Class / Patent application number | Description | Number of patent applications / Date published |
228103000 | With measuring, testing, indicating, inspecting, or illuminating | 88 |
20080197170 | Single and multi-spectral illumination system and method - A stencil printer apparatus for depositing a solder paste onto the surface of the electronic substrate, comprising a frame, a stencil coupled to the frame, the stencil having a plurality of apertures, a dispenser coupled to the frame, the stencil and the dispenser being configured to deposit the solder paste onto the electronic substrate, an imaging system constructed and arranged to capture an image of the electronic substrate, and a controller coupled to the imaging system and configured to control movement of the imaging system to capture the image. The imaging system comprises a camera element configured to capture the image of at least the portion of the surface of the electronic substrate, and a first illumination element comprising a long-wavelength light source configured to illuminate at least the portion of the surface of the electronic substrate by generating long-wavelength light. Other embodiments and methods are disclosed. | 08-21-2008 |
20080203137 | SUBSTRATE BONDING METHODS AND SYSTEM INCLUDING MONITORING - Bonding methods and a bonding system including monitoring are disclosed. In one embodiment, a method of monitoring bonding a first and second substrate includes: providing a plurality of piezoelectric sensors to a substrate mounting stage of a substrate bonding system; and monitoring a force change measured by the plurality of piezoelectric sensors induced by a bond front between the first and second substrate during bonding. This method allows real time monitoring of the bonding quality and adjustment of the bonding process parameters. | 08-28-2008 |
20080237303 | Decision method for dressing of welding electrodes - A method is provided for determining that the electrodes of an electric resistance welder are in need of replacement and dressing includes monitoring the rate at which the depth of the weld indentation caused by the electrode changes during the progressive wearing of the electrodes during the making of successive welds. The electrodes are then dressed when it is determined that the rate of change of the depth of the weld indentation formed by the electrodes has substantially leveled off to a stable depth of indentation. | 10-02-2008 |
20090001133 | ELECTRONIC COMPONENT MOUNTING DEVICE AND METHOD OF MANUFACTURING ELECTRONIC DEVICE - An electronic component mounting device according to the invention includes a bonding head for holding and pressure bonding an electronic component to a mounting substrate, a local stage provided with a support surface formed in an area which is almost equal to or slightly larger than that of a mounting surface of the electronic component and serving to support a pressure bonding force from an antimounting surface of the mounting substrate through the support surface, a length measuring mechanism for measuring a distance between the bonding head and the mounting substrate, thereby calculating a virtual plane in a predetermined mounting position on the mounting substrate, and a tilting and moving mechanism for tilting and moving the bonding head and the local stage, thereby causing a normal of the virtual plane in the mounting position to be coincident with an action line of the pressure bonding force, and the pressure bonding is carried out along the normal. | 01-01-2009 |
20090001134 | Method and apparatus for judging quality of resistance brazing - An apparatus for judgment of the quality of resistance brazing provided in a resistance brazing apparatus gripping a weld object between which a brazing material is interposed between a pair of electrodes, applying pressure to copper parts, and feeding power to the electrodes in that state, having a control unit controlling the amount of heat generated at the pair of electrodes during resistance brazing, a power feed time measurement unit measuring a power feed time to electrodes required from when an amount of displacement of the distance between the pair of electrodes reaches a first amount of displacement to a second amount of displacement, and a quality judgment unit judging there was a brazing material if the power feed time is a predetermined threshold value or less and judging there was no brazing material if the power feed time is larger than the predetermined threshold value. | 01-01-2009 |
20090008428 | METHOD OF MANUFACTURING AN ARTICLE BY SUPERPLASTIC FORMING AND DIFFUSION WELDING - The invention relates to plastic metal forming, particularly to methods of manufacturing articles of titanium alloys by superplastic forming and diffusion welding. The method is particularly applicable to aircraft engine building for manufacturing articles, e.g. fan blades. A method of manufacturing an article by superplastic forming and diffusion welding from at least two workpieces of a titanium alloy, including: marking areas to be and not to be bonded on a surface of at least one of the workpieces; assembling the workpieces into a stack; heating the stack to a predetermined temperature T and applying a pressure of a predetermined value p from a press for diffusion welding of the workpieces together to produce a semifinished article; heating and supplying a pressurized working fluid into the interior of the semifinished article to superplastically form at least one of the workpieces to produce an article of a predetermined shape, characterized in that the diffusion welding is carried out through pads of a titanium alloy having a smaller flow stress than that in the workpieces, wherein mainly in the case when the article is made from three or more workpieces a bond preventing material is applied to at least a part of a surface of at least one of the workpieces at the areas not to be bonded. | 01-08-2009 |
20090014501 | ELECTRONIC COMPONENT MOUNTING SYSTEM, ELECTRONIC COMPONENT PLACING APPARATUS, AND ELECTRONIC COMPONENT MOUNTING METHOD - Regarding electronic component mounting in which an electronic component having plural solder bumps for external connection on its lower surface is mounted on a board, in an electronic component mounting operation of previously measuring the height position of solder paste on the board on which the solder paste has been printed, and mounting the electronic component on the board on which the solder paste has been printed by a loading head, whether the transfer of the solder paste to the solder bumps is necessary or not is judged on the basis of the measurement result of the height of the solder paste. In case that it is judged that the transfer is necessary, the transfer of the solder paste is executed, and thereafter the electronic component is mounted on the board. Hereby, it is possible to prevent the poor joint in case that a thin-sized semiconductor package which causes easily warp deformation is mounted on the board by solder-joint. | 01-15-2009 |
20090020587 | Bonding Method - At a comparatively early stage, members to be bonded are pressurized together by an applied pressure that is a comparatively low pressure. Under an applied pressure condition (a gas venting process) of the comparatively low pressure, an organic protective film is vaporized by heating a bonding material, and a void portion of a porous structure that is formed by metal nanoparticles and a binder in the bonding material is not collapsed any more than necessary due to the applied pressure. Thus, the void portion of the porous structure functions as a degassing path for the gasified organic protective film, and the gas is smoothly released from between the members to be bonded. At the time point when the temperature of the bonding material has reached a predetermined temperature, the applied pressure is increased from the comparatively low pressure to a comparatively high pressure (a pressure increase process). Further, the bonding strength is increased by bonding the members to be bonded together by applying the comparatively high pressure (a bonding process). | 01-22-2009 |
20090020588 | Method for manufacturing product involving solder joining, solder joining apparatus, soldering condition verification method, reflow apparatus, and solder joining method - A method for manufacturing a product involving solder joining wherein components placed on a board on which the components are to be mounted are solder-joined to the board by subjecting the board to reflow heating under prescribed heating conditions, the method comprising: calculating, at each designated site on the board, a component volume that is occupied by the components mounted within a given area; determining the heating conditions in accordance with the calculated component volume; and performing the reflow heating based on the determined heating conditions. | 01-22-2009 |
20090057375 | Method of improving surface roughness of fluid flow conduits within a diffusion bonded fluid flow structure - The present invention relates to a method of diffusion bonding sheets of patterned material to fabricate a fluid delivery system; and particularly relates to a method of improving the interior surface roughness of fluid flow conduits formed within the diffusion bonded fluid delivery system structure. | 03-05-2009 |
20090078742 | Method and a device for Inspecting a pipe connection weld by an ultrasound probe - A method of inspecting a substantially circular circumferential weld for connecting together an inner pipe and a coaxial outer pipe, either directly or via a junction forging, by using an ultrasound probe having a plurality of robotic multibeam piezoelectric emitter-receivers. The method is performed by: a) positioning at least one ultrasound probe inside said inner pipe; b) scanning the various ultrasound beams from the various emitters of said probe while the probe is positioned at a given position; and c) moving said probe in rotation about the axis of said pipe through a given angle corresponding to an arc length less than or equal to the size of the weld defects that are to be detected; and then d) repeating steps b) and c) until the entire circumference of the weld has been inspected. The present invention also provides a device for inspecting a circumferential weld that is suitable for use in a method of the invention. | 03-26-2009 |
20090095794 | Welding system - The present invention relates to a welding system. The welding system comprises: a fixing jig for securely fixing any one of a plurality of to-be-welded objects; a movable jig for moving another of the plurality of to-be-welded objects a movable block for horizontally moving the movable jig; a block driving mechanism for driving the movable block; a position sensor for detecting the position of the movable jig; and a control device for receiving position data from the position sensor to control the block driving mechanism. According to a welding system of the present invention, it is possible sequentially identify the positions of the to-be-welded objects after the melting and shrinkage thereof using a position sensor and determine an optimal welding position of the to-be-welded objects during the welding to thereby realize an optimal finished product. | 04-16-2009 |
20090218386 | Soldering Method, Soldering Apparatus and Method for Manufacturing Semiconductor Device - An object-to-be-soldered ( | 09-03-2009 |
20090289099 | Wire bonding method - A wire bonding apparatus includes a heat block and a heat plate provided on the heat block. A recess is provided in the heat plate to receive the first semiconductor chip and wires without contact therewith when the lead frame is provided on the heat plate such that the first main surface of the lead frame faces toward heat plate. A duct is provided in the heat plate to connect the recess to the outside of the heat plate. A gas supplied through the duct is heated by a heater and discharged into the recess. | 11-26-2009 |
20090294511 | LATERAL POSITION DETECTION FOR FRICTION STIR SYSTEMS - A friction stir system for processing at least a first workpiece includes a spindle actuator coupled to a rotary tool comprising a rotating member for contacting and processing the first workpiece. A detection system is provided for obtaining information related to a lateral alignment of the rotating member. The detection system comprises at least one sensor for measuring a force experienced by the rotary tool or a parameter related to the force experienced by the rotary tool during processing, wherein the sensor provides sensor signals. A signal processing system is coupled to receive and analyze the sensor signals and determine a lateral alignment of the rotating member relative to a selected lateral position, a selected path, or a direction to decrease a lateral distance relative to the selected lateral position or selected path. In one embodiment, the friction stir system can be embodied as a closed loop tracking system, such as a robot-based tracked friction stir welding (FSW) or friction stir processing (FSP) system. | 12-03-2009 |
20100025453 | METHOD AND DEVICE FOR CONTROLLING THE GENERATION OF ULTRASONIC WIRE BONDS - A method for generating a wire bond between a wire and an electrical contact member is provided. The method comprising the steps of: pressing a first surface of a portion of the wire against a second surface of the electrical contact member with a first force while vibrating the portion of the wire along the second surface in order to generate a bond; measuring the time dependent vibration amplitude of the portion of the wire at a number of discrete time steps during the generation of the bond; measuring the time dependent deformation of said portion of the wire due to said applied first force and said vibration at a number of discrete time steps during the generation of the bond; and generating a time dependent first signal from at least said vibration amplitude and said deformation at a number of discrete time steps during the generation of the bond that is a direct measure of the stability of the bond at the respective time step. | 02-04-2010 |
20100051671 | BALL MOUNTING APPARATUS AND METHOD - A device for mounting an array of solder balls to a plurality of substrates of integrated circuits, comprising: a first plate for receiving a first substrate in a loading position; said first plate adapted to translate laterally from a substrate loading position to a flux receiving position; said first plate further adapted to rotate 180° from the substrate loading position to a such that the first plate is in a solder ball receiving position, and; mounting solder balls to the first plate. | 03-04-2010 |
20100108744 | CLOSED LOOP WIRE BONDING METHODS AND BONDING FORCE CALIBRATION - A method of applying bonding energy to form a bond between a portion of a wire and a contact of a bonding location using a wire bonding machine is provided. The method includes: (1) moving a bonding tool towards the contact; (2) detecting when a portion of the contact ( | 05-06-2010 |
20100181366 | CONTROL OF CASE WALL GROWTH DURING REPAIR - A method for repairing a gas turbine engine component includes identifying a distorted feature located in a first portion of the component, identifying a second portion of the component that behaves as at least one of a heat sink or a stiffener, removing the second portion of the component from the first portion, cold working the first portion of the component to repair the distorted feature, heat treating the first portion of the component, and metallurgically joining the first portion of the component to the second portion of the component. | 07-22-2010 |
20100181367 | WIRE BONDING APPARATUS AND WIRE BONDING METHOD - A wire bonding method involves bonding a wire in order at a first bonding point and a second bonding point; raising a capillary, through which the wire is inserted, on the second bonding point; cutting the wire by closing a clamper provided above the capillary at a time when the capillary has reached a prescribed height; and measuring a load incurred on the wire at a time of cutting of the wire | 07-22-2010 |
20110000951 | WIRE PAYOUT MEASUREMENT AND CALIBRATION TECHNIQUES FOR A WIRE BONDING MACHINE - A method of calibrating a wire payout related to predetermined looping motions used during formation of a wire loop is provided. The method includes the steps of: (a) determining a first wire payout length related to predetermined wire looping motions used in the formation of a first of the wire loop, the predetermined looping motions being performed on a first wire bonding system; (b) determining a second wire payout length related to the predetermined wire looping motions used in the formation of a second of the wire loop; and (c) adjusting at least one wire bonding process variable, and repeating step (b) with the at least one adjusted wire bonding process variable such that the second wire payout length determined in the repeated step (b) is closer to the first wire payout length than the second wire payout length determined in the initial step (b). | 01-06-2011 |
20110101073 | AUTOMATIC WIRE FEEDING SYSTEM FOR WIRE BONDERS - Wire is fed to a bonding tool of a wire bonder by a pneumatic device that is operative to urge the wire to feed through an outlet of the pneumatic device towards the bonding tool. A wire clamp is located adjacent to the outlet of the pneumatic device and a wire guider with a hole is located adjacent to the wire clamp between the wire clamp and the bonding tool for threading the wire through the hole before being fed to the bonding tool. | 05-05-2011 |
20110101074 | QUICK CHANGE OVER TOOLING FOR A WELDER - A weld stack includes a horn having a weld end, a polar mount adapted to receive a portion of the horn therein, a first adjustment ring coupled to the polar mount at a pre-determined distance from the weld end of the horn, and a second adjustment ring coupled to the polar mount adjacent the first adjustment ring, wherein the second adjustment ring includes a fine adjustment device for adjusting a relative position of the first adjustment ring and the second adjustment ring. | 05-05-2011 |
20110101075 | Apparatus and methods of attaching hybrid vlsi chips to printed wiring boards - A method for preparing an integrated circuit for connection to a surface, the integrated circuit including lead contacts and leadless contacts, is provided. The method includes providing the integrated circuit, applying a first solder paste to the leadless contacts, forming solder balls on the applied solder paste, heating the solder balls, thereby removing at least a portion of the first solder paste and bringing the solder balls into electrical contact with the leadless contacts, the base of the solder balls being generally aligned in a plane, and bending the lead contacts into gull wings, with the base of the gull wings being substantially coplanar with the plane. The base of the gull wings and the base of the at least one of the solder balls collectively generally define a contact plane for potential future contact with the surface. | 05-05-2011 |
20120080506 | METHOD FOR HOLDING HIGH SPEED FRICTION SPOT JOINING TOOLS - The invention utilizes vibration control, precision manufacturing tolerances for certain components of the system, and techniques for limiting thermal expansion of components, including passive insulation and active cooling techniques, in order to enable high speed tool rotation for Friction Stir Spot Joining of Advanced High Strength Steels. | 04-05-2012 |
20120228363 | PROCESS AND APPARATUS FOR PROVIDING A SOLAR CELL WITH A SOLDER RIBBON - Process and apparatus for providing a solar cell ( | 09-13-2012 |
20120255989 | METHOD OF ESTABLISHING FILLER METAL CHEMISTRY FOR A FILLER ROD FOR JOINING COMPONENTS - A method of establishing filler metal composition for joining components includes determining an initial desired filler metal chemistry, adjoining a first filler rod having a first portion of the desired filler metal chemistry with a second filler rod having a second portion of the desired filler metal chemistry to form a test filler rod, joining a first component formed from a first material to a second component formed from a second material at a weld joint with the test filler rod providing a filler metal portion of the weld joint, and testing the weld joint for desired mechanical, chemical, and weldability properties to establish a desired filler metal composition. | 10-11-2012 |
20120261458 | PROCESS FOR MAPPING FORMIC ACID DISTRIBUTION - A transfer process for bonding a solderable device to a solderable first substrate having a first oxidized surface comprises placing the solderable device proximate to the first substrate in a reducing chamber, where the first surface cannot be visually observed. We place a second substrate having a second oxidized surface in the chamber in a way to visually observe the second surface. Selecting the first substrate and the second substrate so that the reduction of the second surface correlates with the reduction of the first surface provides an indication of the degree of reduction of the first surface. Introducing a reducing agent into the chamber under reducing conditions reduces the surfaces which we track by irradiating and observing the second surface; evaluate any change in the second surface during irradiation and correlate the change with first surface reduction. When sufficiently reduced, we solder the first substrate to the device. | 10-18-2012 |
20120273553 | Systems and Methods For Joining Metal - A metal joining system having a first burner assembly configured to selectively heat a first zone and an assembly support at least partially vertically lower than at least a portion of the first heat zone and a first hood vertically above at least a portion of the assembly support. | 11-01-2012 |
20120305630 | LIVE WELDING METHOD AND ARRANGEMENT FOR ALUMINUM ELECTROLYTIC CELL UNDER SERIES FULL CURRENT - A device using the live welding method for aluminum electrolytic cell overhauling under series full current consists of short-circuit buses at the bottom of the cell ( | 12-06-2012 |
20130119113 | SYSTEM FOR DISPENSING SOFT SOLDER FOR MOUNTING SEMICONDUCTOR CHIPS USING MULTIPLE SOLDER WIRES - An apparatus for dispensing solder onto a substrate for mounting a semiconductor chip on the substrate comprises a dispensing body and first and second dispensing channels extending through the dispensing body. Each dispensing channel is operative to receive a separate solder wire to feed the solder wire to an end of the dispensing body facing the substrate. The dispensing channels are further operative to introduce the solder wires in a solid state simultaneously from the end of the dispensing body to be melted upon contact with the substrate which is heated. | 05-16-2013 |
20130181037 | ELECTRONIC COMPONENT MOUNTING APPARATUS AND THE SAME METHOD THEREOF - A mounting apparatus bonds an electrode of an electronic component and an electrode of a substrate with thermally fusible bond metal to mount the component on a substrate. The apparatus includes a heater base that moves on a path to and from the substrate, a bonding tool, a pedestal to hold the electronic component by vacuum. The bonding tool is heated with a ceramic heater in the heater base to thermally bond the electronic component retained on the pedestal. The bonding tool includes a cooling flow passage providing communication between the upper surface and a side surface of the pedestal. This offers the advantage of shortening the time for cooling during mounting of the electronic component. | 07-18-2013 |
20130341378 | SYSTEM AND METHOD FOR INSPECTING FREE AIR BALL - A system for inspecting a free air ball (FAB) formed during a wire bonding process includes a torch for forming a FAB at a tip of a bonding wire held by a capillary. A camera is positioned near the FAB formation location and captures a color image of the FAB. A ball formation monitor inspects the image to determine a composition of an outer surface of the FAB and inhibits bonding of the FAB to a contact element based on a result of the inspecting. The system is particularly useful for bonding Copper wire plated with Palladium, where bonding of the FAB to the contact element is inhibited if the Copper is exposed. | 12-26-2013 |
20140034708 | SOLAR CELL PAD DRESSING - A process for dressing a solder pad removes excess solder from locations that should be free of solder, such as circuit traces, other solder pads, and components near the solder pad being dressed. A first area of a substrate comprises solder to be removed and is heated to a first temperature. A second area of the substrate is heated to a second temperature. A vacuum nozzle is heated to a third temperature sufficient to melt the solder and is scanned across the area to be dressed, melting and vacuuming away the excess solder. The scanning process is controlled using a computer numerical controlled (CNC) machine. | 02-06-2014 |
20140042208 | METHOD AND APPARATUS FOR MANUFACTURING VEHICLE POWER TRANSMISSION DEVICE - A method for manufacturing a vehicle power transmission device having a case and a ring gear fitted to the outer peripheral surface of the case to transmit drive power from a drive source. The method includes: a welding step in which an annular flange is provided on the case or the ring gear and butt welding is performed by lapping a weld bead along the contact portion of one side surface of the annular flange and the case or the ring gear; a measurement step in which the outline of the other side surface of the annular flange placed in close proximity to the one side surface are measured; and an evaluation step in which a weld condition is evaluated based on part of the outline, which is determined in the measurement step, of a portion corresponding to the lapping portion of the weld bead. | 02-13-2014 |
20140048583 | METHOD FOR HOLDING HIGH SPEED FRICTION SPOT JOINING TOOLS - The invention utilizes vibration control, precision manufacturing tolerances for certain components of the system, and techniques for limiting thermal expansion of components, including passive insulation and active cooling techniques, in order to enable high speed tool rotation for Friction Stir Spot Joining of Advanced High Strength Steels. | 02-20-2014 |
20140131424 | FRICTION STIR WELDING TOOL AND FRICTION STIR WELDING APPARATUS - In a bobbin tool including a first shoulder surface which comes into contact with a front surface of a subject work piece, a second shoulder surface which is disposed so as to face the first shoulder surface and comes into contact with a rear surface of the work piece, and a shaft portion which connects the first shoulder surface and the second shoulder surface to each other with a gap therebetween fixed, the first shoulder surface and the second shoulder surface are provided with a first vortex groove and a second vortex groove which extend toward the front side of a tool rotation direction so as to be opened to the outer peripheral edge as it moves to the outer peripheral side. | 05-15-2014 |
20140197226 | METHODS FOR DETERMINING A MINIMUM WELD DISTANCE FOR ADHESIVES - A method of manufacturing a vehicle frame assembly, includes: (i) receiving threshold temperature data for an adhesive; (ii) defining an adhesive zone wherein which adhesive will be applied with respect to a first and second vehicle structural member; and (iii) determining a minimum distance a weld can be applied on the first structural member with respect to the adhesive zone based on empirical data. | 07-17-2014 |
20140263577 | JOINING METHODS AND TEMPERATURE CONTROLLED FLUID TREATING SYSTEMS FOR JOINING - Methods for joining material to an article comprising one or more passageways include fluidly connecting a temperature controlled fluid source comprising temperature controlled fluid to at least one passageway and passing the temperature controlled fluid through the at least one passageway, wherein the temperature controlled fluid at least partially controls a temperature profile of the article. The methods further include joining material to the article, wherein the temperature profile of the article at least partially controls a resulting joined material characteristic. | 09-18-2014 |
20140263578 | MULTI-COMPONENT NOZZLE SYSTEM - A pick-and-place machine and method includes use of a passive component feeder cartridge including a feeder gear. Rotation of the feeder gear causes a component-bearing tape to be fed through the feeder cartridge. A pickup head includes a vacuum nozzle to pick up the components from the tape and a rack gear to engage and drive the feeder gear of the feeder cartridge via translational motion of the pickup head when operatively disposed with respect to a selected feeder cartridge. | 09-18-2014 |
20140312096 | OXY-FUEL WELD REPAIR OF METALLIC COMPONENTS - A method of repairing a metallic component is disclosed. The method may include machining away a damaged first portion of the component, and machining away a second portion of the component adjacent the damaged first portion, the second portion being an area that would be subject to distortion resulting from solidification of molten weld material added to repair the damaged first portion. The method may also include inserting a dam made of a high-temperature-resistant material adjacent the machined away second portion to contain molten weld material added to the machined away second portion. Oxy-fuel welding may be performed to at least partially fill the machined away damaged first portion of the component and the machined away second portion of the component, and final machining of the welded portions may be performed. | 10-23-2014 |
20140326780 | WELDING DEVICE FOR MASK FRAME ASSEMBLY AND METHOD OF WELDING MASK FRAME ASSEMBLY - A welding device for a mask frame assembly, includes a chamber maintained in a vacuum state, a mask frame disposed in the chamber, a support frame disposed in the chamber and configured to support the mask frame, a mask disposed in the chamber and configured to be welded to the mask frame, a tensile unit disposed in the chamber, installed on the support frame and configured to apply a tensile force to stretch the mask; and a welding unit disposed in the chamber and configured to weld the mask frame and the mask to each other. | 11-06-2014 |
20160052830 | APPARATUS AND METHOD FOR PRODUCING (METAL PLATE)-(CERAMIC BOARD) LAMINATED ASSEMBLY, AND APPARATUS AND METHOD FOR PRODUCING POWER-MODULE SUBSTRATE - Provided are: an apparatus and a method for producing a (metal plate)-(ceramic board) laminated assembly, a bonding material and a metal plate during the bonding of the metal plate to the ceramic board through the bonding-material layer and an apparatus and a method for producing a power-module substrate. An apparatus for producing a (metal plate)-(ceramic board) laminated assembly by laminating a metal plate having a temporary bonding material formed thereon on a ceramic board having a bonding-material layer formed thereon, the apparatus being equipped with: a conveying device which conveys the metal plate onto the ceramic board to laminate the ceramic board and the metal plate on each other; and a heating device which is arranged in the middle of a passage of the conveyance of the metal plate by the conveying device and melts the temporary-bonding material on the metal plate. | 02-25-2016 |
20180021881 | APPARATUS AND METHOD FOR MOBILE FRICTION STIR WELDING OF TWO TUBULAR STRUCTURES | 01-25-2018 |
228104000 | Nondestructive testing | 38 |
20080296348 | Heater for select solder machine - A select solder machine configured to solder a circuit board using a solder material. The select solder machine includes a solder head movable with respect to the circuit board. The solder head is configured to position the solder material with respect to the circuit board to solder the circuit board. The select solder machine further includes a support member configured to support the circuit board in a position adjacent the solder head, and a heating member configured to heat the circuit board. The heating member is located above the circuit board. | 12-04-2008 |
20090090767 | METHOD AND SYSTEM FOR RESTORING PARENT METAL PROPERTIES ACROSS WELDS - A method, with an associated system, for providing a cast component comprises annealing heat treatment to reduce casting stresses; initial machining the cast component; initial nondestructive testing (NDT) the machined cast component to identify NDT indications in the cast component; treating and removing NDT indications from the machined cast component; weld upgrading the treated and removed NDT indications from the machined cast component, the weld upgrading providing stress relief; intermediate nondestructive testing the cast component to identify NDT indications in the weld upgraded cast component; normalizing and temper heat treatment of the cast component; second intermediate nondestructive testing the cast component to identify NDT indications in the cast component; further treating and removing NDT indications from the cast component; post-normalization and temper weld upgrading the treated and removed NDT indications providing stress relief; and final nondestructive testing the cast component to identify NDT indications in the cast component. | 04-09-2009 |
20090140026 | Method and Apparatus for Inspecting Joined Object Formed by Friction Stir Joining - This invention provides a method for inspecting a joined region and joining strength of a joined object formed by a spot friction stir joining process. In this method, an ultrasonic wave is introduced into the joined object from a backing face | 06-04-2009 |
20100127045 | BOND HEAD FOR HEAVY WIRE BONDER - A bonding apparatus for bonding a length of wire comprises a first module which is drivable along a linear axis towards and away from a bonding point and a second module slidably mounted to the first module. A wire cutter is mounted to the first module and a bonding tool is mounted to the second module. A coupling mechanism is operative to lock the second module in fixed relative position to the first module, and to unlock the second module from its fixed relative position to the first module so that the second module is slidable relative to the first module in directions parallel to the linear axis. | 05-27-2010 |
20100147924 | JET STACK BRAZING IN A DIFFUSION FURNACE - A method and apparatus for batch brazing jet stacks in a diffusion furnace. The method may include inserting fusible parts into slots of quartz boats and transporting the quartz boats into an interior of a reaction chamber of a diffusion furnace. An operator may seal the interior of the reaction chamber and an atmosphere of the interior of the reaction chamber may be adjusted according to a brazing recipe. A preheated furnace heating element may be moved toward the reaction chamber to increase a temperature and the fusible parts may be brazed according to the brazing recipe. The furnace heating element may then be moved away from the reaction chamber, the chamber unsealed, and the brazed parts removed. | 06-17-2010 |
20100230472 | ELECTRONIC COMPONENT MOUNTING SYSTEM AND ELECTRONIC COMPONENT MOUNTING METHOD - In a mounting system having a height measuring instrument for measuring the height of solder paste printed on the electrodes and an electronic component placing apparatus, whether the height of solder paste is right or wrong is determined based on the measurement result of measuring the height of solder paste printed on the electrode. Further, whether or not the transfer of solder paste to the solder bump is required based on the determination result, and if it is determined that the transfer is required, the paste is transferred to an electronic component held in a mounting head. Thereby, the mounting quality can be assured by adding adequately an amount of solder in treating the board causing a shortage of the solder amount due to printing failure. | 09-16-2010 |
20100243714 | METHOD OF ASSEMBLING METAL PARTS BY FRICTION WELDING, WITH THE WELDING TEMPERATURE BEING CONTROLLED USING THERMALLY CONDUCTIVE ELEMENTS - The invention provides a method of assembling together two thin plane parts ( | 09-30-2010 |
20100320256 | METHOD AND APPARATUS FOR TESTING SOLDERABILITY OF ELECTRICAL COMPONENTS - The described embodiments relate generally to methods and apparatus for use in determining solderability of an electrical component. One particular aspect relates to apparatus comprising a vacuum chamber, a load sensor, a platform and a control module. The load sensor has a contact portion disposed within the vacuum chamber and the platform is disposed in relation to the contact portion and has a component mounting surface and a mounting member for mounting an electrical component to the component mounting surface. The control module causes relative movement between the platform and the load sensor so that a contact surface of the electrical component is brought into close proximity with the contact portion. When the contact portion has solder thereon and the solder is brought into contact with the contact surface, the load sensor measures force arising from wetting of the solder to the contact surface. The force generated under contact changes over time, depending on the degree of solderability of the electrical component. Thus, measurement of the wetting forces over time provides an indication of the solderability of the electrical component. | 12-23-2010 |
20110024482 | FLUXOMETER SYSTEM AND METHOD - A fluxometer system and method is provided. The fluxometer comprises a frame, a simulated circuit board disposed in the frame and having a plurality of holes formed therein extending generally transverse to a plane of the board and a cover. The cover is received on the frame over the simulated circuit board and includes several protrusions simulating leads that extend into the holes of the simulated circuit board. The fluxometer further includes an indicator sheet disposed between the simulated circuit board and the cover, the protrusions extending through the indicator sheet. | 02-03-2011 |
20110180589 | METHOD OF RESTORING A METALLIC COMPONENT - A component is repaired by removing a damaged region to form a cavity, in which layered repair inserts are installed. The profile of the cavity, and of the exposed surface of each repair insert is measured to serve as the basis for the contact surface of each subsequent repair insert. The repair inserts are fused to the wall of the cavity and to each other in a process in which heated locations of each repair insert are successively heated to minimise heat transfer within the repair inserts and in the underlying substrate material. The repair inserts may be made in a powder bed process from an alloy powder having the same composition as the material of the substrate. | 07-28-2011 |
20110226839 | JET STACK BRAZING IN A DIFFUSION FURNACE - A method and apparatus for batch brazing jet stacks in a diffusion furnace. The method may include inserting fusible parts into slots of quartz boats and transporting the quartz boats into an interior of a reaction chamber of a diffusion furnace. An operator may seal the interior of the reaction chamber and an atmosphere of the interior of the reaction chamber may be adjusted according to a brazing recipe. A preheated furnace heating element may be moved toward the reaction chamber to increase a temperature and the fusible parts may be brazed according to the brazing recipe. The furnace heating element may then be moved away from the reaction chamber, the chamber unsealed, and the brazed parts removed. | 09-22-2011 |
20120012644 | APPARATUS AND A METHOD OF DETERMINING THE QUALITY OF A FRICTION WELD - A method of determining the quality of a friction weld between two components, the method comprising joining two components together using a friction welding process, measuring the loss of length of the components as a function of time during the friction welding process, determining the double differential with respect to time of the loss in length of the components as a function of time, determining the quality of the friction weld by calculating the R | 01-19-2012 |
20120055976 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND WIRE BONDING APPARATUS - A terminal of a compact wire loop with a great strength of bonding is formed by a method including: a first folding step in which a tip end of a capillary is raised by a height of H | 03-08-2012 |
20120085811 | Methods for Manufacture and Use of Composite Preform Having a Controlled Fraction of Porosity in at Least One Layer - The invention provides clad billet for hot working plastic deformation processes for the production of clad products, including, but not limited to, clad pipe and tubing by extrusion of a hollow, bicomponent composite billet having a fully dense structural component and a partially dense component of a specialty alloy at a fraction of porosity predetermined to provide a flow stress compatible with that of the structural component. The components are diffusion bonded to the predetermined fraction of porosity in the specialty component by application of heat and pressure over time, including by hot isostatically pressing the billet components. Computer modeling techniques can be used to determine processing conditions for obtaining flow stress compatibility. | 04-12-2012 |
20120168490 | JET STACK BRAZING IN A DIFFUSION FURNACE - A method for batch brazing in a diffusion furnace includes inserting a plurality of fusible parts into a plurality of slots of at least one quartz boat, transporting the at least one quartz boat, including the fusible parts, into an interior of a reaction chamber of the diffusion furnace, sealing the interior of the reaction chamber, adjusting an atmosphere of the interior of the reaction chamber according to a recipe, moving a preheated furnace heating element from a location spaced apart from the reaction chamber to a location in substantial proximity with the reaction chamber to increase a temperature of the atmosphere of the interior of the reaction chamber above a predefined brazing temperature for a predefined brazing time period according to the recipe. | 07-05-2012 |
20120292376 | METHOD FOR THE QUANTITATIVE DETERMINATION OF SOLDERING AGENT RESIDUES - A method for quantitatively determining flux material residues remaining on a heat exchanger after a preceding soldering process is provided. To this end, a fluid is applied to the heat exchanger, wherein the remaining quantity of flux material on the heat exchanger after the preceding soldering process is derived from the concentration of soldering agent in the fluid. | 11-22-2012 |
20120312863 | SEMICONDUCTOR BONDING APPARATUS - An apparatus includes a tool head configured for bonding to establish 100 or more electrical and mechanical connections between a silicon chip having a thickness of about 50 microns (μm) or smaller and a substrate, wherein 100 or more solder bumps set on a plurality of contacts on the silicon chip or a plurality of contacts on the substrate are melted by heating between the plurality of contacts of the silicon chip and the substrate, and wherein the melted solder bumps are solidified by cooling using forced convection of air flowing from around the silicon chip. The tool head includes a pyrolytic graphite sheet configured to be used in direct contact with the silicon chip, and having a thickness between about 75 μm and 125 μm. | 12-13-2012 |
20130001274 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - To improve reliability of a semiconductor device, in a flip-chip bonding step, a solder material that is attached to a tip end surface of a projecting electrode in advance and a solder material that is applied in advance over a terminal (bonding lead) are heated and thereby integrated and electrically connected to each other. The terminal includes a wide part (a first portion) with a first width W | 01-03-2013 |
20130105557 | QUALITY STATUS DISPLAY FOR A VIBRATION WELDING PROCESS | 05-02-2013 |
20130119114 | METHOD AND APPARATUS FOR MONITORING FREE AIR BALL (FAB) FORMATION IN WIRE BONDING - A method for monitoring free air ball (FAB) formation during a wire bonding process includes attaching a dummy bond wire to an unused location on a first surface of a semiconductor chip carrier, extending the dummy bond wire a predetermined distance from the first surface such that a tip of the dummy bond wire is spaced from the first surface, and forming a dummy FAB at the tip of the bond wire. A profile of the dummy FAB is inspected with an imaging unit to identify any defects in the dummy FAB. An alarm is triggered and the wire bonding process is halted if the dummy FAB is defective so that bonding parameters may be adjusted. The wire bonding process is restarted after the bonding parameters have been adjusted. | 05-16-2013 |
20130221073 | METHOD AND SYSTEM FOR RETREADING TRACK WHEEL - A wheel resurfacing method and system for resurfacing a worn track wheel to its original profile are disclosed. The system comprises a support for maintaining the worn railway wheel, a welding device, a controller, and a surface processing device. The worn railway wheel's circumferential surface defining a flange and a tread surface is reconstituted using a welding material. The welding device and the worn railway wheel rotate one relative to the other at a predetermined rate to adaptively aggregate annular welding beads along the circumferential surface to form a curvilinear profile slanted away from the flange. A surface processing device is then applied to the welded layer to form a substantially uniform surface to reconstitute the worn railway wheel to its original profile. | 08-29-2013 |
20140069984 | SYSTEM FOR FRICTION STIR WELDING INCLUDING A MOBILE COUNTER-BEARING - System for friction stir welding of two parts which includes a welding unit which includes at least one welding head fitted with a rotating pin and a counter-bearing unit which has a support surface to support the parts against a pressure exerted by the welding head, and wherein each welding head can be moved relative to the support surface in a first direction parallel to an axis of rotation of the rotating pin and in a second direction orthogonal to the axis of rotation, and wherein the support surface can be moved in the second direction and is formed of two coaxial clamp rollers which are set apart from each other. | 03-13-2014 |
20140097229 | METHOD FOR WELDING A FLANGE TO A GUIDE THIMBLE TUBE IN NUCLEAR FUEL ASSEMBLY - Disclosed therein are an apparatus for and a method of welding a flange to a guide thimble tube in a nuclear fuel assembly. The automatic welding apparatus includes a welding unit located on an axially conveying line of a tube for welding a surface of the tube inserted thereinto and a surface of a flange, a flange supplying unit for supplying the flange at a tube inlet of the welding unit onto the axially conveying line, and a conveying unit mounted on the axially conveying line in such a way as to move the tube and the flange on the axially conveying line, so that they are inserted into and drawn from the welding unit. | 04-10-2014 |
20140103096 | WIRE BONDING MACHINE AND METHOD FOR TESTING WIRE BOND CONNECTIONS - A wire bonding machine and a method for testing wire bond connection s using the wire bonding machine. The method includes providing a semiconductor assembly that has a semiconductor die mounted to a substrate, each of which has bonding pads. The method includes bonding a wire to one of the bonding pads to form a first wire bond. A shear force then is applied to the first wire bond. A fault signal is generated when a sensor detects the first wire bond moving during application of the shear force. | 04-17-2014 |
20140131425 | METHOD OF DETECTING WIRE BONDING FAILURES - Disclosed is a method of detecting a bonding failure of a wire bonder, which comprises a bonding tool operative to form an electrical connection between a semiconductor die and a substrate using a bonding wire. The method comprises the steps of: forming a first wire bond on a first surface located on the semiconductor die using the bonding tool and the bonding wire; forming a second wire bond on a second surface located on the substrate using the bonding tool and the bonding wire such that a wire loop connects the first and second wire bonds, wherein the first surface is not electrically-conductive; moving the bonding tool in a direction away from the second wire bond to break the bonding wire from the second wire bond; detecting whether the second wire bond remains bonded to the substrate; and determining an occurrence of the bonding failure if the second wire bond is no longer bonded to the substrate. | 05-15-2014 |
20140151438 | APPARATUS TO JOIN TUBULARS USING FRICTION STIR JOINING - A system and method for repairing and/or joining together multiple lengths of tubulars using friction stir joining, and a system for manipulating the tubular so that friction stir joining may be performed while the tubular is on a reel and/or at a field site. | 06-05-2014 |
20140191016 | Tubular Friction Welding Joining Method without Rotation of the Tubulars - Tubulars are joined to each other without rotation of the tubulars. A coupling is placed between the aligned tubulars and is supported for rotation or oscillating about its longitudinal axis. The tubulars are clamped in a manner that allows a compressive force to be transmitted to the coupling as the coupling is rotated. An induction device can preheat each connection site before friction welding and/or provide heat as the connection is made and is allowed to cool down. The process can continuously create a string of casing or liner that can be run in or drilled into a wellbore. | 07-10-2014 |
20140209664 | METHOD OF MANUFACTURING AN ELECTRONIC DEVICE - A method of manufacturing an electronic device includes a positioning step of positioning a first member supporting a laser diode with respect to a second member having a waveguide, a bonding step of bonding the first member and the second member together, and a checking step of checking the accuracy of positioning of the first member with respect to the second member. In the positioning step, the laser diode is energized to allow laser light to be emitted, and the laser light is allowed to be incident on the incidence end of the waveguide. In the bonding step, a bonding material is melted by irradiating the first member with heating light while the laser diode is not energized. In the checking step, the laser diode is energized again. | 07-31-2014 |
20140217153 | BONDING APPARATUS AND BONDING METHOD - To provide a bonding apparatus capable of increasing product quality by realizing high-precision control of a pressing force applied upon mounting of an electronic component on a substrate by bonding, and to a bonding method capable of providing high-quality products stably. The bonding apparatus includes: at least a bonding head | 08-07-2014 |
20140284374 | CARRIER WITH A TEST SURFACE WETTABLE WITH LIQUID SOLDER AND METHOD FOR APPLICATION THEREOF - A carrier plate has test areas for the assessment of a selective soldering process. The carrier plate has different zones, which are provided with peripheral borders. The zones are not wettable with solder, while the peripheral borders are wettable. if a selective soldering head is brought up to the reference areas, then, as long as there is no deficiency in quality, the respective peripheral border must be just wetted with solder, whereby an assessment of the selective soldering process is possible. The test plate advantageously makes a simple optical evaluation possible, for example by visual inspection. | 09-25-2014 |
20150090771 | METHOD AND SYSTEM FOR FABRICATING A MODULE - A method of fabricating a module for an airframe or fuselage structure of an aircraft or spacecraft includes positioning a first member adjacent to a second member at an assembly station; welding the first member to the second member at the assembly station to produce a module having a welded joint between the first and second members; and peening at least one of the first member, the second member, and the welded joint at the assembly station to compensate for or to correct distortion caused by the welding. | 04-02-2015 |
20150115018 | CONDUCTIVE PASTE AND DIE BONDING METHOD - Provided are: a conductive paste in which sinterability of silver particles the conductive paste can be easily controlled by using silver particles having predetermined crystal transformation characteristics defined by an XRD analysis, and after a sintering treatment, excellent electrical conductivity and thermal conductivity can be stably obtained; and a die bonding method using the conductive paste. | 04-30-2015 |
20150129645 | PROTECTIVE STEEL MEMBRANE SYSTEM AND METHOD OF RAPID INSTALLATION OF SECONDARY CONTAINMENT FOR AN ABOVE GROUND STORAGE TANK - An efficient, cost-saving system and method of designing, installing, testing, and monitoring a secondary containment system for new and existing Above Ground Storage Tanks (ASTs) that is comprised of a protective steel membrane for the floor of the tank, including the floor-to-wall juncture, and the lower portion of the tank shell such that the steel membrane creates one or more interstitial zones between the steel membrane and the tank shell. The steel membrane may be installed zone by zone such that the secondary containment system can encapsulate existing tank features by molding itself around the existing contours, such as repair plates, corners, sumps, etc. Furthermore, a unique testing method using a simple electronic device is provided for on-site testing of the integrity of the weld seams that may be efficiently used after each zone is installed without requiring that the entire tank be evacuated during the construction of other zones. | 05-14-2015 |
20150136838 | METHOD FOR SHAPING A LAMINATE SUBSTRATE - A method including providing a laminate substrate, characterizing the laminate substrate for warpage characteristics, determining a horizontal plane distortion based on the warpage characteristics, and placing the laminate substrate into a fixture with an adjustment to correct the horizontal plane distortion, the adjustment being located in a center of the laminate substrate, wherein the adjustment contacts the laminate substrate. The method may further include fluxing the laminate substrate, placing a chip onto the laminate substrate, and placing the fixture into a reflow furnace to join the chip and the laminate substrate. | 05-21-2015 |
20150352652 | SOLDERING JIG AND METHOD - A soldering jig comprises a shaped hole that fits a corresponding battery terminal, such as a square battery terminal, and provides a cavity for insertion of a solder wire. An opposite side from the cavity for insertion of the solder wire provides a blind hole for insertion of one end of the solder wire and a template for bending and cutting the solder wire to a correct length. Once cut, the solder wire is inserted into the cavity and is resiliently retained until the solder wire and jig are inverted and placed onto a hot battery terminal. Under pressure and residual heat the hot battery terminal, the solder wire melts, soldering an interface. | 12-10-2015 |
20160011061 | SOLDER ASSEMBLY TEMPERATURE MONITORING PROCESS | 01-14-2016 |
20160114437 | A METHOD OF JOINING WORKPIECES - A method of joining workpieces includes locating first ends of two first workpieces in a moveable part coupling portion. The lengths of the first workpieces are measured. Any difference in length between the first workpieces is determined. Two additional workpieces are located adjacent the first ends of the first workpieces based on the determined difference in length. The first workpieces are connected to the second workpieces. | 04-28-2016 |
20160158895 | Luminescent Braze Preforms - A braze preform is provided that includes a filler metal and a luminescent material that covers at least a portion of the filler metal and that can luminesce when exposed to a black light. The luminescent material may include a luminescent ink and a solvent that are mixed together before being applied to filler metal. Presence of the braze preform may be determined using automated equipment by detecting luminescence of the braze preform with a sensor. A decision may be made on whether to advance a parts assembly for brazing based on the determination of presence or absence of the braze preform on such parts assembly. | 06-09-2016 |
228105000 | Using optical viewing means (e.g., microscope) | 6 |
20090078743 | WIRE BONDING SYSTEM UTILIZING MULTIPLE POSITIONING TABLES - A wire bonding apparatus and method in which separate first and second positioning tables are provided for mounting electronic devices to be wire bonded, and a bonding tool is provided at a bonding position for bonding the electronic devices. First and second loading/unloading positions are provided for loading electronic devices to or unloading electronic devices from the positioning tables. The first and second positioning tables are operative to move independently of each other, such that the first positioning table is movable between the first loading/unloading position and the bonding position and the second positioning table is movable between the second loading/unloading position and the bonding position. | 03-26-2009 |
20100301101 | BONDING APPARATUS AND BONDING STAGE HEIGHT ADJUSTMENT METHOD FOR THE BONDING APPARATUS - A bonding apparatus includes: a reference plane; a bonding arm configured to be rotated about a rotation center that is arranged separately from the reference plane and to move a capillary attached at a tip end thereof obliquely toward and away from the reference plane; and an imaging device for optically detecting bonding positions on a semiconductor chip and/or a lead frame, in which an angle between an optical axis being heading for the imaging device from the reference plane and the reference plane is approximately equal to an angle between a motion trajectory of a tip end of the capillary and the reference plane, and thereby the bonding apparatus can have a wide bonding area with a simple mechanism as well as perform high-speed and high-accuracy bonding. | 12-02-2010 |
20110226840 | NANO-SOLDERING TO SINGLE ATOMIC LAYER - A simple technique to solder submicron sized, ohmic contacts to nanostructures has been disclosed. The technique has several advantages over standard electron beam lithography methods, which are complex, costly, and can contaminate samples. To demonstrate the soldering technique graphene, a single atomic layer of carbon, has been contacted, and low- and high-field electronic transport properties have been measured. | 09-22-2011 |
20120228364 | METHOD AND APPARATUS FOR PRINTING A SUBSTRATE, IN PARTICULAR A PRINTED CIRCUIT BOARD, WITH A PRINTING PASTE - The present invention relates to a method for printing a substrate, in particular a printed circuit board, with a printing paste, in particular a solder paste, comprising the following steps: —applying a printing screen to the substrate, —printing the substrate using screen printing technology through openings in the printing screen so as to achieve at least one printed structure consisting of printing paste, —separating the printing screen and the substrate by lifting these parts off from one another, —inserting an optical inspection unit between the printing screen and the substrate, —checking the printed structure in terms of the printing paste thickness thereof by means of the inspection unit, —ending the printing when the result of the printing corresponds to at least one preset value. The invention furthermore relates to an inspection unit ( | 09-13-2012 |
20120273554 | SOLAR SUBSTRATE RIBBON BONDING SYSTEM - An ultrasonic solar substrate bonding system is provided. The system includes a bond head assembly including a bonding tool for bonding a ribbon material to a plurality of solar substrates. The system also includes a ribbon feeding system successively supplying portions of a continuous length of the ribbon material to the bonding tool such that the bonding tool forms ultrasonic bonds between the portions of the continuous length of the ribbon material and a plurality of solar substrates. | 11-01-2012 |
20130248583 | REFLOW INSPECTION SYSTEM AND CONTROL METHOD THEREOF - Disclosed herein is a reflow inspection system. The reflow inspection system according to an embodiment of the present invention includes an oven, a stage on which a reflow inspection target is placed inside the oven, and which includes a temperature detecting sensor for detecting a temperature of the reflow inspection target formed on one side thereof; a light source unit formed on one side of the oven and irradiating the reflow inspection target with light, an imaging unit sucking smoke generated in the reflow inspection target, and obtaining image information of the reflow inspection target to thereby transmit the obtained image information to the outside, an image processing unit processing the image information obtained in the imaging unit, and a control unit connected to the stage, the temperature detecting sensor, and the image processing unit to perform control of a reflow inspection process. | 09-26-2013 |