| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 228125000 | With removing or reshaping of filler material or flash after bonding | 8 |
| 20080223906 | SOLDERING STRUCTURE AND METHOD USING ZN - A soldering structure using Zn includes a bonding layer which contains Zn; and a lead-free solder which bonds and reacts to the bonding layer. The bonding layer can be a Zn alloy layer or a multilayer including a Zn layer. Accordingly, the characteristics of the soldering structure can be improved by involving the high reactive Zn to the interfacial reaction of the soldering. | 09-18-2008 |
| 20080290139 | Method of Bonding Probes and Method of Manufacturing a Probe Card Using the Same - In a method of manufacturing bonding probes, bump layer patterns are formed on terminals of a multi-layered substrate. A first wetting layer pattern having a wettability with respect to a solder paste, and a non-wetting layer pattern having a non-wettability with respect to the solder paste are formed on the bump layer patterns. The solder paste is formed on the first wetting layer and the non-wetting layer pattern. The probes, which make contact with an object, are bonded to the solder paste. The solder paste on the non-wetting layer pattern reflows along a surface of the first wetting layer pattern to form an adhesive layer on the first wetting layer pattern. Thus, a sufficient amount of the solder paste, which is required for bonding the probes, may be provided to firmly bond the probes. | 11-27-2008 |
| 20100147927 | EXTERNAL DEBURRING OF WELDED PIPE - An external weld bead is removed and processed from a welded pipe traveling in a downstream direction. The weld bead is separated from the pipe, allowed to flow in a downstream direction, and is guided downstream and cut into chips at a location downstream of where the weld bead is separated from the pipe. | 06-17-2010 |
| 20100308103 | SYSTEM AND METHOD FOR VAPOR PHASE REFLOW OF A CONDUCTIVE COATING - A system for manufacturing electrical components includes a reflow chamber having an inlet port and an outlet port. The inlet port receives a web of interconnected electrical components having a conductive coating into the reflow chamber. The outlet port discharges the web from the reflow chamber. The reflow chamber directs the web of interconnected electrical components along a predetermined pathway through the reflow chamber. The reflow chamber retains a heated and saturated vapor to heat the conductive coating as the web passes along the pathway through the chamber to reflow the conductive coating about the electrical components. | 12-09-2010 |
| 20120018494 | Thermal Compress Bonding - A method includes providing a substrate carrier including work piece holders, and placing a first plurality of work pieces into the work piece holders. A second plurality of work pieces is picked up and placed, with each of the second plurality of work pieces being placed on one of the first plurality of work pieces. Solder bumps between the first and the second plurality of work pieces are then reflowed to simultaneously bond the first and the second plurality of work pieces together. | 01-26-2012 |
| 20120138665 | METHOD FOR FABRICATING OPTICAL SEMICONDUCTOR DEVICE - A method for fabricating an optical semiconductor device, including: melting a solder supplied on a carrier; mounting a semiconductor laser chip on the melted solder with a tool for holding the semiconductor laser chip; cooling the solder; releasing the tool from the semiconductor laser chip after the solder is cooled; remelting the solder after the tool is released from the semiconductor laser chip; and recooling the remelted solder. | 06-07-2012 |
| 20130221074 | SOLDER BUMP STRETCHING METHOD - A method includes heating a solder bump above a melting temperature of the solder bump. The solder bump is stretched to increase a height of the solder bump. The solder bump is cooled down. | 08-29-2013 |
| 20160044795 | SOLDERING DEVICE, SOLDERING METHOD, AND SUBSTRATE AND ELECTRONIC COMPONENT PRODUCED BY THE SOLDERING DEVICE OR THE SOLDERING METHOD - Provided is a space-saving soldering device that can perform allowing high-reliability soldering at a low cost and a high yield be produced at low cost with a high yield. For achieving the above-described objects, the soldering device includes: a first treatment part that sets a component having an electrode; a second treatment part separated by an opening-closing unit, the second treatment part sending the component on to a third treatment part; the third treatment part separated by an opening-closing unit, the third treatment part causing the component to contact an organic fatty-acid-containing solution and move horizontally; a fourth treatment part having a unit for moving the component to a space portion and causing molten solder to adhere to the electrode, and a unit for removing excess molten solder; a fifth treatment part for horizontally moving the component moved downward by the fourth treatment part; a sixth treatment part separated by an opening-closing unit, the sixth treatment part sending the component on to a seventh treatment part; and the seventh treatment part separated by an opening-closing unit, the seventh treatment part taking out the component. | 02-11-2016 |
