| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 205091000 | Utilizing electromagnetic wave energy during coating (e.g., visible light, etc.) | 24 |
| 20090057154 | APPARATUS AND METHOD FOR ELECTROCHEMICAL PROCESSING OF THIN FILMS ON RESISTIVE SUBSTRATES - An electrochemical process comprising: providing a 125 mm or larger semiconductor wafer in electrical contact with a conducting surface, wherein at least a portion of the semiconductor wafer is in contact with an electrolytic solution, said semiconductor wafer functioning as a first electrode; providing a second electrode in the electrolytic solution, the first and second electrode connected to opposite ends of an electric power source; and irradiating a surface of the semiconductor wafer with a light source as an electric current is applied across the first and the second electrodes. The invention is also directed to an apparatus including a light source and electrochemical components to conduct the electrochemical process. | 03-05-2009 |
| 20090078576 | Embedded Passive Device Structure And Manufacturing Method Thereof - Embedded passive device structure and its manufacturing method for mainly embedding the passive device structure in the printed circuit board are presented. In this structure, both the source electrode and the ground electrode of the passive device belong to the same level, and includes several source branches and several ground branches that are formed vertically on the inside of the dielectric layer of the circuit board which are connected, respectively, to avoid the conducting between the source electrode and the ground electrode during lamination. When it is in the form of the capacitor structure, through the use of the ultra-fine wiring technique, these source branches and ground branches are separated by a small gap between each other. Therefore, the side face area and quantities of the source branches and ground branches are both increased. | 03-26-2009 |
| 20090236229 | METHODS FOR PREPARING POLYMER COATINGS BY ELECTROCHEMICAL GRAFTING OF POLYMER BRUSHES, COMPOSITIONS PREPARED THEREBY AND COMPOSITIONS FOR PREPARING THE COATINGS - New methods for the grafting of complex polymer coatings onto conducting surfaces, new grafting compositions and new substrates with grafted coating of the grafting compositions are disclosed. The method offers a new and convenient approach for the preparation of polymer coatings by electrochemically grafting and reactive crosslinking, and/or graft polymerizing. | 09-24-2009 |
| 20100072070 | ELECTROLYTIC DEPOSITION DISPLAY APPARATUS AND DRIVE METHOD THEREOF - A plurality of pixels, each including first and second electrodes and an electrolytic solution, are arranged. When a voltage between the first and the second electrodes increases into a precipitation critical value or more, the precipitation of electroplating starts. When the voltage decreases into a value smaller than the deposition overvoltage value, the precipitation ends. A control unit controlling the voltage between the first and second electrodes repeats a subfield operation including a first operation of selectively supplying any of first, a second voltage and third voltages to the plurality of pixels, and a second operation of collectively supplying the second voltage value to the plurality of pixels after the first operation, at least two times or more, to control the gradation of each pixel based on a timing of supplying the third voltage. | 03-25-2010 |
| 20100224498 | METHOD FOR BORIDING OF COATINGS USING HIGH SPEED ELECTROLYTIC PROCESS - A method for producing a wear and corrosion resistant WC based material coated with one or more metals selected from group IVB, VB and VIB metals (according to CAS system) and Al is disclosed. The method comprises treating of said coated structure with electrochemical boriding treatment in an electrolyte which is substantially free of halogenated compounds wherein the electrolyte comprises alkali carbonates and boron sources and said electrolyte being heated during electrolysis under an induction heating regime having electromagnetic frequency ranging from 50 to 300 kHz during electrolysis. | 09-09-2010 |
| 20110011745 | METHOD FOR ELECTROCHEMICALLY DEPOSITING A METAL ELECTRODE OF A SOLAR CELL - A method for electrochemically depositing a metal electrode of a solar cell, comprising the steps of: making the surface of the solar cell having a cathode contact with an electrolyte solution, connecting an anode of the solar cell and a solid metal, illuminating the main light-receiving surface of the solar cell, wherein metal ions in the electrolyte solution accept electrons formed on the cathode surface of the solar cell so that a metal is formed and deposited on the cathode surface of the solar cell, meanwhile, the solid metal provides electrons to the anode of the solar cell so that the metal ions are formed and dissolved in the electrolyte solution. By using this method, a problem of a decreased cell efficiency due to a short circuit caused by the deposition of metal on the anode will be solved, meanwhile, a possibility of damaging the solar cell and depositing metal unevenly as a result of using any kind of plating fixtures is avoided, the electrochemical reaction rate is effectively controlled, an evenness of the deposition of metal is guaranteed, and the manufacture of a solar cell having a selective diffusion structure is promoted. | 01-20-2011 |
| 20110062028 | PROCESS AND APPARATUS FOR ELECTROPLATING SUBSTRATES - An apparatus for electroplating one or more surfaces ( | 03-17-2011 |
| 20110132764 | FORMATION OF A TRANSPARENT CONDUCTIVE OXIDE FILM FOR USE IN A PHOTOVOLTAIC STRUCTURE - A process for producing a photovoltaic structure that includes a thin coating film, generally made of a transparent conductive oxide, deposited on top of a sublayer having photovoltaic properties. The coating film is deposited electrochemically in an electrolysis bath and at least partly assisted by illumination coming from a light source. | 06-09-2011 |
| 20110253545 | METHOD OF DIRECT ELECTRODEPOSITION ON SEMICONDUCTORS - The present disclosure provides a method of electrodeposition of a metal or metal alloy on at least one surface of a semiconductor material. The method of the present invention provides full coverage of an electrodeposited metallic film on the at least one surface of the semiconductor material. The method of the present disclosure includes providing a semiconductor material. A metallic film is applied to at least one surface of the semiconductor material by an electrodeposition process. The electrodeposition process employed uses current waveforms that apply a low current density initially, and after a predetermined period of time, the current density is changed to a high current density. | 10-20-2011 |
| 20110278172 | ELECTRODEPOSITION UNDER ILLUMINATION WITHOUT ELECTRICAL CONTACTS - A method of forming patterned metallization by electrodeposition under illumination without external voltage supply on a photovoltaic structure or on n-type region of a transistor/junction. | 11-17-2011 |
| 20120000785 | DEVICE AND METHOD TO CONDUCT AN ELECTROCHEMICAL REACTION ON A SURFACE OF A SEMI-CONDUCTOR SUBSTRATE - The invention concerns a device to conduct an electrochemical reaction on the surface of a semiconductor substrate (S), characterized in that the device comprises: a container ( | 01-05-2012 |
| 20120285833 | PREPARATION METHOD FOR MOLECULAR RECOGNITION SENSOR BY ELECTRODEPOSITION - A preparation method for molecular recognition sensor by electrodeposition is provided. The preparation method is as following: forming molecularly imprinted polymeric micelles by self-assembly of ionic type photosensitive copolymers; forming a film on the surface of an electrode by electrodepositing the molecularly imprinted polymeric micelles at a constant potential; crosslinking the electrodeposited micellar film via ultraviolet light irradiation; extracting the template molecules from the crosslinked film to obtain electrode modified by the molecularly imprinted polymeric micellar film; and connecting the modified electrode with a sensor device and a computer to construct a molecular recognition sensing system capable of specifically detecting the template molecules. | 11-15-2012 |
| 20120292192 | WETTING WAVE FRONT CONTROL FOR REDUCED AIR ENTRAPMENT DURING WAFER ENTRY INTO ELECTROPLATING BATH - Methods described herein manage wafer entry into an electrolyte so that air entrapment due to initial impact of the wafer and/or wafer holder with the electrolyte is reduced and the wafer is moved in such a way that an electrolyte wetting wave front is maintained throughout immersion of the wafer also minimizing air entrapment. | 11-22-2012 |
| 20120318673 | APPARATUS AND METHOD FOR ELECTROCHEMICAL PROCESSING OF THIN FILMS ON RESISTIVE SUBSTRATES - An electrochemical process comprising: providing a 125 mm or larger semiconductor wafer in electrical contact with a conducting surface, wherein at least a portion of the semiconductor wafer is in contact with an electrolytic solution, said semiconductor wafer functioning as a first electrode; providing a second electrode in the electrolytic solution, the first and second electrode connected to opposite ends of an electric power source; and irradiating a surface of the semiconductor wafer with a light source as an electric current is applied across the first and the second electrodes. The invention is also directed to an apparatus including a light source and electrochemical components to conduct the electrochemical process. | 12-20-2012 |
| 20130233718 | MATERIAL SURFACE TREATMENT METHOD USING CONCURRENT ELECTRICAL AND PHOTONIC STIMULATION - A material surface treatment protocol (e.g., FIG. | 09-12-2013 |
| 20130240364 | COMPOSITE PHOTOANODES - The provided method includes photoelectrodeposition of an electrocatalyst onto a semiconductor to form a photoanode. The method yields composite photoanodes showing enhancement of photocurrent (water splitting rate) when incorporated into a photoelectrochemical cell for water electrolysis. | 09-19-2013 |
| 20130327649 | Biosensor and Method of Manufacturing Such a Biosensor - A method of manufacturing a biosensor having a microbeam linked to a support, at least one electrode a biological molecule A grafted onto the microbeam in a different zone from the zone where the electrode is embedded, and a mechanoelectrical transducer for converting variations of the mechanical properties of the microbeam into an electrical signal, when the biological molecule A is placed in contact with a biological molecule B to be detected and/or quantified. The method includes: formation of an electrode on fluoropolymer material sheet, passivation of the electrode(s), creation of the form of the biosensor in the sheet of polymer material and separation of this form from the sheet, functionalization either of a prefunctionalized zone or of a zone of the microbeam, this zone being different from the zone wherein the electrode is embedded, and grafting of a biological molecule A onto the functionalized zone. | 12-12-2013 |
| 20140110264 | LIGHT INDUCED NICKEL PLATING METHOD FOR P-TYPE SILICON AND N/P SOLAR CELL MATERIAL - A simple and fast light induced nickel plating method for p-type silicon wafer and n/p silicon solar cell material is revealed. When a n/p solar cell or p-Si semiconductor substrate, which is subjected to metallization with metal contact on the rear side, is immersed in a plating bath, metal ions are reduced on the front surface of semiconductor as soon as illumination starts on the front. The mechanism of nickel plating in this invention is nickel electroplating under the reduction reaction with the use of interfacial potential between the nickel plating bath and the metal surface. It does not need any surface catalytic processing and extra voltage. Instead, it can carry out the nickel deposition on the specific surface with a high nickel plating rate, a simple process and a low production cost. | 04-24-2014 |
| 20140174936 | PLATING OF COPPER ON SEMICONDUCTORS - Monovalent copper plating baths are used to metallize current tracks of the front side or emitter side of semiconductor wafers. Copper is selectively deposited on the current tracks by electrolytic plating or LIP. Additional metallization of the current tracks may be done using conventional metal plating baths. The metalized semiconductors may be used in the manufacture of photovoltaic devices. | 06-26-2014 |
| 20140209471 | FORMING AN OXIDE LAYER ON A FLAT CONDUCTIVE SURFACE - A method and apparatus for electrochemically forming an oxide layer on a flat conductive surface which involves positioning a working electrode bearing the flat conductive surface in opposed parallel spaced apart relation to a flat conductive surface of a counter electrode such that the flat conductive surface of the working electrode and the flat conductive surface of the counter electrode are generally opposed, horizontally oriented, and define a space therebetween. A volume of organic electrolyte solution containing chemicals for forming the oxide layer on the flat conductive surface of the working electrode is arranged to flood the flat conductive surface of the counter electrode surface and to occupy the space defined between the flat conductive surface of the working electrode and the flat conductive surface of the counter electrode such that at least the flat conductive surface of the counter electrode is in contact with the organic electrolyte solution and substantially only the flat conductive surface of the working electrode is in contact with the organic electrolyte solution. An electric current flows between substantially only the flat conductive surface of the counter electrode and substantially only the flat conductive surface of the working electrode, in the organic electrolyte solution, for a period of time and at a magnitude sufficient to cause the chemicals to form the oxide layer on the flat conductive surface of the working electrode. | 07-31-2014 |
| 20150144495 | METHODS AND MATERIALS FOR ELECTROPLATING ALUMINUM IN IONIC LIQUIDS - A method of depositing aluminum onto a substrate is disclosed. In this method, the substrate is disposed as cathode in an electrochemical cell with an anode and a liquid electrodeposition composition comprising an ionic liquid and a source of aluminum, and aluminum is electroplated onto the substrate. Residual water content in the electroplating bath is controlled by exposure to light in the presence of a photo-oxidation catalyst to decompose the water or species associated with water. | 05-28-2015 |
| 20160160364 | PHOTOCATALYTIC METAMATERIAL BASED ON PLASMONIC NEAR PERFECT OPTICAL ABSORBERS - The present disclosure provides a photocatalyst that can utilize plasmon resonance based, near-perfect optical absorption for performing and enhancing photocatalytic reactions. The photocatalyst comprises a substrate and a reflective layer adjacent to the substrate. The reflective layer is configured to reflect light. The photocatalyst further comprises a spacer layer adjacent to the reflective layer. The spacer layer is formed of a semiconductor material or insulator and is at least partially transparent to light. A nanocomposite layer adjacent to the spacer layer is formed of a particles embedded in a matrix. The matrix can comprise a semiconductor, insulator or in some cases metallic pores. The particles can be metallic. Upon exposure to light, the particles can absorb far field electromagnetic radiation and excite plasmon resonances that interact with the reflective layer to form electromagnetic resonances. | 06-09-2016 |
| 20220136122 | PLATED PRODUCT AND METHOD FOR PRODUCING SAME - There is provided an inexpensive plated product, which can prevent the increase of the contact resistance of a silver-plating film and the change of the color of the surface thereof after reflow-treating a plated product wherein the silver-plating film is formed on a portion of the surface thereof and wherein a tin-plating film is formed on a portion of the other portion of the surface thereof, and a method for producing the same. The plated product is produced by a method including the steps of: forming a nickel-plating film | 05-05-2022 |
| 205092000 | Energy produced by laser | 1 |
| 20110048954 | ENHANCED SOLDERABILITY USING A SUBSTANTIALLY PURE NICKEL LAYER DEPOSITED BY PHYSICAL VAPOR DEPOSITION - A first preferred method for increasing the solderability of a substrate comprising: preparing the substrate for nickel plating by cleaning and removal of surface contaminants; plating a first nickel film of the desired thickness directly onto the substrate; preparing the nickel film comprising thoroughly cleaning the surface; depositing a substantially pure nickel film directly on the first nickel film using a suitable PVD technique; and applying solder to the substantially pure nickel film. Another preferred method for increasing the solderability of a substrate comprising plating a first nickel layer directly onto the substrate by using an electrolytic or electroless nickel plating process; depositing a substantially pure nickel film directly on the first nickel film using physical vapor deposition; and applying solder to the substantially pure nickel film. | 03-03-2011 |
