| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 219468100 | Heating element is embedded in the exposed horizontal planar support surface | 8 |
| 20090200289 | HEATING UNIT - A heating unit includes: a base having an upper surface; a first heating element buried in an upper part of the base, the upper part including the upper surface, the first heating element having a flat shape almost parallel to the upper surface; and a second heating element buried in a lower part of the base and arranged in a location lower than the first heating element with respect to the upper surface, the lower part being joined to the upper part, and the second heating element having a flat shape. First and second projection patterns have an overlapping portion where the first projection pattern and the second projection pattern partially overlap each other, the first projection pattern representing the first heating element projected on the upper surface of the base, and the second projection pattern representing the second heating element projected the upper surface of the base. | 08-13-2009 |
| 20090212039 | Fluid Controlling Apparatus - There is provided a fluid controlling apparatus which can satisfactorily perform heating without enlarging an installation area. | 08-27-2009 |
| 20100206867 | COOKING DEVICE - A cooktop includes a plurality of heaters that form a contiguous cooking zone, a power supply for the plurality of heaters with a differentiator that differentiates between a first positive heating power for a first of the plurality of heaters and a second positive heating power for a second of the plurality of heaters in a differentiated heating mode. | 08-19-2010 |
| 20110011845 | TEMPERATURE CONTROLLED SUBSTRATE HOLDER HAVING EROSION RESISTANT INSULATING LAYER FOR A SUBSTRATE PROCESSING SYSTEM - A substrate holder for supporting a substrate in a processing system includes a temperature controlled support base having a first temperature, a substrate support opposing the temperature controlled support base and configured to support the substrate, and one or more heating elements coupled to the substrate support and configured to heat the substrate support to a second temperature above the first temperature. An erosion resistant thermal insulator disposed between the temperature controlled support base and the substrate support, wherein the erosion resistant thermal insulator includes a material composition configured to resist halogen-containing gas corrosion. | 01-20-2011 |
| 20120061377 | THERMAL PROCESSING APPARATUS WITH OPTIMIZED STRUCTURAL SUPPORT MECHANISM - A thermal processing apparatus is disclosed which separates the load bearing components from the thermal components, improving heating time, cooling time, thermal response, and energy efficiency. The thermal processing apparatus comprises an array of cylindrical heating elements which rest on support plates of high temperature, low density material. The support plates and heating elements are then supported by a rigid skeletal structure for load bearing support. | 03-15-2012 |
| 20130180976 | Multi-Layer Plate Device - A method for the joining of ceramic pieces with a hermetically sealed joint comprising brazing a continuous layer of joining material between the two pieces. The wetting and flow of the joining material is controlled by the selection of the joining material, the joining temperature, the time at temperature, the joining atmosphere, and other factors. The ceramic pieces may be aluminum nitride and the pieces may be brazed with an aluminum alloy under controlled atmosphere. The joint material is adapted to later withstand both the environments within a process chamber during substrate processing, and the oxygenated atmosphere which may be seen within the shaft of a heater or electrostatic chuck. | 07-18-2013 |
| 20140263277 | HEATING PLATE - A heating plate includes a thermally conductive, electrically insulating main board on whose surface an electrically-conductive heat-generating circuit and an outer insulating layer are layered. The heat-generating circuit is formed by connecting one first electrically-conductive layer and one second electrically-conductive layer that are arranged in different directions. The first and second electrically-conductive layers are overlapped to form an overlapping area. The heat-generating circuit has at least two electrically-conductive segments exposed outside the outer insulating layer. Thereby, when the electrically-conductive segments receive incoming current, the electrically-conductive heat-generating circuit can generate heat rapidly, and the heat can be transmitted to the main board through the thermally-conductive insulating layer. The overlapping area formed at each turning point along the electrically-conductive heat-generating circuit is more capable of load bearing so that the electrically-conductive heat-generating circuit is unlikely to be damaged at the turning point. | 09-18-2014 |
| 20190148120 | PLASMA PROCESSING APPARATUS, TEMPERATURE CONTROL METHOD, AND TEMPERATURE CONTROL PROGRAM | 05-16-2019 |
