| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 205131000 | Internal coating (e.g., coating inside of cylinder, etc.) | 22 |
| 20090071837 | MASTER ELECTRODE AND METHOD OF FORMING IT - A system and method comprising a master electrode arranged on substrate, said master electrode comprising a pattern layer, least partly of an insulating material and having a first surface provided with a plurality of cavities in which a conducting material is arranged, said electrode conducting material being electrically connected to at least one electrode current supply contact; said substrate comprising a top surface in contact with or arranged adjacent said first surface and having conducting material and/or structures of a conducting material arranged thereon, said substrate conducting material being electrically connected to at least one current supply contact; whereby a plurality of electrochemical cells are formed delimited by said cavities, said substrate conducting material and said electrode conducting material, said cells comprising an electrolyte; herein an electrode resistance between said electrode conducting material and said electrode current supply contact and a substrate resistance between said substrate conducting material and said substrate current supply contact are adapted for providing a predetermined current density in each electrochemical cell. | 03-19-2009 |
| 20090139870 | Plating apparatus and plating method - A method can form a conductive structure, which is useful for three-dimensional packaging with via plugs, in a shorter time by shortening the conventional long plating time that is an impediment to the practical use of electroplating. The method includes forming a conductive film on an entire surface, including interior surfaces of via holes, of a substrate having the via holes formed in the surface; forming a resist pattern at a predetermined position on the conductive film; carrying out first electroplating under first plating conditions, using the conductive film as a feeding layer, thereby filling a first plated film into the via holes; and carrying out second electroplating under second plating conditions, using the conductive film and the first plated film as a feeding layer, thereby allowing a second plated film to grow on the conductive film and the first plated film, both exposed in the resist openings of the resist pattern. | 06-04-2009 |
| 20090255822 | ELECTRICAL DISCHARGE SURFACE TREATMENT METHOD AND DRESSING METHOD - To enable surface treatment of the inside of a part or the like and also simplify grinding work by equipment and a procedure that are simple in comparison with convention | 10-15-2009 |
| 20090301892 | PROCESS AND APPARATUS FOR PLATING ARTICLES - A process and apparatus utilizing at least one conformable anode ( | 12-10-2009 |
| 20090301893 | Methods and Apparatus for Forming Multi-Layer Structures Using Adhered Masks - Numerous electrochemical fabrication methods and apparatus are provided for producing multi-layer structures (e.g. having meso-scale or micro-scale features) from a plurality of layers of deposited materials using adhered masks (e.g. formed from liquid photoresist or dry film), where two or more materials may be provided per layer where at least one of the materials is a structural material and one or more of any other materials may be a sacrificial material which will be removed after formation of the structure. Materials may comprise conductive materials that are electrodeposited or deposited in an electroless manner. In some embodiments special care is undertaken to ensure alignment between patterns formed on successive layers. | 12-10-2009 |
| 20100243462 | Methods for Activating Openings for Jets Electroplating - One embodiment of the present invention one embodiment of the present invention is a method for electrofilling a metal or alloy inside at least one opening surrounded by a field on a front surface of a substrate, wherein at least one surface inside the at least one opening includes an exposed metallic surface, said method including steps of: (a) immersing the substrate in an activation or wetting solution; (b) applying ultrasonic or megasonic vibrations to the substrate; and, after commencing applying ultrasonic or megasonic vibrations to the substrate, (c) applying high pressure jets of an electrolyte to the substrate, said electrolyte includes metallic ions of said metal or alloy; and (d) applying an electroplating current to the substrate to electroplate said metal or alloy inside the at least one opening. | 09-30-2010 |
| 20100264036 | MICROSTRUCTURE - Disclosed is a microfine structure which can be used as an anisotropic conductive member. Also disclosed is a method for producing such a microfine structure. Specifically disclosed is a microfine structure which is composed of a base having penetrating micropores at a density of not less than 10,000,000 micropores/mm | 10-21-2010 |
| 20100264037 | Method for Electrochemical Fabrication - An electroplating method that includes: a) contacting a first substrate with a first article, which includes a substrate and a conformable mask disposed in a pattern on the substrate; b) electroplating a first metal from a source of metal ions onto the first substrate in a first pattern, the first pattern corresponding to the complement of the conformable mask pattern; and c) removing the first article from the first substrate, is disclosed. Electroplating articles and electroplating apparatus are also disclosed. | 10-21-2010 |
| 20110174629 | METHOD FOR FUNCTIONALISING THE WALL OF A PORE - The invention relates to a method for functionalising at least a portion of a wall of a pore of a carrier material, characterised in that it comprises: a) contacting the pore with a solution of electrically activated entities and positioning two electrodes in said solution in order to create inside the pore, and when an electric signal is applied between the two electrodes, a voltage drop capable of generating a localised deposit on said wall; and b) applying an electric signal between the two electrodes in order to activate the electrically activated entities and carry out said functionalisation function. | 07-21-2011 |
| 20110240481 | SEED LAYER DEPOSITION IN MICROSCALE FEATURES - A method and system for coating the interior surfaces of microscale hole features fabricated into the substantially planar surface of a work piece. The method comprises providing a work piece with a barrier metal coating that is substantially continuous and uniform both along the planar surface of the work piece and the inner surfaces of the microscale hole features wherein said barrier metal coating is applied by a substantially surface reaction limited process. The workpiece is provided with a coating, on the planar surface of the work piece, of a thick metal layer anchored to the barrier metal coat and disposed to provide substantially uniform electrical conduction capability to the microscale features located throughout and across the workpiece. An electrical contact path is provided to the electrically conductive coating at the perimeter of the work piece. The workpiece is immersed in a chemical bath, causing said chemical bath to fully contact the interior surfaces of the microscale hole features, said chemical bath containing metal ions suitable for electrodeposition. An electric potential is applied at the perimeter of the work piece to cause electrodeposition of metal ions onto all surfaces of the work piece including the interior surfaces of the microscale hole features to a predetermined finish coating in one step. | 10-06-2011 |
| 20120012465 | METHODS FOR FORMING BARRIER/SEED LAYERS FOR COPPER INTERCONNECT STRUCTURES - Methods for forming barrier/seed layers for interconnect structures are provided herein. In some embodiments, a method of processing a substrate having an opening formed in a first surface of the substrate, the opening having a sidewall and a bottom surface, the method may include forming a layer comprising manganese (Mn) and at least one of ruthenium (Ru) or cobalt (Co) on the sidewall and bottom surface of the opening; and depositing a conductive material on the layer to fill the opening. In some embodiments, one of ruthenium (Ru) or cobalt (Co) is deposited on the sidewall and bottom surface of the opening. The materials may be deposited by chemical vapor deposition (CVD) or by physical vapor deposition (PVD). | 01-19-2012 |
| 20120080318 | Forming Through-Substrate Vias by Electrofilling - A plurality of through holes in a workpiece are filled with a solid conductive material. The workpiece is immersed in an electroplating solution, with the through holes covered at one end by a portion of a conductive plating base. The electroplating solution is permitted to fill the through holes in the workpiece and contact the portion of the conductive plating base. A voltage applied to the conductive plating base enables an electroplating operation that deposits the solid conductive material on the portion of the conductive plating base to thereby fill the through holes with the solid conductive material. | 04-05-2012 |
| 20120145552 | ELECTROPLATING METHOD - An electroplating method includes: preparing a substrate having via holes formed in a surface; immersing the substrate in a pretreatment solution to carry out pretreatment of the substrate; immersing the substrate in a plating solution without applying a voltage between the substrate and an anode, thereby replacing the pretreatment solution in the via holes with the plating solution; carrying out first-step electroplating of the substrate while controlling the voltage, applied between the substrate and the anode, to be equal to or higher than a voltage which is necessary for an electric current, appropriate to fill a plated metal into the via holes, to flow stably between the substrate and the anode; and carrying outsecond-step electroplating of the substrate while controlling the electric current, flowing between the substrate and the anode, at an electric current appropriate to fill the plated metal into the via holes. | 06-14-2012 |
| 20120279866 | METHOD OF FORMING A MULTILAYER STRUCTURE - A multilayer structure is formed by electroetching or electroplating on a substrate. A seed layer is arranged on the substrate and a master electrode is applied thereto. The master electrode has a pattern layer forming multiple electrochemical cells with the substrate. A voltage is applied for etching the seed layer or applying a plating material to the seed layer. A dielectric material is arranged between the structures thus formed. The dielectric layer is planarized for uncovering the structure below and another structure layer is formed on top of the first. Alternatively, the dielectric layer is applied with a thickness two layers and the structure below is accessed by selective etching of the dielectric layer for selectively uncovering the top surface of the structure below. Multiple structure layer may also be formed in one step. | 11-08-2012 |
| 20130075268 | Methods of Forming Through-Substrate Vias - A method of forming through-substrate vias includes separately electrodepositing copper and at least one element other than copper to fill remaining volume of through-substrate via openings formed within a substrate. The electrodeposited copper and the at least one other element are annealed to form an alloy of the copper and the at least one other element which is used in forming conductive through-substrate via structures that include the alloy. | 03-28-2013 |
| 20140083860 | PLATING CATALYST AND METHOD - Stable zero-valent metal compositions and methods of making and using these compositions are provided. Such compositions are useful as catalysts for subsequent metallization of non-conductive substrates, and are particularly useful in the manufacture of electronic devices. | 03-27-2014 |
| 20140097089 | MICROCRYSTALLINE ANODIC COATINGS AND RELATED METHODS THEREFOR - Methods of preparing metal and metal alloys with partially microcrystalline anodic coatings are disclosed. Associated article therefrom are correspondingly disclosed. The partially microcrystalline anodic coatings exhibit steam, superheated steam, alkaline and acidic resistance. Partially microcrystalline anodic coating can be prepared by impregnation of micropores of a metal or metal substrate with metal precursor species, conversion of the metal precursor species into metal hydroxides, thermal treatment to dry out moisture and to promote phase transformation of the metal hydroxide product into metal oxides solids and bonding with metastable metal oxide substance in the pore structure of the metal or metal alloy substrate, and hydrothermal sealing to create sealed partially microcrystalline anodic coating. | 04-10-2014 |
| 20140138252 | Aqueous Acidic Bath for Electrolytic Deposition of Copper - The invention relates to an aqueous acidic bath for electrolytic deposition of copper, comprising, at least one source of copper ions, at least one acid, at least one brightener compound, and at least one leveler for copper-deposition, wherein at least one leveler is a ruthenium compound, and to a process for the electrolytic deposition of copper, in particular for filling a blind micro Vertical Interconnect Access (VIA), through hole VIA, trench and similar structures on printed circuit boards, chip carriers and semiconductor wafers. | 05-22-2014 |
| 20140262801 | METHOD OF FILLING THROUGH-HOLES - The methods inhibit or reduce dimpling and voids during copper electroplating of through-holes with flash copper layers in substrates such as printed circuit boards. An acid solution containing disulfide compounds is applied to the through-holes of the substrate followed by filling the through-holes with copper using an acid copper electroplating bath which includes additives such as brighteners and levelers. | 09-18-2014 |
| 20140299476 | ELECTROPLATING METHOD - An electroplating method is disclosed. The method includes preparing a substrate having via holes in a surface thereof, performing a pretreatment of the substrate surface by immersing the substrate in a pretreatment liquid containing a plating suppressor to adsorb the plating suppressor onto the substrate surface, immersing the pretreated substrate in a plating solution containing a plating suppressor and a plating accelerator to replace the pretreatment liquid, attached to the substrate surface including interior surfaces of the via holes, with the plating solution, and then electroplating the substrate surface to fill the via holes with metal. | 10-09-2014 |
| 20150068910 | APPARATUS AND METHOD FOR ANODIZING INNER SURFACE OF TUBE - Provided is an apparatus for anodizing an internal surface of a tube including an electrolyte container storing an electrolyte solution, a first solution conduit connected with the electrolyte container to receive the electrolyte solution, a first jig configured to fix one end of a targeted tube to a downstream end of the first solution conduit, a second solution conduit in which the other end of the targeted tube is connected to an upstream end to discharge the electrolyte solution flowing into the targeted tube, a second jig configured to fix the other end of the targeted tube to an upstream end of the second solution conduit, and a cathode rod inserted from the second jig and extended to the first jig through the inner portion of the targeted tube, in which, while the electrolyte solution passes through the inner portion of the targeted tube, a cathode is applied to the cathode rod and an anode is applied to the targeted tube to perform an anodizing process. | 03-12-2015 |
| 20170233886 | METHOD OF FILLING THROUGH-HOLES TO REDUCE VOIDS AND OTHER DEFECTS | 08-17-2017 |
