| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 216093000 | Recycling, regenerating, or rejunevating etchant | 12 |
| 20080217296 | ETCHING APPARATUS FOR SEMICONDUCTOR PROCESSING APPARATUS AND METHOD THEREOF FOR RECYCLING ETCHANT SOLUTIONS - An etching apparatus of a semiconductor processing apparatus and the method thereof for recycling etchant solutions are provided. The method is suitable for a processing apparatus which provides an etchant solution on a wafer so as to perform an etching process. After the etching process is completed, a water solution is added to the etchant solution for maintaining a water content thereof. Then, the mixed etchant solution is recycled. | 09-11-2008 |
| 20080237188 | SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD - Mutually different plural kinds of processing liquid are sequentially supplied to a gap space in which a substrate is arranged to perform a wet processing to the substrate with respect to each processing liquid. Further, the processing liquid used in the wet processing is sequentially released from the communicating portion upon execution of each wet processing. The liquid retrieval tanks are selectively positioned at a retrieval position corresponding to the kind of processing liquid released from the communicating portion by relatively moving the processing unit and the liquid retrieval unit. The liquid retrieval unit is separated from the processing unit and is arranged below the processing unit. The processing liquid is released from the communicating portion of the processing unit to below the gap space downwards vertically. | 10-02-2008 |
| 20090078679 | ETCHING SOLUTION AND METHOD FOR REGENERATING WASTE LIQUID THEREOF, AND METHOD FOR RECOVERING VALUABLE METALS FROM WASTE LIQUID - The present invention provides etching solution for alloy steel such as stainless steel using ferric chloride, in which ferric chloride can be regenerated without carrying out an operation of removing chromium and nickel and while suppressing an increase in the amount of the etching solution, and an etching method using the etching solution. | 03-26-2009 |
| 20090236316 | SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS - A wafer processing apparatus | 09-24-2009 |
| 20110000884 | Method for Etching Copper and Recovery of the Spent Etching Solution - An etching and recovery method is described, wherein articles made of copper are etched with an acid aqueous solution of etching chemicals containing Cu | 01-06-2011 |
| 20110278261 | ETCHING ACID WASTE LIQUID DISPOSAL SYSTEM, ETCHING ACID WASTE LIQUID DISPOSAL APPARATUS AND ETCHING ACID WASTE LIQUID DISPOSAL METHOD APPLIED TO THE SYSTEM AND THE APPARATUS - According to one embodiment, a solid removal process in a filter and a positive metal ion removal process in a positive metal ion-exchange resin column are performed sequentially through an etching acid waste liquid disposal circulation flow channel, the solid removal process is performed on an upstream side of the positive metal ion removal process, furthermore after the positive metal ion removal process, a negative metal ion removal process removing at least B using a chelate forming fiber or a chelate forming resin is performed on a downstream side of the etching acid waste liquid disposal circulation flow channel, thereby an etching acid waste liquid is recycled sequentially through the etching acid waste liquid disposal circulation flow channel. | 11-17-2011 |
| 20120006790 | Apparatus and method for treating etching solution - An apparatus and method for treating an etching solution, where the replacement frequency of the etching solution is reduced, while the inclusion of impurities in the treated etching solution is prevented. An apparatus for treating an etching solution in order to reuse the etching solution used in etching treatment of silicon, where the apparatus includes: membrane separation means | 01-12-2012 |
| 20120091099 | METHODS AND APPARATUS FOR RECOVERY AND REUSE OF REAGENTS - Methods and apparatus for recovery and reuse of reagents are provided herein. In some embodiments, a system for processing substrates may include a process chamber for processing a substrate; a reagent source coupled to the process chamber to provide a reagent to the process chamber; and a reagent recovery system to collect, and at least one of purify or concentrate the reagent recovered from an effluent exhausted from the process chamber. In some embodiments, a method for recovering unreacted reagent may include providing reagent from a reagent source to a process chamber; exposing a substrate disposed in the process chamber to the reagent, forming an effluent; exhausting the effluent from the process chamber; and recovering unreacted reagent from the effluent in a reagent recovery system. | 04-19-2012 |
| 20130306600 | Accurately Monitored CMP Recycling - A method is provided for reformulating a chemical mechanical planarization (CMP) slurry for use in conjunction with a CMP tool having an active cycle during which the tool is being used to planarize a substrate, and a rinse cycle during which the tool is being rinsed. The method comprises (a) receiving a feed stream from the CMP tool, at least a portion of the feed stream comprising abrasive particles disposed in a liquid medium; (b) during at least a portion of the rinse cycle, sending the feedstream received from the CMP tool to a first location; and (c) during at least a portion of the active cycle, sending the feedstream received from the CMP tool to a second location where the feedstream undergoes processing to reformulate the slurry. | 11-21-2013 |
| 20150122779 | SYSTEMS AND METHODS FOR ACID-TREATING GLASS ARTICLES - Described herein are various systems and methods for using acidic media to enhance the surface characteristics of glass articles while reducing the adverse effects of precipitate/sludge formation. The systems and methods generally implement a precipitation-capturing device that is configured to 1) permit formation of sludge thereon and 2) reduce formation of the sludge on other solid surfaces involved in the systems and methods. | 05-07-2015 |
| 20160049308 | SUBSTRATE PROCESSING METHOD - A substrate processing method includes a phosphoric acid processing step of supplying a phosphoric acid aqueous solution, which contains silicon and has a silicon concentration lower than a saturation concentration, to a front surface of a substrate, a liquid volume reducing step of reducing a volume of the phosphoric acid aqueous solution on the substrate, after the phosphoric acid processing step, and a rinse replacing step of supplying a rinse liquid having a temperature lower than that of the phosphoric acid aqueous solution supplied to the front surface of the substrate in the phosphoric acid processing step to the front surface of the substrate covered with the phosphoric acid aqueous solution at least partially, after the liquid volume reducing step. | 02-18-2016 |
| 20160086812 | METHOD FOR TREATING ETCHING SOLUTION - A method for treating an etching solution in order to circulate and reuse an etching solution used in etching treatment of silicon includes (1) selectively removing multivalent ions having a valence of two or more, or (2) removing multivalent ions having a valence of two or more, 20-50% of alkali metal ions having a valence of one relative to a total amount of the alkali metal ions, and hydroxide ions, through a membrane separation unit comprising a nanofiltration membrane. A permeated solution of the membrane separation unit is circulated to the etching bath. | 03-24-2016 |
