| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 219121620 | Condition responsive | 56 |
| 20080217306 | Rapid detection of imminent failure in optical thermal processing of a substrate - A system for thermal processing of a substrate includes a source of radiation, optics disposed between the source and the substrate to receive light from the source of radiation at the optics proximate end, and a housing holding the optics and having a void inside the housing isolated from light emitted from the source. A light detector is disposed within the void in the housing to detect light from the optics emitted into the housing and send a deterioration signal. The system further includes a power supply for the source of radiation, and a controller to control the power supply based on the deterioration signal from the light detector. | 09-11-2008 |
| 20080314878 | APPARATUS AND METHOD FOR CONTROLLING A MACHINING SYSTEM - An apparatus for controlling a machining system is provided. The apparatus include an optical unit configured to capture an image of an object based upon radiation generated from the object and an image processing unit configured to process the image and to obtain real-time estimation of parameters associated with manufacture or repair of the object. The apparatus also includes a process model configured to establish target values for the parameters associated with the manufacture or repair of the object based upon process parameters for the machining system and a controller configured to control the process parameters for the machining system based upon the estimated and target values of the parameters associated with the manufacture or repair of the object. | 12-25-2008 |
| 20080314879 | SYSTEMS AND METHODS FOR ADAPTING PARAMETERS TO INCREASE THROUGHPUT DURING LASER-BASED WAFER PROCESSING - Systems and methods automatically modify a laser-based system for processing target specimens such as semiconductor wafers. In one embodiment, the laser-based system detects a trigger associated with a processing model. The processing model corresponds to a set of wafers. In response to the trigger, the system automatically adjusts one or more system parameters based on the processing model. The system then uses the modified system parameters to selectively irradiate structures on or within at least one wafer in the set of wafers. In one embodiment, the trigger includes variations in a thermal state related to a motion stage. In response to the variations in the thermal state, the system operates the motion stage in a series of movements until a thermal equilibrium threshold is reached. The sequence of movements may, for example, simulate movements used to process a particular wafer. | 12-25-2008 |
| 20090120915 | METHOD FOR MAKING AIRTIGHT CONTAINER - A laser beam emitted from a laser oscillator unit passes through a first substrate and irradiates a sealing member. The sealing member irradiated with the laser beam is heated in accordance with the absorptance and thus softens and melts. The laser beam is reflected by the sealing member and the reflection reaches a detector unit. A computing unit transmits information, such as a correction value of the laser power, to a laser controlling unit on the basis of the information from the detector unit so that the melting state of the surface of the sealing member is kept constant. In this manner, the melting state of the sealing material can be maintained in an appropriate state. | 05-14-2009 |
| 20090294416 | Laser manufacturing system having real-time feedback - A manufacturing system is disclosed. The manufacturing system may have a mount configured to hold a workpiece, a laser source configured to generate a laser beam directed toward a first side of the workpiece, and a sensor located on a second side of the workpiece. The sensor may be configured to sense a characteristic of the laser beam during penetration of the workpiece and to generate a signal in response thereto. The manufacturing system may also have a controller in communication with the laser source and the sensor. The controller may be configured to adjust parameters of the laser beam during penetration of the workpiece based on the signal. | 12-03-2009 |
| 20100084382 | LASER MICROMACHINING SYSTEM IN-LINE WITH A STAMPING PRESS - A first portion of a continuous material strip is indexed through a stamping press and the stamping press is cycled so as to undertake a stamping operation on a section of the material strip during each cycle. A length of the continuous strip is accumulated in an accumulator either upstream or downstream of the stamping press. A second portion of the strip is continuously fed at a non-zero speed through a laser micromachining station positioned such that the accumulator is between the stamping press and the laser micromachining station. The speed of the second portion of said strip is controlled so that this speed is constant for at least a portion of each cycle of the stamping press and so that the average speed of the first portion of said strip through the stamping press is equal to the average speed of the second portion of the strip through the laser micromachining station. A laser of the laser micromachining station irradiates the second portion of the strip while the speed of the second portion of said strip is constant. The timing of the laser processing event within the cycle of the stamping press may be such that the laser processing event occurs at a time when the ram of the stamping press is furthest away from actual material stamping event in order to avoid the deleterious effects of stamping vibration on the laser processing quality and reliability of the laser micromachining system. | 04-08-2010 |
| 20100252540 | METHOD AND APPARATUS FOR BRITTLE MATERIALS PROCESSING - An improved method for laser machining features in brittle materials | 10-07-2010 |
| 20100258539 | MACHINING INFORMATION SUPPLY EQUIPMENT AND SUPPLY SYSTEM - A processing information supply apparatus 10 is prepared for a laser processing apparatus for forming a modified region, which becomes a starting point of cutting, along a line to cut within an object to be processed by irradiating the object with laser light while locating a light-converging point within the object. The processing information supply apparatus | 10-14-2010 |
| 20110024401 | Recovery of Energy from a Laser Machining System - A method for the recovery of energy from a laser machining system and a device for performing the same, in which the method includes operating the laser machining system and generating thermal energy having a maximum temperature T | 02-03-2011 |
| 20110042360 | PROCESS CONTROL APPARATUS AND LASER PROCESSING APPARATUS - A process control apparatus controls a focus position of a laser beam, while a laser processing mechanism converges the laser beam into a predetermined focus position and performs a laser processing on a workpiece. The process control apparatus includes: a calculator that, based on the magnitude of an output of the laser beam that changes during the laser processing, calculates a change amount of a positional deviation of the focus position in an optical axis direction that changes during the laser processing at a laser beam radiation position; and a control unit that, based on the change amount of the positional deviation that has been calculated by the calculator, controls the focus position of the laser beam during the laser processing so as to resolve the positional deviation of the focus position. | 02-24-2011 |
| 20110127241 | METHOD AND APPARATUS FOR COMPENSATING FOR OFF-AXIS FOCAL SPOT DISTORTION - A method and apparatus is described that allows accurate control of the width of fine line structures ablated by lasers in thin films on substrates when using scanner and focussing lens systems. The method provides dynamic compensation for optical distortions introduced by the scan lens at off axis points by increasing the laser power or energy in the beam in order to overcome the reduction in power or energy density. | 06-02-2011 |
| 20110147348 | ADAPTIVE PROCESSING CONSTRAINTS FOR MEMORY REPAIR - An apparatus and method for processing a plurality of semiconductor parts in a laser-based system adjusts a default recipe to account for work to be performed on at least one part of the plurality of parts. The work to be performed on a part is analyzed using the default recipe and a part-specific recipe including a modified parameter of the default recipe. The default or part-specific recipe is selected based on a desired processing result, and the selected recipe replaces the default recipe to perform the work using the laser-based system. | 06-23-2011 |
| 20110226745 | EXTREME ULTRAVIOLET LIGHT GENERATION SYSTEM - An extreme ultraviolet light generation system is an extreme ultraviolet light generation system which is used with a laser apparatus and is connected to an external device so as to supply extreme ultraviolet light thereto, and the extreme ultraviolet light generation system may include: a chamber provided with at least one inlet through which a laser beam is introduced thereinto; a target supply unit provided to the chamber for supplying a target material to a predetermined region inside the chamber; a discharge pump connected to the chamber; at least one optical element disposed inside the chamber; an etching gas introduction unit provided to the chamber through which etching gas passes, the etching gas being introduced to etch debris of the target material which is emitted when the target material is irradiated with the laser beam inside the chamber and adheres to the at least one optical element; and at least one temperature control mechanism for controlling a temperature of the at least one optical element. | 09-22-2011 |
| 20110266262 | METHOD AND APPARATUS FOR DETECTING EMBEDDED MATERIAL WITHIN AN INTERACTION REGION OF A STRUCTURE - A system and method processes a structure comprising embedded material. The system includes a laser adapted to generate light and to irradiate an interaction region of the structure. The system further includes an optical system adapted to receive light from the interaction region and to generate a detection signal indicative of the presence of embedded material in the interaction region. The system further includes a controller operatively coupled to the laser and the optical system. The controller is adapted to receive the detection signal and to be responsive to the detection signal by selectively adjusting the laser. | 11-03-2011 |
| 20110284507 | METHOD FOR STABLIZING AN OUTPUT OF A PULSED LASER SYSTEM USING PULSE SHAPING - A method for stabilizing an output of a pulsed laser system includes a directly modulated laser diode by mitigating the effect of switching transients on the temporal shape of the outputted pulses. The method includes controlling a pulse shaping signal to define, over time, processing and conditioning periods. During the processing periods, the pulse shaping signal has an amplitude profile tailored to produce the desired temporal shape of the output. Each conditioning period either immediately precedes or follows a processing period. During a given processing period, the amplitude profile of the pulse shaping signal is tailored so that the drive current of the laser diode is lower than its maximum value during the corresponding processing period, and is of the same order of magnitude as the laser threshold current of the laser diode. In this manner, the stability of the output during the corresponding processing period is improved. | 11-24-2011 |
| 20110297654 | LASER WELDING APPARATUS - A laser welding apparatus is provided with a multiple axis robot having an arm and a scanner attached to a tip end of the arm of the multiple axis robot. The scanner includes an optical system that emits a laser beam onto a work piece. The scanner includes a preset coordinate system with an origin of the coordinate system coinciding with an intersection point between an optical axis of the laser beam and a fixed element of the optical system. | 12-08-2011 |
| 20120055908 | ETCHING SYSTEM AND METHOD OF CONTROLLING ETCHING PROCESS CONDITION - Provided is an etching system and a method of controlling etching process condition. The etching system includes a light source that irradiates incident light into a target wafer, a light intensity measuring unit that measures light intensity according to the wavelength of interference light generated by interference between reflected light beams from the target wafer, a signal processor that detects a time point at which an extreme value in the intensity is generated when the intensity of interference light varies according to the wavelength, and a controller that compares the extreme value generating time point detected from the signal processor with a reference time point corresponding to the extreme value generating time point and controls a process condition according to the comparison result. | 03-08-2012 |
| 20120074105 | LASER MACHINING METHOD AND APPARATUS - A laser machining method and apparatus that allow accurate and fine scribing without the need of a large-scale dust collector and a large quantity of cleaning fluid when a thin film on a substrate is scribed by a laser beam. A laser beam from a laser beam source is focused by a lens, introduced into a window of piping and propagated through cleaning fluid, and the thin film is illuminated with the laser beam from the nozzle. Concurrently with this beam illumination, a jet of the cleaning fluid supplied using a fluid flow controller is discharged from the nozzle that is disposed about substantially the optical axis of the focused laser beam and sized in inside diameter such that the focused laser beam does not make a contact with the nozzle. By these processes, laser-scribing is performed. | 03-29-2012 |
| 20120103948 | LASER MACHINING DEVICE AND LASER MACHINING METHOD - A laser processing device ( | 05-03-2012 |
| 20120125898 | LASER WELDING DEVICE FOR ROLL FORMING SYSTEM AND CONTROL METHOD THEREOF - A roll forming system which roll-forms a shaped beam by a roll forming unit including a plurality of roll formers is disclosed. A laser welding device for the roll forming system may include: front and rear guide means disposed apart from each other at the rear of the roll forming unit, and guiding movement of the shaped beam; laser welding means mounted above and between the front and rear guide means, reciprocatedly rotating a mirror by controlling a mirror motor so as to irradiate a laser beam to a welding position of the shaped beam, and thereby forming a welding bead having a predetermined welding pattern; forming speed detecting means detecting a forming speed of the shaped beam and transmitting a signal corresponding thereto to a controller; a camera disposed at the rear of the laser welding means, photographing a welding portion of the shaped beam, and transmitting an image signal corresponding thereto to the controller. | 05-24-2012 |
| 20120241423 | LASER MACHINING DEVICE AND BELLOWS DEVICE - Provided are: a table on which a workpiece is placed, a laser oscillator emitting a laser beam; a light-guide optical system deflecting the beam emitted from the oscillator; a cylindrical extensible bellows surrounding an optical path of the beam after the light-guide optical system deflects the beam; a bend mirror moving in an axial direction of the bellows while extending/contracting the bellows and deflecting the beam having passed through the bellows toward the table; a machining head irradiating the workpiece with the beam deflected by the mirror; an abnormality detector including a beam-sensor light-emitting unit emitting a beam advancing parallel with an axis of the bellows and a beam-sensor light-receiving unit measuring the amount of received light of the beam; and a control device bringing down the laser oscillator when the amount of received light of the beam in the beam-sensor light-receiving unit falls below a first threshold. | 09-27-2012 |
| 20120248075 | LASER DIRECT ABLATION WITH PICOSECOND LASER PULSES AT HIGH PULSE REPETITION FREQUENCIES - Laser direct ablation (LDA) produces patterns cut into a dielectric layer for the formation of electrically conductive traces with controlled signal propagation characteristics. LDA processing includes selecting a dose fluence for removing a desired depth of material along a scribe line on a surface of a workpiece, selecting a temporal pulsewidth for each laser pulse in a series of laser pulses, and selecting a pulse repetition frequency for the series of laser pulse. The pulse repetition frequency is based at least in part on the selected temporal pulsewidth to maintain the selected dose fluence along the scribe line. The selected pulse repetition frequency provides a predetermined minimum overlap of laser spots along the scribe line. The LDA process further includes generating a laser beam including the series of laser pulses according to the selected dose fluence, temporal pulsewidth, and pulse repetition frequency. | 10-04-2012 |
| 20130062323 | TECHNIQUES FOR REMOVING A CONTAMINANT LAYER FROM A THERMAL BARRIER COATING AND ESTIMATING REMAINING LIFE OF THE COATING - Systems and techniques are disclosed for removing contaminants from a surface of a thermal barrier coating (TBC) and, optionally, estimating the remaining lifetime of the TBC. Laser induced breakdown spectroscopy (LIBS) is one method that may be used to remove contaminants from a surface the TBC prior to performing photo luminescence piezo spectroscopy (PLPS) or another spectroscopic technique on a thermally grown oxide (TGO). LIBS may facilitate monitoring substantially in real-time the chemical composition of the material removed. LIBS may be used to remove substantially only the contaminants with minimal effects on the underlying TBC. One technique for determining when to stop removal of material from the TBC is cross-correlation between a spectrum collected from the ablated material and a reference spectrum collected from a reference substrate. In some embodiments, the same system may be used to perform LIBS to remove impurities and PLPS to measure stress in the TGO. | 03-14-2013 |
| 20130087538 | METHOD AND DEVICE FOR LASER-JOINING SHEET METAL PARTS - The invention relates to a device and to an associated method for joining sheet metal parts, each with a flange, by laser, wherein the flanges of the sheet metal parts ( | 04-11-2013 |
| 20130140282 | SWITCHABLE COMPOUND LASER WORKING MACHINE - A switchable compound laser working machine comprises a machine body, a first output module, a second output module, a switch module, and a control module. The first and second output modules are respectively provided with a laser tube. The switch module has at least one lens. It is able to change the output direction of laser beams by moving the lens. The control module is used for controlling the laser tubes of the first and second output modules to perform output operation respectively and used for moving the lens of the switch module into output pathway of the laser beams from the first or the second output module to alter the output direction of the laser beams. | 06-06-2013 |
| 20130140283 | HIGH POWER LASER SYSTEM - A modulation device for directing a mobile tracking device away from an asset is provided. The modulation device includes a continuous wave laser source whose output is directed at a seeker head of the mobile tracking device. The modulation device causes the generation of localized sources within the mobile tracking device and confuses the mobile tracking device as to the true location of the asset. A portable cutting device is disclosed. The portable cutting device may include a portable power supply and a laser source. The portable power supply and laser source of the portable cutting device may be positioned within a backpack and carried by a user. A handheld unit which is coupled to the laser source may be supported by the hands of the operator. The handheld unit provides power generated by the laser source to a barrier to be cut. | 06-06-2013 |
| 20130168370 | LASER-BEAM DEVICE, LASER-SOLDERING TOOL AND METHOD, FOR LASER-SOLDERING CONNECTION PADS OF A HEAD-STACK ASSEMBLY FOR A HARD-DISK DRIVE - A laser-beam device for laser-soldering connection pads of a head-stack assembly (HSA) for a hard-disk drive (HDD). The laser-beam device includes a laser configured to provide a first beam of light, a rectangular flat-top beam-shaping (RFTBS) optic, and a focusing lens. The RFTBS optic is configured to shape the first beam of light into a second beam having a rectangular shape, and a substantially flat-top intensity profile in a far-field region. The focusing lens is configured to transform the second beam into a third beam aligned with connection pads of the HSA. The third beam of light has a substantially flat-top intensity profile and a rectangular beam shape matched to cover the connection pads, and is configured to generate heat about uniformly to reflow solder of the connection pads. A laser-soldering tool and a method, for laser-soldering connection pads of the HSA are also provided. | 07-04-2013 |
| 20130180965 | LASER WELDING METHOD - A laser welding method basically includes providing a robot that is moveably in accordance with predetermined movement data, and controlling the controlling a laser beam emitting section of the robot to emit a laser beam onto a predetermined irradiation position of a workpiece to conduct welding. The laser welding method further includes: measuring a current movement position of the robot with respect to a movement position specified in the predetermined movement data; operating of the robot to change the current movement position of the robot to a prescribed position based on the predetermined movement data; and adjusting a laser emission direction by controlling an emission changing section of the laser beam emitting section based on the current movement position of the robot and the predetermined movement data such that a laser beam is emitted from the laser beam emitting section and strikes the predetermined irradiation position of the workpiece. | 07-18-2013 |
| 20130193121 | Device and Method for Continuously Welding Strips and/or Sheets - A method and to a corresponding device for continuously welding strips or sheets, guided into abutment, at their abutting edges, comprising at least two welding heads, and tension rollers which are arranged in pairs on both sides of the strips or sheets to be welded perpendicularly to the running direction thereof and which form a gap in the region of a joint of the strips or sheets, through which gap a first energy beam emanating from a first of the at least two welding heads impacts the strip edges or longitudinal edges to be welded, a second of the at least two welding heads being arranged on the opposite side of the strips or sheets a second energy beam of said second welding head impacting in this location the strip edges or longitudinal edges to be welded, characterised in that wherein the at least two welding heads are arranged offset relative to one another in the running direction of the strips or sheets so that the impact points of the energy beams on the strip edges or longitudinal edges to be welded are spaced apart from one another at least by the measurement of half the external diameter of the tension roller facing the first energy beam. | 08-01-2013 |
| 20130193122 | LASER PROCESSING APPARATUS - A laser processing apparatus includes a plasma detecting unit for detecting a wavelength of plasma light generated by applying a pulsed laser beam from a laser beam applying unit to a workpiece. The plasma detecting unit includes a bandpass filter for passing only the wavelength of plasma light generated from a first material and a photodetector for detecting the light passed through the bandpass filter. A light intensity signal is output to a controller. The controller controls the laser beam applying unit so that the amplitude of a light intensity is detected according to the light intensity signal output from the photodetector. The pulsed laser beam is stopped after the amplitude of the light intensity is decreased to a predetermined value and a predetermined number of shots of the pulsed laser beam has been applied. | 08-01-2013 |
| 20130206736 | LASER PROCESSING APPARATUS SUITABLE FOR FORMATION OF LASER PROCESSED HOLE - A laser processing apparatus detects the wavelength of plasma light generated by applying a pulsed laser beam to a workpiece. A plasma detecting unit includes a first bandpass filter for passing only the wavelength of plasma light separated into a first optical path by a beam splitter, a first photodetector for detecting the light passed through the first bandpass filter, a second bandpass filter for passing only the wavelength of plasma light separated into a second optical path by the beam splitter, and a second photodetector for detecting the light passed through the second bandpass filter. In performing laser processing, the pulsed laser beam is stopped when the light intensity detected by the first photodetector is decreased and the light intensity detected by the second photodetector is increased to a peak value and then decreased to a given value slightly less than the peak value. | 08-15-2013 |
| 20130220981 | CONTROL DEVICE AND CONTROL METHOD FOR LASER PROCESSING MACHINE - In a laser processing machine | 08-29-2013 |
| 20130299468 | ACOUSTO-OPTIC DEFLECTOR APPLICATIONS IN LASER PROCESSING OF DIELECTRIC OR OTHER MATERIALS - A laser processing system for micromachining a workpiece includes a laser source to generate laser pulses for processing a feature in a workpiece, a galvanometer-driven (galvo) subsystem to impart a first relative movement of a laser beam spot position along a processing trajectory with respect to the surface of the workpiece, and an acousto-optic deflector (AOD) subsystem to effectively widen a laser beam spot along a direction perpendicular to the processing trajectory. The AOD subsystem may include a combination of AODs and electro-optic deflectors. The AOD subsystem may vary an intensity profile of laser pulses as a function of deflection position along a dither direction to selectively shape the feature in the dither direction. The shaping may be used to intersect features on the workpiece. The AOD subsystem may also provide rastering, galvo error position correction, power modulation, and/or through-the-lens viewing of and alignment to the workpiece. | 11-14-2013 |
| 20130313232 | LASER SHOCK HARDENING APPARATUS - An improved laser shock hardening method and apparatus which can eliminate spattering of a liquid and waving of the liquid surface upon laser irradiation, and can stably irradiate a workpiece with a laser beam. In a laser shock hardening method for carrying out surface processing of a workpiece in contact with a liquid by irradiating through the liquid the surface of the workpiece with a pulsed laser beam intermittently emitted from a laser irradiation device, the disclosed method provides a solid transparent to the wavelength of the laser, serving as an entrance window to the liquid surface; allowing the liquid to be present in the light path of the laser beam between the solid and the surface of the workpiece; and allowing the laser beam to enter through the solid and irradiating through the liquid the surface of the workpiece with the laser beam. | 11-28-2013 |
| 20130319980 | Device and Method for Monitoring a Laser Cutting Process - The present disclosure relates to a device for monitoring and for controlling a laser cutting process on a workpiece, and a method of using the same. The device includes an image capturing apparatus for capturing an image of a region of the workpiece to be monitored, in which the region of the workpiece to be monitored includes a region of interaction of a laser beam with the workpiece, and an evaluation apparatus for detecting material boundaries of the workpiece using the captured image. The evaluation apparatus is configured to determine at least one characteristic value of the laser cutting process based on a geometric relationship between at least two of the detected material boundaries, the region of interaction, or combinations thereof. | 12-05-2013 |
| 20130334181 | LASER PROCESSING MACHINE, LASER CUTTING MACHINE, AND METHOD FOR ADJUSTING A FOCUSED LASER BEAM - Laser processing machines and methods for adjusting focused laser beams. Laser processing heads have nozzle with openings admitting primary laser beam. An orientation device is included, as well as at least one sensor to mutually center primary beam and opening of nozzle. A first beam handling unit is arranged near the nozzle opening and may convert primary beam into a secondary wide-band heat beam, and then may emit this secondary beam towards a sensor; or may reflect/scatter at least a portion of the primary beam towards sensor. The sensor detecting the converted secondary beam is arranged within the laser processing head. In an adjustment process, a primary beam may be converted into a wide-band heat radiation as secondary radiation at the beam handling unit, and emitted and/or diverted into a scattered/reflex beam towards the sensor. Respective position of nozzle opening center and primary beam is calculated from sensor-measured values, and nozzle center and beam center are automatically displaced to mutual center. The axial position of beam focus may be also be measured and set via the nozzle centering procedure. | 12-19-2013 |
| 20130341310 | MONITORING METHOD AND APPARATUS FOR EXCIMER LASER ANNEALING PROCESS - A method is disclosed evaluating a silicon layer crystallized by irradiation with pulses form an excimer-laser. The crystallization produces periodic features on the crystalized layer dependent on the number of and energy density in the pulses to which the layer has been exposed. An area of the layer is illuminated with light. A detector is arranged to detect light diffracted from the illuminated area and to determine from the detected diffracted light the energy density in the pulses to which the layer has been exposed. | 12-26-2013 |
| 20140197140 | LASER PULSE ENERGY CONTROL SYSTEMS AND METHODS - Systems and methods provide laser pulse energy control and/or monitoring. An example laser processing apparatus includes a laser system to generate a beam of laser pulses and a pulse energy control system to adjust the pulse energy of each laser pulse in the beam on a pulse-by-pulse basis. The pulse energy control system includes an open loop feedforward control path that selects a pulse energy transmission value for each laser pulse based on a calibrated transmission curve that maps laser pulse energy as a function of pulse repetition frequency. A laser energy monitor measures the laser pulse energy of each laser pulse in the beam of laser pulses. A power control loop may further adjust the pulse energy of one or more laser pulses in the beam of laser pulses based on feedback from the laser energy monitor. | 07-17-2014 |
| 20140217071 | LASER MACHINING SYSTEMS AND METHODS WITH VISION CORRECTION AND/OR TRACKING - Vision correction and tracking systems may be used in laser machining systems and methods to improve the accuracy of the machining. The laser machining systems and methods may be used to scribe one or more lines in large flat workpieces such as solar panels. In particular, laser machining systems and methods may be used to scribe lines in thin film photovoltaic (PV) solar panels with accuracy, high speed and reduced cost. The vision correction and/or tracking systems may be used to provide scribe line alignment and uniformity based on detected parameters of the scribe lines and/or changes in the workpiece. | 08-07-2014 |
| 20140263209 | APPARATUS AND METHODS FOR MANUFACTURING - An apparatus for manufacturing includes: a build chamber including a build platform; a material dispenser configured to distribute a layer of powdered material over the build platform; a mirror arranged over the build platform and defining a mirrored planar surface; a first laser output optic configured to output a first energy beam toward the mirror; a second laser output optic adjacent the first laser output optic and configured to output a second energy beam toward the mirror; a first actuator configured to maneuver the first laser output optic and the second laser output optic relative to the build platform; a lens arranged between the mirror and the build platform; and a second actuator configured to maneuver the mirror to scan the first and second energy beams across the lens, the lens outputting the first energy beam and the second energy beam toward and substantially normal to the build platform. | 09-18-2014 |
| 20140319107 | LASER MACHINING METHOD - A laser machining method for cutting or cutting grooves on a workpiece using an apparatus having an X-Y table for mounting the workpiece, a laser source emitting a continuous wave or a quasi-continuous wave laser beam, modulator forming a pulsed laser beam by a high-speed modulation of the continuous wave or quasi-continuous wave laser beam, and an optical system capable of converging the pulsed laser beam on the workpiece, wherein the method comprising cutting with the pulsed laser beams along a locus including a portion where the moving speed of the X-Y table is decreased, and the pitch of holes machined with said laser pulses is kept constant by adjusting the intervals between successive said laser pulses in accordance with the moving speed of said workpiece, the method further comprising increasing the pulse widths of the laser pulses in accordance with the decrease in moving speed of the X-Y table in the portion where the moving speed of the X-Y table is decreased. | 10-30-2014 |
| 20140353295 | SYSTEM, METHOD AND APPARATUS FOR REMOVING A BURR FROM A SLOTTED PIPE - A deburring system for removing burrs from a surface of a pipe is provided. The deburring system comprises: a shaft having an anterior end; a conduit contained in the shaft for carrying a laser beam generated from a laser; and a directing module to direct the laser beam emanating from the conduit radially from the shaft to the surface of the pipe. The deburring system is shaped to fit inside the pipe. | 12-04-2014 |
| 20140360990 | LASER WELDING DEVICE FOR ROLL FORMING SYSTEM AND CONTROL METHOD THEREOF - A roll forming system which roll-forms a shaped beam by a roll forming unit including a plurality of roll formers is disclosed. A laser welding device for the roll forming system may include: front and rear guide means disposed apart from each other at the rear of the roll forming unit, and guiding movement of the shaped beam; laser welding means mounted above and between the front and rear guide means, reciprocatedly rotating a mirror by controlling a mirror motor so as to irradiate a laser beam to a welding position of the shaped beam, and thereby forming a welding bead having a predetermined welding pattern; forming speed detecting means detecting a forming speed of the shaped beam and transmitting a signal corresponding thereto to a controller; a camera disposed at the rear of the laser welding means, photographing a welding portion of the shaped beam, and transmitting an image signal corresponding thereto to the controller. | 12-11-2014 |
| 20150021303 | LASER MACHINING DEVICE AND LASER OSCILLATION CONTROL METHOD - A laser machining device includes a laser oscillator for oscillating a laser beam to have a variable output according to a machining condition, an optical fiber for propagating the laser beam, a sensor for detecting an intensity of a light leaking from a cladding side face of the optical fiber and outputting a detection signal indicating that intensity, and an oscillation control unit for controlling an operation of that laser machining device based on the detection signal. The oscillation control unit compares a first threshold that is set in correspondence to that output with an intensity or an amount of light obtained from the detection signal, compares a second threshold that is set in correspondence to that output with an intensity or an amount of light obtained from the detection signal, and controls the operation of that laser machining device based on a result of comparing. | 01-22-2015 |
| 20150048063 | LASER MACHINING APPARATUS - A laser machining apparatus for manufacturing a light guide plate includes a laser source, a first prism, a detector, and a processor. The laser source is configured to emit a laser beam. The first prism includes a first optical surface, a first reflective surface and a second reflective surface. A sub wavelength grating is arranged and fixed on the second reflective surface. A portion of the laser beam is diffracted by the grating forming a diffraction beam. The detector captures and detects a real-time energy value of the diffraction beam. The processor receives the detected energy value, compares it with a preset energy value, calculates a to-be-increased value of the laser beam, and sends an instruction about the calculated value to the laser source. | 02-19-2015 |
| 20150060419 | Machining Metal Removal Control - A process is disclosed for controlling the length of chips or shavings on materials that is inherent to produce long undesired chips when machined. Based on the work piece configuration and surface area to machine a determined outlay and process application for a continuous scribe or arrangements of different scribe pattern or patterns for the part and or surface is selected to provide optimal chip control during the machining operation. Engineered Interruptions are applied to the work object prior to the machining operation to maximize optimal chip control. Controlling the depth of scribe of the laser is accomplished and managed through the interface of hardware, software and electronics. | 03-05-2015 |
| 20150144604 | LASER MACHINING SYSTEM UTILIZING THERMAL RADIATION IMAGE AND METHOD THEREOF - A laser machining system and a method thereof are disclosed. The disclosed laser machining system comprises a laser generator, an array photo detector, a processer, and a position controller. The laser generator is configured to emit laser via a first light path onto a work piece. The array photo detector is configured to receive the thermal radiation from the work piece via a second light path, different from the first light path, to generate a thermal radiation image. The processor, electrically coupled to the laser generator and the array photo detector, is configured to calculate a temperature centroid of the thermal radiation image and generate a distance control signal according to the temperature centroid. The position controller, electrically coupled to the processor, is controlled by the distance control signal to make a present distance between the laser machining system equal to a working distance. | 05-28-2015 |
| 20150303080 | ADJUSTING INTENSITY OF LASER BEAM DURING LASER OPERATION ON A SEMICONDUCTOR DEVICE - Among other things, a system and method for adjusting the intensity of a laser beam applied to a semiconductor device are provided for herein. A sensor is configured to measure the intensity of a laser beam reflected from the semiconductor device. Based upon the reflection intensity, an intensity of the laser beam that is applied to the semiconductor device is adjusted, such as to alter an annealing operation performed on the semiconductor device, for example. | 10-22-2015 |
| 20150343560 | APPARATUS AND METHOD FOR CONTROLLED LASER HEATING - The invention pertains to an apparatus and method for controlled laser heating of a body. An optical integrating chamber, with an opening adjacent to the surface of the body, has a first and second aperture. A laser source, produces a beam of known power which is directed through the first aperture and the chamber opening onto the surface. A portion of the power of the laser beam is absorbed by the body, thereby heating it locally, and the remaining portion is substantially reflected back into the chamber. A photodetector samples the reflected light accumulated within the chamber through the second aperture, thereby discerning the total power of the reflected light, and enabling the computation of the absorbed power imparted as heat to the body. This computation is performed by a computer or controller, which also serves as a control feedback mechanism, by which the application of the laser is controlled based on the absorbed power imparted to the body during the heating process. Several embodiments are described, useful for a wide range of potential applications in processing and evaluation of organic and inorganic materials and structures. | 12-03-2015 |
| 20160001397 | LASER PROCESSING APPARATUS - The present disclosure provides a laser processing apparatus. A laser processing apparatus includes a laser generator, a laser amplifier, a chromatic dispersion tuner and an optical focusing unit. The laser generator is configured to generate ultrashort pulse laser having chirp characteristics by simultaneously generating a plurality of wavelengths. The laser amplifier is configured to amplify the laser generated by the laser generator. The chromatic dispersion tuner is configured to adjust chirp and pulse width of the laser output from the laser amplifier. The optical focusing unit is configured to irradiate a workpiece with the laser after adjusting the depth of focus of the laser with the chirp and the pulse width adjusted by the chromatic dispersion tuner. | 01-07-2016 |
| 20160074963 | TURBOCHARGER SHAFT AND WHEEL ASSEMBLY - A system can include a controller; a force applicator; a rotatable shaft centering collet; a drive mechanism that rotates the rotatable shaft centering collect; and a laser beam unit. | 03-17-2016 |
| 20160136756 | LASER WELDING METHOD - A laser welding method is capable of easily restraining poor welding when spatters adhere to a protective glass of an optical system. The laser welding method includes a step of calculating a decrease-amount of the laser power before laser welding is performed by irradiating a welding portion of a workpiece with the laser beam having a predetermined power. The step of calculating the decrease-amount includes irradiating the welding portion with an inspecting laser beam having a power smaller than the predetermined power, receiving a return beam of the inspecting laser beam, measuring an intensity of the return beam, and comparing the intensity of the return beam with a standard intensity to calculate an amount of decrease in power of the inspecting laser beam at the welding portion. | 05-19-2016 |
| 20160151859 | SYSTEM AND METHOD FOR CONTROLLING THE INPUT ENERGY FROM AN ENERGY POINT SOURCE DURING METAL PROCESSING | 06-02-2016 |
| 20160158891 | LASER PROCESSING APPARATUS SUITABLE FOR FORMATION OF LASER PROCESSED HOLE - A laser processing method for forming a laser processed hole in a workpiece having a first member including a first material and a second member including a second material, the laser processed hole extending from the first member to the second member, the laser processing method including: applying a pulsed laser beam to the workpiece; using a plasma detecting means to detect the wavelength of plasma light generated by applying the pulsed laser beam to the workpiece; controlling, via a controller, a laser beam applying means according to a detection signal from the plasma detecting means; and stopping the application of the pulsed laser beam when both: (i) the light intensity detected by a first photodetector is decreased, and (ii) the light intensity detected by a second photodetector is increased to a peak value and next decreased to a given value that is slightly less than the peak value. | 06-09-2016 |
| 20160193692 | Devices and Methods for Monitoring, in Particular for Regulating, a Cutting Process | 07-07-2016 |
| 20160199940 | LASER PROCESSING APPARATUS | 07-14-2016 |
