| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 205230000 | Utilizing fused bath | 9 |
| 20100276292 | HIGH SPEED COPPER PLATING BATH - A copper electroplating bath that includes an aqueous solution that comprises a copper salt and at least one acid and a container that comprises a copper salt in solid form, is disclosed. The container supplies copper ions to the aqueous solution to maintain the copper ion concentration of the aqueous solution at saturation levels while retaining the copper salt in solid form within the container. | 11-04-2010 |
| 20110290655 | METHOD FOR ELECTROCHEMICALLY DEPOSITING CARBON FILM ON A SUBSTRATE - Dense carbon films are deposited on a conductive substrate by placing the substrate acting as anode in a molten salt electrolyte bath containing a source of carbide ion and applying DC current across the substrate and a counter electrode acting as cathode also placed in the molten salt electrolyte bath. The carbide ions are electrochemically oxidized to deposit a carbon film on the surface of the substrate. | 12-01-2011 |
| 20110290656 | METHOD FOR ELECTROCHEMICALLY DEPOSITING CARBON NITRIDE FILMS ON A SUBSTRATE - Dense carbon nitride films are electrochemically formed on a conductive substrate by placing the substrate acting as cathode in a molten salt electrolyte bath and applying DC current across the substrate and a counter electrode acting as anode also placed in the molten salt electrolyte bath. Carbonate ion and nitrate ion are concurrently reduced to deposit carbon nitride films on the substrate. | 12-01-2011 |
| 205231000 | Reactive coating (e.g., by diffusion, etc.) | 1 |
| 20130056363 | ULTRA-FAST BORIDING OF METAL SURFACES FOR IMPROVED PROPERTIES - A method of ultra-fast boriding of a metal surface. The method includes the step of providing a metal component, providing a molten electrolyte having boron components therein, providing an electrochemical boriding system including an induction furnace, operating the induction furnace to establish a high temperature for the molten electrolyte, and boriding the metal surface to achieve a boride layer on the metal surface. | 03-07-2013 |
| 205232000 | Depositing predominantly alloy coating | 2 |
| 20090101514 | Electrodeposition Method for Metals - An objective of the present invention is to provide an electrodeposition method for metals using a molten salt, which easily enables the electrodeposition of various types of metals such as refractory metals and rare earth metals. In order to solve this problem, the invention is characterized in that it is effected at the electrodeposition temperature in a range of from 100° C. to 200° C. using a molten salt of quaternary ammonium halide represented by the general formula (I) below (wherein, in the formula, R | 04-23-2009 |
| 20160194773 | METHOD AND APPARATUS FOR PRODUCING METAL BY ELECTROLYTIC REDUCTION | 07-07-2016 |
| 205233000 | Depositing aluminum coating | 3 |
| 20080302667 | METHOD AND APPARATUS FOR AIRFOIL ELECTROPLATING, AND AIRFOIL - A chemically-nonreactive, electrically-nonconductive shield having a recess generally corresponding to the shape of an airfoil portion to be positioned therein. The shield is submerged in an electroplating solution in a plating tank. The recess in the shield is sized to provide a predetermined, closely-spaced apart clearance gap between walls of the recess and the adjacent airfoil portion sufficient to reduce the flow rate of an electrolyte present in the electroplating solution between walls of the recess and the adjacent airfoil portion. The clearance gap permits control of the amount of electroplating that is deposited on the airfoil portion that is positioned within the recess in relation to portions of the airfoil not positioned within the recess. | 12-11-2008 |
| 20110192728 | METALLIC OXYGEN EVOLVING ANODE OPERATING AT HIGH CURRENT DENSITY FOR ALUMINIUM REDUCTION CELLS - A metallic oxygen evolving anode for electrowinning aluminium by decomposition of alumina dissolved in a cryolite-based molten electrolyte, and operable at anode current densities of 1.1 to 1.3 A/cm2, comprises an alloy of nickel, iron, manganese, optionally copper, and silicon. Preferably, the alloy is composed of 64-66 w % Ni; Iron; 25-27 w % Fe; 7-9 w % Mn; 0-0.7 w % Cu; and 0.4-0.6 w % Si. The weight ratio Ni/Fe is in the range 2.1 to 2.89, preferably 2.3 to 2.6, the weight ratio Ni/(Ni+Cu) is greater than 0.98, the weight ratio Cu/Ni is less than 0.01, and the weight ratio Mn/Ni is from 0.09 to 0.15. The alloy surface can comprise nickel ferrite produced by pre-oxidation of the alloy. The alloy, optionally with a pre-oxidised surface, can be coated with an external coating comprising cobalt oxide CoO. | 08-11-2011 |
| 20160024677 | MOLTEN-SALT ELECTROLYSIS PLATING APPARATUS AND METHOD FOR PRODUCING ALUMINUM FILM - A molten-salt electrolysis plating apparatus that uses a molten salt for a liquid electrolyte satisfies any one of (i) to (iv) below. (i) At least a portion that is in contact with the liquid electrolyte contains a vinyl chloride resin, and the vinyl chloride resin has a chlorine content of 51% by mass or more. (ii) At least a portion that is in contact with the liquid electrolyte contains a vinyl chloride resin, and the vinyl chloride resin contains titanium oxide. (iii) At least a portion that is in contact with the liquid electrolyte contains a polyethylene resin, and the polyethylene resin has a density of 0.940 g/cm | 01-28-2016 |
