| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 205148000 | Agitating or moving electrolyte during coating | 13 |
| 20090045069 | Plating apparatus and plating method - A plating apparatus performs a plating process while placing a work in a pod disposed in a plating bath storing a plating solution. The pod has a pair of meshes that allow the plating solution to pass but substantially inhibit the work from passing. The plating apparatus is provided with a solution flowing mechanism for flowing the plating solution out of the pod through one of the pair of meshes. | 02-19-2009 |
| 20090139871 | Plating apparatus and plating method - A plating apparatus can form a bump having a flat top or can form a metal film having a good in-plane uniformity even when the plating of a plating object (substrate) is carried out under high-current density conditions. The plating apparatus includes a plating tank for holding a plating solution; an anode to be immersed in the plating solution in the plating tank; a holder for holding a plating object and disposing the plating object at a position opposite the anode; a paddle, disposed between the anode and the plating object held by the holder, which reciprocates parallel to the plating object to stir the plating solution; and a control section for controlling a paddle drive section which drives the paddle. The control section controls the paddle drive section so that the paddle moves at a velocity whose average absolute value is 70 cm/sec to 100 cm/sec. | 06-04-2009 |
| 20090242413 | Electroplating Head and Method for Operating the Same - An electroplating head is disposed above and proximate to an upper surface of a wafer. Cations are transferred from an anode to an electroplating solution within the electroplating head. The electroplating solution flows downward through a porous electrically resistive material at an exit of the electroplating head to be disposed on the upper surface of the wafer. An electric current is established between the anode and the upper surface of the wafer through the electroplating solution. The electric current is uniformly distributed by the porous electrically resistive material present between the anode and the upper surface of the wafer. The electric current causes the cations to be attracted to the upper surface of the wafer. | 10-01-2009 |
| 20100065433 | SYSTEM AND APPARATUS FOR ENHANCING CONVECTION IN ELECTROLYTES TO ACHIEVE IMPROVED ELECTRODEPOSITION OF COPPER AND OTHER NON FERROUS METALS IN INDUSTRIAL ELECTROLYTIC CELLS - A system and apparatus for enhancing convection in electrolytes for improved electrodeposition of copper and other non ferrous metals in industrial electrolytic cells at given a current density providing exact geometric locations of the electrolyte jet infeed supply system used to impart forced convection in the electrolyte, the gas bubbling system for low pressure/low volume convection enhancement, and the electrode bottom and lateral distancing system, and range of operational parameters, for correct electrolyte flow and air bubbling flow improving cell productivity, quality of metal plates with increased electrical efficiency for its industrial application. The system and apparatus can also be used in industrial cells with same optimal results but at increased current densities, provided sufficient suitable electrolyte and additional electric power is available. | 03-18-2010 |
| 20100307926 | METHOD AND DEVICE FOR SUPPLYING ELECTRICAL POWER - Method and device for supplying electrical power to a wafer that is at least partially submerged in a liquid. The device comprises: —a container filled with the liquid; —a transportation device comprising a wafer carrier device for transporting the wafer at least partially submerged through the liquid; —a power supply device for supplying electrical power to the wafer. | 12-09-2010 |
| 20120160695 | NANO-TUBULAR TITANIA SUBSTRATE AND METHOD OF PREPARING SAME - The invention relates to a method of making a nanotubular titania substrate having a titanium dioxide surface comprised of a plurality of vertically oriented titanium dioxide nanotubes containing oxygen vacancies, including the steps of anodizing a titanium metal substrate in an acidified fluoride electrolyte and annealing the titanium oxide surface in a non-oxidating atmosphere. The invention further relates to a nanotubular titania substrate having an annealed titanium dioxide surface comprised of self-ordered titanium dioxide nanotubes containing oxygen vacancies. The invention further relates to a photo-electrolysis method for generating H | 06-28-2012 |
| 20130306484 | MODIFIED METAL MATERIALS, SURFACE MODIFICATIONS TO IMPROVE CELL INTERACTIONS AND ANTIMICROBIAL PROPERTIES, AND METHODS FOR MODIFYING METAL SURFACE PROPERTIES - The present disclosure is directed to modified metal materials for implantation and/or bone replacement, and to methods for modifying surface properties of metal substrates for enhancing cellular adhesion (tissue integration) and providing antimicrobial properties. Some embodiments comprise surface coatings for metal implants, such as titanium-based materials, using (1) electrochemical processing and/or oxidation methods, and/or (2) laser processing, in order to enhance bone cell-materials interactions and achieve improved antimicrobial properties. One embodiment comprises the modification of a metal surface by growth of in situ nanotubes via anodization, followed by electrodeposition of silver on the nanotubes. Other embodiments include the use of LENS™ processing to coat a metal surface with calcium-based bioceramic composition layers. These surface treatment methods can be applied as a post-processing operation to metallic implants such as hip, knee and spinal devices as well as screws, pins and plates. | 11-21-2013 |
| 20140131211 | ELECTROLYTE LOOP WITH PRESSURE REGULATION FOR SEPARATED ANODE CHAMBER OF ELECTROPLATING SYSTEM - An electrolyte, and particularly anolyte, may be circulated via an open loop having a pressure regulator, so that the pressure in the plating chamber is maintained at a constant (or substantially constant) value with respect to atmospheric pressure. In these embodiments, a pressure regulator is in fluid communication with the anode chamber. | 05-15-2014 |
| 20140190835 | PLATING APPARATUS, NOZZLE-ANODE UNIT, METHOD OF MANUFACTURING PLATED MEMBER, AND FIXING APPARATUS FOR MEMBER TO BE PLATED - A plating apparatus includes a plating bath, an insoluble anode located in the plating bath, a plating electric power supply being capable of applying a voltage between the insoluble anode and the member to be plated, an anode-displacement mechanism being capable of moving the insoluble anode in the plating bath and of holding the insoluble anode at a predetermined position in the plating bath, and a controller having an anode-position controller being capable of generating a control signal for controlling an action of the anode-displacement mechanism and of outputting the control signal to the anode-displacement mechanism. | 07-10-2014 |
| 20140246326 | Method Of Electrolytic Deposition Of Arsenic From Industrial Electrolytes Including Waste Electrolytes Used In Electrorefining Of Copper After Prior Decopperisation Of Electrolyte - The subject of the present invention is a method of the electrolytic isolation of arsenic from industrial electrolytes including waste electrolytes used in the electrorafination of copper after its prior decopperisation. | 09-04-2014 |
| 20150014176 | WAFER PROCESSING APPARATUS HAVING SCROLL PUMP - A wafer processing apparatus is disclosed that includes a wafer support and a processing base. The wafer support is configured to support a wafer at a processing position with respect to a processing base. The processing base includes a scroll pump oriented to pump a processing fluid in a substantially perpendicular direction with respect to the surface of the wafer when the wafer contacts the processing fluid while in the processing position. While in contact with the processing fluid, the wafer support may rotate the wafer in the processing fluid. In one embodiment, the diameter of the scroll pump is substantially the same as or greater than the diameter of the surface of the wafer being processed. | 01-15-2015 |
| 20150041329 | NICKEL DIRECT-PLATING - A method of depositing nickel on a surface of an object, the method including the steps of providing a source of direct current having a positive and a negative terminal; connecting the object to the negative terminal; connecting an anode to the positive terminal; and submerging the object and anode in a solution comprising nickel. The anode is positioned at a distance equal to or less than 2 mm from the surface of the object and when the source of direct current is switched on, nickel in the solution comprising nickel is deposited on the surface of the object. | 02-12-2015 |
| 20150299865 | METAL TREATMENT - Metal objects are treated by anodising (P, SE) the metal object in contact with an acidic solution, and then subjecting the anodised metal object to a reversed voltage (VR). The anodising is performed in two stages, firstly to passivate (P) with the formation of a surface layer, and secondly to form pits in this surface layer (SE). The second stage (SE) of anodising is performed at a lower voltage than the first stage (P). After the reversed voltage step (VR) the metal object is then contacted with a biocidal metal-containing solution. Biocidal metal is absorbed into the surface of the metal object, resulting in improved biocidal properties. The lower voltage of the second stage anodising (SE) results in reduced processing time. | 10-22-2015 |
