| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 205238000 | Depositing predominantly alloy coating | 89 |
| 20080257744 | METHOD OF MAKING AN INTEGRATED CIRCUIT INCLUDING ELECTRODEPOSITION OF ALUMINIUM - A method of making an integrated circuit including composition of matter for electrodepositing of aluminium is disclosed. One embodiment includes a bath having a solution of selected aluminium salts in a substantially anhydrous organic solvent, to uses of certain aluminium salts for electrodepositing and to processes for electrodepositing aluminium. | 10-23-2008 |
| 20090057159 | Method for producing alloy deposits and controlling the nanostructure thereof using negative current pulsing electro-deposition - Bipolar current electrodeposits a nanocrystalline grain size. Polarity Ratio relates the absolute value of time integrated amplitude of negative polarity and positive polarity current. Grain size can be controlled in alloys of two or more components, one of which being a metal, and one of which being most electro-active. Typically the more electro-active material is preferentially lessened in the deposit during negative current. The deposit is relatively crack and void free. Grain size is typically a function of deposit composition, which is typically a function of Polarity Ratio. Specified grain size can be achieved by selecting a corresponding Polarity Ratio. Coatings can be in layers, each having a grain size, which can vary layer to layer and also in a graded fashion. A finished article may be built upon a substrate of electro-conductive plastic, or metal, including steels, aluminum, brass. The substrate may remain, or be removed. | 03-05-2009 |
| 20090205969 | CROSSLINKED POLYMERS, GALVANIZATION BATHS COMPRISING THEM AND USE THEREOF - The invention relates to polymers which comprise at least partially cross-linked main chains constructed from repeat units of the general formula I | 08-20-2009 |
| 20100044239 | CYANIDE-FREE ELECTROLYTE COMPOSITION, AND METHOD FOR THE DEPOSITION OF SILVER OR SILVER ALLOY LAYERS ON SUBSTRATES - The invention relates to a cyanide-free electrolyte composition for depositing a silver or silver alloy layer on a substrate as well as a method for depositing such layers with the help of said cyanide-free electrolyte composition. The electrolyte composition according to the invention comprises at least one silver ion source, a sulfonic acid and/or a sulfonic acid derivative, a wetting agent and a hydantoin. The silver or silver alloy layers deposited from such an electrolyte composition by means of the method according to the invention are dull and ductile. | 02-25-2010 |
| 20100072073 | Method for the electrochemically coating or stripping the coating from components - A method for the electrochemical application or removal of a coating of components ( | 03-25-2010 |
| 20110083967 | ELECTRODEPOSITED ALLOYS AND METHODS OF MAKING SAME USING POWER PULSES - Power pulsing, such as current pulsing, is used to control the structures of metals and alloys electrodeposited in non-aqueous electrolytes. Using waveforms containing different types of pulses: cathodic, off-time and anodic, internal microstructure, such as grain size, phase composition, phase domain size, phase arrangement or distribution and surface morphologies of the as-deposited alloys can be tailored. Additionally, these alloys exhibit superior macroscopic mechanical properties, such as strength, hardness, ductility and density. Waveform shape methods can produce aluminum alloys that are comparably hard (about 5 GPa and as ductile (about 13% elongation at fracture) as steel yet nearly as light as aluminum; or, stated differently, harder than aluminum alloys, yet lighter than steel, at a similar ductility. Al—Mn alloys have been made with such strength to weight ratios. Additional properties can be controlled, using the shape of the current waveform. | 04-14-2011 |
| 20110100830 | CHEMICAL CONVERSION TREATMENT SOLUTION FOR A STEEL MATERIAL AND CHEMICAL CONVERSION TREATMENT METHOD - A chemical conversion treatment solution for a steel material is provided. The solution is an acidic aqueous solution of pH 3 to 5 containing 50 to 500 ppm by weight of zirconium fluoride complex in terms of Zr, 5 to 50 ppm by weight of free fluorine, and 5 to 30% by weight in relation to Zr of polyethyleneimine having a weight average molecular weight of 300 to 10,000, a molar ratio of the primary amino group of at least 30%, and a molar ratio of the tertiary amino group of at least 15% in relation to the total amino group content. A method for chemical conversion treatment is also provided. This invention realizes excellent coating adhesion and corrosion resistance after the coating, as well as improved throwing power in the coating, and in particular, in the electrodeposition coating of a steel material. | 05-05-2011 |
| 20110198230 | PROCESS FOR PRODUCING AN ACTIVE CATHODE FOR ELECTROLYSIS - Soluble nickel and tin contained in a coating layer are eluted into an aqueous solution by bringing a cathode coated with a nickel-tin alloy into contact with an aqueous solution of an alkali metal hydrogen carbonate such as sodium hydrogen carbonate, thereby reducing the amounts of these metals eluted during electrolysis. | 08-18-2011 |
| 20110220511 | ELECTRODEPOSITION BATHS AND SYSTEMS - Electrodeposition baths and systems. The baths and systems are useful for forming coated articles. The articles may include a base material and a coating comprising silver formed thereon. In some embodiments, the coating comprises a silver-based alloy, such as a silver-tungsten alloy. The coating may, in some instances, include at least two layers. For example, the coating may include a first layer comprising a silver-based alloy and a second layer comprising a precious metal. The coating can exhibit desirable properties and characteristics such as durability (e.g., wear), hardness, corrosion resistance, and high conductivity, which may be beneficial, for example, in electrical and/or electronic applications. In some cases, the coating may be applied using an electrodeposition process. | 09-15-2011 |
| 20120043215 | METHOD AND APPARATUS FOR ELECTRODEPOSITING LARGE AREA CADMIUM TELLURIDE THIN FILMS FOR SOLAR MODULE MANUFACTURING - Embodiments of the inventions provide methods and apparatus to electroplate films of tellurides such as CdTe, or its alloys on multiple large area workpieces. In one embodiment a method of forming a solar cell absorber film on multiple work pieces uses a self adjusting mechanism taking advantage of the high resistivity of the solar cell absorber film. Larger deposits of the plating material onto one workpiece, due for example, to non-uniformity of solution flow, results in larger resistance thus decreasing the current flowing through that workpiece. The decreased current then deposits less material over that workpiece. In another embodiment multiple workpieces can be electroplated using a single power supply in a single plating bath. | 02-23-2012 |
| 20120118755 | COATED ARTICLES, ELECTRODEPOSITION BATHS, AND RELATED SYSTEMS - Coated articles, electrodeposition baths, and related systems are described. The article may include a base material and a coating comprising silver formed thereon. In some embodiments, the coating comprises a silver-based alloy, such as a silver-tungsten alloy. The coating can exhibit desirable properties and characteristics such as durability (e.g., wear), hardness, corrosion resistance, and high conductivity, which may be beneficial, for example, in electrical and/or electronic applications. In some cases, the coating may be applied using an electrodeposition process. | 05-17-2012 |
| 20120199490 | ELECTROPLATING METHODS AND CHEMISTRIES FOR DEPOSITION OF GROUP IIIA-GROUP VIA THIN FILMS - An electrochemical co-deposition method and solution to plate uniform, defect free and smooth (In,Ga)—Se films with repeatability and controllable molar ratios of (In,Ga) to Se are provided. Such layers are used in fabrication of semiconductor and electronic devices such as thin film solar cells. In one embodiment, the present invention provides an alkaline electrodeposition solution that includes an In salt, a Se acid or oxide, a tartrate salt as complexing agent for the In species, and a solvent to electrodeposit an In—Se film possessing sub-micron thickness on a conductive surface. | 08-09-2012 |
| 20130001092 | IONIC LIQUIDS - There is provided a mixture having a freezing point of up to 100° C. formed by a process comprising the step of contacting: (A) from 1 to 2 equivalents of a compound of formula (I) AlX | 01-03-2013 |
| 20130284605 | HIGH SPEED METHOD FOR PLATING PALLADIUM AND PALLADIUM ALLOYS - A high speed method of depositing palladium and palladium alloys is disclosed. The high speed method uses an aqueous, ammonia-based bath which has reduced free ammonia in the bath. The high speed method may be used to deposit palladium and palladium alloy coatings on various substrates such as electrical devices and jewelry. | 10-31-2013 |
| 20140238866 | SILVER-CONTAINING ALLOY PLATING BATH AND METHOD FOR ELECTROLYTIC PLATING USING SAME - A silver-containing alloy electrolytic plating bath that can produce silver-containing alloy plated products having excellent resistance to oxidation suitable for electronic members, decoration members, and dental members, is described, along with a method for electrolytic plating using the same. The silver-containing alloy plated products have excellent resistance to oxidation and can be manufactured by using the plating bath that contains (a) a silver compound containing 99.9% to 46% by mass of silver on the basis of the total metal mass therein, (b) a gadolinium compound containing 0.1% to 54% by mass of gadolinium on the basis of the total metal mass therein, (c) at least one kind of complexing agent, and (d) a solvent. | 08-28-2014 |
| 20150300477 | HARDENED SILVER COATED JOURNAL BEARING SURFACES AND METHOD - An article comprises a metal alloy substrate and a plated wear interface layer disposed over a surface of the metal alloy substrate. The wear interface layer has a chemical composition including between about 0.005 wt % and about 0.050 wt % of antimony (Sb), and the balance silver (Ag) and incidental impurities. | 10-22-2015 |
| 20160076161 | LEVELING ADDITIVES FOR ELECTRODEPOSITION - Leveling additives, their use in electrodeposition, and regeneration are described. In one embodiment, an electrodeposition bath may include a non-aqueous liquid and an optionally substituted aromatic hydrocarbon. The optionally substituted aromatic hydrocarbon may be protonated. | 03-17-2016 |
| 20160177462 | ELECTROLYTE FOR THE ELECTROLYTIC DEPOSITION OF SILVER-PALLADIUM ALLOYS AND METHOD FOR DEPOSITION THEREOF | 06-23-2016 |
| 205239000 | Copper-containing alloy | 24 |
| 20090020434 | Substrate processing method and substrate processing apparatus - A substrate processing method makes it possible to fill interconnect recesses, such as trenches, with a defect-free interconnect material by carrying out electroplating directly on a surface of a ruthenium film as a barrier layer. The substrate processing method comprises: providing a substrate having interconnect recesses formed in a substrate surface and having a ruthenium film formed in the entire substrate surface including interior surfaces of the interconnect recesses; keeping the substrate surface in contact with a plating solution for a predetermined time to adsorb an additive in the plating solution onto the ruthenium film, and then carrying out electroplating to form a conductive film on a surface of the ruthenium film. | 01-22-2009 |
| 20090283415 | ELECTROPLATING METHODS AND CHEMISTRIES FOR DEPOSITION OF COPPER-INDIUM-GALLIUM CONTAINING THIN FILMS - Described is an electrodeposition solution for deposition of a Group IB-IIIA thin film on a conductive surface. In a preferred embodiment, the electrodeposition solution comprises a solvent; a Group IB material source that dissolves in the solvent and provides a Group IB material; a Group IIIA material source that dissolves in the solvent and provides a Group IIIA material; and a blend of at least two complexing agents, one of the at least two complexing agent forming a complex with the Group IB material and the other one of the at least two complexing agent forming a complex with the Group IIIA material; wherein the pH of the solution is at least 7. | 11-19-2009 |
| 20100084278 | Novel Cyanide-Free Electroplating Process for Zinc and Zinc Alloy Die-Cast Components - The proposed invention comprises a process for plating upon zinc die cast articles without the use of cyanide in the plating solution The process proposes the plating of the zinc die cast articles with a zinc alloy layer first, followed by plating with copper, nickel, chromium, tin or brass. The preferred zinc alloy initial coating is zinc-nickel. | 04-08-2010 |
| 20100206739 | METHOD OF OBTAINING A YELLOW GOLD ALLOY DEPOSITION BY GALVANOPLASTY WITHOUT USING TOXIC METALS OR METALLOIDS - The invention relates to an electrolytic deposition in the form of a gold alloy with a thickness of between 1 and 800 microns and which includes copper. According to the invention, the deposition includes indium as the third main compound. The invention concerns the field of electroplating methods. | 08-19-2010 |
| 20100294669 | ELECTROLYTIC DEPOSITION OF METAL-BASED COMPOSITE COATINGS COMPRISING NANO-PARTICLES - A method is provided for imparting corrosion resistance onto a surface of a substrate. The method comprises contacting the surface of the substrate with an electrolytic plating solution comprising (a) a source of deposition metal ions of a deposition metal selected from the group consisting of zinc, palladium, silver, nickel, copper, gold, platinum, rhodium, ruthenium, chrome, and alloys thereof, (b) a pre-mixed dispersion of non-metallic nano-particles, wherein the non-metallic particles have a pre-mix coating of surfactant molecules thereon; and applying an external source of electrons to the electrolytic plating solution to thereby electrolytically deposit a metal-based composite coating comprising the deposition metal and non-metallic nano-particles onto the surface. | 11-25-2010 |
| 20110180414 | ELECTROPLATING METHODS AND CHEMISTRIES FOR DEPOSITION OF COPPER-INDIUM-GALLIUM CONTAINING THIN FILMS - Described is an electrodeposition solution for deposition of a Group IB-IIIA thin film on a conductive surface. In a preferred embodiment, the electrodeposition solution comprises a solvent; a Group IB material source that dissolves in the solvent and provides a Group IB material; a Group IIIA material source that dissolves in the solvent and provides a Group IIIA material; and a blend of at least two complexing agents, one of the at least two complexing agent forming a complex with the Group IB material and the other one of the at least two complexing agent forming a complex with the Group IIIA material; wherein the pH of the solution is at least 7. | 07-28-2011 |
| 20130264215 | DIRECT-CONTACT MEMBRANE ANODE FOR USE IN ELECTROLYSIS CELLS - The present invention relates to an anode system for conventional electrolysis cells, a process for the production thereof and its use for the deposition of electrolytic coatings. The anode system is characterized in that the anode ( | 10-10-2013 |
| 20130327651 | PLATING BATHS AND METHODS FOR ELECTROPLATING SELENIUM AND SELENIUM ALLOYS - Plating bath solutions and methods for depositing selenium generally include an aqueous plating bath containing a soluble selenium source and a soluble surfactant additive, wherein the soluble surfactant additive is selected from the group consisting of an alkane sulfonic acid, an alkane phosphonic acid and mixtures thereof, wherein the alkane group defining the alkane sulfonic acid and the alkane phosphonic acid has less than 25 carbon atoms The method includes immersing a conductive substrate to be plated into the aqueous plating bath; and electroplating selenium onto the substrate to form a continuous and particle free film. | 12-12-2013 |
| 20150368819 | LEVELING COMPOSITION AND METHOD FOR ELECTRODEPOSITION OF METALS IN MICROELECTRONICS - The present disclosure relates to a leveling composition for electrodepositing metals. The composition comprises a compound of formula (I): | 12-24-2015 |
| 20160186345 | SULFONAMIDE BASED POLYMERS FOR COPPER ELECTROPLATING - Sulfonamide based polymers are reaction products of sulfonamides and epoxides. The polymers may be used as levelers in copper electroplating baths, to provide good throwing power. Such reaction products may plate copper or copper alloys with good surface properties and good physical reliability. | 06-30-2016 |
| 20160186349 | SULFONAMIDE BASED POLYMERS FOR COPPER ELECTROPLATING - Sulfonamide based polymers are reaction products of sulfonamides and epoxides. The polymers may be used as levelers in copper electroplating baths, to provide good throwing power. Such reaction products may plate copper or copper alloys with good surface properties and good physical reliability. | 06-30-2016 |
| 205240000 | Including zinc (e.g., brass, etc.) | 3 |
| 20100243466 | COPPER-ZINC ALLOY ELECTROPLATING BATH AND PLATING METHOD USING THE COPPER-ZINC ALLOY ELECTROPLATING BATH - A cyanide-free copper-zinc alloy electroplating bath is provided which can form a uniform and glossy alloy layer having the desired composition even at a higher current density than that for a conventional electroplating bath, and which is excellent in productivity. | 09-30-2010 |
| 20110089043 | MODIFIED COPPER-TIN ELECTROLYTE AND PROCESS FOR THE DEPOSITION OF BRONZE LAYERS - The invention relates to a modified copper-tin electrolyte which is free of toxic constituents such as cyanides or thio compounds. The invention further relates to a process for the deposition of decorative bronze layers on consumer goods and industrial articles using the electrolyte of the invention. The electrolyte comprises an additive formed from epichlorohydrin and hexamethylenetetramine and contains carbonate or hydrogencarbonate ions. | 04-21-2011 |
| 20130140185 | ELECTROLYTE AND PROCESS FOR THE DEPOSITION OF COPPER-TIN ALLOY LAYERS - The present invention relates to an electrolyte and a process for depositing bronze alloys on consumer goods and industrial articles. The electrolyte of the invention comprises, in addition to the metals to be deposited and additives such as wetting agents, complexing agents and brighteners, in particular sulfur compounds which have a positive effect in the corresponding process for the deposition of the bronzes. | 06-06-2013 |
| 205241000 | Including tin (e.g., bronze, etc.) | 7 |
| 20080230394 | Metal surface treatment liquid for cation electrodeposition coating - A surface treatment with a zirconium ion that enables sufficient throwing power, and superior anti-corrosion properties to be exhibited when thus surface treated metal base material is subjected to cation electrodeposition coating is provided. A metal surface treatment liquid for cation electrodeposition coating includes zirconium ions and tin ions, and has a pH of 1.5 to 6.5, in which: the concentration of zirconium ions is in the range of 10 to 10,000 ppm; and the content of the tin ions to the zirconium ions is 0.005 to 1 on a mass basis. Furthermore, a polyamine compound, copper ions, fluorine ions, and a chelate compound may also be included. | 09-25-2008 |
| 20080257745 | COPPER-TIN-OXYGEN ALLOY PLATING - The present invention relates to a Cu—Sn—O alloy plating having an oxygen content of 0.3 to 50 at %, a copper content of 20 to 80 at %, and a tin content of 10 to 70 at % in the plating. The present invention provides a copper tin alloy plating that has excellent plating adhesion and disengaging force stability and particularly a Cu—Sn—O alloy plating that has a blackish color tone without containing any controlled substances. | 10-23-2008 |
| 20090188807 | Electroplating bronze - Electrolytes for white bronzes are disclosed as well as methods of depositing the white bronzes. The electrolytes for depositing the white bronzes are cyanide free and provide a uniform white color. | 07-30-2009 |
| 20100147696 | COPPER-TIN ELECTROLYTE AND METHOD FOR DEPOSITING BRONZE LAYERS - Consumer goods and industrial articles are electro-plated with bronze layers for decorative reasons and to protect them against corrosion. The electrolytes used hitherto for producing decorative bronze layers are either cyanide-containing or, as in the case of baths based on organosulphonic acids, highly corrosive or have, as in the case of cyanide-free baths based on diphosphoric acid, unsatisfactory long-term stabilities. Electrolytes which are used for applying solderable bronze layers in the electronics industry usually contain toxic or very toxic thio compounds. The present invention provides a non-toxic electrolyte which displays long-term stability for the electrolytic deposition of decorative bronze layers and a corresponding process for the application of such decorative bronze layers to consumer goods and industrial articles. | 06-17-2010 |
| 20110233065 | ELECTROLYTE AND METHOD FOR DEPOSITION OF MATTE METAL LAYER - This invention relates to an electrolyte as well as a method for the deposition of a matte metal layer on a substrate surface, where the matte metal layer is V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Ru, Rh, Pd, Ag, In, Sn, Sb, Te, Re, Pt, Au, TI, Bi, or an alloy thereof, and there is a halogenide, sulphate, or sulfonate of an element of the group consisting of sodium, potassium, aluminum, magnesium, or boron to facilitate deposition of a smooth and even layer with much lower deposition metal requirements. | 09-29-2011 |
| 20140124376 | PYROPHOSPHATE-CONTAINING BATH FOR CYANIDE-FREE DEPOSITION OF COPPER-TIN ALLOYS - A pyrophosphate-containing bath for the cyanide-free deposition of copper alloys on substrate surfaces, comprising a reaction product of a secondary monoamine with a diglycidyl ether, is described. The electrolyte bath is suitable for the galvanic deposition of glossy white, even and uniform copper-tin alloy coatings. | 05-08-2014 |
| 20160186350 | AMINO SULFONIC ACID BASED POLYMERS FOR COPPER ELECTROPLATING - Amino sulfonic acid based polymers are reaction products of amino sulfonic acids, an amine, polyepoxide compounds and epihalohydrin. The polymers may be used as levelers in copper electroplating baths, to provide good throwing power. Such reaction products may plate copper or copper alloys with good surface properties and good physical reliability. | 06-30-2016 |
| 205242000 | Including noble metal (e.g., gold-copper-cadmium alloy, etc.) | 3 |
| 20090321269 | SILVER AND SILVER ALLOY PLATING BATH - To develop stable, non-cyanide silver and silver alloy plating baths. The present invention is a silver and silver alloy plating bath, comprises: (A) a soluble salt, comprising a silver salt or a mixture of a silver salt and a salt of a metal selected from the group consisting of tin, bismuth, cobalt, antimony, iridium, indium, lead, copper, iron, zinc, nickel, palladium, platinum, and gold; and (B) at least one aliphatic sulfide compound comprising a functionality selected from the group consisting of an ether oxygen atom, a 3-hydroxypropyl group, and a hydroxypropylene group, with the proviso that the aliphatic sulfide compound does not comprise a basic nitrogen atom. | 12-31-2009 |
| 20140299481 | METHOD OF OBTAINING A YELLOW GOLD ALLOY DEPOSITION BY GALVANOPLASTY WITHOUT USING TOXIC METALS OR METALLOIDS - The invention relates to a make-up solution for a galvanic bath comprising organometallic components, a wetting agent, a complexing agent and free cyanide, wherein the make-up solution further comprises copper in the form of copper II cyanide and potassium, and complex indium allowing, after addition of alkaline aurocyanide, to galvanically depositing a gold alloy. | 10-09-2014 |
| 20150027898 | METHOD OF OBTAINING A YELLOW GOLD ALLOY DEPOSITION BY GALVANOPLASTY WITHOUT USING TOXIC MATERIALS - The invention concerns the field of galvanic depositions and relates to a method of galvanoplastic deposition of a gold alloy on an electrode dipped into a bath including metal gold in alkaline aurocyanide form, organometallic compounds, a wetting agent, a sequestering agent and free cyanide. According to the invention, the alloy metals are copper, in double copper and potassium cyanide form, and silver in cyanide form, allowing a mirror bright yellow gold alloy to be deposited on the electrode. | 01-29-2015 |
| 205243000 | Chromium is predominant constituent | 2 |
| 20090114544 | CRYSTALLINE CHROMIUM ALLOY DEPOSIT - An electrodeposited crystalline functional chromium deposit which is nanogranular as deposited, and the deposit may be both TEM and XRD crystalline or may be TEM crystalline and XRD amorphous. In various embodiments, the deposit includes one or any combination of two or more of an alloy of chromium, carbon, nitrogen, oxygen and sulfur; a {111} preferred orientation; an average crystal grain cross-sectional area of less than about 500 nm | 05-07-2009 |
| 20120061249 | METHOD FOR MAKING AND USING CHROMIUM III SALTS - A method of preparing an aqueous composition of a chromium III compound, comprising adding hydrogen peroxide to a mixture comprising water and a chromium VI compound in the presence of at least one acid according to the formula H | 03-15-2012 |
| 205244000 | Zinc is predominant constituent | 11 |
| 20100116677 | GALVANIC BATH AND PROCESS FOR DEPOSITING ZINC-BASED LAYERS - The preceding invention concerns a galvanic bath as well as a method for depositing a zinc-bearing layer onto a substrate surface. According to the invention, it is provided that the galvanic bath be divided into at least two cell chambers, in which the division occurs by means of a cation-exchange membrane and one cell chamber includes an acidic deposition-electrolyte and the other cell chamber includes a neutral or acidic anolyte. The acidic anolyte here is at least partially removed from the cell chamber containing it and is stripped of the foreign metal ions contained in it by means of a cation-exchange arrangement. | 05-13-2010 |
| 20100236936 | Aqueous,alkaline,cyanide-free bath for the galvanic deposition of zinc and zinc alloy coatings - The invention relates to an aqueous, alkaline cyanide-free electrolyte bath for de-positing zinc and zinc alloy coatings on substrate surfaces comprising (a) a source for zinc ions and optionally a source for further metal ions, (b) hydroxide ions, (c) a polymer of general formula I which is soluble in the bath and (d) at least one pyridinium compound of general formula II or III. The electrolyte bath is suitable for the galvanic deposition of bright and even zinc and zinc alloy coatings. | 09-23-2010 |
| 20110147224 | POLYAMINE BRIGHTENING AGENT - A zinc electroplating bath includes zinc ions and a brightening agent. The brightening agent is a polyamine or a mixture of polyamines that include a quaternary ammonium group. | 06-23-2011 |
| 20120160698 | POLYMERS HAVING TERMINAL AMINO GROUPS AND USE THEREOF AS ADDITIVES FOR ZINC AND ZINC ALLOY ELECTRODEPOSITION BATHS - Additives for electrolyte baths for the electrodeposition of zinc or zinc alloy layer are described. The additives are polymers with terminal amino groups. These polymers are obtainable by reaction of at least one diamino compound (having two tertiary amino groups) with at least one di(pseudo)halogen compound, wherein the diamino compound is used in stoichiometric excess. The additives effect, in particular, a very little formation of bubbles and only few burnings as well as a uniform distribution of layer thickness in the electrodeposition of zinc or zinc alloy layers. | 06-28-2012 |
| 20130175179 | POLYAMINE BRIGHTENING AGENT - A zinc electroplating bath includes zinc ions and a brightening agent. The brightening agent is a polyamine or a mixture of polyamines that include a quaternary ammonium group. | 07-11-2013 |
| 205245000 | Including iron group metal (i.e., Fe, Co, or Ni) | 6 |
| 205246000 | Nickel | 6 |
| 20100096274 | ZINC ALLOY ELECTROPLATING BATHS AND PROCESSES - The present invention relates to the electrodeposition of zinc nickel alloy on a variety of electrically conducting substrates in a medium which seeks to provide improved deposit distribution and operable current density range. This is achieved through a bath comprising zinc ions, nickel metal ions, and a suitable combination of one or more urea based polymers and non-polymeric complexing agents capable of holding nickel metal ions in alkaline solution and an electrolytic process whereby the bath is used to electrodeposit zinc nickel alloy on electrically conducting substrates. | 04-22-2010 |
| 20100155257 | Aqueous, alkaline, cyanide-free bath for the galvanic deposition of zinc alloy coatings - An aqueous, alkaline, cyanide-free electrolyte bath for deposition of zinc alloy layers on substrate surfaces is described, which contains cationic pyridinium compounds as brighteners and polyamines as complexing agents. The electrolyte bath is suitable for electroplating bright and even zinc alloy coatings. | 06-24-2010 |
| 20110031127 | ALKALINE ZINC-NICKEL BATH - The anode is separated from the alkaline electrode to avoid undesirable secondary reactions in an alkali zinc nickel electroplating bath. | 02-10-2011 |
| 20130341198 | PLATING APPARATUS - A plating assembly for plating a part having an interior cavity with a plating material. The plating assembly has a main frame assembly adapted to receive and support the part. An anode frame assembly is positioned inside the main frame assembly and is electrically isolated from the main frame assembly. The anode frame assembly is electrically connected to an anode of a direct current power supply. A plurality of anode rods are mounted on the anode frame assembly in electrically conductive contact with it. A cathode assembly is electrically connected to the part and is electrically connected to a cathode of the direct current power supply. A fluid conduit assembly connects a fluid source such as a pump station to a plurality of fluid nozzles. At least one of the fluid nozzles is positioned within the interior cavity of the part. | 12-26-2013 |
| 20160024683 | APPARATUS AND METHOD FOR ELECTROLYTIC DEPOSITION OF METAL LAYERS ON WORKPIECES - The present invention is related to an apparatus and a method for the electrolytic deposition of a zinc or zinc alloy layer on a workpiece, the apparatus comprising a container to hold the metal plating bath divided into at least two compartments with an electrode assembly in the container, the assembly comprises in a first compartment a soluble anode to provide ions of the at least one metal to be deposited and a cathode corresponding to the workpiece to be metal plated and in an anolyte compartment separated from the first compartment by an ion exchange membrane comprises an insoluble anode and wherein the electrode assembly in the compartments are connected by an adjustable power supply. | 01-28-2016 |
| 20160068984 | ZINC-NICKEL ALLOY PLATING SOLUTION AND PLATING METHOD - To provide a high-nickel plating bath which is weakly acidic and can stably form a plating film having a nickel content of 11 to 19% (preferably 12 to 18%) even at a current density of 3 A/dm | 03-10-2016 |
| 205247000 | Gold is predominant constituent | 8 |
| 20090000953 | Hard gold alloy plating bath - A hard gold plating solution and plating method which provides a gold plating solution with high deposition selectivity using a gold plating solution containing gold cyanide, cobalt salt, and hexamethylenetetramine. | 01-01-2009 |
| 20090014335 | Acidic gold alloy plating solution - A gold alloy plating solution and plating method thereof that provides a gold plating solution with high deposition selectivity by using a gold plating solution that contains gold cyanide, cobalt ions, hexamethylene tetramine, and specific glossing agents. | 01-15-2009 |
| 20100187121 | PROCESS FOR THE PREPARATION OF ELECTRODES FOR USE IN A FUEL CELL - A process for the preparation of electrodes for use in a fuel cell comprising a membrane electrode assembly with a negative and a positive electrode is described, said process comprising the following steps: (i) providing an electrode substrate and (ii) coating said substrate electrolytically from a plating bath with a metal layer, said metal being selected from Ag, Au, Pd and its alloys. | 07-29-2010 |
| 20110290657 | Process for gold and silver leaching with thiourea solutions - A solution composition that permits the use of thiourea is provided. The process is to form a solution that improves, on one hand, the velocity of gold and silver extraction, from minerals and other materials that contain them, improving the stability of the thiourea in the leaching solution and, on the other, the direct electrorecovery of the metals from the solution. The leaching solution, beforehand or simultaneously, has been subjected to a controlled electro-oxidation to produce formamidine disulfide (FADS) which acts as an oxidizing agent for the mineral phases that contain the gold and silver. In a preferred mode, the FADS is present as 10 to 30% of the total thiourea contained in the solution and the electrodeposition of the metals is performed in the same cell (cathodic compartment) in which the FADS is formed (anodic compartment). | 12-01-2011 |
| 20120247968 | METHOD OF OBTAINING A 18 CARACTS 3N GOLD ALLOY - The invention relates to a method for the galvanoplastic deposition of a gold alloy on an electrode dipped into a bath including gold metal, organometallic compounds, a wetting agent, a sequestering agent and free cyanide, the alloy metals being copper metal and silver metal allowing a mirror-bright yellow gold alloy to be deposited on the electrode characterized in that the bath respects a proportion of 21.53% gold, 78.31% copper and 0.16% silver. | 10-04-2012 |
| 20130140186 | PROCESS FOR GOLD AND SILVER LEACHING WITH THIOUREA SOLUTIONS - A solution composition that permits the use of thiourea is provided. The process is to form a solution that improves, on one hand, the velocity of gold and silver extraction, from minerals and other materials that contain them, improving the stability of the thiourea in the leaching solution and, on the other, the direct electrorecovery of the metals from the solution. The leaching solution, beforehand or simultaneously, has been subjected to a controlled electro-oxidation to produce formamidine disulfide (FADS) which acts as an oxidizing agent for the mineral phases that contain the gold and silver. In a preferred mode, the FADS is present as 10 to 30% of the total thiourea contained in the solution and the electrodeposition of the metals is performed in the same cell (cathodic compartment) in which the FADS is formed (anodic compartment). | 06-06-2013 |
| 205248000 | Utilizing sulfite-containing bath | 1 |
| 20110127168 | HARD GOLD-BASED PLATING SOLUTION - To provide a hard gold-based plating solution which enables selective partial plating treatment and is suitable for electronic components such as a connector. A hard gold-based plating solution of the present invention comprises: a soluble gold salt or a gold complex; a conductive salt; and a chelating agent, wherein the hard gold-based plating solution further comprises an aromatic compound having one or more nitro groups, for example, an aromatic compound selected from the group consisting of nitrobenzoic acid, dinitrobenzoic acid and nitrobenzene sulfonic acid. The hard gold-based plating solution further comprises at least one metal salt of a cobalt salt, a nickel salt and a silver salt, or polyethyleneimine as an organic additive. | 06-02-2011 |
| 205250000 | Including iron group metal | 1 |
| 20140238867 | COATED OVERHEAD CONDUCTORS AND METHODS - A coated overhead conductor having an assembly including one or more conductive wires, such that the assembly includes an outer surface coated with an electrochemical deposition coating forming an outer layer, wherein the electrochemical deposition coating includes a first metal oxide, such that the first metal oxide is not aluminum oxide. Methods for making the overhead conductor are also provided. | 08-28-2014 |
| 205252000 | Tin, lead, or germanium is predominant constituent | 16 |
| 20080283406 | Tin or tin alloy electroplating solution - An additive obtained from the reaction product obtained by reacting glutaraldehyde and at least one type of compound selected from hydrocarbon compounds containing a hydroxyl group, and at least one type of compound selected from amine compounds, as well as a tin or tin alloy plating solution containing this additive. | 11-20-2008 |
| 20100170804 | Plating film and forming method thereof - Tin plating film composed of tin or tin alloy is formed on a front surface and a rear surface of a substrate composing a lead frame. As tin alloy, for example, tin-copper alloy (content of copper: 2 mass %), tin-bismuth alloy (content of bismuth: 2 mass %) and the like can be cited. The substrate is composed of, for example, Cu alloy or the like. Within the tin plating film, plural crystal grains are arranged irregularly. Further, plural gap portions exist within the tin plating film. An external stress is reduced even if a bending process or the like are performed subsequently, because the gap portions exist within the tin plating film. Consequently, growths of whiskers accompanied by the external stress are suppressed. | 07-08-2010 |
| 20100300890 | PYROPHOSPHATE-BASED BATH FOR PLATING OF TIN ALLOY LAYERS - An aqueous cyanide-free electrolyte bath for plating of tin alloy layers on substrate surfaces comprising (i) a tin ion source and a source for another alloy element, characterised in that it further contains (ii) N-methyl pyrrolidone is described. | 12-02-2010 |
| 20130277226 | IMMERSION TIN OR TIN ALLOY PLATING BATH WITH IMPROVED REMOVAL OF CUPROUS IONS - The invention concerns an immersion tin plating bath which comprises at least one aromatic sulfonic acid, at least one first precipitation additive and at least one second precipitation additive. The at least one first precipitation additive is an aliphatic poly-alcohol compound, an ether thereof or a polymer derived thereof having an average molecular weight in the range of 62 g/mol and 600 g/mol. The at least one second precipitation additive is a polyalkylene glycol compound having an average molecular weight in the range of 750 to 10,000 g/mol. | 10-24-2013 |
| 205253000 | Utilizing organic compound-containing bath | 12 |
| 20100038255 | SN-B PLATING SOLUTION AND PLATING METHOD USING IT - The object of the present invention is to prevent generation of whisker in a Pb-free plating layer. Provided is a Pb-free Sn—B plating solution containing tin sulfate, which is a source of Sn ions, and dimethyl amine borane or trimethyl amine borane, which is a source of B ions. | 02-18-2010 |
| 20110259754 | TIN OR TIN ALLOY ELECTROPLATING SOLUTION - An additive obtained from the reaction product obtained by reacting glutaraldehyde and at least one type of compound selected from hydrocarbon compounds containing a hydroxyl group, and at least one type of compound selected from amine compounds, as well as a tin or tin alloy plating solution containing this additive. | 10-27-2011 |
| 20120298519 | ELECTROLYTE AND PROCESS FOR DEPOSITING A MATT METAL LAYER - An electrolytic composition for the deposition of a matt metal layer onto a substrate and deposition process where the composition comprises a source of metal from the group consisting of Cr, Mn, Fe, Co, Ni, Cu, Zn, Ru, Rh, Pd, Ag, In, Sn, Sb, Re, Pt, Au, Bi, and combinations thereof; | 11-29-2012 |
| 20130206602 | PLATING BATH AND METHOD - Tin-silver alloy electroplating baths having certain amine-oxide surfactants and methods of electrodepositing a tin-silver-containing layer using these baths are disclosed. Such electroplating baths are useful to provide tin-silver solder deposits having reduced void formation and improved within-die uniformity. | 08-15-2013 |
| 20130256145 | PLATING BATH AND METHOD - Silver electroplating baths having certain sulfide compounds and methods of electrodepositing a silver-containing layer using these baths are disclosed. Such electroplating baths are useful to provide silver-containing solder deposits having reduced void formation and improved within-die uniformity. | 10-03-2013 |
| 20130270122 | TIN OR TIN ALLOY ELECTROPLATING SOLUTION - An additive obtained from the reaction product obtained by reacting glutaraldehyde and at least one type of compound selected from hydrocarbon compounds containing a hydroxyl group, and at least one type of compound selected from amine compounds, as well as a tin or tin alloy plating solution containing this additive. | 10-17-2013 |
| 20140251818 | TIN ALLOY PLATING SOLUTION - A cyanide-free tin alloy plating solution having outstanding serial stability as well as a method of precipitating tin alloy plating onto an electroconductive object using the tin alloy plating solution is disclosed. The tin alloy plating solution contains tin ions and one or more additional metal ions of silver, copper, bismuth, indium, palladium, lead, zinc, or nickel, and peptides with cysteine residues. | 09-11-2014 |
| 20150122661 | PLATING BATH AND METHOD - Tin-containing electroplating baths having a combination of certain brightening agents provide tin-containing solder deposits having reduced void formation and smooth morphology. | 05-07-2015 |
| 20150122662 | PLATING BATH AND METHOD - Tin electroplating baths having certain brightening agents and nonionic surfactants provide tin-containing solder deposits having good morphology, reduced void formation and improved within-die uniformity. | 05-07-2015 |
| 205254000 | Organic sulfoxy-containing | 3 |
| 20150354076 | Process for Electrolytically Depositing a Tin- and Rutenium-Based Alloy, the Electrolytic Bath That Permits Said Alloy to Deposit and the Alloy Obtained by Means of Said Process - The invention refers to the electrolytic deposit of a tin- and ruthenium-based alloy having good features of corrosion resistance. In particular, the invention refers to an ecologically compatible process to achieve the electrolytic deposit of the alloy and to the operative conditions to make the deposit. Moreover, the invention refers to the electrolytic bath from which the alloy is caused to electro-deposit. In particular, the electrolytic bath is advantageously distinguished by the total absence of toxic metals and cyanides. The invention refers also to the alloy obtained through that process, as well as to the object/manufactured article covered with the alloy obtained through that process. | 12-10-2015 |
| 20150376808 | ELECTRODEPOSITION SYSTEM AND METHOD INCORPORATING AN ANODE HAVING A BACK SIDE CAPACITIVE ELEMENT - Disclosed are an electrodeposition system and method with an anode assembly comprising a capacitor comprising a first conductive plate (i.e., an anode) with a frontside having a surface exposed to a plating solution, a second conductive plate on a backside of the first conductive plate, and a dielectric layer between the two conductive plates. During a non-plating mode, a power source, having positive and negative terminals connected to the first and second conductive plates, respectively, is turned on, thereby polarizing the first conductive plate (i.e., the anode) relative to the second conductive plate to prevent degradation of the anode and/or plating solution. During an active plating mode, another power source, having positive and negative terminals connected to the first conductive plate (i.e., the anode) and a cathode, respectively, is turned on, thereby polarizing the anode relative to the cathode in order to deposit a plated layer on a workpiece. | 12-31-2015 |
| 20150376812 | ELECTRODEPOSITION SYSTEM AND METHOD INCORPORATING AN ANODE HAVING A BACK SIDE CAPACITIVE ELEMENT - Disclosed are an electrodeposition system and method with an anode assembly comprising a capacitor comprising a first conductive plate (i.e., an anode) with a frontside having a surface exposed to a plating solution, a second conductive plate on a backside of the first conductive plate, and a dielectric layer between the two conductive plates. During a non-plating mode, a power source, having positive and negative terminals connected to the first and second conductive plates, respectively, is turned on, thereby polarizing the first conductive plate (i.e., the anode) relative to the second conductive plate to prevent degradation of the anode and/or plating solution. During an active plating mode, another power source, having positive and negative terminals connected to the first conductive plate (i.e., the anode) and a cathode, respectively, is turned on, thereby polarizing the anode relative to the cathode in order to deposit a plated layer on a workpiece. | 12-31-2015 |
| 205255000 | Group VIII metal is predominant constituent (i.e., Fe, Co, Ni, Pt, Pd, Rh, Ru, Ir, or Os) | 10 |
| 205257000 | Platinum group metal-containing alloy (i.e., contains Pt, Pd, Rh, Ru, Ir, or Os) | 7 |
| 20080251390 | Process of electrodeposition platinum and platinum-based alloy nano-particles with addition of ethylene glycol - An electrodeposition process of platinum and platinum-based alloy nano-particles with addition of ethylene glycol is disclosed. An acidic solution which contains metal chloride includes at least one platinum-based chloride and the alloy thereof, and ethylene glycol are introduced into a reactor as an electrodeposition solution. By applying an external negative potential, platinum particles or platinum-based alloy particles are deposited on the substrate. The above acidic solution is able to provide ionic conductivity during electrodeposition. The added ethylene glycol effectively enhances the removal of chlorine from metal chlorides. Meanwhile, ethylene glycol is used as stabilizer to prevent the particles from aggregation onto the substrate, thereby increasing the dispersion of deposited particles. | 10-16-2008 |
| 20090038950 | High speed method for plating palladium and palladium alloys - A high speed method of depositing palladium and palladium alloys is disclosed. The high speed method uses an aqueous, ammonia-based bath which has reduced free ammonia in the bath. The high speed method may be used to deposit palladium and palladium alloy coatings on various substrates such as electrical devices and jewelry. | 02-12-2009 |
| 20090065366 | MAGNETIC MATERIAL, AND A MEMS DEVICE USING THE MAGNETIC MATERIAL - A magnetic material comprises 50-80 wt % of Cobalt, 9-15 wt % of Nickel, 10-25 wt % of Rhenium, 0.1 to 2.0 wt % of Phosphorus, and 5-10 wt % of Tungsten or Platinum. It can be formed as a layer having good vertical magnetic properties (e.g. when magnetised it can provide a high magnetic field strength in the direction perpendicular to the plane of the layer). The layer preferably has a thickness of above 1 μm. It can be formed by electroplating. The layer is useful for inclusion in a MEMS device. | 03-12-2009 |
| 20090134035 | Method for forming platinum aluminide diffusion coatings - A method for forming a platinum aluminide coating comprising forming a platinum-containing coating on the substrate, and performing a diffusion coating process with the use of an aluminum-based compound and a halide activator, each having a sulfur concentration of less than about 20 parts-per-million by weight. | 05-28-2009 |
| 20110147225 | HIGH SPEED METHOD FOR PLATING PALLADIUM AND PALLADIUM ALLOYS - A high speed method of depositing palladium and palladium alloys is disclosed. The high speed method uses an aqueous, ammonia-based bath which has reduced free ammonia in the bath. The high speed method may be used to deposit palladium and palladium alloy coatings on various substrates such as electrical devices and jewelry. | 06-23-2011 |
| 20110308959 | PROCESS FOR THE DEPOSITION OF PLATINUM-RHODIUM LAYERS HAVING IMPROVED WHITENESS - The present invention relates to an electrochemical process for the deposition of coatings comprising an alloy of platinum and rhodium on, in particular, decorative articles. The process of the invention is characterized in that defined conditions are employed under which the electrolytically deposited layer has, contrary to expectations, a high whiteness which comes extraordinarily close to the appearance of silver. | 12-22-2011 |
| 20150075996 | METHOD OF FABRICATING A BATH OF ELECTROLYTE FOR PLATING A PLATINUM-BASED METALLIC UNDERLAYER ON A METALLIC SUBSTRATE - The invention relates to a method of fabricating a bath of electrolyte for plating a platinum-based metal underlayer on a metallic substrate, the method comprising the following steps:
| 03-19-2015 |
| 205258000 | Phosphorus-containing alloy | 2 |
| 20090101515 | IRON-PHOSPHORUS ELECTROPLATING BATH AND METHOD - In one embodiment, this invention relates to an aqueous acid iron phosphorus bath which comprises | 04-23-2009 |
| 20140061056 | METHODS FOR THE IMPLEMENTATION OF NANOCRYSTALLINE AND AMORPHOUS METALS AND ALLOYS AS COATINGS - Methods for the use of nanocrystalline or amorphous metals or alloys as coatings with industrial processes are provided. Three, specific, such methods have been detailed. One of the preferred embodiments provides a method for the high volume electrodeposition of many components with a nanocrystalline or amorphous metal or alloy, and the components produced thereby. Another preferred embodiment provides a method for application of a nanocrystalline or amorphous coatings in a continuous electrodeposition process and the product produced thereby. Another of the preferred embodiments of the present invention provides a method for reworking and/or rebuilding components and the components produced thereby. | 03-06-2014 |
| 205259000 | Utilizing organic compound-containing bath | 1 |
| 20160053395 | GALVANIC NICKEL OR NICKEL ALLOY ELECTROPLATING BATH FOR DEPOSITING A SEMI-BRIGHT NICKEL OR NICKEL ALLOY - The present invention is related to a galvanic nickel or nickel alloy electroplating bath for depositing a semi-bright nickel or nickel alloy coating characterized in that the electroplating bath comprises at least one compound having the general formula (I) | 02-25-2016 |
