| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 205095000 | Coating has specified thickness variation | 15 |
| 20090038946 | METAL OXIDE FILM, LAMINATE, METAL MEMBER AND PROCESS FOR PRODUCING THE SAME - A metal oxide film suitable for protection of metals, composed mainly of aluminum. A metal oxide film includes a film of an oxide of a metal composed mainly of aluminum, having a thickness of 10 nm or greater, and exhibiting a moisture release rate from the film of 1E18 mol./cm | 02-12-2009 |
| 20100084277 | Composition for copper plating and associated methods - A composition for copper plating and associated methods, a method of forming a copper wiring including forming an insulation layer having a recessed portion on a substrate, and forming a copper layer on the insulation layer to fill the recessed portion by performing an electroplating process using a composition that includes an aqueous electrolyte solution containing a copper ion and at least one of a disulfide compound represented by Formula 1, a betaine compound represented by at least one of Formulae 3 and 4, and a triblock copolymer of polyethylene oxide-polypropylene oxide-polyethylene oxide (PEO-PPO-PEO) having a weight average molecular weight of about 2,500 to about 5,000 g/mol and an ethylene oxide content (EO %, w/w) of about 30% to about 60%. | 04-08-2010 |
| 20100089760 | FABRICATION OF TOPICAL STOPPER ON HEAD GASKET BY ACTIVE MATRIX ELECTROCHEMICAL DEPOSITION - A method for making a gasket ( | 04-15-2010 |
| 20110024300 | ELECTRO-DEPOSITION OF NANO-PATTERNS - The present disclosure generally relates to techniques for electro-depositing nano-patterns. More specifically, systems and methods for fabricating periodic structures in complex nano-patterns are described. An electrical signal may be applied to one or more electrodes that are positioned about a surface of a substrate. The periodicity of the deposited pattern may be influenced by one or more parameters associated with an applied electrical signal, including one or more of frequency, amplitude, period, duty cycle, etc. The weight of each deposited line on the substrate may be influenced by the described parameters, and the shape of the pattern may be influenced by the number, shape, and position of electrodes. | 02-03-2011 |
| 20110100826 | SUPERFILLING SECONDARY METALLIZATION PROCESS IN MEMS FABRICATION - Processes are provided herein for the fabrication of MEMS utilizing both a primary metal that is integrated into the final MEMS structure and a sacrificial secondary metal that provides structural support for the primary metal component during machining More specifically, techniques are disclosed to increase the rate of secondary metal deposition between primary metal features in order to prevent voiding in the sacrificial secondary metal and thus enhance structural support of the primary metal during machining. | 05-05-2011 |
| 20110186437 | Polymeric Electret Film and Method of Manufacturing the Same - Disclosed is a polymeric electret film as well as the method of manufacturing the same. The polymeric electret film comprises a polytetrafluoroethylene film and an electrode layer. The polytetrafluoroethylene film includes a porous layer, which has a porous structure. The porous structure has a pore diameter ranging between 0.01 μm and 5.0 μm and has a porosity ranging between 20% and 95%. The polytetrafluoroethylene film has a thickness ranging between 1 μm and 50 μm, and is preferably made of expanded porous polytetrafluoroethylene. The polymeric electret film has a surface potential ranging between 0.1 V and 1000 V. | 08-04-2011 |
| 20110203936 | POLYMER-BASED HIGH SURFACE AREA MULTI-LAYERED THREE-DIMENSIONAL STRUCTURES AND METHOD OF MAKING SAME - A method of forming three-dimensional structures includes forming a conductive layer on a substrate and patterning a resist layer over the conductive layer, the resist layer having contained therein a plurality of vias. An electrically conductive polymer is then electro-deposited in the vias. The electro-deposition operation is then stopped to form one or more of posts, posts having bulbous termini (i.e., mushrooms), or a layer atop the resist layer. The resist may be removed to yield the structure which may be further processed. For example, the structure may be pyrolyzed. In addition, biomolecules may also be adhered or otherwise affixed to the structure. | 08-25-2011 |
| 20120247965 | METHOD FOR PRODUCING LITHOGRAPHIC PRINTING PLATE ORIGINAL PLATE AND METHOD FOR ROUGHENING SURFACE OF ALUMINUM SUPPORT BODY - A method for producing a lithographic printing plate original plate, the method comprising an electrolytic surface-roughening treatment step to perform an electrolytic surface-roughening treatment of an aluminum support body, wherein, in the electrolytic surface-roughening treatment step, an electrolysis treatment is performed in an acidic solution having a dissolved oxygen concentration of 6.0 mg/l or less. | 10-04-2012 |
| 20130001088 | LEVELER COMPOUNDS - Leveling agents for metal plating baths are provided. Plating baths containing such leveling agents provide metal deposits having substantially level surfaces. Such leveling agents may be selected to selectively incorporate desired levels of impurities into the metal deposit. | 01-03-2013 |
| 20130020203 | COMPOSITION FOR METAL ELECTROPLATING COMPRISING LEVELING AGENT - A composition comprising a source of metal ions and at least one additive comprising a polyalkyleneimine backbone, said polyalkyleneimine backbone having a molecular weight Mw of from 300 g/mol to 1000000 g/mol, wherein the N hydrogen atoms in the backbone are substituted by a polyoxyalkylene radical and wherein the average number of oxyalkylene units in said polyoxyalkylene radical is from 1.5 to 10 per N—H unit. | 01-24-2013 |
| 20130161196 | CYLINDER PLATING METHOD AND DEVICE - Provided are a plating method and a plating apparatus for a cylinder, which are capable of forming a plating layer having a uniform thickness in a technology of plating a cylinder, effectively preventing current concentration in cylinder end portions when being combined with a plating technology using divided insoluble electrodes, and performing plating with a more uniform thickness over the full length of a cylinder without generating defects such as rashes and pits irrespective of the size of the cylinder. The insoluble electrode has a shape in which a lower part thereof is curved inward, and is capable of rotating about an upper end thereof. Further, a thickness of a plating layer on an outer peripheral surface of the cylinder is adjusted by controlling an interval of closeness to the cylinder. | 06-27-2013 |
| 20130334051 | Novel Plating Method - An electroplating method is disclosed that selectively deposits a greater thickness of a metal or alloy layer on a region of wafer that has a higher thickness loss during a subsequent chemical mechanical polish process. A paddle assembly has three rectangular sides joined at their edges to form a triangle shape from an end view, and a notch in a bottom side that faces a wafer during the plating process. The notch extends along second and third paddle sides to a height up to about 50% of the paddle thickness. The thickness in a K-block region that has two sides formed parallel to the wafer flat is selectively increased by aligning a first side of the paddle notch side directly over one K-block side and aligning a second notch side directly over a second K-block side during a paddle movement cycle. The notch may be rectangular shaped or tapered. | 12-19-2013 |
| 20140174937 | COPPER ELECTROPLATING SOLUTION AND METHOD OF COPPER ELECTROPLATING - A copper plating solution which contains compounds with the structure —X—S—Y— where X and Y are, independently of each other, atoms selected from a group consisting of hydrogen, carbon, sulfur, nitrogen, and oxygen, and X and Y can be the same only if they are carbon atoms and aliphatic semialdehydes. By using this copper electroplating solution it is possible to form good filled vias without worsening the appearance of the plating. | 06-26-2014 |
| 20140262797 | Electro Chemical Plating Process - The present disclosure relates to an electro-chemical plating (ECP) process which utilizes a dummy electrode as a cathode to perform plating for sustained idle times to mitigate additive dissociation. The dummy electrode also allows for localized plating function to improve product gapfill, and decrease wafer non-uniformity. A wide range of electroplating recipes may be applied with this strategy, comprising current plating up to approximately 200 Amps, localized plating with a resolution of approximately 1 mm, and reverse plating to remove material from the dummy electrode accumulated during the dummy plating process and replenish ionic material within the electroplating solution. | 09-18-2014 |
| 20150361574 | Lighting Tiles - We describe a lighting tile having a substrate bearing an electrode structure, the electrode structure comprising: a plurality of electrically conductive tracks disposed over said substrate; and an electrical connection region connecting to said plurality of tracks; wherein the height of said tracks tapers away from said connection region to compensate for a reduction in luminance from said lighting tile array from the electrical connection region which arises from a non-uniform voltage drop which appears along the tracks in use. Advantageously the tracks are fabricated by electroplating: then, as the rate of deposition is determined by the voltage drop along a track during plating, the height of the deposited tracks, and therefore their resistance, will match the profile required in operation to compensate for the reduction in luminance which would otherwise occur. | 12-17-2015 |
