| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 205147000 | Applying current to substrate without mechanical contact (e.g., liquid contact, bipolar electrode, etc.) | 8 |
| 20080223725 | Process chamber component having electroplated yttrium containing coating - A component capable of being exposed to a plasma in a process chamber has a structure having an electroplated coating comprising yttrium-containing species. The electroplated coating can include zirconium oxide, or can have an oxide layer thereon. In another embodiment the electroplated coating comprises a first species and is coated with a second electroplated coating comprising a second species that is different from the first species. The electroplated coating is resistant to corrosion in the plasma. In another embodiment, the electroplated coating has an interface having a thickness with a first concentration gradient of an yttrium-containing species and a second concentration gradient of a second species. An electroplated coating having a layer comprising first and second concentration gradients of first and second metals can be formed by varying the concentration of the first and second metal electrolyte species in the electroplating bath to electroplate the coating. | 09-18-2008 |
| 20080277286 | Method and apparatus for racking articles for surface treatment - A process employing a rack having an article carrier that is movably supported on a frame and mechanically coupled for translating movement from a motor to the article carrier to effect movement of an article during processing to provide more uniform surface treatment, reducing or eliminating the need for shielding. | 11-13-2008 |
| 20090127121 | METHOD AND APPARATUS FOR ELECTROPLATING ON SOI AND BULK SEMICONDUCTOR WAFERS - An electroplating apparatus and method for depositing a metallic layer on the surface of a wafer is provided wherein said apparatus and method do not require physical attachment of an electrode to the wafer. The surface of the wafer to be plated is positioned to face the anode and a plating fluid is provided between the wafer and the electrodes to create localized metallic plating. The wafer may be positioned to physically separate and lie between the anode and cathode so that one side of the wafer facing the anode contains a catholyte solution and the other side of the wafer facing the cathode contains an anolyte solution. Alternatively, the anode and cathode may exist on the same side of the wafer in the same plating fluid. In one example, the anode and cathode are separated by a semi permeable membrane. | 05-21-2009 |
| 20100018865 | ELECTROLYTE SOLUTION AND METHOD FOR ELECTROLYTIC CO-DEPOSITION OF THIN FILM CALCIUM PHOSPHATE AND DRUG COMPOSITES - Disclosed herein are electrolyte solutions and methods for electrolytic co-deposition of calcium phosphate and drug composites. The electrolyte solution may be formed by mixing solutions comprising calcium and phosphate precursors together to form an electrolyte solution. The electrolyte solution can have a water content less than 30 weight percent. The electrolyte solution may comprise a water-soluble non-aqueous solvent. A therapeutic agent, such as water-insoluble drug, is also present in the solution. The electrolyte solution thus formed may be used to co-deposit a calcium phosphate coating and the therapeutic agent on a substrate. One method includes the steps of immersing the substrate in the electrolyte solution and applying an electrical potential to the substrate to thereby cause (i) the calcium and phosphate precursors to electrochemically react with hydroxyl groups on the surface of the substrate and deposit the calcium phosphate coating thereon; and (ii) the therapeutic agent to electrophoretically migrate to the substrate and become co-deposited thereon together with the calcium phosphate coating. The method thus provides a convenient and easily controllable means for depositing thin film calcium phosphate and drug composites on substrates such as implantable medical devices. | 01-28-2010 |
| 20100108527 | DRUM AND METHOD FOR COATING WORKPIECES WITH A NON-METALLIC COATING - The invention relates to a drum which has a wall, wherein at least the inside of the wall is provided with a surface of insulating material, an opening, defined by wall segments of the wall, radially spaced from one another with respect to a central rotational axis of the drum, and a drive mechanism for rotating the drum in a first or in a second direction, wherein at least one first electrode is arranged on the inside of the wall, and wherein at least one counter electrode is arranged on or between a central axis of the drum and the wall, and a method for coating workpieces. | 05-06-2010 |
| 20100213071 | Treatment Of An Osteointegrative Interface - A method for the biomimetic treatment of an osteointegrative interface on a substrate of biocompatible metal of titanium, tantalum, or their alloys, includes performing a first ASD anodic deposition treatment of the osteointegrative interface in a calcium glycerophosphate solution, performing a second ASD anodic deposition treatment of the osteointegrative interface in a calcium hydroxide solution and performing an immersion of the osteointegrative interface in a potassium or sodium hydroxide solution. | 08-26-2010 |
| 20110036722 | SEMICONDUCTOR WAFER HOLDER AND ELECTROPLATING SYSTEM FOR PLATING A SEMICONDUCTOR WAFER - A semiconductor wafer holder includes first and second holding members between which a semiconductor wafer is held. The second holding member includes a second conductive element placed in contact with a first conductive element of the first holding member and the semiconductor wafer. A ring clamp is used to press the second holding member against the first holding member for holding of the semiconductor wafer. | 02-17-2011 |
| 20110048955 | ELECTRODEPOSITION OF PLATINUM/IRIDIUM (PT/IR) ON PT MICROELECTRODES WITH IMPROVED CHARGE INJECTION PROPERTIES - Aspects of the present disclosure are directed to electrochemical approaches for synthesis of platinum-iridium alloys with selected platinum-iridium ratio content and subsequently predetermined mechanical properties and electrochemical impedance properties. Such can provide a simple and cost-effective process for preparing these electrodes, as compared to conventional thin film processing techniques. A three-electrode electrochemical electrodeposition system is described including an electrochemical cell with a working electrode on which the electrodeposited film is deposited, a counter electrode to complete the electrochemical circuit and a reference electrode to measure and control surface potential. Mixed layers of platinum atoms and iridium atoms can be deposited from electrolyte solution onto the working electrode surface to create an electrically conductive surface with material properties related to the composition of the as-deposited film. The mechanical properties and electrochemical properties of the film can be tuned by adjusting the electrodeposition parameters. | 03-03-2011 |
