| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 205170000 | Forming multiple superposed electrolytic coatings | 61 |
| 20090101512 | Method for forming multilayer coating film and coated article - An object of the present invention is to provide a coated article having excellent finish and corrosion resistance unaffected by a chemical conversion coating solution even if water washing after a pretreatment step is omitted and a pretreatment solution is carried as a contaminant into an electrodeposition coating composition. | 04-23-2009 |
| 20090242415 | METHOD FOR MANUFACTURING SOLID ELECTROLYTIC CAPACITOR - A method for manufacturing a solid electrolytic capacitor having a capacitor element produced by the steps of: forming a dielectric coating layer on the surface of an anode body, forming a conductive polymer cathode layer on the dielectric coating layer, and forming a cathode lead-out layer on the conductive polymer cathode layer, wherein the step of forming the conductive polymer cathode layer includes an electrolytic polymerization step of forming the conductive polymer cathode layer on the surface of the anode body on which the dielectric coating layer is formed by electrolytic polymerization using an electrolytic polymerization solution containing at least a monomer to be polymerized into the conductive polymer and an ionic liquid. | 10-01-2009 |
| 20090301894 | METHOD OF FABRICATING AN INTEGRATED CIRCUIT - A method of fabricating an integrated circuit comprising providing a substrate, forming a first layer on the substrate by electrochemical deposition using an electrolyte solution, and converting at least a portion of the first layer into a second layer by electrochemical oxidation using an electrolyte solution, the second layer being an oxide layer. | 12-10-2009 |
| 20100122910 | ELECTROCHEMICAL-CODEPOSITION METHODS FOR FORMING CARBON NANOTUBE REINFORCED METAL COMPOSITES - An electrochemical-codeposition method for forming a carbon nanotube (CNT) reinforced metal nanocomposite includes providing a reaction vessel having an anode and a cathode and a plating solution therein, where the plating solution includes at least one acid, at least one surfactant, a plurality of CNTs, and a plurality of metal cations that include at least one metal. The plating solution has a pH between 2 and 4.5 and at least a portion of the plurality of CNTs are positively charged CNTs in the plating solution. A power supply is connected between the anode and cathode. The positively charged CNTs and metal cations are both electrochemically-codeposited onto the cathode to form the nanocomposite, wherein the metal provides a continuous metal phase for the nanocomposite. | 05-20-2010 |
| 20100200414 | WORK ELECTRODEPOSITION COATING METHOD AND ELECTRODEPOSITION COATING DEVICE - Provided with a work electrodeposition coating method for immersing a work in a paint in an electrodeposition tank provided with a first positive electrode for supplying a low voltage and a second positive electrode for supplying a high voltage to carry out electrodeposition coating of a work surface. The work electrodeposition coating method is comprised of a first step in which a first robot moves the work to a first table provided with an current collecting bar corresponding to the first positive electrode; a second step of connecting the work with the current collecting bar and supplies the work with the low voltage to carry out the electrodeposition coating; a third step in which a second robot provided with a negative electrode switches a connecting condition of the negative electrode connected with the work from the current collecting bar to an current collecting bar corresponding to the second positive electrode when the second robot chucks the work, and then carries out the electrodeposition coating while moving the work to a second table provided with an current collecting bar; and a fourth step of connecting the work to the current collecting bar and supplies the work with the high voltage to carry out the electrodeposition coating. | 08-12-2010 |
| 20100224500 | VEHICLE BODY PRODUCTION METHOD - Disclosed is a method for producing a vehicle body, which, without removing protrusions on an electrophoretic coating, improves the coating quality. The outer surface of the vehicle body is sanded prior to a pre-treatment, where the vehicle body is degreased and washed. | 09-09-2010 |
| 20100252440 | Electroplating on ultra-thin seed layers - Methods and structures for the electroplating on ultra-thin seed layers are disclosed. A dual layer structure is utilized, consisting of a thicker, highly conductive layer surrounding device structures. Within the device die, an ultra-thin seed layer is employed, which is electrically coupled to the conduction layer. Using this technique, electroplating of critical device structures can be carefully controlled and made uniform across the full diameter of the wafer. The technique also allow for the deployment of ultra-thin seed layers of varying thickness and composition in different locations within the circuit device, or in different die on the wafer. | 10-07-2010 |
| 20100282613 | Methods for tailoring the surface topography of a nanocrystalline or amorphous metal or alloy and articles formed by such methods - Electrochemical etching tailors topography of a nanocrystalline or amorphous metal or alloy, which may be produced by any method including, by electrochemical deposition. Common etching methods can be used. Topography can be controlled by varying parameters that produce the item or the etching parameters or both. The nanocrystalline article has a surface comprising at least two elements, at least one of which is metal, and one of which is more electrochemically active than the others. The active element has a definite spatial distribution in the workpiece, which bears a predecessor spatial relationship to the specified topography. Etching removes a portion of the active element preferentially, to achieve the specified topography. Control is possible regarding: roughness, color, particularly along a spectrum from silver through grey to black, reflectivity and the presence, distribution and number density of pits and channels, as well as their depth, width, size. Processing parameters that have been correlated in the Ni—W system to topography features include, for both the deposition phase and the etching phase of a nanocrystalline surface: duty cycle, current density, deposition duration, plating chemistry, polarity ratio. The relative influence of the processing parameters can be noted and correlated to establish a relationship between values for processing parameters and degree of topography feature. Control can be established over the topography features. Correlation can be made for any such system that exhibits a definite spatial distribution of an active element that bears a predecessor spatial relationship to a desired topography feature. | 11-11-2010 |
| 20110042225 | ELECTROCHEMICAL NANOCOMPOSITE BIOSENSOR SYSTEM - The present invention relates to an electrode useful in electrochemical nanobiosensors for determining the presence or concentration of analytes in aqueous samples. In particular, the electrode comprises a biocatalyst or other bioreceptor entrapped in a conducting polymeric film deposited on a conducting material and a non-conducting or conducting coating. In particular embodiments, the conducting polymeric layer also comprises metallic nanoparticles. Electrochemical nanobiosensors containing the electrode, methods of making the electrode or sensor and methods of detecting analytes are other aspects of the invention. | 02-24-2011 |
| 20110147222 | METHOD FOR MANUFACTURING A PERPENDICULAR MAGNETIC WRITE HEAD HAVING A TAPERED WRITE POLE AND A STEPPED WRAP AROUND SIDE SHIELD GAP - A method for manufacturing a magnetic write head that has a trailing magnetic shield with a tapered write pole trailing edge, a non-magnetic step layer and a Ru bump and an alumina bump formed at the front of the non-magnetic step layer. The process forms a Ru/alumina side wall at the sides of the write pole, such that the Ru side wall is closest to the write pole. The Ru is removed more readily than the alumina during the ion milling that is performed to taper the write pole. This causes the Ru portion of the side wall to taper away from the write pole rather than forming an abrupt step. This tapering prevents dishing of the trailing edge of the write pole for improved write head performance. | 06-23-2011 |
| 20110147223 | Methods of Forming Three-Dimensional Structures Having Reduced Stress and/or Curvature - Electrochemical fabrication processes and apparatus for producing single layer or multi-layer structures where each layer includes the deposition of at least two materials and wherein the formation of at least some layers includes operations for reducing stress and/or curvature distortion when the structure is released from a sacrificial material which surrounded it during formation and possibly when released from a substrate on which it was formed. Six primary groups of embodiments are presented which are divide into eleven primary embodiments. Some embodiments attempt to remove stress to minimize distortion while others attempt to balance stress to minimize distortion. | 06-23-2011 |
| 20110155581 | METHOD FOR FORMING METAL FILM - A metal film-forming method is capable of forming a metal film on a surface of a base metal film, formed on a surface of a substrate, with sufficient adhesion to the base metal film even when a natural oxide film is formed on the surface of the base metal film. The metal film-forming method includes: preparing a substrate having a base metal film formed on a surface; and carrying out electroplating of the substrate using the base metal film as a cathode and another metal as an anode while immersing the substrate in a solution containing a metal complex and a reducing material, both dissolved in a solvent, to form a metal film, deriving from a metal contained in the metal complex, on the surface of the base metal film. | 06-30-2011 |
| 20110180413 | PROPERTY MODULATED MATERIALS AND METHODS OF MAKING THE SAME - A method of making property modulated composite materials includes depositing a first layer of material having a first microstructure/nanostructure on a substrate followed by depositing a second layer of material having a second microstructure/nanostructure that differs from the first layer. Multiple first and second layers can be deposited to form a composite material that includes a plurality of adjacent first and second layers. By controlling the microstructure/nanostructure of the layers, the material properties of the composite material formed by this method can be tailored for a specific use. The microstructures/nanostructures of the composite materials may be defined by one or more of grain size, grain boundary geometry, crystal orientation, and a defect density. | 07-28-2011 |
| 20110226630 | GALLIUM ELECTROPLATING METHODS AND ELECTROLYTES EMPLOYING MIXED SOLVENTS - An electrochemical deposition method and electrolyte to plate uniform, defect free and smooth gallium films are provided. In a preferred embodiment, the electrolyte may include a solvent that comprises water and at least one monohydroxyl alcohol, a gallium salt, and an acid to control the solution pH and conductivity. The method electrodeposits a gallium film possessing sub-micron thickness on a conductive surface. Such gallium layers are used in fabrication of semiconductor and electronic devices such as thin film solar cells. | 09-22-2011 |
| 20110290654 | APPARATUS AND METHODS FOR FAST CHEMICAL ELECTRODEPOSITION FOR FABRICATION OF SOLAR CELLS - The invention relates generally to electrodeposition apparatus and methods. When depositing films via electrodeposition, where the substrate has an inherent resistivity, for example, sheet resistance in a thin film, methods and apparatus of the invention are used to electrodeposit materials onto the substrate by forming a plurality of ohmic contacts to the substrate surface and thereby overcome the inherent resistance and electrodeposit uniform films. Methods and apparatus of the invention find particular use in solar cell fabrication. | 12-01-2011 |
| 20120061247 | Method and Chemistry for Selenium Electrodeposition - Techniques for electrodepositing selenium (Se)-containing films are provided. In one aspect, a method of preparing a Se electroplating solution is provided. The method includes the following steps. The solution is formed from a mixture of selenium oxide; an acid selected from the group consisting of alkane sulfonic acid, alkene sulfonic acid, aryl sulfonic acid, heterocyclic sulfonic acid, aromatic sulfonic acid and perchloric acid; and a solvent. A pH of the solution is then adjusted to from about 2.0 to about 3.0. The pH of the solution can be adjusted to from about 2.0 to about 3.0 by adding a base (e.g., sodium hydroxide) to the solution. A Se electroplating solution, an electroplating method and a method for fabricating a photovoltaic device are also provided. | 03-15-2012 |
| 20120067733 | METHOD OF ELECTROPLATING SILVER STRIKE OVER NICKEL - A silver electroplating solution is used to electroplate a mirror bright silver layer on a nickel or nickel alloy substrate. The silver electroplating solution is cyanide-free and environmentally friendly. | 03-22-2012 |
| 20120138471 | ELECTROPLATING APPARATUS AND PROCESS FOR WAFER LEVEL PACKAGING - An apparatus for continuous simultaneous electroplating of two metals having substantially different standard electrodeposition potentials (e.g., for deposition of Sn—Ag alloys) comprises an anode chamber for containing an anolyte comprising ions of a first, less noble metal, (e.g., tin), but not of a second, more noble, metal (e.g., silver) and an active anode; a cathode chamber for containing catholyte including ions of a first metal (e.g., tin), ions of a second, more noble, metal (e.g., silver), and the substrate; a separation structure positioned between the anode chamber and the cathode chamber, where the separation structure substantially prevents transfer of more noble metal from catholyte to the anolyte; and fluidic features and an associated controller coupled to the apparatus and configured to perform continuous electroplating, while maintaining substantially constant concentrations of plating bath components for extended periods of use. | 06-07-2012 |
| 20120138472 | METHOD OF FORMING A PROCESS CHAMBER COMPONENT HAVING ELECTROPLATED YTTRIUM CONTAINING COATING - Methods of fabricating a chamber component capable of being exposed to a plasma in a process chamber includes: providing a component structure composed of metal; immersing the surface of the component structure in an electroplating bath comprising first metal electrolyte species and second metal electrolyte species; forming a cathode by connecting the component structure to a negative terminal of a voltage source; immersing in the electroplating bath, an anode comprising an inert material or material to be electroplated, and connecting the anode to a positive terminal of the voltage source; and electroplating a layer having a concentration gradient of the first metal, second metal, or both. | 06-07-2012 |
| 20130313124 | ELECTRO CHEMICAL DEPOSITION APPARATUS - This invention relates to apparatus for electrochemical deposition onto the surface of a substrate. The apparatus includes an anode electrode | 11-28-2013 |
| 20140190836 | ANTI-CORROSION ELECTROCOAT - The present disclosure relates to the application of anti-corrosion coatings for a ferrous substrate. The first coating applied to the ferrous substrate is an electrocoat composition comprising electrically conductive pigments. A dried a cured coating layer of the first electrocoat composition provides the basis for a second electrocoat composition. | 07-10-2014 |
| 20140216943 | LAMINATING MAGNETIC CORES FOR ON-CHIP MAGNETIC DEVICES - A laminating structure includes a first magnetic layer, a second magnetic layer, a first spacer disposed between the first and second magnetic layers and a second spacer disposed on the second magnetic layer. | 08-07-2014 |
| 20140346051 | Method and Chemistry for Selenium Electrodeposition - Techniques for electrodepositing selenium (Se)-containing films are provided. In one aspect, a method of preparing a Se electroplating solution is provided. The method includes the following steps. The solution is formed from a mixture of selenium oxide; an acid selected from the group consisting of alkane sulfonic acid, alkene sulfonic acid, aryl sulfonic acid, heterocyclic sulfonic acid, aromatic sulfonic acid and perchloric acid; and a solvent. A pH of the solution is then adjusted to from about 2.0 to about 3.0. The pH of the solution can be adjusted to from about 2.0 to about 3.0 by adding a base (e.g., sodium hydroxide) to the solution. A Se electroplating solution, an electroplating method and a method for fabricating a photovoltaic device are also provided. | 11-27-2014 |
| 205171000 | At least one anodic coating | 12 |
| 20080251388 | METHOD OF PREPARING HIGHLY THERMALLY CONDUCTIVE CIRCUIT SUBSTRATE - A method of preparing a highly thermally conductive circuit substrate includes the steps of preparing a metallic substrate, producing an insulated layer on a surface of the metallic substrate, producing an intermediate medium layer on a surface of the insulated layer, and producing an electrically conductive main layer on a surface of the intermediate medium layer. | 10-16-2008 |
| 20080308424 | MAGNESIUM ALLOY MEMBER, METHOD FOR PRODUCING THE SAME, AND TRANSPORTER COMPRISING THE SAME - A magnesium alloy member includes a member main body formed of a magnesium alloy containing aluminum, and an anodic oxidation coating covering at least a portion of the member main body. The anodic oxidation coating includes a porous first layer and a second layer located between the first layer and the member main body and having a higher aluminum content than that of the first layer. The ratio of the thickness of the second layer with respect to the thickness of the anodic oxidation preferably is about 5% to about 20%. | 12-18-2008 |
| 20090145768 | Process of ceramic coating for silver or silver plated - A process of ceramic coatings on silver or silver-plated articles is developed in order to prevent surface tarnish, which are employed as ornaments on bags, garments or accessories such as necklaces, earrings, etc. Such a process comprises the steps of: forming a beryllium film on the surface of the article by fixing a stainless steel plate to an anode, fixing the silver or silver-plated article to a cathode and plating the surface of the silver-plated article with beryllium in an electrolyte containing beryllium sulfate (BeSO4.4H2O) by an electroplating method; buffing the article coated with the beryllium film; washing and drying the buffed article using a surfactant; forming the resultant ceramic coating by dipping the dried article in a ceramic coating solution which includes 20 to 80 cc of glass water (liquid sodium silicate) No. 1, 5 to 60 g of sodium metasilicate, 5 to 30 g of sodium tungstate, 5 to 10 g of molybdic acid in 1 liter of water; and drying the wetted article. | 06-11-2009 |
| 20120160696 | ELECTROPLATING METHOD - A substrate with a through-hole is immersed in a plating solution in a plating tank. A pair of anodes are disposed in the plating solution in the plating tank in facing relation to face and reverse sides, respectively, of the substrate in the plating solution. A plurality of plating processes are performed on the face and reverse sides by supplying pulsed currents respectively between the face side of the substrate and one of the anodes which faces the face side of the substrate, and between the reverse side of the substrate and the other anode which faces the reverse side of the substrate. A reverse electrolyzing process is performed on the face and reverse sides between adjacent plating processes by supplying currents in an opposite direction to the pulsed currents respectively between the face side of the substrate and one of the anodes, and between the reverse side of the substrate and the other anode. | 06-28-2012 |
| 20140367268 | JIG FOR MANUFACTURING CAPACITOR ELEMENT AND METHOD FOR MANUFACTURING CAPACITOR ELEMENT - A jig for manufacturing a capacitor element is provided in which an immersion position of an anode body in a processing liquid can be controlled accurately, and a heat treatment can be performed without difficulty when heat treatment is required in the middle of manufacturing the capacitor element. The jig includes a first substrate | 12-18-2014 |
| 205172000 | Predominantly aluminum substrate | 7 |
| 20130256143 | ANODIZED INSERTS FOR COULOMB DAMPING OR FRICTIONAL DAMPING - A method comprising providing an insert having a portion capable of being oxidized and electrochemically anodizing the portion capable of being oxidized to provide a layer comprising an oxidized material thereon. | 10-03-2013 |
| 205173000 | Electrolytically depositing material only within or above pores of anodic coating (e.g., electrolytic coloring, etc.) | 3 |
| 20090152120 | SURFACE TREATMENT PROCESS FOR COLORING METAL ARTICLES - A surface treatment process for coloring metal articles includes following steps. In a first step, a metal article is anodized to form a first anodic oxide layer including a first portion and a second portion on the original metal article. In a second step, the anodized metal article is dyed. In a third step, the first portion of the first anodic oxide layer is removed from the anodized metal article to partially expose a metal body of the anodized metal article. In a fourth step, the exposed metal body of the anodized metal article is anodized to form a second anodic oxide layer. In a fifth step, the exposed metal body of the metal article is dyed. | 06-18-2009 |
| 20160010237 | Process for Making Heat Stable Color Anodized Aluminum and Articles Formed Thereby | 01-14-2016 |
| 205174000 | Multiple anodic coatings | 1 |
| 20150337450 | DENSE OXIDE COATED COMPONENT OF A PLASMA PROCESSING CHAMBER AND METHOD OF MANUFACTURE THEREOF - A method of forming a dense oxide coating on an aluminum component of semiconductor processing equipment comprises cold spraying a layer of pure aluminum on a surface of the aluminum component to a predetermined thickness. A dense oxide coating is then formed on the layer of pure aluminum using a plasma electrolytic oxidation process, wherein the plasma electrolytic oxidation process causes the layer of pure aluminum to undergo microplasmic discharges, thus forming the dense oxide coating on the layer of pure aluminum on the surface of the aluminum component. | 11-26-2015 |
| 205175000 | Multiple anodic coatings | 3 |
| 20090211912 | Antireflective member, optical element, display device, method of making stamper and method of making antireflective member using the stamper - An antireflective member according to the present invention has an uneven surface pattern, in which unit structures are arranged in x and y directions at respective periods that are both shorter than the shortest wavelength of an incoming light ray, on the surface of a substrate and satisfies the following Inequality (1): | 08-27-2009 |
| 20100219079 | METHODS FOR MAKING MEMBRANES BASED ON ANODIC ALUMINUM OXIDE STRUCTURES - Membranes including anodic aluminum oxide structures that are adapted for separation, purification, filtration, analysis, reaction and sensing. The membranes can include a porous anodic aluminum oxide (AAO) structure having pore channels extending through the AAO structure. The membrane may also include an active layer, such as one including an active layer material and/or active layer pore channels. The active layer is intimately integrated within the AAO structure, thus enabling great robustness, reliability, resistance to mechanical stress and thermal cycling, and high selectivity. Methods for the fabrication of anodic aluminum oxide structures and membranes are also provided. | 09-02-2010 |
| 20110315557 | MOLD MANUFACTURING METHOD AND ELECTRODE STRUCTURE FOR USE THEREIN - A method of fabricating a motheye mold according to the present invention includes the steps of: (a) anodizing a surface of an aluminum film ( | 12-29-2011 |
| 205176000 | At least one alloy coating | 10 |
| 20090321268 | Electrodeposited film having sliding function and coated article therewith - The present invention is an electrodeposited film substantially containing no lead, characterized by applying an alloy layer or a simple metal layer with an Hv value of not less than 60 to an under layer, and an alloy layer or a simple metal layer with an Hv value of not more than 40 to an upper layer. This electrodeposited film is harmless to the human body and the environment, and superior in sliding properties. | 12-31-2009 |
| 20100025255 | ELECTROPLATING METHOD FOR MAGNESIUM AND MAGNESIUM ALLOY - An electroplating method for magnesium and magnesium alloys, comprising: providing a magnesium or magnesium alloy substrate and pre-treating it to be cleaned; roughening the surface of the substrate; activating the surface of the substrate; chemically plating the substrate to form a nickel coating on its surface; and electroplating the substrate to form, in order, a first nickel coating, a copper coating, a second nickel coating, and a chromium coating on the chemically produced nickel coating. | 02-04-2010 |
| 20110056839 | METHOD AND SYSTEM FOR CORROSION PROTECTION OF LAYERS IN A STRUCTURE OF A MAGNETIC RECORDING TRANSDUCER - A method for providing a structure in a magnetic recording transducer is described. The method includes plating a first layer in a plating bath using a first plurality of plating conditions. The first layer has a first galvanic potential. The method also includes modifying the plating bath and/or the first plurality of plating conditions to provide a modified plating bath and/or a second plurality of plating conditions. The method further includes plating a second layer using the modified plating bath and/or the second plurality of plating conditions. The second layer has a second galvanic potential. The first galvanic potential is between the second galvanic potential and a third galvanic potential of a third layer if the third layer adjoins the first layer. The second galvanic potential is between the first galvanic potential and the third galvanic potential of the third layer if the third layer adjoins the second layer. | 03-10-2011 |
| 20110315558 | THIN FILM SUPPORT SUBSTRATE FOR USE IN HYDROGEN PRODUCTION FILTER AND PRODUCTION METHOD OF HYDROGEN PRODUCTION FILTER - In a through hole closing process, a metal plate is attached to one surface of a conductive base member having a plurality of through holes by the use of a magnet, in a copper plating process, a copper plating layer is formed on the conductive base member and the metal plate exposed within the through holes, from the side of the conductive base member where the metal plate is not attached, thereby to fill up the through holes, in a film forming process, a Pd alloy film is formed by plating on the surface of the conductive base member after removal of the metal plate, and in a removal process, the copper plating layer is removed by selective etching, thereby to produce a hydrogen production filter that is used in a reformer a fuel cell so as to be capable of stably producing high purity hydrogen gas. | 12-29-2011 |
| 20120055802 | ACIDIC GOLD ALLOY PLATING SOLUTION - A gold alloy plating solution and plating method thereof that provides a gold plating solution with high deposition selectivity by using a gold plating solution that contains gold cyanide, cobalt ions, hexamethylene tetramine, and specific glossing agents. | 03-08-2012 |
| 20130008798 | ELECTRODEPOSITION METHODS OF GALLIUM AND GALLIUM ALLOY FILMS AND RELATED PHOTOVOLTAIC STRUCTURES - Photovoltaic devices and methods for preparing a p-type semiconductor generally include electroplating a layer of gallium or a gallium alloy onto a conductive layer by contacting the conductive layer with a plating bath free of complexing agents including a gallium salt, methane sulfonic acid or sodium sulfate and an organic additive comprising at least one nitrogen atom and/or at least one sulfur atom, and a solvent; adjusting a pH of the solution to be less than 2.6 or greater than 12.6. The photovoltaic device includes an impurity in the p-type semiconductor layer selected from the group consisting of arsenic, antimony, bismuth, and mixtures thereof. Various photovoltaic precursor layers for forming CIS, CGS and CIGS p-type semiconductor structures can be formed by electroplating the gallium or gallium alloys in this manner. Also disclosed are processes for forming a thermal interface of gallium or a gallium alloy. | 01-10-2013 |
| 20130341197 | METHODS FOR PRODUCING A HIGH TEMPERATURE OXIDATION RESISTANT MCRALX COATING ON SUPERALLOY SUBSTRATES - Methods for producing a high temperature oxidation and hot corrosion resistant MCrAlX coating on a superalloy substrate include applying an M-metal, chromium, and aluminum or an aluminum alloy comprising a reactive element to at least one surface of the superalloy component by electroplating at electroplating conditions below 100° C. in a plating bath thereby forming a plated component and heat treating the plated component. | 12-26-2013 |
| 20150068912 | COPPER FOIL STRUCTURE HAVING BLACKENED ULTRA-THIN FOIL AND MANUFACTURING METHOD THEREOF - A copper foil structure having blackened ultra-thin copper foil of the instant disclosure includes a carrier foil, a blackened layer, a release layer, and an ultra-thin copper foil. The carrier foil includes a matte surface and a shiny surface wherein the blackened layer is disposed thereon. The release layer is disposed on the blackened layer formed with one selected from the group: copper, cobalt, nickel, and manganese while the release layer is formed with one selected from the group: molybdenum, nickel, chromium, and potassium. Successively, the ultra-thin copper foil is disposed on the release layer. Laser drilling can apply to the blackened ultra-thin copper foil on the inner layers of a high density multi-layer printed wiring board, thus eliminating the traditional blackening or browning chemical process. The blackened ultra-thin copper foil in combination with a polyimide thin (PI) or other substrate materials displays desirable appearance. | 03-12-2015 |
| 20150108004 | Multi-Layer Structures and Methods for Forming - An electroplating method that includes: a) contacting a first substrate with a first article, which includes a substrate and a conformable mask disposed in a pattern on the substrate; b) electroplating a first metal from a source of metal ions onto the first substrate in a first pattern, the first pattern corresponding to the complement of the conformable mask pattern; and c) removing the first article from the first substrate, is disclosed. Electroplating articles and electroplating apparatus are also disclosed. | 04-23-2015 |
| 20160002804 | PROCESS FOR CORROSION PROTECTION OF IRON CONTAINING MATERIALS - The present invention relates to a process for corrosion protection of an iron-containing substrate wherein a first zinc-nickel alloy layer, a second zinc-nickel alloy layer and a black passivate layer are deposited onto the substrate. The nickel concentration in the second zinc-nickel alloy layer is higher than the nickel concentration in the first zinc-nickel alloy layer. The substrate surface obtained is homogenously black with an appealing decorative appearance and both resistance against white rust and red rust are improved. | 01-07-2016 |
| 205177000 | At least one predominantly zinc metal coating | 2 |
| 20090008258 | Porous catalyst structure and its manufacturing method - A porous catalyst structure with a high specific surface area comprising a porous substrate with a catalyst layer thereon is provided. The porous catalyst structure can be prepared by a process comprising depositing a metallic layer onto the surface of a porous, metallic substrate by electroplating, and optionally oxidizing the metallic layer into the metal oxide layer. Any conductive porous metallic substrate can be used as the substrate of the subject invention, and the metallic layer may comprise any suitable metal(s) and/or metal oxide(s) with desired catalytic function(s). | 01-08-2009 |
| 20150027896 | METHOD FOR PRODUCING Cu2ZnSnS4-xSex (0 LESS THAN-EQUAL TO X LESS THAN-EQUAL TO 4) THIN FILM BY ONE STEP ELECTRODEPOSITION IN ELECTROLYTIC BATH CONTAINING IONIC LIQUID | 01-29-2015 |
| 205178000 | At least one chromium-containing coating | 3 |
| 205179000 | Multiple chromium-containing coatings | 2 |
| 20090255823 | METHOD FOR ELECTROPLATING A PLASTIC SUBSTRATE - A method for electroplating a plastic substrate includes the following steps, a plastic substrate is firstly provided. The plastic substrate is then pretreated to form a noble metal coating. The noble metal coating is coated with a copper coating. A first chrome coating is electroplated onto the copper coating using a first electrolyte including a chromic component. A second chrome coating is electroplated onto the first chrome coating using a second electrolyte including a chromyl component. | 10-15-2009 |
| 20140284218 | CHROME-PLATED PART AND MANUFACTURING METHOD OF THE SAME - An nickel plating layer ( | 09-25-2014 |
| 205180000 | At least one predominantly nickel metal coating | 1 |
| 20100243463 | Chromium Alloy Coating with Enhanced Resistance to Corrosion in Calcium Chloride Environments - The invention consists of a chromium electroplating solution comprising a chromium electroplating solution comprising: (1) a water soluble trivalent chromium salt; (2) at least one complexant for trivalent chromium ions; (3) a source of hydrogen ions sufficient to create a pH of from 2.8-4.2; (4) a pH buffering compound; and (5) a sulfur-containing organic compound. The chromium electroplating solution is usable in a method for producing an adherent metallic coating on a decorative article, such coating having enhanced resistance to corrosion in environments containing calcium chloride. | 09-30-2010 |
| 205181000 | At least one predominantly nickel metal coating | 6 |
| 20090211913 | Production of Silky Material of metal surfaces - The invention relates to a galvanic metal coating with an adjustable satin gloss in which a matt Ni layer is deposited on a brilliant surface and is coated with a sulfamate Ni layer. | 08-27-2009 |
| 20090242416 | Nanowire sensor, sensor array, and method for making the same - The present invention relates to a nanowire sensor and method for forming the same. More specifically, the nanowire sensor comprises at least one nanowire formed on a substrate, with a sensor receptor disposed on a surface of the nanowire, thereby forming a receptor-coated nanowire. The nanowire sensor can be arranged as a sensor sub-unit comprising a plurality of homogeneously receptor-coated nanowires. A plurality of sensor subunits can be formed to collectively comprise a nanowire sensor array. Each sensor subunit in the nanowire sensor array can be formed to sense a different stimulus, allowing a user to sense a plurality of stimuli. Additionally, each sensor subunit can be formed to sense the same stimuli through different aspects of the stimulus. The sensor array is fabricated through a variety of techniques, such as by creating nanopores on a substrate and electrodepositing nanowires within the nanopores. | 10-01-2009 |
| 20100101962 | Immersion method - A composition and method for inhibiting corrosion is disclosed. Metals and metal alloys are treated with compositions which contain inorganic and organic acids that prevent oxide formation on the metals and metal alloys. | 04-29-2010 |
| 20100243464 | METHODS OF FORMING COATINGS ON SUBSTRATES - Methods are provided for forming coatings on substrates. In an embodiment, a method includes forming a first metal layer on the substrate, the first metal layer comprising a first precious metal, electrodepositing an active element over the first metal layer to form an active element layer, the active element selected from the group consisting of yttrium, scandium, and a lanthanide series element, applying a second metal layer over the active element layer, the second metal layer consisting essentially of a metal selected from a group consisting of a second precious metal, nickel, and cobalt, heating the substrate including the first metal layer, the active element layer, and the second metal layer to form a diffusion-alloyed layer over the substrate, adding aluminum to the diffusion-alloyed layer, and heating the substrate to diffuse and react the aluminum with the diffusion-alloyed layer to form a modified precious metal aluminide coating on the substrate. | 09-30-2010 |
| 20110011747 | METHOD FOR MAKING A BASE PLATE FOR SUSPENSION ASSEMBLY IN HARD DISK DRIVE - A swage mount that includes a flange, having a first side and a second side, and a cylindrically shaped hub. The hub is primarily comprised of a metal (such as stainless steel), and extends from the second side of the flange, and has an inner surface and an outer surface. The surface of the swage mount is plated with one or more layers of metal, or a combination of metals, which provide a) increased retention torque, and b) increased part cleanliness. This invention may be used in conjunction with surface hardened swage mounts that contain surface protrusions. In this case the metal plating prevents separation of the protrusions from the swage mount, thereby preventing contamination. | 01-20-2011 |
| 20130277225 | Method to Produce Golden Bronze by Diffusion of Tin Into Copper Under Controlled Conditions - The present invention relates to the production of a bronze plated substrate having a golden appearance thanks to a multiple-layer plating method. The method notably comprises plating a substrate having at least one layer of copper with a tin layer which thickness represents 3.5% to 12% of the copper layer thickness. The method further comprises annealing the plated substrate in an annealing furnace comprising a plurality of heating zones, the last heating zone of the furnace having an annealing temperature ranging from 600° C. to 815° C. The annealing step of the method is performed under controlled operating parameters which comprise an annealing residence time, the annealing temperature and the relative thickness of the tin layer in view of the copper layer. The operating parameters are controlled in accordance to each other to ensure obtaining the gold-like appearance of the plated bronze. | 10-24-2013 |
| 205182000 | At least one predominantly copper metal coating | 5 |
| 20090255824 | METHOD FOR SURFACE TREATING A SUBSTRATE - A method for surface treating a substrate includes following steps. Firstly, a substrate including a metallic surface capable of being electroplated with a metal coating is provided. Secondly, a first metal coating is electroplated onto the metallic surface of the substrate. Thirdly, an oxidized metal film is formed to cover the first metal coating. The first metal coating of substrate is blasted using quartz sand. The oxidized metal film is removed from the first metal coating. The second metal coating is electroplated onto the first metal coating. | 10-15-2009 |
| 20090294297 | METHOD OF FORMING PLATING LAYER - There is provided a method of forming a plating layer, the method including: forming a seed layer on a substrate; forming a pattern layer on the seed layer, the pattern layer formed of a thermoplastic resin and including openings; forming a plating layer on portions of the seed layer corresponding to the openings; and removing the pattern layer. This method ensures that the plating layer is formed with a sufficient thickness and the substrate, particularly, a ceramic substrate suffers minimal chemical damage during a plating process. Moreover, the plating layer is formed with a more uniform thickness. | 12-03-2009 |
| 20090314649 | PRECURSOR CONTAINING COPPER INDIUM AND GALLIUM FOR SELENIDE (SULFIDE) COMPOUND FORMATION - The present invention relates to systems and methods for preparing metallic precursor thin films for the growth of semiconductor compounds to be used for radiation detector and solar cell fabrication. In one aspect, there is provided a method of efficiently using expensive materials necessary for the making of solar cells. | 12-24-2009 |
| 20120217166 | PROCESS FOR THE ELECTROLYTIC COPPER PLATING OF ZINC DIECASTING HAVING A REDUCED TENDENCY TO BLISTER FORMATION - In the electroplating of zinc diecastings with a copper layer, the electrolyte penetrates into the pores of the zinc diecasting. When the temperature is increased later, this leads to vaporization of the electrolyte liquid in the pores and to blistering or flaking of the copper layer. It is proposed that plating be carried out in two steps. In the first step, only a thin copper layer of less than 1 μm is applied and the plated parts are then treated at a temperature which leads to vaporization of the electrolyte liquid. The thin copper layer is still sufficiently porous for the vapour to be able to escape. Only the solid constituents of the electrolyte remain. The copper layer is then thickened to a final thickness of from about 20 to 30 μm. In this plating step, electrolyte liquid no longer penetrates into the pores of the zinc diecasting. The parts which are coated in this way display no blistering or flaking of the copper layer after storage at a temperature of 150° C. | 08-30-2012 |
| 20150014177 | METHOD FOR PRODUCING MATT COPPER DEPOSITS - The present invention relates to a method for deposition of a matte copper coating wherein a first copper layer is deposited from an aqueous copper electrolyte which does not contain an organic compound comprising divalent sulfur. A second copper layer is then deposited onto the first copper layer from an aqueous copper electrolyte comprising a first and a second water soluble sulfur-containing additive wherein the first water soluble sulfur-containing compound is an alkyl sulfonic acid derivative and the second water soluble sulfur-containing additive is an aromatic sulfonic acid derivative. The method provides copper layers with a homogeneous and adjustable matte appearance for decorative applications. | 01-15-2015 |
