| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 205137000 | Coating moving substrate | 50 |
| 20080296166 | PROXIMITY PROCESSING USING CONTROLLED BATCH VOLUME WITH AN INTEGRATED PROXIMTIY HEAD - A plating assembly for use in plating metallic materials onto a surface of a substrate is provided. The plating assembly comprising a delivery unit having a fluid chamber, a metallic source, and a porous insert. The plating assembly also comprising a receiving unit having a fluid chamber and a metallic receiver. The receiving unit also has a porous insert. The porous insert of the delivery unit being substantially aligned with, and spaced apart from, the porous insert of the receiving unit. The metallic receiver being substantially aligned with the porous insert of the delivery unit and a path being defined between the delivery unit and the receiving unit. Wherein a plating meniscus is capable of being defined in the path between the porous inserts of the delivery unit and the receiving unit and a substrate is capable of being moved through the plating meniscus to enable the plating of metallic materials onto the surface of the substrate. Examples for de-plating are also provided. | 12-04-2008 |
| 20090101511 | ELECTROPLATING DEVICE AND METHOD - The invention relates to a device for the electrolytic coating of at least one electrically conductive substrate ( | 04-23-2009 |
| 20090107847 | PLATING APPARATUS, PLATING METHOD AND MULTILAYER PRINTED CIRCUIT BOARD - A plating method includes providing an article in a plating bath, covering a surface of the article with an insulating member in the plating bath, and electrolytically plating the article while moving one of the insulating member and the article relative to each other. | 04-30-2009 |
| 20100170802 | POWER FEEDING METHOD, CONTINUOUS ELECTROLYTIC PLATING APPARATUS FOR WEB AND METHOD FOR MANUFACTURING PLASTIC FILM WITH PLATED COATING FILM - Two rotating members placed to face each other and nipping a web such that only an end of the web provided with conductivity is pressed are provided, at least one of the rotating members serves as a feeding electrode, and these rotating members are rotated about the same velocity, to a transportation velocity of the web. | 07-08-2010 |
| 20100200413 | SOLUTION DEPOSITION METHOD AND APPARATUS WITH PARTIPHOBIC SUBSTRATE ORIENTATION - A metal and oxygen material such as a transparent electrically conductive oxide material is electro deposited onto a substrate in a solution deposition process. Process parameters are controlled so as to result in the deposition of a high quality layer of material which is suitable for use in a back reflector structure of a high efficiency photovoltaic device. The deposition may be carried out in conjunction with a masking member which operates to restrict the deposition of the metal and oxygen material to specific portions of the substrate. In particular instances the deposition may be implemented in a continuous, roll-to-roll process. Further disclosed are semiconductor devices and components of semiconductor devices made by the present process, as well as apparatus for carrying out the process. | 08-12-2010 |
| 20100258444 | APPARATUS AND METHODS FOR CHEMICAL ELECTRODEPOSITION ON A SUBSTRATE FOR SOLAR CELL FABRICATION - The invention relates generally to electrodeposition apparatus and methods. The invention finds particular use in fabricating thin film solar cells. Electrodeposition is improved by using a continuous thin film flow of electrodeposition solution between a substrate and a counter electrode, positioned in close proximity to each other, while the plating current is applied. Apparatus for carrying out methods described herein are highlighted particularly by flow manifolds that allow electrodeposition in the manner described. | 10-14-2010 |
| 20110017605 | PROXIMITY PROCESSING USING CONTROLLED BATCH VOLUME WITH AN INTEGRATED PROXIMITY HEAD - Methods for plating substrates are herein defined. One method includes providing a plating assembly having a plating source in a plating fluid and a plating facilitator in the plating fluid, and defining a plating meniscus between the plating source and the plating facilitator. The plating meniscus being contained in a path of the plating assembly. The method further includes traversing a substrate through the path of the plating assembly. The substrate being charged so that plating ions are attracted to a surface of the substrate when the plating meniscus is present on the surface of the substrate, wherein the substrate traversing through the path of the plating assembly enables plating across the surface of the substrate. And, inducing a uniform charge in the path where the plating meniscus is formed, such that charge from the plating source is substantially uniformly directed toward the plating facilitator as the substrate that is charged moves through the path of the plating assembly. | 01-27-2011 |
| 20110073483 | APPARATUS AND METHOD FOR IMPROVING UNIFORMITY IN ELECTROPLATING - A method and apparatus for plating a metal onto a substrate. One embodiment of the present invention provides an apparatus for electroplating a substrate. The apparatus comprises a fluid basin, an anode disposed near a bottom of the fluid basin, a restrictor disposed above the anode, and a substrate support member configured to move the substrate within the fluid basin among different elevations relative to the restrictor. Plating profiles on the substrate may be adjusted by changing the elevation of the substrate during plating. | 03-31-2011 |
| 20110259751 | METHOD AND DEVICE FOR CONTROLLING UPLINK POWER - The present invention provides a method for producing solar cells, comprising the steps of—providing silicon containing vitreous substrates, each provided with an electrically conductive material on at least one side thereof, —successively transporting at least a portion of each substrate through an electrolytic solution that is present in an electrolytic bath, —connecting said electrically conductive material as the cathode during the transport of the substrates through the electrolytic bath for the purpose of electrodepositing material from the electrolytic solution onto the electrically conductive material during said transport, wherein the substrates are suspended from a conveyor element during transport and extend in the transport direction. The invention further provides a device for producing solar cells. | 10-27-2011 |
| 20120061244 | METHOD AND DEVICE FOR THE CONTROLLED ELECTROLYTIC TREATMENT OF THIN LAYERS - An electric contact in the outer edge thereof, is used for electroplating substrates, e.g. as a wafer in a cup plater. In order to obtain an even electroplating result, at least two electrolytic partial cells are formed which are supplied with current by respective electroplating current sources ( | 03-15-2012 |
| 20120298518 | ELECTROPLATING APPARATUS AND METHOD - Provided is an electroplating apparatus including: a copper electrode plate that is disposed with a gap from an upper surface of an insulating substrate on which seed electrodes are formed; a driving unit that makes the copper electrode plate move along a rectilinear line; a power supply that applies electric current between the copper electrode plate and each of the seed electrodes; and spacers that are provided on the lower surface of the copper electrode plate to thereby make an electrolyte stay by surface tension between the copper electrode plate and the insulating substrate, and that maintains the gap between the copper electrode plate and the insulating substrate so that the electrolyte may move together with the copper electrode plate. Accordingly, a uniform copper film can be formed on the surface of a large substrate. | 11-29-2012 |
| 20140262802 | Metal Deposition Process Using Electroplasma - A process for treating a surface of an electrically conductive workpiece is provided, comprising placing a movable workpiece within a reaction chamber, wherein the reaction chamber includes an anode, and wherein the workpiece is a cathode; creating a gap between the anode and the cathode, wherein the anode includes a plurality of orifices; applying an aqueous electrolyte into the reaction chamber through the orifices in the anode and onto the workpiece, and applying the aqueous electrolyte from below the workpiece, to establish an electrically conductive medium around the workpiece, applying a DC voltage to the electrically conductive medium in excess of 30 VDC, such that a foam is formed within the reaction chamber, wherein the foam comprises a gas/vapor phase and a liquid phase which fills the entire reaction chamber; adjusting the voltage to establish an electro-plasma discharge between the anode and workpiece, sufficient to cause positive ions in the electrically conductive medium to become concentrated near the surface of the workpiece and cause micro-zonal melting of the surface in the area of discreet plasma bubbles; and moving the workpiece through the reaction chamber and away from the electrically conductive medium to allow re-freezing of the molten surface of the workpiece. The process applies to both cleaning and coating of the workpiece, wherein coating is achieved via sacrificial anodes. | 09-18-2014 |
| 20160194776 | DEVICE FOR VERTICAL GALVANIC METAL DEPOSITION ON A SUBSTRATE | 07-07-2016 |
| 205138000 | Indeterminate length (e.g., strip, wire, fiber, etc.) | 12 |
| 20090277796 | APPARATUS AND METHOD FOR ELECTROPLATING A SUBSTRATE IN A CONTINUOUS WAY - The invention relates to an apparatus and to a method for depositing a metal coating on an electrically conductive substrate in a continuous way. The apparatus comprises at least one plating vessel for receiving an electrolyte solution; at least one plating unit, and means to pass said substrate through said at least one plating vessel. The plating unit comprises—a first zone comprising at least one first electrode (anode) said first electrode being connected to a positive pole of a power supply; —a second zone comprising at least one second electrode (cathode) said second electrode being connected to a negative pole of a power supply; —an intermediate zone between said first zone and said second zone, said intermediate zone separating said first zone from said second by a predetermined distance being larger than zero. The substrate is functioning as a cathode having a current density Jc when the substrate is facing the first electrode, whereas the substrate is functioning as an anode having a current density Ja when the substrate is facing the second electrode. | 11-12-2009 |
| 20100025254 | INSOLUBLE ANODE FOR METAL WIRE ELECTROPLATING AND METHOD OF ELECTROPLATING METAL WIRE USING THE SAME - To provide an insoluble anode for metal wire electroplating capable of simultaneously electroplating a plurality of metal wires and uniformalizing the electroplating amounts of the metal wires stably for a long time. For realizing these, a plurality of insoluble electrode plates | 02-04-2010 |
| 20100032307 | DEVICE FOR TREATING A BAND-SHAPED SUBSTRATE WITH A LIQUID - A device for treating a band-shaped substrate with a liquid, including: a conveying system including a winding system guiding the band-shaped substrate in a spiral path around the winding system with at least one winding; a first pulley rotatable about a first axis of rotation guiding the at least one winding of the band-shaped substrate through a first angle of deflection around part of the circumference of the first pulley, and a second pulley guiding the at least one winding of the band-shaped substrate through a second angle of deflection around part of the circumference of the second pulley, which is rotatable about a second axis of rotation, for each winding; and a bath of the liquid. The band-shaped substrate extends through the liquid over at least part of the length of the at least one winding. The second axis of rotation of each second pulley makes an angle alpha with the first axis of rotation. | 02-11-2010 |
| 20100078330 | APPARATUS AND METHOD FOR MANUFACTURING PLATED FILM - A conductive surface | 04-01-2010 |
| 20110147221 | PLATING APPARATUS AND METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD - A plating apparatus includes a plating tank. The plating tank contains a plating solution. A long-sized substrate is transported by transport rollers to pass through inside of the plating tank. Three or more bar-shaped anodes are provided in the plating tank to line up along the long-sized substrate. A surface area of each of the anodes arranged at both ends is smaller than a surface area of another anode. | 06-23-2011 |
| 20120061245 | METHOD AND DEVICE FOR THE ELECTROLYTIC TREATMENT OF HIGH-RESISTANCE LAYERS - A method and a device for electroplating and electrolytically etching plate-shaped or strip-shaped material in continuous installations or bath installations having rotating transport and contact structures along the conveyor belt. The current is fed to the material in the center, i.e. in the useful zone, thereby obtaining a layer thickness distribution which is at least as good as when the current is supplied from both edges. The invention further allows material of any formats of width and different contours to be electrolytically treated in any order. | 03-15-2012 |
| 20120073977 | PLATING APPARATUS AND PLATING METHOD - A method for plating a belt substrate including conveying a belt substrate through a plating tank, contacting an immersed cathode power-supply device and/or an auxiliary cathode power-supply device with the belt substrate conveyed into the interior of the plating tank such that the belt substrate becomes a cathode, and electrically plating a surface of the belt substrate in the interior of the plating tank while the immersed cathode power-supply device and/or the auxiliary cathode power-supply device maintains cathode power-supply to the belt substrate conveyed into the interior portion of the plating tank. The immersed cathode power-supply device and the auxiliary cathode power-supply device are positioned in the interior portion of the plating tank and are electrically connected by a short circuit wiring. | 03-29-2012 |
| 20120111729 | CONTINUOUS ELECTROLYTIC SURFACE FINISHING OF BARS - An apparatus ( | 05-10-2012 |
| 20120261268 | POWER FEEDING METHOD, CONTINUOUS ELECTROLYTIC PLATING APPARATUS FOR WEB AND METHOD FOR MANUFACTURING PLASTIC FILM WITH PLATED COATING FILM - Two rotating members placed to face each other and nipping a web such that only an end of the web provided with conductivity is pressed are provided, at least one of the rotating members serves as a feeding electrode, and these rotating members are rotated about the same velocity to a transportation velocity of the web. | 10-18-2012 |
| 20130026045 | ANODIZING APPARATUS - An anodizing apparatus includes: a power supplying drum for supporting a strip of an anodizable metal or a composite conductive foil having an anodizable metal on one surface thereof in close contact, at least a portion of the power supplying drum supporting the strip being conductive; opposing electrodes facing the power supplying drum; an electrolysis tank filled with an electrolytic solution in which a portion of the power supplying drum that supports the strip and the opposing electrodes are immersed; non conductive protective members that overlap the transverse ends of the strip on the power supplying drum and portions of the power supplying drum that the strip is not in contact with to protect the overlapped portions from the electrolytic solution; and a drive section that causes the strip and the protective members to move together within the electrolytic solution, synchronized with the rotating speed of the power supply drum. | 01-31-2013 |
| 20150053567 | SYSTEM AND METHOD FOR ELECTROPOLISHING OR ELECTROPLATING CONVEYOR BELTS - An electropolishing or electroplating system and method for metal conveyor belts is described. As opposed to conventional polishing processes in which the product is guided around rollers which direct the product into and out of an electrolyte bath, embodiments of the present invention pass the product through a housing supplied with a continuous directional flow of electrolyte. Thus, the electroplating or electropolishing can be targeted to specific areas of the product, such as the edges and/or the center of a conveyor belt, and straight products can pass through the housing without deformation. | 02-26-2015 |
| 205139000 | Predominantly aluminum substrate | 1 |
| 20140097090 | ANODIZING DEVICE, CONTINUOUS ANODIZING DEVICE, AND FILM FORMING METHOD - An anodizing device has: a power supply drum that supports, in close contact therewith, a web consisting of an anodizable metal and has a part configured with a conductive material, to which the web is closely attached; a counter electrode provided facing the power supply drum; an electrolysis tank filled with an electrolyte, into which part of the power supply drum and the counter electrode are immersed; a protection member formed of a non-conductive material that protects the lateral direction end portions of the web supported by the power supply drum in close contact therewith and a portion of the power supply drum, to which the web is not closely attached, from the electrolyte; and a driver adapted to make the web and the protection member travel concurrently in the electrolyte in synchronization with the circumferential speed of the power supply drum. | 04-10-2014 |
| 205143000 | Rotary (e.g., barrel plating, etc.) | 19 |
| 20090032404 | PLATING APPARATUS AND PLATING METHOD - An apparatus that performs an electrolytic plating on a plating surface of a belt substrate is provided. The apparatus includes a plating tank, a conveyor device configured to carry a belt substrate through an interior of the plating tank, an immersed cathode power-supply section provided within the interior of the plating tank, an auxiliary cathode power-supply section provided within the interior of the plating tank, and short-circuit wiring configured to short-circuit the immersed cathode power-supply section to the auxiliary cathode power-supply section. A plating method for performing electrolytic plating on a plating surface of a belt substrate is provided. The method includes conveying the belt substrate through a plating tank, making the plating surface a cathode by contacting at least one of an immersed cathode power-supply section or an auxiliary cathode power-supply section with the belt substrate, and short-circuiting the immersed cathode power-supply section to the auxiliary cathode power-supply section. | 02-05-2009 |
| 20090095633 | COPPER PLATING METHOD AND APPARATUS FOR A GRAVURE CYLINDER - The present invention provides a copper plating method and apparatus for a gravure cylinder in which copper plating with more uniform thickness can be provided over a full length of a gravure cylinder without causing defects such as rashes and pits irrespective of a size of the gravure cylinder, concentration of a copper plating solution can be managed automatically, a consumption amount of an additive is reduced to make it possible to perform a plating treatment within a short period of time, a power supply cost is reduced, and handling is easy with excellent visibility. A gravure cylinder in a hollow cylindrical shape is held at both ends in a longitudinal direction. The gravure cylinder is accommodated in a plating bath filled with a copper plating solution. The gravure cylinder is energized so that the gravure cylinder functions as a cathode while being rotated at a predetermined speed. A pair of anode chambers in a long box shape, in which insoluble anodes are provided upright slidably to both sides of the gravure cylinder in the plating bath and energized so as to function as an anode, are brought close to both side surfaces of the gravure cylinder at a predetermined interval. Copper plating is provided on an outer peripheral surface of the gravure cylinder. | 04-16-2009 |
| 20090250352 | Methods for electroplating copper - Embodiments of the invention are directed to methods of electroplating copper onto at least one surface of a substrate in which more uniform electrical double layers are formed adjacent to the at least one surface being electroplated (i.e., the cathode) and an anode of an electrochemical cell, respectively. In one embodiment, the electroplated copper may be substantially-free of dendrites, exhibit a high-degree of (111) crystallographic texture, and/or be electroplated at a high-deposition rate (e.g., about 6 μm per minute or more) by electroplating the copper under conditions in which a ratio of a cathode current density at the at least one surface to an anode current density at an anode is at least about 20. In another embodiment, a porous anodic film may be formed on a consumable copper anode using a long conditioning process that promotes forming a more uniform electrical double layer adjacent to the anode. | 10-08-2009 |
| 20090283413 | ELECTROLYTIC PLATING METHOD AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD - A disclosed electrolytic plating method includes a first step of immersing a substrate in electrolytic plating liquid including copper salt to form a first Cu layer on the substrate; and a second step of forming a second Cu layer over the first Cu layer. The first step is continued for ten seconds or less after the immersion. In the first step, the substrate is rotated at a first speed N (rpm) which satisfies D×N×n≦6000×π (mm/min), where D is the diameter of the substrate (mm), and D×N×π represents the peripheral speed of the substrate, and a current is supplied to the substrate at a first density of 10 mA/cm | 11-19-2009 |
| 20100044238 | DEVICE AND A METHOD FOR APPLYING A COATING ON A WORKPIECE BY ELECTRODEPOSITION - The invention relates to a device and a method of applying a coating on a workpiece by electrodeposition. A vessel is provided that is suitable for filling with a bath of electrolyte, anode-forming conductor means being placed in the vessel and connected to a current generator, a cathode-forming workpiece mounted on the mandrel of a lathe, and guidance and movement means for guiding and moving the vessel relative to the lathe, the guidance and movement means enabling the workpiece to be immersed in full or in part in the bath of electrolyte. | 02-25-2010 |
| 20120000786 | CONTROL OF ELECTROLYTE HYDRODYNAMICS FOR EFFICIENT MASS TRANSFER DURING ELECTROPLATING - Described are apparatus and methods for electroplating one or more metals onto a substrate. Embodiments include electroplating apparatus configured for, and methods including, efficient mass transfer during plating so that highly uniform plating layers are obtained. In specific embodiments, the mass transfer is achieved using a combination of impinging flow and shear flow at the wafer surface. | 01-05-2012 |
| 20120199489 | METHOD FOR TREATING SURFACES OF HOLLOW PARTS, TANK FOR CARRYING OUT A METHOD OF THIS TYPE, INSTALLATION FOR CONTINUOUSLY TREATING SURFACES COMPRISING SUCH A TANK - The invention relates to a method for treating surfaces of hollow parts, this method being a conversion treatment such as an anodizing, and to a method according to which the hollow pieces are completely immersed inside at least one treatment tank containing a liquid, characterized in that each hollow piece is immersed while making it execute at least one rotational movement so that air bubbles likely to be created inside the tank are removed from the inner wall of the hollow part. | 08-09-2012 |
| 20120205249 | Aluminum or Aluminum Alloy Barrel Electroplating Method - To provide a barrel electroplating method which is less prone to bare spots and adhesion failure such as blisters and peeling, and which makes it possible to obtain uniform plated coatings free from burnt deposits and poor brightness, irrespective of the amount of workpieces. | 08-16-2012 |
| 20120273363 | ULTRASONIC TREATMENT METHOD AND APPARATUS - Improved methods and apparatus for cleaning substrates and enhancing diffusion limited reaction at substrate surfaces use piezoelectric transducers operating in the gigasonic domain. The resonator assemblies include plural transducer stacks each including a thin film piezoelectric element coupled to a resonator plate that faces the substrate. At the disclosed frequencies and powers used, Eckart or Rayleigh streaming can be induced in a liquid treatment medium without substantial generation of cavitation. | 11-01-2012 |
| 20130037413 | CLAM SHELL TWO-PIN WAFER HOLDER FOR METAL PLATING - A clam shell wafer holder includes a base and a lid pivotally connected with the base by an integral hinge. The base includes a rotatable wafer support, and the lid includes a universal frame and a pin holder attachment spaced inwardly from the frame. Only two contact pins are formed in a wafer-facing surface of the pin holder attachment. The contact pins are manually aligned with and contact two points on a wafer when the lid is closed against the base. A method for holding a wafer for plating is provided using the disclosed holder apparatus. | 02-14-2013 |
| 20130313123 | CROSS FLOW MANIFOLD FOR ELECTROPLATING APPARATUS - The embodiments herein relate to methods and apparatus for electroplating one or more materials onto a substrate. In many cases the material is a metal and the substrate is a semiconductor wafer, though the embodiments are no so limited. Typically, the embodiments herein utilize a channeled plate positioned near the substrate, creating a cross flow manifold defined on the bottom by the channeled plate, on the top by the substrate, and on the sides by a cross flow confinement ring. During plating, fluid enters the cross flow manifold both upward through the channels in the channeled plate, and laterally through a cross flow side inlet positioned on one side of the cross flow confinement ring. The flow paths combine in the cross flow manifold and exit at the cross flow exit, which is positioned opposite the cross flow inlet. These combined flow paths result in improved plating uniformity. | 11-28-2013 |
| 20140262803 | METAL PLATING SYSTEM INCLUDING GAS BUBBLE REMOVAL UNIT - An electroplating apparatus includes an anode configured to electrically communicate with an electrical voltage and an electrolyte solution. A cathode module includes a cathode that is configured to electrically communicate with a ground potential and the electrolyte solution. The cathode module further includes a wafer in electrical communication with the cathode. The wafer is configured to receive metal ions from the anode in response to current flowing through the anode via electrodeposition. The electroplating apparatus further includes at least one agitating device interposed between the wafer and the anode. The agitating device is configured to apply a force to gas bubbles adhering to a surface of the wafer facing the agitating device. | 09-18-2014 |
| 20140291159 | PARTIAL PLATING DEVICE AND PARTIAL PLATING METHOD - A partial plating device includes a drum jig which has a plurality of positioning pins provided on the outer peripheral surface thereof, and which feeds a metal member around the outer periphery thereof by engaging the metal member with the positioning pins; a rotating shaft which rotatably supports the drum jig, a jet unit that supplies plating liquid to the metal member, and a brake unit that reduces the circumferential speed of the drum jig, and which is fitted to the rotating shaft. A plating device and a partial plating method in which plating is not carried out on the first region of a metal member on the carrying-in side of the drum jig, but in which plating is carried out on the second region of a metal member on the carrying-out side. | 10-02-2014 |
| 20140299477 | CONTROL OF ELECTROLYTE HYDRODYNAMICS FOR EFFICIENT MASS TRANSFER DURING ELECTROPLATING - Described are apparatus and methods for electroplating one or more metals onto a substrate. Embodiments include electroplating apparatus configured for plating highly uniform metal layers. In specific embodiments, the apparatus includes a flow-shaping element made of an ionically resistive material and having a plurality of channels made through the flow shaping element. The channels allow for transport of the electrolyte through the flow shaping element during electroplating. The channel openings are arranged in a spiral-like pattern on the substrate-facing surface of the flow shaping element such that the center of the spiral-like pattern is offset from the center of the flow shaping element. | 10-09-2014 |
| 20140299478 | CONTROL OF ELECTROLYTE HYDRODYNAMICS FOR EFFICIENT MASS TRANSFER DURING ELECTROPLATING - Described are apparatus and methods for electroplating one or more metals onto a substrate. Embodiments include electroplating apparatus configured for plating highly uniform metal layers. In specific embodiments, the apparatus includes a flow-shaping element made of an ionically resistive material and having a plurality of channels made through the flow shaping element. The channels allow for transport of the electrolyte through the flow shaping element during electroplating. The channel openings are arranged in a spiral-like pattern on the substrate-facing surface of the flow shaping element such that the center of the spiral-like pattern is offset from the center of the flow shaping element. | 10-09-2014 |
| 20140326608 | ANISOTROPIC HIGH RESISTANCE IONIC CURRENT SOURCE (AHRICS) - An electroplating apparatus that promotes uniform electroplating on the substrates having thin seed layers includes a convex anisotropic high resistance ionic current source (AHRICS), such as an electrolyte-permeable resistive domed plate. The AHRICS is positioned in close proximity of the substrate, so that a distance from the central portion of the AHRICS to the substrate is smaller than the distance from the edge portion of the AHRICS to the substrate. The apparatus further includes a plating chamber configured to hold the electrolyte and an anode. The apparatus further includes a substrate holder configured to hold the substrate. In some embodiments, the apparatus further includes a secondary (thief) cathode configured to divert ionic current from the near-edge region of the substrate. | 11-06-2014 |
| 20150014175 | ELECTROPLATING APPARATUS HAVING SCROLL PUMP - An electroplating apparatus for plating a metal onto a surface of a wafer is disclosed. The apparatus comprises a wafer support configured to support a wafer and a processing base. The processing base has a scroll pump oriented to pump a plating solution in a substantially perpendicular direction with respect to the surface of the wafer. Further, the scroll pump includes a first scroll and a second scroll, at least one of which is configured as an anode. In one embodiment, the processing base includes an anolyte chamber including the scroll pump, a catholyte chamber, and a membrane separating the anolyte chamber from the catholyte chamber. | 01-15-2015 |
| 20160083861 | METHOD AND DEVICE FOR ELECTROPLATING IN CYLINDRICAL GEOMETRY - A method and device for electrodeposition in cylindrical geometry. A method for electrochemically depositing a thin layer on a flexible substrate, comprising: providing, in an electrolysis bath, a first closed cylinder in a second hollow cylinder, applying the flexible substrate to one of the surfaces chosen from the outer surface of the first cylinder and the inner surface of the second, the flexible substrate forming a first electrode, providing, in the electrolysis bath, a second electrode, and applying a potential difference between the first electrode and the second electrode in order to electrodeposit the thin layer on the flexible substrate. | 03-24-2016 |
| 20170236715 | ANISOTROPIC HIGH RESISTANCE IONIC CURRENT SOURCE (AHRICS) | 08-17-2017 |
| 205145000 | Simultaneous or sequential coating of a plurality of separate articles | 5 |
| 20120279867 | METHOD FOR PRODUCING METAL COATINGS ON PLASTICS MATERIAL PARTS - A method for producing a metal coating on a plastics material part includes connecting each of a plurality of plastics material parts to a flexible support via a respective connecting part so as to temporarily chain the plurality of plastics material parts together. Each connecting part is attached to a respective one of the plurality of plastics material parts on at least one side. An electrically conductive connection is provided between the flexible support and each of the plurality of plastics material parts via the respective connecting part so as to provide a current supply for producing a galvanic metal coating layer on a conductive layer of each of the plurality of plastics material parts. | 11-08-2012 |
| 20130168256 | SYSTEM AND METHOD FOR ELECTROPOLISHING OR ELECTROPLATING CONVEYOR BELTS - An electropolishing or electroplating system and method for metal conveyor belts is described. In some embodiments, the system has a metal conveyor belt held in constant tension; a tank for holding an electrolytic fluid, the tank having an interior space suitable to contain the fluid, a metal plate and the metal conveyor belt; and an electrical current supply. In an electropolishing application, the current passes from the metal conveyor belt, through the fluid and into the metal plate. In an electroplating application, the current passes from the metal plate, through the fluid and into the metal conveyor belt. | 07-04-2013 |
| 20140014523 | METHOD OF ANODIZING HOLLOW METALLIC BODIES - Cup-shaped workpieces are first each secured in a downwardly open position on respective fingers of a workpiece holder, and to holder is inverted such that the workpieces are open upward and the upwardly open workpieces are lowered into a body of anodizing liquid in a treatment bath until the workpieces are wholly immersed. The holder and the workpiece are then moved horizontally immersed in the body of anodizing liquid while passing electricity between the holder and a cathode immersed in the bath below the workpieces such that the liquid anodizes surfaces of the workpieces. Finally, the holder is raised out of the body of liquid with the workpieces open upward, and while the workpieces are still above the body of liquid, the holder and the workpieces are again inverted so that the workpieces are open downward and any treatment liquid in the workpieces drains downward back into the bath. | 01-16-2014 |
| 20140097091 | Design of 60x120 cm2 Prototype Electrodeposition Cell for Processing of Thin Film Solar Panels - Techniques for electrodeposition of thin film solar panels are provided. In one aspect, an electrodeposition apparatus is provided. The electrodeposition apparatus includes at least one electroplating cell; and a conveyor for moving panels over the electroplating cell, wherein the conveyor comprises at least one metal belted track over the electroplating cell surrounding a plurality of metal rollers. The electroplating cell can include an anode at a bottom of the electroplating cell; and a plurality of paddles at a top of the electroplating cell. A baffle may be located in between the anode and the paddles. An electroplating process is also provided. | 04-10-2014 |
| 20150008135 | METHODS FOR THE IMPLEMENTATION OF NANOCRYSTALLINE AND AMORPHOUS METALS AND ALLOYS AS COATINGS - Methods for the use of nanocrystalline or amorphous metals or alloys as coatings with industrial processes are provided. Three, specific, such methods have been detailed. One of the preferred embodiments provides a method for the high volume electrodeposition of many components with a nanocrystalline or amorphous metal or alloy, and the components produced thereby. Another preferred embodiment provides a method for application of a nanocrystalline or amorphous coatings in a continuous electrodeposition process and the product produced thereby. Another of the preferred embodiments of the present invention provides a method for reworking and/or rebuilding components and the components produced thereby. | 01-08-2015 |
| 205146000 | Reciprocating substrate | 1 |
| 20160068989 | AGITATOR - The present invention provides an agitator for agitating a liquid (e.g. an electrolyte solution) containing particles (e.g. abrasive particles) within a tank. The agitator comprises an agitator body having an upper surface and a lower surface with at least one aperture extending through the agitator body. There is a one-way valve for allowing liquid flow through at least one aperture from the upper surface to the lower surface and for blocking liquid flow through at least one aperture from the lower surface to the upper surface. | 03-10-2016 |
