| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 205205000 | Treating substrate prior to coating | 56 |
| 20090008260 | Method For Manufacturing Embossed Conductive Clothes - The present invention provides a method for manufacturing embossed conductive cloth, which comprises the steps of (a) providing cloth made of natural fibers or artificial fibers; (b) embossing the cloth to form embossed patterns on it; (c) subjecting the cloth with embossed patterns to a surface roughening treatment while maintaining the embossed patterns on the cloth; and (d) subjecting the surface-roughened cloth to a surface metalizing treatment. | 01-08-2009 |
| 20090314650 | PROCESS OF PACKAGE SUBSTRATE - A process of a package substrate is provided. A plurality of metal layers stacked in sequence is used as a foundation structure. A thick heat conductive core is fabricated from one of the metal layers for providing high heat dissipation capability, and a plurality of pads is fabricated from another one of the metal layers for electrically connecting an electronic package at the next level. | 12-24-2009 |
| 20100006447 | METHOD OF PREPARING AN ULTRA SHARP TIP, APPARATUS FOR PREPARING AN ULTRA SHARP TIP, AND USE OF AN APPARATUS - A method of preparing an ultra sharp tip, in particular a single atom tip, is provided, comprising providing a tip having a shank, an apex, and a coating covering the shank and the apex; locally removing the coating from the apex by field evaporation; and partially or fully restoring the coating at the apex. | 01-14-2010 |
| 20100025256 | SURFACE TREATMENT METHOD FOR HOUSING - A surface treatment method for housings comprising: providing a metal housing and pre-treating it to be cleaned; electroplating the housing to form a hexavalent chromium coating on the surface of the housing; and electroplating the housing to form a trivalent chromium coating on the hexavalent chromium coating. | 02-04-2010 |
| 20100038254 | Tin electroplating solution and tin electroplating method - To provide a tin electroplating solution devoid of harmful lead and having excellent solder wettability, and a method for depositing a tin film on electronic parts using such a tin electroplating solution. The tin electroplating solution includes organic acids, a naphtholsulfonic acid and, as needed, an antioxidant and a surfactant is disclosed. | 02-18-2010 |
| 20100108529 | SENSORS AND SWITCHES FOR DETECTING HYDROGEN - Sensors and switches for detecting hydrogen include an electrically-insulating support; a first and second electrode; and a palladium structure alone or in combination with an organic insulating film. The palladium structures of the sensors are deposited on and contact a first electrode and a portion of the palladium structure extends to and contacts the second electrode to create a conductive path. The palladium structures of the switches are deposited on and contact a first electrode and a portion of the palladium structures extend to and contact an organic insulating film deposited on the second electrode. Upon exposure of the switch to hydrogen, portions of the palladium structure extend through the film and contact the second electrode to create a conductive path. Methods of detecting hydrogen and methods of fabricating a sensor for detecting an analyte of interest are also provided. | 05-06-2010 |
| 20100108530 | METHOD OF SEMICONDUCTOR NANOCRYSTAL SYNTHESIS - A method is described for the manufacture of semiconductor nanoparticles. Improved yields are obtained by use of a reducing agent or oxygen reaction promoter. | 05-06-2010 |
| 20100163424 | COATING COMPOSITIONS WITH BRANCHED PHOSPHOROUS-CONTAINING RESIN - An aqueous electrodeposition coating composition comprising a cathodically depositable binder, the binder comprising an branched phosphorylated resin, provides corrosion protection equivalent to that obtained by the conventional phosphate pretreatment-electrodeposition coating process. | 07-01-2010 |
| 20100200416 | METHOD AND DEVICE FOR IMMERSION TREATMENT OF VEHICLE - An immersion treatment method with which a vehicle body horizontally immersed in liquid is taken out in a tilted position. The vehicle body is taken out of the liquid at high speed in a tilted position. Foreign matter is separated from the vehicle body and removed together with the liquid. | 08-12-2010 |
| 20110036723 | METHODS OF COATING MAGNESIUM-BASED SUBSTRATES - A method of coating a magnesium-based substrate includes applying a first potential of electric current to the substrate and, after applying, immersing the substrate in an electrocoat coating composition. After immersing, a second potential of electric current is applied between the substrate and a counter electrode to deposit the electrocoat coating composition onto the substrate. The second potential is greater than the first potential. The method also includes curing the electrocoat coating composition to form a cured film and thereby coat the substrate. An electrocoat coating system includes the magnesium-based substrate, and the cured film disposed on the substrate and formed from the electrocoat coating composition. The substrate exhibits a negative charge from an applied first potential of electric current of ≦ approximately 40 V prior to contact with the electrocoat coating composition. The magnesium-based substrate is substantially free from magnesium dissolution when in contact with the electrocoat coating composition. | 02-17-2011 |
| 20110036724 | BASEBALL AND SOFTBALL BATS WITH FUSED NANO-STRUCTURED METALS AND ALLOYS - A sports bat, such as a baseball or softball bat, is electro-deposited with a nanostructured metal. Bats made from aluminum alloys or other metals may be electro-deposited with varying thicknesses of nanostructured metals such as nickel, nickel iron, cobalt phosphorous, or similar materials. The bat substrate alloy can be any metal or alloy. The coating may be done using an electro-deposition process. | 02-17-2011 |
| 20110120878 | METHOD FOR MANUFACTURING A PERPENDICULAR MAGNETIC WRITE HEAD HAVING A TAPERED WRITE POLE AND NON-MAGNETIC BUMP STRUCTURE - A method for manufacturing a magnetic write head having a write pole and a trailing wrap around magnetic shield, and having a non-magnetic step layer and a non-magnetic bump to provide additional spacing between the write pole and the trailing wrap around shield at a location removed from the air bearing surface. A magnetic write pole material is deposited on a substrate and a non-magnetic step layer is deposited over the write pole. A reactive ion milling can he used to pattern the non-magnetic step layer to have a front edge that is located a desired distance from an air hearing surface. A patterning and ion milling process is then performed to define a write pole, and then a layer of alumina is deposited and ion milled to from a tapered, non-magnetic bump at the front the non-magnetic step layer. | 05-26-2011 |
| 20110272288 | METHOD FOR FABRICATING CARBON NANOTUBE ALUMINUM FOIL ELECTRODE - A method for fabricating a carbon nanotube aluminum foil electrode is used to increase the surface area of the electrode by growing the high-electric conductivity carbon nanotubes on an aluminum foil or an AAO (Anodic Aluminum Oxide)-containing aluminum template, whereby is greatly increased the capacitance of the aluminum electrolytic capacitor. The electrode fabricated via forming the carbon nanotubes on the AAO-containing aluminum template has a capacitance of 2158.6 μF/cm | 11-10-2011 |
| 20120160697 | PROCESS FOR APPLYING A METAL COATING TO A NON-CONDUCTIVE SUBSTRATE - Described is a new process for applying a metal coating to a non-conductive substrate comprising the steps of (a) contacting the substrate with an activator comprising a noble metal/group IVA metal sol to obtain a treated substrate, (b) contacting said treated substrate with a composition comprising a solution of: (i) a Cu(II), Ag, Au or Ni soluble metal salt or mixtures thereof, (ii) 0.05 to 5 mol/l of a group IA metal hydroxide and (iii) a complexing agent for an ion of the metal of said metal salt comprising an organic material having a cumulative formation constant log K of from about 0.73 to about 21.95 for an ion of the metal of said metal salt, characterised in that the composition according to step (b) is treated with an electrical current for a period of time prior to and/or during contacting said solution with the substrate. | 06-28-2012 |
| 20140326609 | Method for Marking a Tool - A method is disclosed for marking a tool. The method includes the steps of providing a tool, cleaning the tool, providing a printed layer on the tool, and providing at least one electroplated layer on the tool. The step of cleaning the tool includes the step of providing an air blast over the tool. The step of providing the air blast includes the step of providing an air compressor for producing the air blast. The step of providing the air compressor includes the step of providing an electrostatic dust gun that produces ions in addition to the air blast so that the ions neutralizes static charges on the tool as the air blast sweeps the tool. | 11-06-2014 |
| 20160168742 | METHOD FOR ANODIZING ALUMINUM ALLOY WORKPIECE, METHOD FOR SURFACE TREATING ALUMINUM ALLOY WORKPIECE, AND ANODIZING SOLUTION MIXES | 06-16-2016 |
| 205206000 | Contacting substrate with solid member or material (e.g., polishing, rolling, etc.) | 8 |
| 20090090634 | Method of plating metal onto titanium - A method of plating a metal onto a titanium surface comprising a surface cleaning step, an anodic etching step, a cathodic activation step and a plating step. | 04-09-2009 |
| 20090145769 | METHOD OF FABRICATING AN ALUMINA NANOHOLE ARRAY, AND METHOD OF MANUFACTURING A MAGNETIC RECORDING MEDIUM - An alumina nanohole array and a method of fabricating the same includes the steps of forming an aluminum thin-film on a substrate at a substrate temperature of −80° C. or below so that crystal grain growth is suppressed, even when a high-purity aluminum material is used, thus providing improved surface smoothness; and anodizing the aluminum thin-film. Preferably, the method additionally includes texturing by pressing a mold having an orderly array of projections against the aluminum thin-film to form pits on the aluminum thin-film which enables a larger array area to be formed. When the mold and the aluminum thin-film are held at a temperature of 150 to 200° C., the pressure used for pit formation is reduced. A magnetic recording medium manufactured by a method therefore includes forming a magnetic layer within the nanoholes so that the medium is suitable as a bit patterned media for a perpendicular recording system. | 06-11-2009 |
| 20100122911 | METHOD FOR COATING METALLIC INTERCONNECT OF SOLID OXIDE FUEL CELL - Disclosed is a method for coating a metallic interconnect for a solid oxide fuel cell (SOFC), the method including the steps of: carrying out pre-treatment for removing impurities adhered on a surface of the metallic interconnect; and carrying out pulse plating with cobalt as an anode, and the metallic interconnect as a cathode, in which an average current density (I | 05-20-2010 |
| 20110048958 | METHODS OF REDUCING SURFACE ROUGHNESS AND IMPROVING OXIDE COATING THICKNESS UNIFORMITY FOR ANODIZED ALUMINUM-SILICON ALLOYS - In one exemplary method, an anodized aluminum-silicon alloy work piece may be formed from an aluminum-silicon alloy substrate material by applying a friction stir processing treatment to the aluminum-silicon alloy substrate material to reduce an average particle size of a plurality of silicon particles contained within the substrate material while increasing a size uniformity of the plurality of silicon particles, and subsequently anodizing said aluminum-silicon alloy substrate material. | 03-03-2011 |
| 20130075270 | METHOD FOR COATING METALLIC INTERCONNECT OF SOLID FUEL CELL - Disclosed herein is a method for coating a metallic interconnect of a solid oxide fuel cell. The method for coating a metallic interconnect of a solid oxide fuel cell includes generating a cobalt compound solution using lithium cobalt oxide (LiCoO | 03-28-2013 |
| 205207000 | Heating substrate | 1 |
| 20120279868 | MANUFACTURING GALVANNEALED SHEETS BY HEAT-TREATING ELECTROLYTICALLY FINISHED SHEETS - The invention relates to a method for manufacturing a steel strip with a cathodic corrosion protection coating, in which the steel strip is hot rolled and then cold rolled; the steel strip is subjected to an electrolytic galvanization and after the electrolytic galvanization, the steel strip is heat treated in a bell-type annealing furnace at temperatures of 250° C. to 350° C. for a period of 4 to 48 hours and this produces a zinc/iron layer. | 11-08-2012 |
| 205208000 | Blasting substrate with particulate material | 2 |
| 20130319873 | PHOTOMASKS AND METHODS FOR USING SAME - Methods and structures for forming anodization layers that protect and cosmetically enhance metal surfaces are described. In some embodiments, methods involve forming an anodization layer on an underlying metal that permits an underlying metal surface to be viewable. In some embodiments, methods involve forming a first anodization layer and an adjacent second anodization layer on an angled surface, the interface between the two anodization layers being regular and uniform. Described are photomasking techniques and tools for providing sharply defined corners on anodized and texturized patterns on metal surfaces. Also described are techniques and tools for providing anodizing resistant components in the manufacture of electronic devices. | 12-05-2013 |
| 20150101935 | APPARATUS AND METHOD FOR IONIC LIQUID ELECTROPLATING - An electroplating apparatus includes a container containing plural portions and an ionic liquid plating solution that is capable of flowing therebetween. The plural portions include at least a first portion containing a counter electrode that includes coating donor material and a second portion that includes a workpiece. A porous scrubber separating the first and second portions has a plurality of metallic outer surfaces in contact with the ionic liquid plating solution. Coating, repair, and regeneration methods using an ionic liquid plating solution are also described. | 04-16-2015 |
| 205210000 | Treating substrate with liquid other than tap water (e.g., for removing foreign material, etching, activating, etc.) | 32 |
| 20080245669 | PLATING APPARATUS AND METHOD - An apparatus forms a plated film in fine trenches and plugs for interconnects and in the openings of a resist formed in the surface of a substrate such as a semiconductor wafer, and forms bumps (protruding electrodes) on the surface of a semiconductor wafer. The apparatus includes a substrate holder capable of opening and closing for holding a substrate such that the front surface of the substrate is exposed while the backside and the edge thereof are hermetically sealed. A plating tank accommodates a plating liquid in which an anode is immersed. A diaphragm is provided in the plating tank and disposed between the anode and the substrate held by the substrate holder. Plating liquid circulating systems circulate the plating liquid to respective regions of the plating tank, separated by the diaphragm. A deaerating unit is disposed in at least one of the plating liquid circulating systems. | 10-09-2008 |
| 20090038949 | Copper plating process - Providing a copper plating method with which to precipitate copper-plated membranes that are uniform and flat, and that have good mirror gloss even when relatively thin copper plated membranes are formed. A copper plating method wherein the object to be plated and a pre-treatment solution in which bromide compound ions are contained are brought into contact and copper is precipitated by means of electrical plating using a copper plating solution. | 02-12-2009 |
| 20090250353 | Nanoporous Material - A method of fabricating a nanoporous material, the method comprising the steps of: (i) heating a substrate in the presence of at least one reducing agent and at least one precursor solution; and (ii) cooling the resulting nanoporous material. The nanoporous material may be used for detection of a substrate, for an electrode in a fuel cell, and as a catalyst in the electro-oxidation of an organic species. | 10-08-2009 |
| 20100155256 | Electroplating Process for Using Trivalent Chromium Electroplating Solution - A trivalent chromium electroplating solution in accordance with the present invention contains at least one trivalent chromium salt for electroplating a chromium coating layer on a workpiece. By using the low toxic trivalent chromium to substitute highly toxic hexavalent chromium, an electroplating process of the present trivalent chromium electroplating solution has less pollution. | 06-24-2010 |
| 20100200417 | Method and Apparatus for Electrodeposition in Metal Acoustic Resonators - Methods and systems for electrodeposition of Indium, Gallium, or other metals within a metal acoustic resonator chamber are provided, including for electrodeposition of Indium or Gallium as a strike layer on an interior surface of a cavitation chamber. The resultant strike layer affords an accommodating wetting surface for subsequent filling with a liquid metal and performing cavitation therein. In some embodiments, this allows for the use of liquid metal in an acoustic resonator without the damping effects inherent with oxide boundaries or other defects. | 08-12-2010 |
| 20120061248 | PROCESS FOR DEPOSITING RINSABLE SILSESQUIOXANE FILMS ON METALS - Cleaned metal surfaces are coated with an aqueous anti-corrosion treatment. The anti-corrosion treatment includes an organofunctional silsesquioxane and a fluoro metallic acid such as H | 03-15-2012 |
| 20120073979 | Plating apparatus and plating method - [Problem] To provide a plating method and apparatus which do not require preparation of a separate treatment tank for each treatment step and therefore enable the facility to be reduced in size and, further, which can reduce the amounts of use of the treatment solutions. | 03-29-2012 |
| 20120152754 | PROCESS AND SEAL COAT FOR IMPROVING PAINT ADHESION - Aqueous compositions useful as pretreatments prior to painting and to reduce the formation of rust in the uncoated condition consist essentially of water, an organo-functional silane, a compound of a Group IV-B element, and optionally a polyvinyl alcohol, stabilizing agents, wetting agents, thickeners, and biocides, and have an alkaline pH>7. A process for treating a metal surface includes contacting the surface with such an aqueous composition. The compositions and processes were found to have further benefits in comparison to the zinc phosphate metal pretreatment thought to be the standard in the industry. Preferably, the pH of the compositions is alkaline, which has been found to improve the efficacy of a silane as a surface treatment to improve uniformity of paint adhesion. By operating in the alkaline pH range, it was found that flash rusting and/or blush rust were significantly reduced. | 06-21-2012 |
| 20120186986 | MULTISTAGE METHOD FOR TREATING METAL SURFACES PRIOR TO DIP PAINTING - The present invention relates to a multistage method for the corrosion-protective and adhesion-promoting treatment of metal surfaces, comprising a first method step for passivating pretreatment using an acidic aqueous composition (A) containing water-soluble compounds of Zr and/or Ti and fluoride ions, a subsequent method step for post-treatment using an aqueous composition (B) containing at least one organic compound having at least one aromatic heterocyclic compound, wherein the aromatic heterocyclic compound has at least one nitrogen atom. The invention further relates to a metal surface treated according to the method according to the invention and the use of said treated metal surface for subsequent coating with an organic binding agent system. | 07-26-2012 |
| 20120255864 | ELECTROPLATING METHOD - An electroplating method is capable of reliably embedding via holes with a plated metal such as copper or the like when a substrate with a seed layer of a metal having a greater ionization tendency than hydrogen is electroplated using an acidic plating solution such as a copper sulfate plating solution. The electroplating method including preparing a substrate having via holes covered with a first metal, which has a greater ionization tendency than hydrogen, in a surface thereof, pretreating the substrate by immersing the substrate in a pretreatment solution in which a second metal that is more noble than the first metal or a salt thereof is dissolved, and then electroplating the surface of the substrate to embed the second metal or a third metal in the via holes. | 10-11-2012 |
| 20130075271 | PROTECTION OF MAGNESIUM ALLOYS BY ALUMINUM PLATING FROM IONIC LIQUIDS - A method for electroplating aluminum metal on a magnesium alloy includes providing an Lewis acidic ionic liquid having dissolved species of an aluminum metal salt; pre-treating a surface of the magnesium alloy including subjecting the surface of the magnesium alloy to a reverse current etching in the ionic liquid; electroplating the aluminum metal on the surface using the ionic liquid as the electrolyte; and subjecting the surface of the magnesium alloy to a post-treatment including neutralization rinsing in a rinsing solvent solution. | 03-28-2013 |
| 20130186764 | Low Etch Process for Direct Metallization - An aqueous treatment solution for increasing the cleaning capability of a treated copper surface comprising: a) an organic compound selected from the group consisting of organic acids, alcohols, ketone, nitriles and combinations of one or more of the foregoing; and b) an oxidizing agent. The aqueous treatment solution is usable in a process for metallizing the walls of holes within a printed wiring board substrate having metallic and non-metallic regions, wherein the printed wiring board is treated with a reducing agent and then contacted with an aqueous dispersion of carbonaceous particles to term a coating of the dispersion over the substrate. The process comprises the step of contacting the metallic regions of the printed wiring board substrate with the aqueous treatment solution to remove deposited carbonaceous particles therefrom. The aqueous treatment solution provides a clean copper surface while providing a low microetch rate. | 07-25-2013 |
| 20160040315 | Treatment for Electroplating Racks to Avoid Rack Metallization - A method of coating an electroplating rack used for supporting non-conductive substrates during a plating process. The method comprises the steps of contacting at least a portion of the electroplating rack with a plastisol composition, the plastisol composition having dispersed therein an effective amount of an additive having the structure: | 02-11-2016 |
| 205211000 | Liquid is nonaqueous (e.g., hydrocarbon solvent, fused bath, etc.) | 7 |
| 20100193368 | Method of forming multicolor aluminum alloy - A method for forming multicolor aluminum alloy has steps of preparing, surface treating, forming, processing and reprocessing. Preparing comprises providing an aluminum alloy substrate and cleaning with water. Surface treating has disposing the substrate in a base electrolytic solution to form a base oxide layer by anodizing. Forming has forming a membrane of transparent, acid-proof, insulated plastic on the substrate. Processing has removing local area membrane and corresponding oxide layer from the substrate and cleaning. Reprocessing has disposing the clean substrate in a subsequent electrolytic solution to form a subsequent oxide layer on areas of the substrate exposed by the membrane by anodizing. | 08-05-2010 |
| 20110214994 | PRETREATING AGENT FOR ELECTROPLATING, PRETREATMENT METHOD FOR ELECTROPLATING, AND ELECTROPLATING METHOD - A pretreating agent for electroplating includes an aqueous solution containing, as essential ingredient, (A) at least one anti-adsorption agent selected from among a triazole compound, a pyrazole compound, an imidazole compound, a cationic surfactant, and an amphoteric surfactant, and (B) chloride ion. The pretreating agent does not impair adhesion between substrate copper and a photoresist, and does not damage adhesion between the substrate copper and an electrolytic copper plating film. | 09-08-2011 |
| 20120145556 | System and Method for Causing Cavitation in a Liquid Metal - Systems and methods for achieving cavitation at high static pressures which may be used in acoustic applications and research such as in liquid metal resonators. Novel preparation and electroplating methods are disclosed to improve boundary layer conditions. A chemical cleaning loop for containment and treatment for oxide removal and to develop a dynamic system for chemically treating liquid metal disposed in a liquid metal loop is also described. A liquid metal handling loop for containment and treatment is provided to maintain cleanliness of bulk liquid metal. | 06-14-2012 |
| 20130240368 | LOW INTERNAL STRESS COPPER ELECTROPLATING METHOD - Copper electroplating methods provide low internal stress copper deposits. Concentrations of accelerators in the copper electroplating bath vary as a function of the plating current density and the low internal stress copper deposit is observed as a matt copper deposit. | 09-19-2013 |
| 20130292256 | METHOD OF FORMING SKID-PROOF LEATHER-TEXTURE SURFACE ON METALLIC SUBSTRATE - A method of forming a skid-proof leather-texture surface on a metallic substrate, including the following steps of: providing a metallic substrate; performing a first pretreatment to clean the surface of the metallic substrate; etching the surface of the metallic substrate through an etchant while using a etch-moderating agent to moderate the condition of etching. performing a second pretreatment, such as pickling or chemical polishing, on the surface of the metallic substrate; performing an anodic treatment on the surface of the metallic substrate to form an oxidized film having micro-porous structure thereon; activating the surface of the metallic substrate after the anodic treatment; dyeing the surface of the metallic substrate; sealing the micro-porous structure formed on the surface of the metallic substrate; and ash-removing to clean the metallic substrate. | 11-07-2013 |
| 20130313125 | PRODUCTION METHOD FOR R-FE-B BASED SINTERED MAGNET HAVING PLATING FILM ON SURFACE THEREOF - An object of the present invention is to provide a production method for an R—Fe—B based sintered magnet having a plating film excellent in adhesiveness on the surface thereof, by conducting a series of processes of acid cleaning and smut removal as pretreatments of a plating treatment of an R—Fe—B based sintered magnet, and the subsequent plating treatment, effectively without requiring troubles. The production method for an R—Fe—B based sintered magnet having a plating film on the surface thereof of the present invention, as a solution method therefor, is characterized in that a series of processes of acid cleaning and smut removal of a magnet as pretreatments of a plating treatment, and the subsequent plating treatment is conducted consistently with a state, in which the magnet is placed in a barrel made of synthetic resin, and that the smut removal is conducted by ultrasonic cleaning of the magnet with rotating the barrel in water in which the dissolved oxygen amount is set to 0.1 ppm to 6 ppm by degassing. | 11-28-2013 |
| 20140021056 | METHOD FOR BALANCING A TURBOMACHINE ROTOR - The invention relates to a method for balancing a rotor, notably of a turbomachine, comprising a step of determining the unbalancing mass followed by a step of balancing by chemical machining of the rotor. More particularly, the chemical machining comprises the immersion of the rotor in a bath containing a chemical machining agent, the bath having a capacity of heterogeneous material removal (as a function of the depth of the bath), the rotor being oriented in the bath taking account of the said capacity of heterogeneous material removal so that the quantity of material removed from the rotor in the zone of the unbalancing mass is sufficient to balance the rotor. | 01-23-2014 |
| 205212000 | Predominantly titanium, vanadium, zirconium, niobium, hafnium, tantalum, molybdenum, or tungsten substrate | 2 |
| 20090218232 | Method for the Pre-Treatment of Titanium Components for the Subsequent Coating Thereof - A method for the pre-treatment of titanium components for the subsequent coating thereof is provided. The method includes at least the following steps: a) etching of the component in an acidic solution containing fluoride and nitric acid (HNO3); b) activation pickling of the etched component in a solution containing at least sodium nitrate (NaNO3) and tetrafluoroboric acid (HBF4); and c) activation of the activation-pickled component in a bath containing acid or in an acidic bath containing nickel. | 09-03-2009 |
| 20160060781 | METHOD FOR DEPOSITING THICK COPPER LAYERS ONTO SINTERED MATERIALS - The present invention relates to a method for electrodepositing a thick copper layer onto an electrically conductive, sintered layer. The thick copper layer has a high adhesion strength, is poor in defects and internal stress, and has high electrical and thermal conductivity. The thick copper layer on the sintered layer is suited for printed circuit boards for high power electronic applications. | 03-03-2016 |
| 205213000 | Predominantly aluminum substrate | 4 |
| 20090090635 | METHODS AND COMPOSITIONS FOR ACID TREATMENT OF A METAL SURFACE - The invention relates to compositions and methods that are useful in etching a metal surface. In particular, the invention relates to novel acid compositions and methods of using such compositions in etching a metal surface, preferably an aluminum surface prior to anodizing to dissolve impurities, imperfections, scale, and oxide. The compositions are effective in maintaining their etching capacity and in removing smut produced by the etching of a surface as well as in general cleaning. | 04-09-2009 |
| 20100025257 | METHOD FOR SURFACE TREATING METAL SUBSTRATE - A method of treating a metal substrate comprise the steps of: anodizing the metal substrate to create pores on the surface of the substrate; and treating the metal substrate by NCVM to form a NCVM coating on the surface of the substrate. | 02-04-2010 |
| 20130248374 | CHEMICAL POLISHING OF ALUMINUM - A highly polished surface on an aluminum substrate is formed using any number of machining processes. During the machining process, intermetallic compounds are typically generated at a top surface area of the aluminum substrate caused by spot heat generated between the tool edge and the cut tip of the aluminum substrate during the cutting process. The intermetallic compounds can leave surface imperfections after conventional mechanical polishing operations that render the surface of the aluminum substrate difficult to obtain a desired high glossiness due to exfoliation of the intermetallic compounds from the top surface. In order to remove the effect of the intermetallic compounds, an acid etching solution is applied to the surface resulting in removal of intermetallic compounds across a surface portion of the aluminum substrate. | 09-26-2013 |
| 205214000 | Graining or roughening chemically or electrolytically | 1 |
| 20090084683 | METHOD FOR MAKING A LITHOGRAPHIC PRINTING PLATE SUPPORT - A method for making a lithographic printing plate support is disclosed which comprises the steps of:
| 04-02-2009 |
| 205215000 | Predominantly copper, zinc, or tin substrate | 2 |
| 20090250354 | Pre-Treatment Method for Plating and Instrument for Waterworks of Lead-Contained Copper Alloy - A pre-treatment method for plating wherein lead or the like dissolved in an etching liquid is not electro-deposited (re-adhesion) on a lead-contained copper alloy to be plated even without adding a chelating agent forming an insoluble inert combined substance. The lead-contained copper alloy to be plated is dipped in an alkaline etching liquid without adding a chelating agent which would form an insoluble inert combined substance. In this state, electrolysis where the lead-contained copper alloy functions as one of a positive electrode and a negative electrode, and electrolysis where the lead-contained copper alloy functions as the other of the positive electrode and the negative electrode are performed alternately (PR electrolysis). | 10-08-2009 |
| 20140262805 | AQUEOUS COMPOSITION FOR ETCHING OF COPPER AND COPPER ALLOYS - The present invention relates to an aqueous composition and a process for etching of copper and copper alloys. The aqueous composition comprises Fe | 09-18-2014 |
| 205216000 | Predominantly cobalt or nickel substrate | 1 |
| 20090255825 | METHOD OF PRODUCING A TEMPERATURE SENSOR - In a method of producing a temperature sensor including at least one lead wire of a non-noble metal or of an alloy containing a non-noble metal, at first a lead wire is attached to the temperature sensor. An oxide layer is removed from at least one portion of the lead wire, and the at least one portion of the lead wire is chemically gilded immediately after removing the oxide layer. | 10-15-2009 |
| 205217000 | Predominantly iron or steel substrate | 1 |
| 20170233885 | PROCESS TO MAKE IRON BASED ELECTROCATALYST, AN ANODE MATERIAL, AN ELECTROCHEMICAL SYSTEM AND A PROCESS FOR WATER CONVERSION, CATALYSIS AND FUEL GENERATION | 08-17-2017 |
| 205219000 | Electrolytic treatment | 2 |
| 20100219080 | METHODS AND APPARATUS FOR CATHODE PLATE PRODUCTION - The present invention relates to electrolytic recovery of metal, and in particular methods and apparatus for producing cathode plates suitable for such electrolytic recovery. A first aspect of the invention provides a method of providing an electrically conductive coating on a cathode plate comprising inverting and submerging an upper portion of the cathode plate in an electrolytic bath adjacent at least one anode and applying a current to electroplate the upper portion of the cathode plate wherein each anode includes: i) a first base portion adapted to be positioned adjacent to a hanger bar of said cathode plate; ii) a second extended portion connected to and extending from the base portion and adapted to be positioned adjacent a blade of the cathode plate wherein the profile of each anode is shaped such that in use, a consistent thickness of coating is electroplated over said hanger bar and cathode blade. A second aspect of the invention provides an anode for use in an electroplating and upper portion of a cathode plate having a hanger bar and cathode blade, said anode comprising: i)a first exposed base portion being longer than said hanger bar and having a constant cross sectional profile over its length; ii) a second exposed portion connected to and extending from said first base portion and being shorter in length than the width of the cathode blade. A third aspect of the invention provides a process for refurbishing a cathode plate comprising following a process of removal of an electrically conductive coating on the hanger bar and cathode plate, applying a current density to the cathode plate in a deplating bath at a level sufficient to etch the exposed metal below the solution line of the deplating bath, but insufficient to preferentially attack any weld connection between the hanger bar and the cathode blade. | 09-02-2010 |
| 20140110266 | THIN-TIN TINPLATE - Iron containing substrates are electrically polarized in a pre-plating composition which activates the surface of the steel substrate to receive thin tin or tin alloy. The thin tin or tin alloy is electroplated onto the activate surface of the steel substrate. The thin tinplate and alloy have reduced amounts of pores in the surface. | 04-24-2014 |
