the cavity includes a heat conductive element configured to contact the laser diode, a plurality of thermal studs disposed below the heat conductive element, and a substrate disposed below the thermal studs. The heat conductive element, thermal studs, and substrate are thermally coupled to draw heat from the laser diode. | 04-03-2014 |
20140097231 | SURFACE TREATING COMPOSITION FOR COPPER AND COPPER ALLOY AND UTILIZATION THEREOF - A surface treating composition for copper or a copper alloy comprising an imidazole compound and means for using the composition in the soldering of electronic parts to printed wiring boards are disclosed. | 04-10-2014 |
20140103097 | CIRCUIT BOARD, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - There is provided a circuit board to which a solder ball composed of a lead (Pb)-free solder is to be connected, a semiconductor device including an electrode and a solder ball composed of a lead (Pb)-free solder disposed on the electrode, and a method of manufacturing the semiconductor device, in which mounting reliability can be improved by enhancing the bonding strength (adhesion strength) between the solder ball composed of a lead (Pb)-free solder and the electrode. | 04-17-2014 |
20140183248 | METHODS FOR VACUUM ASSISTED UNDERFILLING - Methods for applying an underfill with vacuum assistance. The method may include dispensing the underfill onto a substrate proximate to at least one exterior edge of an electronic device attached to the substrate. A space between the electronic device and the substrate is evacuated through at least one gap in the underfill. The method further includes heating the underfill to cause the underfill to flow into the space. Because a vacuum condition is supplied in the open portion of the space before flow is initiated, the incidence of underfill voiding is lowered. | 07-03-2014 |
20140231491 | METHOD OF MANUFACTURING ELECTRONIC COMPONENT UNIT - An electronic component unit manufacturing method includes: preparing a circuit board including a heat generating element mounted thereon and a bonding metal foil layer formed thereon, a heat transfer board including an insulative layer formed on one face thereof and a heat transfer metal foil layer formed on the insulative layer, and a heat sink; applying a cream solder to form a solder layer on the board bonding metal foil layer or the heat transfer metal foil layer; superimposing the bonding metal foil layer and the heat transfer metal foil layer with each other via the solder layer; re-melting the solder layer to solder the bonding metal foil layer and the heat transfer metal foil layer; and superimposing the other face of the heat transfer board with the heat sink to thereby assemble the circuit board with the heat sink via the heat transfer board. | 08-21-2014 |
20140263581 | ELECTRONIC COMPONENT BONDING METHOD - The present invention ensures a good bonding state between the electrode terminals of electronic components and the electrodes of a substrate, and achieves an increase in productivity and a downsizing of the substrate. The present invention includes: an applying step of applying a metal fine powder paste on each of multiple electrodes that are provided on a substrate; a component placing step of placing multiple electronic components with different heights, on the multiple electrodes, respectively; an organic film placing step of placing an organic film on the multiple electronic components; an organic film compressing step of applying a first pressure to the electronic component side with a pressing member and equalizing the height of the organic film; and a bonding step of applying a second pressure to the electronic component side with a compressing member on heating for a predetermined time and sintering the metal fine powder paste. | 09-18-2014 |
20140339289 | METHOD OF MANUFACTURING MOUNTING SUBSTRATE AND METHOD OF MANUFACTURING ELECTRONIC APPARATUS - A method of manufacturing a mounting substrate, the method includes: transferring part or all of a plurality of devices on a device substrate onto a wiring substrate, and temporarily fixing the transferred devices to the wiring substrate with use of a fixing layer having viscosity, the device substrate including a support substrate and the plurality of devices fixed on the support substrate; and performing a reflow process on the wiring substrate to electrically connect the transferred devices with the wiring substrate, and thereby forming the mounting substrate. | 11-20-2014 |
20150014398 | METHOD OF MOUNTING ELECTRONIC PARTS ON SURFACE MOUNTING SUBSTRATE - A method of mounting electronic parts on a surface mounting substrate includes a step of forming a film resist layer by applying a resist with a film coating device to amounting surface of a surface mounting substrate formed with a wiring pattern including a pair of lands to mount an electronic part; precuring the formed film resist layer; exposing, by using a mask, inner side regions of the film resist layer, the inner side regions defining the exposure regions and another region defining non-exposure region; etching away the film resist layer in the non-exposure regions and forming film resist layers in the inner side regions; post curing the film resist layers; printing solder pastes in regions on the lands excluding the inner side regions; and placing the electronic part on the solder pastes and reflow-soldering thereon. | 01-15-2015 |
20150034702 | Apparatus & method for treating substrate - Provided are a semiconductor substrate manufacturing apparatus and a substrate treating method, and more particularly, an apparatus and method for performing a reflow treating process on a semiconductor wafer. The apparatus treating apparatus includes a load port on which a carrier accommodating a substrate is seated, a substrate treating module including one process chamber or a plurality of process chambers having a treating space in which a reflow process with respect to the substrate is performed, a cleaning unit cleaning the substrate, and a substrate transfer module disposed between the load port and the substrate treating module. The substrate transfer module includes a transfer robot transferring the substrate among the load port, the substrate treating module, and the cleaning unit. | 02-05-2015 |
20150053752 | BALL PLANTING DEVICE AND BALL PLANTING METHOD THEREOF - The present disclosure relates to a ball planting device for mounting a solder ball and a ball planting method thereof. The device includes a substrate, a dielectric layer, and a solder paste. The substrate includes a surface. The dielectric layer is disposed on the surface. The dielectric layer includes a plurality of apertures. The solder paste fills the apertures. A top surface of the solder paste is aligned with an exposed surface of the dielectric layer. | 02-26-2015 |
20150303778 | METHOD FOR SOLDERING A STATOR TO A COOLER, AND STATOR COMPRISING A SOLDER CONNECTION TO THE STATOR SUPPORT - A method for soldering a stator of an electric machine to a cooler is described. Firstly, the stator and/or the cooler is coated, at least partially, with a layer of solder. Then, the stator is brought together with the cooler such that the layer of solder is between the stator and the cooler. Finally, the cooler is heated to the melt temperature of the layer of solder in order to produce a solder connection between the stator and the cooler. The cooler can also act as support. Furthermore, a stator for an electric machine, comprising a stator support and a solder connection between the stator and the stator support is described. | 10-22-2015 |
20150308273 | SHROUDED SINGLE CRYSTAL DUAL ALLOY TURBINE DISK - A turbine engine component for a gas turbine engine includes an inner disk, an outer shroud, and a plurality of blades. Each blade comprises a blade root and an airfoil body. The blade root is plated at least in part with a noble metal, and is coupled to the inner disk. The airfoil body extends at least partially between the blade root and the outer shroud. | 10-29-2015 |
20150345044 | METHOD OF ELECTROPLATING COBALT ALLOY TO WIRING SURFACE - A method of electroplating a cobalt alloy to a wiring surface includes providing a substrate having a metal wiring; electroplating a cobalt-based alloy to the metal wiring at a deposition rate of 15-30 μm/hr to form thereon a cobalt-based alloy electroplated layer 0.5 μm-5 μm thick, wherein the main constituent element of the cobalt-based alloy is cobalt; plating gold to the cobalt-based alloy electroplated layer to form thereon a gold plated layer 0.03 μm-0.3 μm thick. The surface of the cobalt-based alloy electroplated layer features a crystalline-phase structure full of micro-protuberances, and the thickness of the gold plated layer is reduced to 0.03 μm. | 12-03-2015 |
20160023292 | JOINING METHOD AND JOINING SYSTEM - A joining method for joining a first member and a second member is provided. The joining method includes a step of providing a first brazing layer on the first member by plating, a step of providing a second brazing layer on the first brazing layer by plating, a step of arranging the first member and the second member to oppose each other across the first brazing layer and the second brazing layer, and a step of melting the first brazing layer and the second brazing layer to join the first member and the second member which are arranged to oppose each other. | 01-28-2016 |
20160107253 | REEL-TO-REEL MANUFACTURING PLANT FOR INTERLINKED CONTINUOUS AND DISCONTINUOUS PROCESSING STEPS - A continuous manufacturing plant ( | 04-21-2016 |
20160144458 | MACHINE AND METHOD FOR PRODUCING A CARTRIDGE FOR AN ELECTRONIC CIGARETTE PROVIDED WITH A HEAT RESISTOR - A manufacturing machine and a method for producing a cartridge for an electronic cigarette comprising a supporting base, a pair of power electrodes fitted to the supporting base, and a heating member folded into a ‘U’ around the power electrodes are disclosed: a conveyor comprising a pocket for feeding the supporting base fitted with the power electrodes along a conveying path; a connecting unit which connects the heating member to the power electrodes while the supporting base, fitted with the power electrodes, is housed inside the pocket on the conveyor; a welding device located along the conveyor to weld a pair of terminals of a heat resistor of the heating member to the corresponding power electrodes; and a folding device, which cooperates with the connecting unit and folds the heating member into a ‘U’ before the heating member is connected to the power electrodes. | 05-26-2016 |
20160375525 | Process of manufacturing fuel tank - An process of manufacturing an automotive fuel tank is provided with preparing a cover formed of stainless steel, the covering including a closed edge and a space; preparing a main body formed of stainless steel, the main body including a closed edge and a space; aligning the closed edge of the cover with the closed edge of the main body; and securing the cover and the main body together by welding along the closed edges. | 12-29-2016 |