Class / Patent application number | Description | Number of patent applications / Date published |
205093000 | Contacting coating as it forms with solid member or material other than electrode | 9 |
20080217182 | ELECTROPLATING PROCESS - This invention provides processes for selectively electroplating metal layers into recessed topographic features on the surface of a conductive substrate. The processes are useful for fabricating metal circuit patterns, for example for creating copper interconnects between integrated circuit elements embedded in a thin layer of dielectric material on the surface of a semiconductor wafer. | 09-11-2008 |
20100084276 | Devices and Methods for Target Molecule Characterization - The present invention provides a device having at least one constriction that is sized to permit translocation of only a single copy of the molecule. The device has a pair of spaced apart sensing electrodes that border the constriction, which may be a nanopore. The first electrode is connected to a first affinity element and the second electrode is connected to a second affinity element. The first and second affinity elements are configured to temporarily form hydrogen bonds with first and second portions of the target molecule as the latter passes through the constriction. | 04-08-2010 |
20100193364 | METHOD AND APPARATUS FOR WORKPIECE SURFACE MODIFICATION FOR SELECTIVE MATERIAL DEPOSITION - In some embodiments, a workpiece-surface-influencing device preferentially contacts the top surface of the workpiece, to chemically modify the surface at desired field areas of the workpiece without affecting the surfaces of cavities or recesses in the field areas. The device includes a substance which is chemically reactive with material forming the workpiece surface. The substance can be in the form of a thin film or coating which contacts the surface of the workpiece to chemically modify that surface. The workpiece-surface-influencing device can be in the form of a solid state applicator such as a roller or a semi-permeable membrane. In some other embodiments, the cavities are filled with material that prevents surface modification of the cavity surfaces while allowing modification of the field areas, or which encourages surface modification of the cavity surfaces while preventing modification of the field areas. The modified surface facilitates selective deposition of materials on the workpiece. | 08-05-2010 |
20110226626 | APPARATUS AND METHOD FOR TREATING SUBSTRATE - A substrate treating device may include a plating treatment portion configured to perform a plating process of a substrate, a wet treatment portion configured to perform a wet treating process of the substrate, the wet treatment portion being under the plating treatment portion, and a substrate support portion configured to support the substrate so that a plating surface of the substrate faces upward, the substrate support portion being further configured to move the substrate between the plating treatment portion and the wet treatment portion. | 09-22-2011 |
20160145747 | BRUSH PLATING REPAIR METHOD FOR PLATED POLYMERS - Methods for repairing plated metallic layers on plated polymeric parts are disclosed. First, a polymer is formed into an article of a desired shape or geometry. The outer surface of the article is prepared to receive a catalyst and then the outer surface is activated with the catalyst. A first metallic layer is then plated onto the outer surface to form a structure. Optional additional metallic layers may be applied. Then, a defect in a damaged metal layer is repaired by brush plating or brush electroplating. | 05-26-2016 |
20160177463 | Portable, Liquid Free, Electroless, Electrochemical Deposition of Metal on Conductive and Nonconductive Surfaces | 06-23-2016 |
20160177464 | FILM DEPOSITION DEVICE OF METAL FILM AND FILM DEPOSITION METHOD | 06-23-2016 |
20160194777 | FILM DEPOSITION DEVICE OF METAL FILM AND METAL FILM DEPOSITION METHOD | 07-07-2016 |
20160201210 | FILM FORMATION SYSTEM AND FILM FORMATION METHOD FOR FORMING METAL FILM | 07-14-2016 |