| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 205088000 | Utilizing subatmospheric or superatmospheric pressure during coating | 6 |
| 20090078575 | METHOD FOR VACUUM-COMPRESSION MICRO PLASMA OXIDATION AND DEVICE FOR CARRYING OUT SAID METHOD - The inventive method and device for vacuum-compression micro plasma oxidation relate to electrochemical processing of metal, in particular to micro plasma treatment in electrolyte solutions. The aim of said invention is to develop a method for obtaining qualitatively homogeneous coatings by micro-plasma oxidation on large-sized parts, including irregular shaped parts, or simultaneously on a great number of small parts. The second aim of the invention is to design a device for processing parts, having an extended surface area, by using low-power supplies. The inventive method for vacuum-compression micro-plasma oxidation of parts consists in dipping a processable part into an electrolyte solution pre-filled in a sealed container, in generating micro-plasma discharges on the surface of said part and, subsequently, in forming a coating, wherein the micro-plasma discharges are formed in low-pressure conditions above the electrolyte solution. The device for carrying out said method comprises means for forming vacuum in the electrolyte-containing container and additional means for pumping air. | 03-26-2009 |
| 20090200172 | METHOD OF MANUFACTURING FUEL CELL - A method of manufacturing a fuel cell includes thermally treating a hydrogen permeable membrane in a given temperature higher than an actual operating temperature of the fuel cell, and forming an electrolyte layer on the hydrogen permeable membrane subjected to the thermal treatment. The hydrogen permeable membrane is composed of a polycrystalline metal. | 08-13-2009 |
| 20100300887 | Preparing Electrodes for Electroplating - A method of immersing an electrode in an electroplating solution while under vacuum, to substantially eliminate air and/or other gas from microscopic holes, cavities or indentations in the electrode. A method of electroplating an electrode in an electroplating solution including the application of a vacuum to the electrode while it is immersed in the electroplating solution to thereby substantially eliminate air and/or other gas from microscopic holes, cavities or indentations in the electrode. The electroplating liquid may be applied to only one side of the electrode (“the wet side”) in which case, sufficient time is allowed to pass for the immersion liquid to fill the microscopic through-holes, cavities or indentations in the electrode. An enhancement of this mode is to force liquid through the microscopic holes from the wet side. A highly penetrating solvent may be used as an immersion liquid. Alternatively, carbon dioxide can be used as an immersion liquid, in which case the liquid carbon dioxide may be obtained by adjusting the temperature and pressure conditions in a closed container of gaseous carbon dioxide. | 12-02-2010 |
| 20130146467 | Preparing Electrodes for Electroplating - A method of immersing an electrode in an electroplating solution while under vacuum, to substantially eliminate air and/or other gas from microscopic holes, cavities or indentations in the electrode. A method of electroplating an electrode in an electroplating solution including the application of a vacuum to the electrode while it is immersed in the electroplating solution to thereby substantially eliminate air and/or other gas from microscopic holes, cavities or indentations in the electrode. The electroplating liquid may be applied to only one side of the electrode (“the wet side”) in which case, sufficient time is allowed to pass for the immersion liquid to fill the microscopic through-holes, cavities or indentations in the electrode. An enhancement of this mode is to force liquid through the microscopic holes from the wet side. A highly penetrating solvent may be used as an immersion liquid. Alternatively, carbon dioxide can be used as an immersion liquid, in which case the liquid carbon dioxide may be obtained by adjusting the temperature and pressure conditions in a closed container of gaseous carbon dioxide. | 06-13-2013 |
| 20140262795 | ELECTROPLATING PROCESSOR WITH VACUUM ROTOR - A substrate processor uses pressurized gas to create a vortex for lifting and holding a wafer, and to create a vacuum to prevent the wafer from adhering to a contact ring seal after electroplating the wafer. A processor head has a rotor movable into and out of an electrolyte vessel. A backing plate on the rotor includes vortex outlets which create the vortex in the rotor. A vacuum channel adjacent to the perimeter of the rotor applies vacuum to the wafer edges to hold the wafer onto the backing plate. A solenoid or switch in the head has a first position to supply gas flow to the vortex outlets, and a second position to supply gas flow to an aspirator which creates the vacuum in the vacuum channel. | 09-18-2014 |
| 20150122659 | METHOD OF PRODUCING GRAPHENE FROM LIQUID METAL - A multilayered plate containing, as the graphene forming matrix, an external layer composed of a metal or a metal alloy and, as a support substrate, the transition metals and/or their alloys and/or metalloids and/or their solutions and compounds is subjected to heat treatment in the following stages: plate heating until the plate reaches a temperature that is between 0.5° C. and 50° C., annealing, at a constant or variable temperature from the temperature range, for a period between 60 and 600 seconds and cooling, with the cooling rate maintained between 0.1 and 2° C./min in the temperature range of 1,200° C.-1,050° C. | 05-07-2015 |
