Entries |
Document | Title | Date |
20080217378 | Device for Centering and Clamping Tubular Parts, Comprising Means for the Real-Time Mesurement and Regulation of the Moisture Content - The invention relates to a device for centring and clamping conduits which are preferably made from alloy steel and which are positioned end to end in order to be welded to form a pipeline. The invention comprises: means for centring and clamping two conduits that are to be welded, optional leak-tight patition means which define an inerting chamber at the mating surface, and inert gas distribution means for creating a protective atmosphere at the mating surface. The inventive device also comprises at least means for the real-time measurement of the moisture content of the protective atmosphere and means ( | 09-11-2008 |
20090014499 | AUTOMATED PREFORM ATTACH FOR VACUUM PACKAGING - Systems and methods for automatically attaching preforms to substrates. An example system includes a nest, a first component that places a substrate into the nest, a second component that places a preform on the substrate in the nest, a tacking device that tacks the preform to the substrate, a plurality of sensors that sense operational states of the components and the tacking device, and a controller that automatically controls operations of the components and the tacking device based on the sensed operational states. | 01-15-2009 |
20090014500 | Weight Balancer and Pipe Joining Method - The present invention relates to a weight balancer ( | 01-15-2009 |
20090020586 | SEMICONDUCTOR DEVICE BONDING APPARATUS AND METHOD FOR BONDING SEMICONDUCTOR DEVICE USING THE SAME - The semiconductor device bonding apparatus | 01-22-2009 |
20090127315 | APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - An apparatus for manufacturing a semiconductor device is provided. The apparatus has a bonding head, a stage, and a system for appropriately setting the amount of a descending movement of the bonding head. The bonding head incorporates a heater. A camera is capable of capturing an image of a gap between the bonding head and the stage under the condition that the bonding head holds a first bonding object and the stage has a second bonding object mounted thereon and before the first and second bonding objects come in contact with each other. A controller calculates the amount of the descending movement of the bonding head based on the image captured by the camera, and causes the bonding head to descend based on the calculated amount of the descending movement. | 05-21-2009 |
20090152325 | Method for consolidating and sealing a tube - The invention refers to a procedure for consolidating and sealing a tube, whereby the tube is positioned between a sonotrode and an associated anvil of an ultrasonic welding device, the sonotrode being activated and displaced relative to the counter electrode for consolidating and sealing the tube. In order to enable automatic consolidating and sealing of a tube without individually entering the data of the tube into an ultrasonic welding device in advance, the following steps are proposed:
| 06-18-2009 |
20090188966 | ULTRASONIC PRESS USING SERVO MOTOR WITH DELAYED MOTION - An ultrasonic welding method includes the acts of pressing an ultrasonic welding stack mounted for linear movement against a first workpiece using an electrical servo motor, applying a predetermined initial load to the first workpiece, and initiating a weld, the initiating of the weld comprising outputting energy from the ultrasonic welding stack to the first workpiece. The method further includes sensing, with at least one sensor, a control variable, outputting a signal corresponding to the sensed control variable to a controller, simultaneously outputting energy from the ultrasonic welding stack to the first workpiece and maintaining a weld distance at or near zero until the signal corresponding to the sensed control variable satisfies a predetermined condition, and applying a controlled force, speed, or a combination of force and speed to said first workpiece with an electrically powered linear actuator to urge said first workpiece against a second workpiece to which said first workpiece is to be joined following satisfaction of said predetermined condition. | 07-30-2009 |
20090188967 | Vapor-Operated Soldering System and Vapor Generation System for a Soldering System - A method is provided for a soldering process. The method can include receiving a liquid phase heat transfer medium at a preheating container. The heat transfer medium can be received from an external supply. The method can also include heating the heat transfer medium to or above a predefined temperature that maintains the liquid phase and directing the heated heat transfer medium from the preheating container to an evaporation container. In the evaporation container, the heat transfer medium can be vaporized to convert the heat transfer medium from the liquid phase to a gas phase. Further, the method can include directing the gas phase heat transfer medium from the evaporation container to a solder chamber. The soldering process occurs in the solder chamber. | 07-30-2009 |
20090255980 | CONTROL SYSTEMS FOR FRICTION STIR WELDING OF TITANIUM ALLOYS AND OTHER HIGH TEMPERATURE MATERIALS - Control systems, methods, and algorithms are provided for controlling the process parameters during FSW in order to repeatedly produce high quality welds for high temperature alloys such as titanium alloys and superalloys. In accordance with exemplary embodiments of the present invention, a desired range of forge load, pinch load, and/or travel load can be reliably maintained in a FSW system by adjusting the rotational speed thereof. In other embodiments, a desired temperature range of the tool or weld can be maintained by adjusting a plunge depth of pin tool for conventional FSW or distances between upper and lower shoulders for self-reacting FSW processes. Other embodiments of the present invention provide methods and/or apparatus suitable for rotational control and/or plunge depth control for FSW of titanium alloys and/or other high temperature alloys such as super alloys. | 10-15-2009 |
20090289098 | Chip Mounting Apparatus and Chip Mounting Method - A chip mounting apparatus is provided with a drive control means. The drive control means is provided with a tool holder whereupon a tool for applying pressure to a chip is mounted, a holder supporting means for supporting the tool holder to be vertically moved, a drive means for vertically moving the holder supporting means, and a position detecting means for detecting a relative position of the tool holder to the holder supporting means. The drive control means controls the height and the pressurizing force of the tool, based on the position of the tool holder when the tool and the chip are one over another and brought into contact with a substrate. A chip mounting method is also provided. Short-circuit failures between adjacent solder bumps can be prevented and chips can be mounted with high yield and reliability. | 11-26-2009 |
20090314822 | METHOD OF CONTROLLING THE TRAJECTORY OF A BONDING TOOL DURING THE FORMATION OF A WIRE LOOP - A method of determining a trajectory of an arc motion of a wire used in the formation of a wire loop is provided. The arc motion is between a first point and a second point of the trajectory. The method includes: ( | 12-24-2009 |
20090321499 | ELECTRONIC COMPONENT MOUNTING APPARATUS AND ELECTRONIC COMPONENT MOUNTING METHOD - The present invention aims at providing an electronic component mounting apparatus and an electronic component mounting method that perform automated setting of a thickness of a paste film. | 12-31-2009 |
20100001042 | COMPONENT-MOUNTED BOARD PRODUCTION APPARATUS AND POSITION CONTROL METHOD FOR ELECTRONIC COMPONENTS IN COMPONENT-MOUNTED BOARD PRODUCTION APPARATUS - The electronic component mounting line includes computing unit for calculating a print position of solder paste printed on board-side electrodes, electronic component placement device for placing an electronic component onto the board-side electrodes by referencing the print position of the solder paste, placement position control device for controlling the placement position of the electronic component by referencing the print position of the solder paste, bonding device for melting the solder paste to bond the electronic component and the board-side electrodes to each other, and mounting-position control device for controlling the mounting position of the electronic component by referencing the board-side electrode position. In this configuration, position control responsive to a displacement of the electronic component by the self alignment effect exerted by the molten solder paste is fulfilled. | 01-07-2010 |
20100006624 | SOLDERING METHOD AND SOLDERING APPARATUS - Along with miniaturization of a solder connection portion in a bump repair or a local reflow, a void generated at the time of soldering remains in a solder to remarkably reduce connection strength, and there occurs a non-connection phenomenon in which the solder connection portion and a solder paste are melted, but are not fused with each other. During melting of a solder, a target component is clamped, ultrasonic oscillation is directly applied only to the target component. Further, start of solidification of the solder connection portion is detected by change of an electric impedance of a transducer while applying the ultrasonic oscillation, and the clamp is released before a substrate is warped. | 01-14-2010 |
20100038406 | ULTRASONIC BONDING APPARATUS - An ultrasonic bonding apparatus includes an ultrasonic bonding unit, and a wiping unit configured to wipe out pre-cured underfill that has adhered to a tool surface of a head, by using a wiping member. The ultrasonic bonding unit includes a first driver configured to drive the head to press an electronic component upon a substrate, and an ultrasonic generator. The wiping unit includes a wiping table used to wipe out the tool surface, a feed mechanism configured to supply a wiping member to the wiping table and to roll up the wiping member, a cartridge configured to house the wiping table and the feed mechanism, and a second driver configured to drive the cartridge in the plane. The first driver is configured to press the head upon the wiping member on the wiping table. | 02-18-2010 |
20100044414 | TURNTABLE WELDING SYSTEM WITH LIGHT CURTAIN PROTECTION - A robotic welding system is provided that includes multiple welding cells equidistantly spaced in a circular arrangement, multiple perimeter light curtains to provide safety protection around the welding cells, a turntable centrally located in the circular arrangement, and multiple welding robots attached to the turntable. The welding system further includes a first welding process and a second welding process whereby both the first welding process and the second welding process each include a primary welding operation and a secondary welding operation whereby the turntable rotates between the welding cells to perform the primary and secondary welding operations. | 02-25-2010 |
20100051670 | Wire bonding device and wire bonding process using same - A wire bonding device conducts: detecting Z-axis moving speed of the capillary in a predetermined bonding position on a coupling terminal and controlling the Z-axis movement of the capillary by a moving mechanism if the Z-axis moving speed of the capillary is equal to or lower than a predetermined threshold; calculating a displacement in the Z-axis position after the Z-axis moving speed of the capillary reaches equal to or lower than the threshold on the basis of time-dependent change of the Z-axis position of the capillary; detecting a non-stick of the wire on the basis of a conducting condition between the wire and the coupling terminal, and judging whether a difference between the reference displacement and the displacement when a non-stick of the wire is detected by a non-stick detecting unit on the basis of the conducting condition is within a predetermined range or not; and correcting any one of the threshold and the oscillation output of the ultrasonic wave if a correction/judging unit judges with the non-stick detecting unit that a difference between the reference displacement and the displacement when a non-stick of the wire is detected is out of a predetermined range. | 03-04-2010 |
20100072261 | FRICTION STIR WELDING SPINDLE DOWNFORCE AND OTHER CONTROL TECHNIQUES, SYSTEMS AND METHODS - Friction stirred welding equipment, developed according to requirements of high reliability, robustness, precision and low cost, weld lap and butt joints in complex surfaces with fixed pin tool under controlled downforce. Exemplary equipment comprises a control force orbital spindle, wherein a coaxial sensor measures the downforce and simultaneously the axial electrical actuator corrects axial tool position along the welding, by a direct axial force system control, in order to maintain controlled downforce according to previously set parameters. The equipment sets up, monitors and controls the spindle rotation speed, welding speed, acceleration speed and downforce and can record in a database the downforce and tool welding position during the welding. The exemplary equipment may also comprise a laser system that scans the backing surface before welding and corrects original tool path, in order to provide an offset tool path and precision alarm system to get a safe welding, avoiding tool collision with the backing. | 03-25-2010 |
20100072262 | Wire bonding method - A wire bonding method capable of further improving accuracy in wire bonding and realizing faster wire bonding including: transferring a semiconductor chip to a bonding center; capturing an image of a bonding point on the semiconductor chip; recognizing a position of the bonding point; performing wire bonding to the bonding point that has been corrected; capturing a post-bonding image of the semiconductor chip; transferring a next semiconductor chip to the bonding center; capturing an image of a bonding point on the next semiconductor chip; recognizing a position of the bonding point of the next semiconductor chip; and then recognizing an amount of displacement in the post-bonding image of the semiconductor chip during wire bonding to the bonding point that is of the next semiconductor chip and has been corrected. | 03-25-2010 |
20100078462 | METHOD FOR USING MODIFIABLE TOOL CONTROL PARAMETERS TO CONTROL THE TEMPERATURE OF THE TOOL DURING FRICTION STIR WELDING - A new control variable is introduced, that when combined with previous dependent control criteria on other variables results in a control program that can create a superior weld while minimizing wear on the FSW tool, wherein the tool repeatedly experiences the same thermal and mechanical loading within specified control windows during every repeated weld sequence because flow stresses and tool loads are driven by temperature, and dependent control loops account for differences in material and heat that is transferred at different rates in varying locations throughout a friction stir weld. | 04-01-2010 |
20100084455 | SOLDERING IRON DEVICE, SOLDERING IRON CONTROL MODULE AND SOLDERING CONTROL METHOD THEREOF - A soldering iron control module applied to a soldering iron and a soldering iron stand is provided. The soldering iron stand accommodates the soldering iron which has a soldering iron bit. The soldering iron control module includes a sensing unit and a soldering iron control system. The sensing unit provides a sensing signal indicating whether the soldering iron is accommodated in the soldering iron stand. The soldering iron control system includes a tin supply unit and a control unit. The control unit determines whether the soldering iron has been accommodated in the soldering iron stand for a first time period according to the sensing signal. When the control unit determines that the soldering iron has been accommodated in the soldering iron stand for the first time period, the tin supply unit provides the tin to the soldering iron bit and the power of the soldering iron is turned off. | 04-08-2010 |
20100108743 | Apparatus For And Method Of Automatically Welding Flange Of Guide Thimble Tube In Nuclear Fuel Assembly - Disclosed therein are an apparatus for and a method of automatically welding a flange to a guide thimble tube in a nuclear fuel assembly. The automatic welding apparatus includes: a welding part located on an axially conveying line of a tube for welding a welded surface of the tube inserted thereinto and a welded surface of a flange; a flange supplying part for supplying the flange at a tube inlet of the welding part onto the axially conveying line; and a conveying part mounted on the axially conveying line in such a way as to move the tube and the flange on the axially conveying line, so that they are inserted into and drawn from the welding part. | 05-06-2010 |
20100133322 | Wire bonding apparatus, record medium storing bonding control program , and bonding method - A wire bonding apparatus including a bonding control section provided with an electrical non-bonding detector, an optical non-bonding detector, and an optical shape detector, which are for detecting non-bonding between a first bonding point and a bonding wire; and when non-bonding is detected by the electrical non-bonding detector and non-bonding bonding is also detected by the optical non-bonding detector, then the tip end of the bonding wire is reformed by, based on the shape of the tip end of the bonding wire detected by the optical shape detector, a ball formation device into a ball of a prescribed shape, and rebonding is performed at the first bonding point. | 06-03-2010 |
20100140324 | LATERAL POSITION DETECTION FOR FRICTION STIR SYSTEMS - A friction stir system for processing at least a first workpiece includes a spindle actuator coupled to a rotary tool comprising a rotating member for contacting and processing the first workpiece. A detection system is provided for obtaining information related to a lateral alignment of the rotating member. The detection system comprises at least one sensor for measuring a force experienced by the rotary tool or a parameter related to the force experienced by the rotary tool during processing, wherein the sensor provides sensor signals. A signal processing system is coupled to receive and analyze the sensor signals and determine a lateral alignment of the rotating member relative to a selected lateral position, a selected path, or a direction to decrease a lateral distance relative to the selected lateral position or selected path. In one embodiment, the friction stir system can be embodied as a closed loop tracking system, such as a robot-based tracked friction stir welding (FSW) or friction stir processing (FSP) system. | 06-10-2010 |
20100155455 | Wire bonding method - A wire bonding method for bonding a ball which is formed at a tip end of a bonding wire to a pad that is a first bonding point to form a first bonding part and bonding the wire to an interconnect wiring that is a second bonding point to form a second bonding part, thus connecting the pad and the interconnect wiring with the wire, wherein after the ball is bonded to the first bonding point and a capillary is ascended, examination is performed to find any bonding failure of the first bonding part; and when the bonding failure at the first bonding point is found, then the capillary is caused to descend to execute rebonding to bond the first bonding part to the first bonding point with applying greater energy comprising a longer period of bonding time than last first bonding while pressing the capillary to the first bonding point. | 06-24-2010 |
20100163601 | FRICTION WELD VIBRATION QUALITY MONITORING SYSTEM - Friction welding systems and methods including a welding arrangement configured to impart kinetic friction between at least one surface of a first workpiece and at least one surface of a second workpiece to form a weld, a force providing mechanism arranged and disposed for applying a force to one or both of the first workpiece and the second workpiece, and a sensor arranged and disposed to measure a parameter of the welding arrangement, wherein an amount of vibration is determinable from the measured parameter. | 07-01-2010 |
20100163602 | ELECTRONIC COMPONENT PLACING APPARATUS AND ELECTRONIC COMPONENT MOUNTING METHOD - To provide an electronic component placing apparatus and an electronic component mounting method that can prevent a cold joint from occurring when an electronic component likely to cause warp deformation is mounted by means of soldering. | 07-01-2010 |
20100176183 | Guiding Device - The present invention relates to a guiding device ( | 07-15-2010 |
20100181365 | METHOD OF TEACHING EYEPOINTS FOR WIRE BONDING AND RELATED SEMICONDUCTOR PROCESSING OPERATIONS - A method of teaching an eyepoint for a wire bonding operation is provided. The method includes ( | 07-22-2010 |
20100187289 | TURNTABLE WELDING SYSTEM WITH LIGHT CURTAIN PROTECTION - A robotic welding system and method includes multiple welding cells equidistantly spaced in a circular arrangement, multiple perimeter light curtains to provide safety protection around the welding cells, a turntable centrally located in the circular arrangement, and multiple welding robots attached to the turntable. The welding system and method further includes a first welding process and a second welding process whereby both the first welding process and the second welding process each include a primary welding operation and a secondary welding operation whereby the turntable rotates between the welding cells to perform the primary and secondary welding operations. | 07-29-2010 |
20100206938 | PROCESS FOR WORKING A CONTOUR ON AT LEAST ONE WORKPIECE BY MEANS OF A ROBOT - A process for working a contour on at least one workpiece using a robot includes positioning the workpiece relative to the robot; acquiring an actual position of the workpiece; acquiring a real course of the contour on the workpiece at predefined points using at least one sensor; and actuating the robot according to individual vectors so as to correct a robot motion during the working of the contour. | 08-19-2010 |
20100224670 | MICRO-FLUIDIC INJECTION MOLDED SOLDER (IMS) - A portion of compliant material includes four walls defining a slot. The slot has a relatively large cross-section end in fluid communication with a solder reservoir, and also has a relatively small cross-section end opposed to the relatively large cross-section end. The slot has a generally elongate rectangular shape when viewed in plan, with a length perpendicular to a scan direction, a width, parallel to the scan direction, associated with the relatively large cross section end, and a width, parallel to the scan direction, associated with the relatively small cross section end. The slot is configured in the portion of compliant material such that the relatively small cross-section end of the slot normally remains substantially closed, but locally opens sufficiently to dispense solder from the reservoir when under fluid pressure and locally unsupported by a workpiece. Methods of operation and fabrication are also disclosed. | 09-09-2010 |
20100230471 | BONDING METHOD AND BONDING DEVICE - The bonding method for fanning a bump on an electrode on a substrate through bonding, includes: making a data storage part store a bonding position coordinate and an assumed bump-bonding area at the bonding position coordinate; recognizing a bondable area of the electrode by shooting an image of the electrode and processing the image; calculating overlap rate between the recognized bondable area and the assumed bump-bonding area stored in the data storage part; determining whether or not the calculated overlap rate is equal to or greater than a set value; and performing bonding on the bonding position coordinate when the overlap rate is determined to be equal to or greater than the set value. The bonding can be performed without being affected by the quality of finish of the electrode pads, and it is possible to avoid a bonding failure at flip-chip bonding and the like. | 09-16-2010 |
20100264196 | ELECTRONIC COMPONENT MOUNTING METHOD - In electronic component mounting operation for mounting an electronic component having bumps provided on its lower surface to a substrate by soldering, solder paste is printed on electrodes, and positions of the solder paste are detected in print inspection. An inspection result is output as solder paste position data. In a resin coating process where corners are previously coated with reinforcing resin, control parameters of a coating device that applies the reinforcing resin are updated in accordance with solder paste position data, thereby correcting positions where the coating device applies the reinforcing resin. Mixed application of the reinforcing resin on the already-printed solder paste can thereby be prevented. | 10-21-2010 |
20100270358 | METHOD AND SYSTEM FOR OPTIMIZED VIBRATION WELDING - A method of minimizing mechanical resonance in an assembly during formation of a vibration-welded joint therein includes positioning work pieces such that they are directly adjacent to each other, and generating a set of control signals that cause one or more sonotrode weld heads to vibrate. A waveform characteristic of a mechanical oscillation of the sonotrode(s) and weld head(s) is varied to minimize the mechanical resonance occurring in the assembly, such as a multi-cell battery for a vehicle. An apparatus for forming the welded joint includes at least one sonotrode having a weld head or heads formed integrally therewith, and a weld controller. The controller is connected to a converter, sonotrode(s), and weld head(s), with the mechanical oscillation occurring in the sonotrode(s) and weld head(s). Variation of the control signals during formation of the welded joint varies a waveform characteristic of the mechanical oscillation, thus minimizing the mechanical resonance. | 10-28-2010 |
20100270359 | DEVELOPMENTS IN OR RELATING TO LINEAR FRICTION WELDING - A method of analysing a welding parameter associated with a linear friction welding process. The linear friction welding process incorporates a weld cycle comprising a burn-off phase, the end of the burn- off phase being determined during the weld cycle by reference to a respective weld upset target. The method comprises: recording a profile of the weld parameter as a function of time during the weld cycle and assessing the recorded profile against a predetermined, respective threshold profile for the weld parameter which is based on a pre-estimate of the end of the burn-off phase. The assessment is carried out retrospectively following a determination of the actual end of the burn-off phase for the recorded profile, and comprises time-shifting the threshold profile relative to the recorded profile so that the pre-estimated endpoint of the burn-off phase is closer to, and preferably coincidental with, the actual endpoint of the burn off phase. | 10-28-2010 |
20100276472 | METHOD OF REWORKING ELECTRICAL SHORT IN ULTRA SONIC BONDER - A modified ultrasonic bonding machine and process uses a sharpened bonding wedge to perform cutting of short material. The sharpened wedge is controlled by the same position control device control used to position the bonding wedge for bonding. The software is modified to permit selection of bonding or cutting, and the bonding wedge is replaced with a cutting wedge. The modified ultrasonic bonding machine allows the operator to use the automated system of the machine to do the cutting, and the precision gained ensures that no damage to the parts is caused by the cutting process. | 11-04-2010 |
20110011919 | BONDING APPARATUS AND BONDING METHOD - To provide a bonding apparatus capable of increasing product quality by realizing high-precision control of a pressing force applied upon mounting of an electronic component on a substrate by bonding, and to a bonding method capable of providing high-quality products stably. The bonding apparatus includes: at least a bonding head | 01-20-2011 |
20110031296 | METHOD OF PRODUCING TUBES AND A ROLLING MILL TRAIN FOR PRODUCING TUBES - A method for producing tubes for use in a heat exchanger that includes providing first and second metallic strips on a rolling mill train with predetermined breaking points using a device, deforming the strips to form the a tube, separating individual tubes from the tube at the predetermined breaking points, sensing positions of the predetermined breaking points in the strips using a sensing element which the strips pass through, transmitting signals relating to sensed positions of the predetermined breaking points of the strips to a computer, comparing the positions of the predetermined breaking points in the first and the second strips using the computer on the basis of the signals transmitted, and sending signals to the device using the computer which lead to the alignment of the positions of the predetermined breaking points in the first and the second strips. | 02-10-2011 |
20110031297 | FLOW SOLDERING APPARATUS AND FLOW SOLDERING METHOD - The present invention provides a flow soldering apparatus that can suppress the occurrence of soldering defects, even if VOC-free flux or low-VOC flux is applied to an electronic circuit substrate. In other words, the flow soldering apparatus according to the present invention includes: a water content sensor for measuring a residual water content of a surface of a substrate; and a monitoring device for judging whether soldering quality is satisfactory or not by using a residual water content value of the surface of the substrate acquired from the residual water content measured by the water content sensor, on the basis of a correlation between a residual water content value of a surface of a sample substrate and a residual water content value of through holes of the sample substrate, as acquired previously by using a plurality of substrate samples. | 02-10-2011 |
20110031298 | MULTI-ANGLE, ARTICULATED-JIG-SUPPORTED, BEAM-END COMPONENT, MANUAL AND COMPUTER-CONTROLLED WELDING - Adjustable, elongate, beam-offset jig structure for assisting, under manual, or appropriate computer, control, in welding a pair of beam-end, column-interface components to the opposite ends of an elongate beam. The jig structure includes spaced, adjustable head-stock and tail-stock structures, each capable of holding such a component adjacent a beam end for adjustment to an infinite number of different, pre-weld angular-offset dispositions relative to such a beam end in order to accommodate planned horizontal and vertical beam offsets which will be encountered when such beams are installed in a building frame. A computer-controlled, robotic welder may be provided adjacent each end of the jig structure to implement appropriate welding when any and all offset angles have been jig-established. | 02-10-2011 |
20110062216 | Method for manufacturing semiconductor device and bonding apparatus - A bonding apparatus includes: a storage unit that stores bonding conditions of a ball; a detection unit that detects a first position on a Z axis of a capillary with the ball coming into contact with a semiconductor element and detects a second position on the Z axis of the capillary when the ball at the tip end of the capillary is bonded to the semiconductor element; a calculation unit that calculates a collapse amount of the ball which is a difference between the first position and the second position detected by the detection unit and a bonding time and calculates a collapse amount of the ball for a predetermined period; and a first adjustment unit that adjusts the bonding conditions when the collapse amount of the ball for a predetermined period is outside a predetermined numerical range. | 03-17-2011 |
20110073636 | Method and device for welding workpieces made of high-temperature resistant super Alloys - A method of welding workpieces of high-temperature superalloys is provided. Welding filler is applied in a plurality of layers to a surface of the workpiece via a heat input zone and a supply zone for supplying the welding filler into the heat input zone. The heat input zone and the supply zone on the one hand and the workpiece surface on the other hand are moved in relation to one another. A polycrystalline weld seam is generated by remelting a previously applied layer of the plurality of layers. Welding parameters are chosen such that a cooling rate during a solidifying of the material is at least 8000 Kelvins per second. Further, a welding apparatus for carrying out such a method is provided. | 03-31-2011 |
20110101072 | ADJUSTABLE CLAMP SYSTEM AND METHOD FOR WIRE BONDING DIE ASSEMBLY - A method and an adjustable clamp system for clamping a die assembly during wire bonding. The system includes at least one pair of opposing base walls, each of the base walls has a base clamping surface. There is at least one pair of clamping members, each one of the clamping members being movable towards a respective base clamping surface to thereby clamp a lead frame of the die assembly. A die assembly support is disposed between the pair of opposing base walls and the die assembly support and pair of opposing base walls provide a cavity. There is a position sensor coupled to a controller and there is also a drive that is controllable by the controller. The drive provides movement of the die assembly support relative to each the base clamping surface to thereby adjust a depth of the cavity. In operation, after the lead frame is clamped between the base clamping surface and clamping members, the controller allows the drive to provide the relative movement until the position sensor detects that an underside of the lead frame has abutted the die assembly support. | 05-05-2011 |
20110114704 | Bonding apparatus and bonding method - A bonding apparatus provided with a control unit capable of controlling the position of the central axis of a bonding tool in the X direction and the Y direction based on an image of a pad acquired with a camera and an offset amount, the apparatus including: an outline obtaining unit for obtaining each of the sides of the pad and an outline of a pressure-bonded ball by processing the image acquired with the camera; a gap length obtaining unit for obtaining gap lengths between the respective sides of the pad and the outline of the pressure-bonded ball; and an offset correcting unit for correcting the offset amount based on the gap lengths obtained by the gap obtaining unit. | 05-19-2011 |
20110127313 | GROUND PEG, AND DEVICE AND METHOD FOR THE PRODUCTION THEREOF - The invention relates to a ground peg ( | 06-02-2011 |
20110139855 | RESIDUAL OXYGEN MEASUREMENT AND CONTROL IN WAVE SOLDERING PROCESS - Methods and apparatus for improving wave soldering processes by measuring and controlling the amount of residual oxygen present in the soldering tank and thereby avoiding excess dross formation. The methods and apparatus utilize a glass plate with ports to support sensors, e.g. oxygen sensors to both protect the solder bath from contact with air and to measure the oxygen levels associated with the solder bath. | 06-16-2011 |
20110174865 | METHOD OF TEACHING EYEPOINTS FOR WIRE BONDING AND RELATED SEMICONDUCTOR PROCESSING OPERATIONS - A method of teaching an eyepoint for a wire bonding operation is provided. The method includes (1) selecting a group of shapes from a region of a semiconductor device for use as an eyepoint, and (2) teaching the eyepoint to a wire bonding machine using at least one of (a) a sample semiconductor device, or (b) predetermined data related to the semiconductor device. The teaching step includes defining locations of each of the shapes with respect to one another. | 07-21-2011 |
20110186615 | Ring Gear Based Welding System - A welding system having a traveling base carriage, a carriage positioning mechanism engaging the base carriage; and a ring gear assembly mounted on the base carriage. The ring gear assembly will include: (i) two half ring sections, each having at least one gear track; (ii) a ring gear mount attaching each of the half ring sections to the base carriage, where the ring gear mounts allow the half ring sections to separate and guide the half ring sections into mating engagement. The system further includes at least one weld head assembly mounted on the ring gear assembly. The weld head assembly includes: i) a welding torch; ii) a torch positioner, and iii) a position sensor. A system controller is programmed to control at least the carriage positioning mechanism and the weld head assembly in order to perform the steps of: (i) setting a velocity of the base carriage to approximate the pipe joint's lateral movement in order to maintain the position of the weld head assembly approximately at the pipe joint; and (ii) adjusting a path of the welding torch to accommodate a geometry of the pipe joint as detected by the position sensor. | 08-04-2011 |
20110226838 | BONDING METHOD, BONDING APPARATUS, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE UNSING THE SAME - Provided is a bonding apparatus capable of forming even loops at high speed. According to a bonding apparatus | 09-22-2011 |
20110259941 | APPARATUS FOR MONITORING BONDING SURFACE BOUNCING, WIRE BONDING APPARATUS HAVING THE SAME AND METHOD FOR MONITORING BONDING SURFACE BOUNCING - There are provided an apparatus for monitoring bonding surface bouncing, a wire bonding apparatus having the same, and a method for monitoring bonding surface bouncing. According to an aspect of the present invention, the apparatus for monitoring bonding surface bouncing includes a sensor measuring a capillary height in real time during bonding and a bouncing detector extracting a change rate of a capillary height from the capillary height measured in real time during a bonding performing period and detecting of whether bonding surface bouncing is present by comparing the extracted change rate with a set reference change rate. | 10-27-2011 |
20110290860 | Wire bonding apparatus and method thereof - The present invention provides a wire bonding apparatus including: a lead frame loading unit for loading a lead frame, on which a semiconductor chip is mounted, on a transfer rail; a heater block for heating the loaded lead frame; a wire bonding tool for wire-bonding the semiconductor chip and leads of the lead frame; a lead frame unloading unit for unloading the wire-bonded lead frame from the transfer rail; and a control unit for detecting a wire bonding failure when the wire bonding failure occurs in the lead frame and separating the heater block from the lead frame after a predetermined time has elapsed from the occurrence of the wire bonding failure, and a method thereof. | 12-01-2011 |
20110315743 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND BONDING APPARATUS - In a first bonding step of bonding an initial ball to a pad surface, the initial ball is applied by ultrasonic vibration while in pressure contact with the pad surface and a capillary undergoes a scrubbing motion to be rotated spirally. This allows a deformation area of the initial ball to be reduced, whereby the accuracy of bonding can be improved. In a second bonding step of bonding a bonding wire to a lead surface, the capillary and the bonding wire are applied by ultrasonic vibration while in pressure contact with the lead surface and the capillary undergoes a scrubbing motion to be rotated spirally. This allows the bonding wire bonded to the lead surface to be cut reliably. | 12-29-2011 |
20120012643 | PROCESS CONTROL METHOD - A method is disclosed for controlling a process in which a component | 01-19-2012 |
20120031955 | WIRE BONDING METHOD AND CAPILLARY ENABLING HIGH-SPEED WEDGE BONDING OF WIRE BONDS - Methods and systems are described for enabling the efficient fabrication of wedge-bonding of integrated circuit systems and electronic systems. | 02-09-2012 |
20120074205 | METHOD AND DEVICE FOR POSITIONING A FIRST PIPE WITH RESPECT TO A SECOND PIPE - This invention relates to a method for axial positioning of a first pipe with respect to a second pipe for the welding of said pipes at their ends thereof of which the faces have been previously machined and define a joint plane, according to which a plurality of jacks are distributed around the first and second pipes, and said jacks are connected to a central processing and control unit. | 03-29-2012 |
20120074206 | METHODS OF FORMING WIRE BONDS FOR WIRE LOOPS AND CONDUCTIVE BUMPS - A method of forming a wire bond using a wire bonding machine is provided. The method includes the steps of: (1) selecting at least one target bonding control value; (2) generating bonding parameters for forming a wire bond using an algorithm and the at least one selected target bonding control value; (3) forming a wire bond using the generated bonding parameters; (4) determining if the at least one selected target bonding control value of the formed wire bond is within a predetermined tolerance of the at least one selected target bonding control value; (5) adjusting at least one bonding adjustment value if the at least one selected target bonding control value of the formed wire bond is not within the predetermined tolerance; and (6) generating revised bonding parameters for forming a subsequent wire bond using an algorithm and the at least one adjusted bonding adjustment value | 03-29-2012 |
20120138664 | SOLDER FEEDER, PRINTER, AND PRINTING METHOD - Disclosed is a print technology in which a solder pool staying on the surface of a mask is driven by means of a squeegee, and solder is applied onto a substrate onto which the lower surface of a mask is placed. A forward print process where solder is applied by driving a squeegee in a predetermined forward direction relative to a mask, and a backward print process where the solder is applied by driving the squeegee in a returning direction opposite to the forward direction are switched alternately. When the squeegee passes through the solder pool on the downstream side in a moving direction before switching in the course of switching from any one of the forward and backward print processes to the other one of these processes, the amount of solder in the solder pool is measured. Based on the amount of solder thus measured, the necessity of replenishing solder is determined The solder pool is supplemented with solder, based on the result of the decision on whether solder replenishment is required. | 06-07-2012 |
20120145771 | DEVICE AND METHOD FOR AUTOMATIC MULTIPLE-BEAD WELDING - A welding device and a method for automatic multiple-bead welding, wherein a line illumination member is arranged to illuminate the joint by scanning a light beam across the joint line. A camera is arranged for the registration of line images of the joint when it is illuminated with the scanned light beam. The locations of the edges of the joint are determined by means of triangulation based on the registered line image. The welding device can include a stereo image member arranged to register photometric stereo images of the joint substantially simultaneously with the registration of the line images. The welding device is arranged to, during welding of a weld joint with a plurality of weld beads, control the welding head in dependence on both stereo images and line images. | 06-14-2012 |
20120153006 | ULTRASONIC WELDING SYSTEM AND METHOD FOR FORMING A WELD JOINT - An ultrasonic welding system and a method are provided. The system includes an ultrasonic welding device and a controller that generates control signals for inducing the device to form a first weld joint. The system further includes a power adjusting unit having a desired output power level curve indicating desired power levels over time for obtaining a desired weld joint. The unit receives data from the controller indicating power levels when forming the first weld joint. The unit compares a power level output by the controller at a first time with an associated power level of the curve at the first time, and induces the controller to increase the power level at a second time if the power level output by the controller at the first time is less than the associated power level of the curve at the first time. | 06-21-2012 |
20120175404 | METHOD OF MANUFACTURING LED LIGHT BAR AND MANUFACTURING EQUIPMENT THEREOF - A manufacturing equipment for manufacturing an LED light bar includes a reflow oven and a clamping device. The LED light bar includes a printed circuit board and a plurality of LEDs arranged on the printed circuit board. The reflow oven includes a hearth box and a transmitting belt extended through the hearth box. The hearth box includes a heating area and a cooling area in an interior thereof. The clamping device is mounted on the transmitting belt. The clamping device defines a receiving space for receiving the LED light bar therein. The clamping device is changed between a clamping state for maintaining the LEDs in positions and a releasing state whereby the LED light bar can be removed from the clamping device. | 07-12-2012 |
20120193400 | METHOD AND SOLDERING SYSTEM OF SOLDERING A DIP COMPONENT ON A CIRCUIT BOARD - A method of soldering a DIP component on a circuit board includes piercing the DIP component through the circuit board, laying fluxer on the circuit board, passing a first surface of the circuit board through a boiler so that molten tin from the boiler flows between the DIP component and the circuit board through the first surface of the circuit board, and heating a second surface of the circuit board different from the first surface so as to increase temperature of the second surface by a thermal radiation heating device to when the first surface of the circuit board passes through the boiler. | 08-02-2012 |
20120211547 | In-Situ Accuracy Control in Flux Dipping - A flux dipping apparatus includes a flux plate having a top surface; and a dipping cavity in the flux plate and recessed from the top surface. A flux leveler is disposed over the flux plate and configured to move parallel to the top surface. A piezoelectric actuator is configured to adjust a distance between the flux leveler and the top surface in response to a controlling voltage applied to electrodes of the first piezoelectric actuator. | 08-23-2012 |
20120228362 | PROCESS FOR OPERATING A STRINGER AND STRINGER APPARATUS - A process for operating a stringer ( | 09-13-2012 |
20120255988 | BRAZING SYSTEM AND METHOD - A brazing system has a first gas source, a second gas source, a first enclosure, a second enclosure, a brazing torch, and a control system configured to control a ratio of the first gas source and the second gas source. | 10-11-2012 |
20120261457 | FRICTION STIR WELDING APPARATUS AND METHOD - A friction stir welding apparatus includes: a thermocouple and a temperature measurement device which are configured to detect a temperature of the temperature measurement point; a temperature monitor configured to calculate an estimated temperature of the welding tool from the detected temperature of the temperature measurement point, based on a predefined correlation between a temperature of the welding tool and a temperature of the backing member; and a controller configured to perform a predetermined procedure based on the estimated temperature of the welding tool so as to prevent overheating of the welding tool. | 10-18-2012 |
20130056524 | METHOD AND DEVICE FOR CONTROLLING A THERMAL CYCLE OF A WELD JOINING ENDS OF STRIP TOGETHER - A method and a device for controlling a thermal cycle of a weld joining one end of a first strip to an end of a second strip, suited to a joining machine of a strip treatment plant. The control device includes connections intended to connect the control device to a central automation system of the strip treatment plant and to the joining machine respectively, so as respectively to allow an exchange of at least one strip data item and an exchange of at least one operating data item. A computer is capable of computing, from the strip and operating data items, at least one thermal parameter of the weld. A weld control and characterization device is capable of controlling the welding as a function of the thermal parameter. | 03-07-2013 |
20130062396 | METHOD OF FRICTION WELDING AXLES IN FINISHED FORM - A method of fabricating an axle for use on a truck body or trailer by machining and fully finishing, the components before friction welding results in an axle that is ready for use upon assembly of the components. Beam ends are friction welded to the main shaft with the longitudinal center axes of the kingpin bore holes being substantially the same orientation and preferably substantially within one degree of one another. | 03-14-2013 |
20130068824 | Die Bonder and Bonding Method - A bonding method of a die bonder with a single conveyance lane and a single bonding head, or a plurality of conveyance lanes and a plurality of bonding heads includes the steps of generating a classification map of class dies with different electric properties on the wafer, which are classified in accordance with a plurality of grades, picking up the die from the wafer, bonding the die onto a substrate or the die using a bonding head, conveying a class substrate corresponding to the class die on the conveyance lane in a unit of the class substrate, and further bonding the class die to the corresponding class substrate based on the classification map. | 03-21-2013 |
20130153644 | ELECTRONIC COMPONENT MOUNTING APPARATUS AND METHOD - An electronic component mounting apparatus includes a bonding tool for thermally bonding an electronic component onto a substrate, the bonding tool to be driven in a direction getting close to and from the substrate, a linear scale and a linear scale head detecting the position of the bonding tool in the direction getting close to and from the substrate, and a control unit configured to hold the position of the bonding tool in the direction getting close to and from the substrate when a solder film between an electrode of the electronic component and an electrode of the substrate is thermally fused when the bonding tool gets close to the substrate by a predetermined distance from a reference position while heating the electronic component. The electronic component mounting apparatus for bonding the electronic component and the substrate with thermally fusible bond metal offers an improvement in the bonding quality. | 06-20-2013 |
20130186939 | AUTOMATED WELDING OF MOULDS AND STAMPING TOOLS - A tool welding system is disclosed that includes a table that heats a tool. A multi-axis robot includes a welding head that is moved relative to the table in response to a command. A controller is in communication with the robot and generates the command in response to welding parameters. The weld parameters are based upon a difference between an initial tool shape and a desired tool shape. The difference between the initial tool shape and the desired tool shape corresponds to a desired weld shape. The desired weld shape is adjusted based upon initial tool shape variations, which includes thermal growth of the tool. The tool is welded to provide the desired weld shape to achieve a desired tool shape. | 07-25-2013 |
20130214032 | METHOD OF MANUFACTURING LED LIGHT BAR - A method of manufacturing an LED light bar comprises: providing a reflow oven and a clamping device mounted on a transmitting belt of the reflow oven, the reflow oven comprising a heating area and a cooling area; providing a semi-finished LED light bar comprising a printed circuit board and a plurality of LEDs arranged on the print circuit board with solder paste applied between the LEDs and the printed circuit board, and mounting the semi-finished LED light bar in the clamping device; and starting the reflow oven and thus the transmitting belt carrying the clamping device and the semi-finished LED light bar moving together to pass through the reflow oven, whereby the solder paste is firstly melted in the heating area and then solidified in the cooling area to fix the LEDs on the printed circuit board to form the LED light bar. | 08-22-2013 |
20130228612 | FRICTION BIT JOINING OF MATERIALS - A system and method of using a friction stir tool having a bit that is at least partially consumable may be improved by providing enhanced cutting geometries on the bit, modifying stop times to improve bit joining, including automated tracking in an automatic friction bit joining method, providing automated feeding and automated friction bit joining, making the friction bit joining system portable, enabling the friction stir tool to be usable by a robotic device or as a handheld device, friction bit joining a plurality of different layers even if only a base material is solid-state joinable with the consumable bit, performing metal stitching on traditionally unweldable materials, performing solid-state plug welding, and operating the friction bit tool at variable RPMs in order to improve bit joining characteristics. | 09-05-2013 |
20130228613 | Method Of And System For Brazing Aluminum Workpieces Using A Flame And Monitoring Of The Flame Color - A method of brazing an assembly ( | 09-05-2013 |
20130277413 | IMAGE-ASSISTED SYSTEM FOR ADJUSTING A BONDING TOOL - A bonding tool is adjusted to a desired operational position by viewing the bonding tool with an image-capturing device and displaying an image of the bonding tool as viewed by the image-capturing device onto a display screen. A corresponding image of a reference bonding tool showing the desired operational position of the bonding tool is superimposed onto the display screen and the position of the bonding tool is adjusted with an adjustment mechanism until the bonding tool as viewed by the image-capturing device is aligned with the superimposed image of the reference bonding tool. | 10-24-2013 |
20130277414 | METHODS OF ADJUSTING ULTRASONIC BONDING ENERGY ON WIRE BONDING MACHINES - A method of adjusting ultrasonic bonding energy on a wire bonding machine, the method comprising the steps of: providing a reference relationship between free air ball squash and ultrasonic bonding energy; determining an actual relationship between free air ball squash and ultrasonic bonding energy on a subject wire bonding machine; and adjusting at least one ultrasonic bonding energy setting of the subject wire bonding machine such that the actual relationship of the subject wire bonding machine is closer to the reference relationship. | 10-24-2013 |
20130292454 | APPARATUS AND METHOD FOR DETERMINING AN ALIGNMENT OF A BONDHEAD OF A DIE BONDER RELATIVE TO A WORKCHUCK - Disclosed is an apparatus for determining an alignment of a bondhead of a die bonder relative to a workchuck. Specifically, the apparatus comprises: i) a sensor configured to measure a distance between the bondhead and the sensor; and ii) a positioning device coupled to the sensor, the positioning device being configured to position the sensor relative to a plurality of locations on the bondhead facing the sensor. In particular, the sensor is operative to measure a set of distances between each of the plurality of locations on the bondhead and the sensor, the set of distances being for determining the alignment of the bondhead. A method of determining an alignment of a bondhead of a die bonder relative to a workchuck is also disclosed. | 11-07-2013 |
20130320069 | METHOD FOR SHAPING A LAMINATE SUBSTRATE - A method for shaping a laminate substrate includes characterizing the laminate substrate for warpage characteristics. The laminate substrate is placed into a fixture with a correction to shape the laminate substrate based on the warpage characteristics. The laminate substrate is fluxed. A chip is placed onto the laminate substrate. The fixture is placed into a reflow furnace to join the chip and the laminate substrate. The fixture is removed from the reflow furnace. A warpage measurement is performed on the joined chip and laminate substrate. The correction may be modified if shorts are observed at the chip site. | 12-05-2013 |
20130320070 | FRICTION STIR WELDING APPARATUS AND METHOD - A friction stir welding method in which a welding tool rotating around an axis is pressed against a welding target portion of workpieces supported by a backing member so that frictional heat is generated and the friction heat softens the welding target portion. The welding tool is at least partially inserted into the softened welding target portion and stirs the softened welding target portion so that the welding target portion is stir welded in a solid phase state. The friction stir welding method includes detecting a temperature of a temperature measurement point provided in the backing member, and calculating an estimated temperature of the welding tool from the detected temperature of the temperature measurement point, based on a predefined correlation between a temperature of the welding tool and a temperature of the backing member. | 12-05-2013 |
20130327812 | BOND PAD ASSESSMENT FOR WIRE BONDING - For selecting suitable bonding parameters for forming wire bonds onto bond pads of a substrate, one or more indentations are made onto at least one bond pad of the substrate with an indentation tool by applying a series of predetermined forces onto the at least one bond pad with the indentation tool. A depth-force profile of the substrate is measured comprising a relationship between each predetermined force that is applied and a resultant depth of the indentation made by the indentation tool. An appropriate set of bonding parameters suitable for forming wire bonds on the substrate is determined based on the measured depth-force profile. | 12-12-2013 |
20130327813 | DYNAMIC PATH CORRECTION OF FRICTION STIR WELDING - A method for controlling friction stir welding is provided. The method may include initiating friction stir welding and determining the position of a friction stir welding tool and at least one part being welded. The method may also include adjusting the position of the friction stir welding tool while friction stir welding based at least in part on the positions of the tool and at least one of the parts. The position of the parts may be determined downstream of the friction stir welding tool in order to prospectively account for the position of the parts. Accordingly, the position of the friction stir welding tool may be dynamically adjusted during friction stir welding to account for part movement. Related systems and computer code are provided. | 12-12-2013 |
20130334290 | SOLDER PASTE DROPLET EJECTION APPARATUS, PATTERNING SYSTEM HAVING THE SAME, AND CONTROL METHOD THEREOF - Disclosed herein is a solder paste droplet ejection apparatus including: a nozzle cap forming an appearance and including a heating electric wire provided inside thereof; a nozzle unit formed inside the nozzle cap, spaced apart from the nozzle cap, and surrounded by the nozzle cap; an ejection probe formed inside the nozzle unit, spaced apart from the nozzle unit, and surrounded by the nozzle unit; and a transfer unit formed in a top portion of the nozzle cap and used for a minute movement, wherein a solder paste supplied in a space between the nozzle unit and the ejection probe is ejected in a droplet shape along the ejection probe. | 12-19-2013 |
20140027496 | FRICTION STIR WELDING WITH TEMPERATURE CONTROL - A method for friction stir welding is provided. The method may include determining the temperature of one or both parts being welded. The parts may then be heated to a desired temperature and then friction stir welded together. By preheating the parts, the friction required to plasticize the parts during welding may be reduced. Thereby, the rotational speed of the friction stir welding tool may be reduced, and thus the tool life may be extended without decreasing the rate at which welds are created. Additionally, the cooling rate of the weld may be regulated with a thermal control device. | 01-30-2014 |
20140076956 | SOLDERING MACHINE AND METHOD OF SOLDERING - A soldering machine includes a frame and a fixture held by the frame that supports a substrate and a cable. A guidance system is supported by the frame with a camera viewing the fixture that is movable relative to the fixture. A positioning system is supported by the frame. The positioning system has a camera positioner and a soldering mechanism positioner. A soldering mechanism is coupled to the soldering mechanism positioner and is moved by the soldering mechanism positioner relative to the fixture. The soldering mechanism solders wires to the substrate. A controller communicates with the positioning system and the guidance system to operates the positing system to control positions of the camera and soldering mechanism relative to the fixture based on an image obtained by the camera. | 03-20-2014 |
20140091129 | SELF-LEVELING WELDING TRACTOR - A welding tractor is described as well as a process for using the tractor in which a predefined angle of inclination or declination is maintained during a circumferential welding process. | 04-03-2014 |
20140144971 | In System Reflow of Low Temperature Eutectic Bond Balls - Low temperature bond balls connect two structures having disparate coefficients of linear thermal expansion. An integrated circuit is made to heat the device such that the low temperature bond balls melt. After melting, the bond balls solidify, and the device is operated with the bond balls solidified. In one example, one of the two structures is a semiconductor substrate, and the other structure is a printed circuit board. The integrated circuit is a die mounted to the semiconductor substrate. The bond balls include at least five percent indium, and the integrated circuit is an FPGA loaded with a bit stream. The bit stream configures the FPGA such that the FPGA has increased power dissipation, which melts the balls. After the melting, a second bit stream is loaded into the FPGA and the FPGA is operated in a normal user-mode using the second bit stream. | 05-29-2014 |
20140175158 | METHOD FOR MANUFACTURING LIGHT EMITTING DIODE PACKAGE - A method for manufacturing an LED package includes following steps: providing a eutectic bonding apparatus comprising a heating device, a supporting platform located in the heating device, and a nozzle; providing a resistance measuring device comprising a probe, an electrical power, and a controlling unit; providing an LED chip; providing a substrate and positioning the substrate on the supporting platform of the eutectic bonding apparatus; moving the nozzle to catch the LED chip onto the substrate; and heating the substrate and the LED chip to form a eutectic bonding process. The probe of the resistance measuring device is electrically connected to the LED chip, a total resistance of the LED chip and the substrate is measured by the resistance measuring device in real-time, when the total resistance is equal to a predetermined value, the heating device is ordered to stop heating by the controlling unit. | 06-26-2014 |
20140175159 | Thermocompression Bonding Method And Apparatus For Mounting Semiconductor Chips On A Substrate - A thermocompression bonding method for mounting semiconductor chips on a substrate comprises:
| 06-26-2014 |
20140203066 | METHOD AND SYSTEM FOR ONLINE QUALITY MONITORING AND CONTROL OF A VIBRATION WELDING PROCESS - A method for monitoring and controlling a vibration welding system includes collecting sensory data during formation of a welded joint using sensors positioned with respect to welding interfaces of a work piece. A host machine extracts a feature set from a welding signature collectively defined by the sensory data, compares and correlates the feature set with validated information in a library, and executes a control action(s) when the present feature set insufficiently matches the information. A welding system includes a sonotrode, sensors, and the host machine. The host machine is configured to execute the method noted above. | 07-24-2014 |
20140209663 | WIRE BONDER AND METHOD OF CALIBRATING A WIRE BONDER - Disclosed is a wire bonder comprising: a processor; a bond head coupled to the processor, the processor being configured to control motion of the bond head; a bonding tool mounted to the bond head, the bonding tool being drivable by the bond head to form an electrical interconnection between a semiconductor die and a substrate to which the semiconductor die is mounted using a bonding wire; and a measuring device coupled to the bond head, the measuring device being operable to measure a deformation of a bonding portion of the bonding wire as the bonding tool is driven by the bond head to connect the bonding wire to the semiconductor die via the bonding portion. Specifically, the processor is configured to derive at least one correlation between the measured deformation of the bonding portion and an operating parameter of the wire bonder; compare the at least one derived correlation against a predetermined correlation between the operating parameter of the wire bonder and a desired deformation of the bonding portion; and calibrate the operating parameter of the wire bonder based on the comparison between the at least one derived correlation and the predetermined correlation of the deformation of the bonding portion against the operating parameter of the wire bonder. A method of calibrating a wire bonder is also disclosed. | 07-31-2014 |
20140246480 | AUTOMATIC REWORK PROCESSES FOR NON-STICK CONDITIONS IN WIRE BONDING OPERATIONS - A method of performing a wire bonding operation is provided. The method includes the steps of: (a) performing a wire bonding operation between a portion of wire and a bonding location using a bonding tool; (b) raising the bonding tool to a desired height; (c) performing a test to determine if the portion of wire is sufficiently bonded to the bonding location; and (d) automatically performing another wire bonding operation between the portion of wire and the bonding location using the bonding tool if, during step (c), it is determined that the portion of wire was not sufficiently bonded to the bonding location in step (a). | 09-04-2014 |
20140353360 | Temperature Triggering Ejector Mechanism for Lock Pin Soldering Type Component - A temperature triggering ejector system for lock pin soldering type component is provided. There is provided a temperature triggering ejector system for a lock pin soldering type component, lock pins of said component are fixed in through holes of a circuit board and solder is filled in the through holes after soldering, said system comprising: an ejector that is located at one side of the circuit board that is opposed to said component, and has ejector pins aligned with the through holes of the circuit board and a cylinder that drives the ejector pins; a temperature sensor for sensing the temperature of said solder being heated; a controller for driving the ejector pins of the ejector within a solder melting temperature range based on the temperature sensed by the temperature sensor, to eject the lock pins of said component from said circuit board. | 12-04-2014 |
20140374466 | METHOD OF ULTRASONICALLY WELDING MULTI-STRANDED MALLEABLE WIRES TOGETHER - Multi-stranded wires are clamped between an ultrasonic welding tip and an opposing anvil. The multi-stranded wires are made of a material that is more malleable than copper, or of a material that has a malleability that is substantially the same or greater than the malleability of aluminum. The plurality of multi-stranded wires can be clamped between opposing side surfaces to further form the wire bundle. Ultrasonic energy is applied to a first side of the wire bundle adjacent the ultrasonic welding tip. After termination of ultrasonic energy to the first side, the wire bundle is rotated 180 degrees relative to the anvil and ultrasonic energy is applied to a second side of the wire bundle, wherein the second side is oppositely disposed relative to the first side. | 12-25-2014 |
20150014396 | PRINT HEAD FOR STENCIL PRINTER - A stencil printer for printing viscous material on an electronic substrate includes a stencil having apertures formed therein, and a print head positioned over the stencil and configured to deposit viscous material within the apertures of the stencil. The print head includes a housing defining an elongate chamber, a source port defining a passage having an inlet positioned to allow viscous material to flow into the elongate chamber, a pair of blades defining a slot that provides an outlet from which viscous material can flow out of the elongate chamber, an elongate plunger movable in the elongate chamber to reduce a volume of viscous material within the elongate chamber, and at least one sensor to detect pressure of the viscous material within the elongate chamber. | 01-15-2015 |
20150021375 | METHOD FOR SEMI-AUTOMATICALLY RECONDITIONING A RAILCAR ARTICULATED CONNECTOR - A method for semi-automatically reconditioning a railcar articulated connector that comprises a male portion including a parent casting material is provided. The method comprises applying weld material to a male portion of an articulated connector, mounting a housing mounting a housing defining an interior space to the male portion, the male connector within the interior space, centering and stabilizing the fixture laterally on the male portion, inserting a clamping mechanism attached to the housing within an opening of the male connector to affix the housing to the male portion, securing the clamping mechanism to a surface of the male portion, and automatically machining at least a portion of the weld and/or parent casting material. | 01-22-2015 |
20150048146 | METHOD FOR PRODUCING WELDED TUBES FROM STEEL - In a method for producing welded pipes from steel, in which strips or metal sheets are formed into a pipe provided with a longitudinal or helical slot and the abutting edges of the slotted pipe are welded together, the process parameters for production of the pipes are specified on the basis of previously ascertained material properties and geometry of the strips or metal sheets. Before the forming process, the strip or metal sheet is subjected to an nondestructive, continuous or discontinuous test for inhomogeneities over the length and width, an integral characteristic value for the material property of the strip or metal sheet is formed from the measured values, a measure of the homogeneity of the material properties relating to the length and width of the strip or metal sheet is derived from the variance in the measured values for the various measurement points and, in the event of deviations in the measured values exceeding previously specified limit values, the process parameters are reset and/or the strip or metal sheet is subjected to a homogenisation process prior to the forming process. | 02-19-2015 |
20150069112 | NON-DESTRUCTIVE ALUMINUM WELD QUALITY ESTIMATOR - An aluminum welding system includes a welding machine configured to weld a workpiece with an aluminum nugget and a measurement device configured to measure an attribute of at least one of the aluminum nugget and a welding process. The system further includes a processing device configured to output a weld quality signal representing a quality of an aluminum weld based at least in part on the attribute measured. A method includes measuring an attribute of at least one of an aluminum nugget forming a joint of a workpiece and a welding process, determining a quality of an aluminum weld based at least in part on the attribute measured, and outputting a weld quality signal representing the determined quality. | 03-12-2015 |
20150069113 | VCSEL Packaging - A process to bond VCSEL arrays to submounts and printed circuit boards is provided. The process is particularly suited to large area thin and ultra-thin VCSEL arrays susceptible to bending and warping. The process integrates a flatness measurement step and applying appropriate combination of pressure prior to bonding the VCSEL array to the submount or a printed circuit using a vacuum flux-less bonding process. The process is very promising in making very good quality bonding between the VCSEL array and a submount or a printed circuit board. The process is applied to construct optical modules with improved flatness that may be integrated with other electronic components in constructing optoelectronic systems. | 03-12-2015 |
20150083786 | Substrate Bonding Apparatus and Substrate Bonding Method - A substrate bonding apparatus that bonds a first substrate and a second substrate together, comprising a joining section that joins the first substrate and second substrate together aligned to each other for stacking; a detecting section that detects an uneven state on at least one of the first substrate and second substrate prior to joining by the joining section; and a determining section that determines whether the uneven state detected by the detecting section satisfies a predetermined condition, wherein the joining section does not join the first substrate and the second substrate if it is determined by the determining section that the uneven state does not satisfy the predetermined condition. | 03-26-2015 |
20150090770 | SCREEN PRINTER, COMPONENT MOUNTING LINE, AND SCREEN PRINTING METHOD - A screen printer includes: a substrate holder that holds a substrate; a mask to be contacted with the substrate; an imaging device that images the substrate; an elevation mechanism that moves up the substrate holder at a below-mask-position below the mask based on a result of the imaging to contact the substrate with the mask; a horizontal moving mechanism that moves the substrate holder between the below-mask-position and a retreat position retreated in a horizontal direction from the below-mask-position; a printing head that moves on the mask contacted with the substrate and prints a paste on the substrate via the mask; and a mask cleaner that cleans a lower surface of the mask with the substrate separated from the mask by the elevation mechanism. The imaging of the substrate and the cleaning of the mask are performed with the substrate holder positioned at the retreat position. | 04-02-2015 |
20150102087 | METHOD AND DEVICE FOR IMPROVING THE QUALITY OF THE WELD SEAM IN FRICTION STIR WELDING - A method and a device for improving the quality of the weld seam in friction stir welding is provided. The process of friction stir welding is effected by means of a friction welding tip, in which a spiral conveyor screw is provided in the spindle bearing. The longitudinal axis of the spindle bearing is inclined at an angle to the vertical. The sliding surface of the rotating spindle consists of a flat sliding surface and, for the welding of curved seams, in each case of a sliding surface inclined at an acute angle to the sliding surface, the friction welding tip is designed in the shape of a truncated cone. The lateral surface of the truncated cone is formed by six trapezoidal planar parts, of which three planar parts each uniformly distributed at the circumference lie at an angle of 120 degrees with respect to one another and account for a proportion greater than â…™ at the circumference. | 04-16-2015 |
20150136837 | ELECTRONIC COMPONENT MOUNTING SYSTEM AND ELECTRONIC COMPONENT MOUNTING METHOD - A deformation state of a predetermined specific site as a site of singulated substrates where the electrodes are liable to be positionally deviated due to deformation is detected for each of the singulated substrates. In component mounting operation for picking up electronic components, and mounting the electronic components on the singulated substrates, it is determined whether the mounting of the electronic component on the specific site of the singulated substrates is suitable or not, based on the detection results of the deformation state for each of the singulated substrates. The operation of mounting all of the electronic components on the singulated substrate having the specific site determined to be not suitable in mounting is canceled. | 05-21-2015 |
20150296670 | ELECTRONIC COMPONENT MOUNTING SYSTEM AND ELECTRONIC COMPONENT MOUNTING METHOD - An electronic component is mounted on a substrate according to a mounting mode which is set in advance in the following mounting information when component mounting work is performed. In the mounting information, any one of a first mounting mode in which an electronic component is transferred and mounted to a mounting position which is corrected based on a positional-shift amount between a position of printed solder and a position of an electrode and a second mounting mode in which the electronic component is transferred and mounted to the mounting position by considering only the position of the electrode as a reference, is set as a mounting mode for performance for each electronic component. | 10-15-2015 |
20150298233 | METHOD AND SOLDERING DEVICE FOR SELECTIVE SOLDERING WITH AT LEAST ONE SOLDER NOZZLE AND ANOTHER FUNCTIONAL ELEMENT WHICH ARE MOVED SYNCHRONOUSLY BY A MOVEMENT DEVICE - A soldering apparatus for selective soldering, comprising
| 10-22-2015 |
20150305213 | ELECTRONIC COMPONENT MOUNTING SYSTEM AND ELECTRONIC COMPONENT MOUNTING METHOD - In mounting position correction of detecting a position of printed solder, calculating a positional-shift amount between a position of an electrode and the position of the printed solder, and correcting a mounting position based on the calculated positional-shift amount, when a correction amount based on the calculated positional-shift amount exceeds a limit value which indicates an upper limit of the correction amount which is defined and allowed in mounting information, the electronic component is mounted on the mounting position which is corrected by considering the limit value as the correction amount. Accordingly, it is possible to appropriately employ mounting position correction by considering a solder printing position as a reference in accordance with the degree of printing position shift, and to obtain an expected joint quality improvement effect. | 10-22-2015 |
20150321280 | SYSTEM AND METHOD FOR MODULAR PORTABLE WELDING AND SEAM TRACKING - A modular two-part welding and processing platform is described. A cart section is capable of rotating around objects e such as pipes and cylinders, or of linear travel along plates or the like. This cart section reversibly couples to a processing section supplied for instance with welding apparatus, painting apparatus, cleaning means, analysis means or the like. By means of this two-part device, work pieces can be cleaned, welded, and inspected quickly and accurately. Special marks may be provided on the work piece which in conjunction with sensors and motoring means on the cart, allow for precise positioning of the process head with respect to the work. | 11-12-2015 |
20150333033 | Pick-and-Place Tool for Packaging Process - A method includes moving a first bond head along a first guide apparatus for a first loop. The first guide apparatus is configured in a ring shape. The method also includes picking up a first die using the first bond head during the first loop, and aligning the first die with a first package substrate. The aligning the first die with the first package substrate includes moving the first package substrate in a first direction and a second direction. The first direction and the second direction are contained in a first plane parallel to the first loop. The method further includes placing the first die over the first package substrate during the first loop. | 11-19-2015 |
20150351295 | ELECTRONIC COMPONENT MOUNTING SYSTEM AND ELECTRONIC COMPONENT MOUNTING METHOD - An electronic component mounting system includes: a printing apparatus; an electronic component mounting apparatus; and a mounting information storage unit which stores mounting information. The mounting information includes execution mode information in which one of a first mounting mode and a second mounting mode is set for each of electronic components. In the first mounting mode, the electronic component is placed at a mounting position corrected on the basis of a recognition result of a first recognition mark formed on a board. In the second mounting mode, the electronic component is placed at a mounting position corrected on the basis of a recognition result of a second recognition mark formed by paste printed on the board. The electronic components are mounted on the board according to mounting modes set for the respective electronic components by referring to the mounting information. | 12-03-2015 |
20150375334 | ELIMINATION OF TOOL ADHESION IN AN ULTRASONIC WELDING PROCESS - A welding assembly includes a sonotrode, cleaning station, and controller. The controller periodically commands clamping of the sonotrode onto the cleaning block, and a transmission of ultrasonic energy into the cleaning block for a calibrated duration sufficient for removing residual amounts of metal from welding pads of the sonotrode. The cleaning block may include an aluminum bar coated with a polymeric material, e.g., porous polyethylene silica or alumina composite. A thin sacrificial layer of an anti-adhesion material, e.g., colloidal silica, may be periodically applied to the welding pads, particularly after a transition from welding a first metal to welding a second metal. The sacrificial layer may be applied via a sponge, a saturated surface, or spraying. | 12-31-2015 |
20150380379 | SYSTEM AND METHOD FOR THERMO-COMPRESSION BONDING OF HIGH BUMP COUNT SEMICONDUCTORS - A system and method are provided for enabling the production of semiconductors requiring very high precision thermo-compression bonding, the system comprising a thermo-compression bonding system having force and/or distance measuring sensors configured to sense thermal expansion of system components and a controller configured to counteract such expansion by exercising appropriate control over such system. This system and method may be used for both constant force profile applications as well as those requiring variable force during a bonding operation. | 12-31-2015 |
20160031044 | SOLDERING IRON WITH AUTOMATIC SOLDERING CONNECTION VALIDATION - A soldering iron station and a method thereof for a soldering joint connection validation, the method including: identifying a type of the soldering cartridge being used; performing a preliminary validation by measuring the soldering tip temperature, after the soldering event has started; monitoring the power level delivered to the soldering tip to detect liquidus occurrence; determining the thickness of an intermetallic component (IMC) of the soldering joint; determining whether the thickness of the IMC is within a predetermined rage, within a predetermined cooling time period; and indicating that a reliable soldering joint connection is formed, when the thickness of the IMC is within the predetermined rage, within the predetermined cooling time period. | 02-04-2016 |
20160039053 | SYSTEM AND METHOD OF MONITORING A WELDING ENVIRONMENT - A welding system includes a first position detection system, a second position detection system independent of the first position detection system, and a controller coupled to the first and second position detection systems. The first position detection system is configured to generate a first output corresponding to a first position and a first orientation of a welding torch during a welding session for a weld. The second position detection system is configured to generate a second output corresponding to a second position and a second orientation of the welding torch during the welding session. The controller is configured to determine welding parameters during the welding session based at least in part on the first output, the second output, or any combination thereof. The welding parameters may include a work angle, a travel angle, a contact tip to work distance, a travel speed, an aim, or any combination thereof. | 02-11-2016 |
20160044791 | INCREASING SOLDER HOLE-FILL IN A PRINTED CIRCUIT BOARD ASSEMBLY - A method, apparatus, and computer program product for increasing solder hole-fill in a printed circuit board assembly (PCBA) are provided in the illustrative embodiments. In the PCBA comprising a Printed Circuit Board (PCB) and the device, a pin of a device is caused to move in a first direction, the pin occupying a hole in the PCB, the hole being filled to a first distance by a solder material. By causing the pin to move, the solder material is drawn into the hole up to a second distance that is greater than the first distance. The pin is allowed to move in a second direction, to return the pin to an initial position in the hole. Allowing the pin to move in the second direction keeps the solder material at a third distance, wherein the third distance is greater than the first distance in the hole. | 02-11-2016 |
20160079199 | APPARATUS FOR BONDING SEMICONDUCTOR CHIPS - A semiconductor chip bonding apparatus includes a bonding head to adsorptively pick up a semiconductor chip, a bonding stage supporting a substrate, the semiconductor chip to be bonded to the substrate on the bonding stage, a first camera to capture an image of the semiconductor chip and to obtain positional information regarding the semiconductor chip, a second camera to capture an image of the substrate and to obtain positional information regarding the substrate, a correction device structure at a first side surface of the bonding stage, the correction device structure including a correction substrate and at least one correction chip, and a bonding controller to control pick up of the at least one correction chip by the bonding head, mounting of the at least one correction chip on the correction substrate, and correcting of a bonding position. | 03-17-2016 |
20160096241 | CONSUMABLE INSERT FOR WELDING - A consumable insert for welding a first component to a second component is provided. The first component is positioned with respect to the second component in such a manner that a gap is defined between adjacent surfaces thereof. The consumable insert includes a body having a profile. The profile of the body matches a scan of a profile of the gap between the adjacent surfaces. The consumable insert also includes a dam portion having a profile. The profile of the dam portion matches, at least in part, a scan of corresponding surfaces of the first component and the second component respectively. The dam portion is provided in contact with at least one end of the body. The dam portion is configured to control an overflow of a weld puddle therefrom. The body and the dam portion are formed using three dimensional printing. | 04-07-2016 |