| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 205136000 | Utilizing means other than mask | 13 |
| 20080237052 | Method for fabricating plated product - A bumper molding is fabricated by disposing segmented anodes | 10-02-2008 |
| 20080296165 | PLATING APPARATUS - A plating method and apparatus for a substrate fills a metal, e.g., copper, into a fine interconnection pattern formed in a semiconductor substrate. The apparatus has a substrate holding portion | 12-04-2008 |
| 20090134034 | PREVENTION OF SUBSTRATE EDGE PLATING IN A FOUNTAIN PLATING PROCESS - A plating apparatus and method for plating a surface of a substrate are described. Generally, the apparatus includes a double wall plating vessel having an inner cup and an outer cup peripherally surrounding and spaced apart from the inner cup. The inner cup has an inlet for receiving a plating solution and an outlet from which the plating solution overflows into a plenum defined between the inner and outer cups. | 05-28-2009 |
| 20120247967 | METAL PLATING METHOD AND APPARATUS - An apparatus and a method suited for metal plating aircraft engine components that allows the creation a local environment for plating by covering a localized area to be plated so that the localized area to be plated is sealed from remaining parts of the component, thereby eliminating the need for masking remaining parts of the component prior to plating. | 10-04-2012 |
| 20120318676 | METHOD OF ELECTROPLATING UNIFORM COPPER LAYERS - Electroplating methods provide substantially uniform deposits of copper on the edges and walls of through-holes of printed circuit boards. The electroplating methods provide copper deposits which have high throwing power. | 12-20-2012 |
| 20130026044 | CHEMICALLY AMPLIFIED POSITIVE RESIST COMPOSITION AND PATTERNING PROCESS - A chemically amplified positive resist composition is provided comprising an alkali-insoluble or substantially alkali-insoluble polymer having an acid labile group-protected acidic functional group, an alkyl vinyl ether polymer, a photoacid generator, and a benzotriazole compound in a solvent. The composition forms on a substrate a resist film of 5-100 μm thick which can be briefly developed to form a pattern at a high sensitivity and a high degree of removal or dissolution to bottom. | 01-31-2013 |
| 20140061055 | REMOVABLE ANODISING AGENT, IN PARTICULAR FOR LOCAL ANODIC OXIDATION OF METAL SURFACES - The invention relates to a removable anodising agent, in particular for local anodic oxidation of metal surfaces, and its use, and a method for anodic oxidation by means of an anodising agent according to the invention. | 03-06-2014 |
| 20140151237 | Methods of and Apparatus for Electrochemically Fabricating Structures Interlaced Layers or Via Selective Etching and Filling of Voids - Multi-layer structures are electrochemically fabricated by depositing a first material, selectively etching the first material (e.g. via a mask), depositing a second material to fill in the voids created by the etching, and then planarizing the depositions so as to bound the layer being created and thereafter adding additional layers to previously formed layers. The first and second depositions may be of the blanket or selective type. The repetition of the formation process for forming successive layers may be repeated with or without variations (e.g. variations in: patterns; numbers or existence of or parameters associated with depositions, etchings, and or planarization operations; the order of operations, or the materials deposited). Other embodiments form multi-layer structures using operations that interlace material deposited in association with some layers with material deposited in association with other layers. | 06-05-2014 |
| 20140231266 | METHODS OF FABRICATING ELECTRONIC AND MECHANICAL STRUCTURES - The present invention relates to the fabrication of complicated electronic and/or mechanical structures and devices and components using homogeneous or heterogeneous 3D additive build processes. In particular the invention relates to selective metallization processes including electroless and/or electrolytic metallization. | 08-21-2014 |
| 20150014174 | PERPENDICULAR WRITE HEAD WITH LAMINATED SIDE SHIELDS - A perpendicular write head, the write head having an air bearing surface, the write head including a magnetic write pole, wherein at the air bearing surface, the write pole has a trailing side, a leading side that is opposite the trailing side, and first and second sides; side gaps, wherein the side gaps are proximate the write pole along the first and second side edges; and side shields proximate the side gaps, wherein the side shields have gap facing surfaces and include at least one set of alternating layers of magnetic and non-magnetic materials, wherein only one kind of material makes up the gap facing surfaces at the air bearing surfaces. | 01-15-2015 |
| 20150021191 | PATTERN TRANSFER MOLD AND PATTERN FORMATION METHOD - According to one embodiment, a pattern transfer mold includes a base body, first and second stacked bodies, first and second electrodes. The base body includes a base unit including a first surface, a first protrusion provided on the first surface and having a first side surface, and a second protrusion provided on the first surface, separated from the first protrusion, and having a second side surface opposing the first side surface. The first stacked body is provided on the first side surface, and includes first conductive layers and a first insulating layer. The second stacked body is provided on the second side surface, separated from the first stacked body, and includes second conductive layers and a second insulating layer. The first electrode is electrically connected to at least one of the first conductive layers. The second electrode is electrically connected to at least one of the second conductive layers. | 01-22-2015 |
| 20150376809 | METHOD OF FORMING METALLIC PATTERN ON POLYMER SUBSTRATE - A method of forming a metallic pattern on a polymer substrate is provided. A mixture layer is formed on a polymer substrate surface. The mixture layer includes an active carrier medium and nanoparticles dispersed in the active carrier medium. A laser process is performed to treat a portion of the mixture layer to form a conductive pattern on the surface of the polymer substrate. A cleaning process is performed to remove an untreated portion of the mixture layer to expose the surface of the polymer substrate, while the conductive pattern is remained on the surface of the polymer substrate. Then, the conductive pattern on the polymer substrate is subjected to an electroplating process to form the metallic pattern over the conductive pattern on the polymer substrate. | 12-31-2015 |
| 20160090660 | METHOD FOR FOCUSED ELECTRIC-FIELD IMPRINTING FOR MICRON AND SUB-MICRON PATTERNS ON WAVY OR PLANAR SURFACES - Focused Electric Field Imprinting (FEFI) provides a focused electric field to guide an unplating operation and/or a plating operation to form very fine-pitched metal patterns on a substrate. The process is a variation of the electrochemical unplating process, wherein the process is modified for imprinting range of patterns of around 2000 microns to 20 microns or less in width, and from about 0.1 microns or less to 10 microns or more in depth. Some embodiments curve a proton-exchange membrane whose shape is varied using suction on a backing fluid through a support mask. Other embodiments use a curved electrode. Mask-membrane interaction parameters and process settings vary the feature size, which can generate sub-100-nm features. The feature-generation process is parallelized, and a stepped sequence of such FEFI operations, can generate sub-100-nm lines with sub-100-nm spacing. The described FEFI process is implemented on copper substrate, and also works well on other conductors. | 03-31-2016 |
