| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 205067000 | ELECTROFORMING OR COMPOSITION THEREFOR | 81 |
| 20080237049 | Ion-implanted electroformed structural material and method of producing the structural material - An ion-implanted electroformed structural material is made of an electroformed body formed by electroforming and has an ion-implanted layer formed by implanting ions into the electroformed body. In the electroformed structural material, the microstructure is modulated at a position deeper than the ion-implanted layer, and the hardness becomes higher than that of the original electroformed body even at a position deeper than the ion-implanted layer. | 10-02-2008 |
| 20080296163 | Structure and method of manufacturing the same - A structure including tungsten as a main component and tungsten carbide and a method of manufacturing the structure are provided, wherein the content of carbon is at least 0.1% by mass and the total content of cobalt, nickel, and iron is 3% or less by mass, respectively based on the structure. | 12-04-2008 |
| 20080314752 | ACID MIST MITIGATION AGENTS FOR ELECTROLYTE SOLUTIONS - Sulfonate-, sulfate-, or carboxylate-capped, alkoxylated anti-misting agents having the structure: R((AO) | 12-25-2008 |
| 20090277794 | DIMENSIONAL CONTROL IN ELECTROFORMS - A method includes placing a conductive mold in a first bath of electroforming solution, the solution including metal and having a selected temperature. A current is provided to the electroforming solution so that metal deposits onto the mold, thereby forming an electroformed element on the mold, the electroformed element and the mold being a composite assembly. The method further includes removing the composite assembly from the electroforming solution and transferring the composite assembly to a second bath having the same selected temperature. Thereafter, the electroformed element is separated from the mold while the composite assembly is in the second bath. | 11-12-2009 |
| 20100116670 | Electroforming mold and method for manufacturing the same, and method for manufacturing electroformed component - To provide an electroforming mold for manufacturing a multi-step structure minute component and a method for manufacturing the same, for which height control is possible and manufacturing process does not become complicated. On the upper face of a film of an electroconductive layer | 05-13-2010 |
| 20100213068 | Methods of and Apparatus for Molding Structures Using Sacrificial Metal Patterns - Molded structures, methods of and apparatus for producing the molded structures are provided. At least a portion of the surface features for the molds are formed from multilayer electrochemically fabricated structures (e.g. fabricated by the EFAB™ formation process), and typically contain features having resolutions within the 1 to 100 μm range. The layered structure is combined with other mold components, as necessary, and a molding material is injected into the mold and hardened. The layered structure is removed (e.g. by etching) along with any other mold components to yield the molded article. In some embodiments portions of the layered structure remain in the molded article and in other embodiments an additional molding material is added after a partial or complete removal of the layered structure. | 08-26-2010 |
| 20100288643 | METHOD FOR MANUFACTURING ELECTROFORMED MOLD, ELECTROFORMED MOLD, AND METHOD FOR MANUFACTURING ELECTROFORMED PARTS - In a method of manufacturing an electroforming mold, a first photoresist layer is formed on an upper surface of a bottom conductive film of a substrate, and the first photoresist layer is divided into a first soluble portion and a first insoluble portion. A conductive material is thermally deposited on an upper surface of the first photoresist layer within a predetermined temperature range, to thereby form an intermediate conductive film. An intermediate conductive film is patterned. A second photoresist layer is formed on an exposed upper surface of the first photoresist layer after the intermediate conductive film is removed, and on an upper surface of the intermediate conductive film remaining after patterning. The second photoresist layer is divided into a second soluble portion and a second insoluble portion. Next, the first and second photoresist layers are developed, and the first and second soluble portions are removed. | 11-18-2010 |
| 20110203934 | HETEROGENEOUS LIGA METHOD - The method of fabricating metal microstructures includes the following steps:
| 08-25-2011 |
| 20110220510 | DEVICE AND METHOD FOR FABRICATING MICRO ARTICLES - A device for fabricating micro articles, which includes a first electrode plate, a second electrode plate, and a spacing component. The first electrode plate has a forming electrode, where the forming electrode correspondingly matches a cross-section of the micro article. The spacing component is disposed in between the first electrode plate and the second electrode plate, with the thickness corresponds to the thickness of the micro article. Thereby, the device is able to store the solidifiable liquid therein, where the solidifiable liquid is controlled for shaping according to the forming electrode. After the solidifiable liquid has shaped and solidified, the finished product of the micro article is attained. The present disclosure also provides a method for fabricating micro articles. | 09-15-2011 |
| 20110240476 | FABRICATION OF CONDUCTIVE NANOSTRUCTURES ON A FLEXIBLE SUBSTRATE - Provided is a method of fabricating a continuous nanostructured material having an electrodeposited surface layer. A conductive master drum having a relief pattern on its surface that exposes only a portion of the master drum surface is immersed into a plating bath. An electrodepositable material is coated onto the exposed surface of the drum. A support material is coated over the deposited layer and the relief structure. Removal from the drum yields the nanostructured material. | 10-06-2011 |
| 20120111728 | METHOD OF MANUFACTURING CIRCUIT BOARD - Disclosed herein is a method of manufacturing a circuit board. The method of manufacturing a circuit board according to a preferred embodiment of the present invention is configured to include (A) forming a cavity | 05-10-2012 |
| 20120217163 | ELECTRODES, COMPONENTS, APPARATUSES, AND METHODS FOR BURR-FREE OR SUBSTANTIALLY BURR-FREE ELECTROCHEMICAL MACHINING - Electrodes, components, apparatuses, and methods for electrochemical machining (ECM) are disclosed. ECM may be employed to provide burr-free or substantially burr-free ECM of electrically-conductive workpieces (e.g. shrouds). As one non-limiting example, the electrically-conductive workpiece may be a shroud that is used as an electrical component in electronics boards. While the ECM components, apparatuses, and methods disclosed herein reduce burrs, ECM can provide imprecise machining and cause stray erosions to occur in the machined electrically-conductive workpiece. In this regard, the electrodes, components, apparatuses, and methods for ECM disclosed herein provide features that allow for precise machining of the machined electrically-conductive workpiece and also allow avoidance of stray erosions in the machined electrically-conductive workpiece. | 08-30-2012 |
| 20130056357 | Acid Mist Mitigation Agents for Electrolyte Solutions - Sulfonate-, sulfate-, or carboxylate-capped, alkoxylated anti-misting agents having the structure: R((AO) | 03-07-2013 |
| 20130228466 | FABRICATION OF MULTILAYERED NANOSIZED POROUS MEMBRANES AND THEIR USE FOR MAKING NOVEL NANOSTRUCTURES - Multilayer porous membranes and methods for fabricating the membranes may have applications in filtration, separation, and nanomanufacturing. The layers of the membrane may be selected based on different physiochemical properties, such as ionization rate and/or etch rate. The pores may be formed by high energy particle bombardment and chemical etching. In some embodiments, the multilayer porous membrane may be utilized to form complex nanostructures by selecting different materials for the layers based on physiochemical properties, layer thickness, stacking sequence, and/or varying the pore generation process. | 09-05-2013 |
| 20130313119 | Additives for Producing Copper Electrodeposits Having Low Oxygen Content - A copper electroplating bath for producing copper electrodeposits is described. The copper electroplating bath comprises (a) a soluble copper salt, (b) an electrolyte comprising one or more acids, and (c) a grain refining additive comprising an alkyl, aryl or alkylaryl diamine. The copper electroplating bath can be used for producing electroformed copper deposits having low oxygen content. | 11-28-2013 |
| 20150291516 | Acid Mist Mitigation Agents for Electrolyte Solutions - Sulfonate-, sulfate-, or carboxylate-capped, alkoxylated anti-misting agents having the structure: R((AO) | 10-15-2015 |
| 20160145755 | LIGHTWEIGHT METAL PARTS PRODUCED BY PLATING POLYMERS - Methods for fabricating lightweight or hollow metal parts are disclosed. First, a polymer is formed into an article of a desired shape or geometry. The outer surface of the article is prepared to receive a catalyst and then the outer surface is activated with the catalyst. A first metallic layer is then plated onto the outer surface to form a structure. Optional additional metallic layers may be applied. The polymer may be removed from the structure before it is subjected to a final heat treatment for alloying purposes. | 05-26-2016 |
| 20160153102 | HIGH TEMPERATURE ADDITIVE MANUFACTURING FOR ORGANIC MATRIX COMPOSITES | 06-02-2016 |
| 20160153103 | ADAPTING ELECTROFORMING TECHNIQUES FOR THE MANUFACTURE OF ARCHITECTURAL BUILDING ELEMENTS | 06-02-2016 |
| 205068000 | Recording device | 3 |
| 20080223723 | METHOD FOR MANUFACTURING MASTER INFORMATION CARRIER FOR MAGNETIC TRANSFER - There is provided a method for manufacturing a high quality master information carrier for magnetic transfer, the method preventing the metallic disk formed by electroforming from coming off from the conduction ring and decreasing the distortion of the master information carrier. A conduction ring connected to a cathode is arranged on a matrix and electroforming is performed with the conduction ring being smaller in bore diameter than a presser ring for fixing the conduction ring and the matrix. | 09-18-2008 |
| 20090008257 | METHOD OF PRODUCING STAMPER FOR OPTICAL RECORDING MEDIUM, METHOD OF PRODUCING SUBSTRATE, AND METHOD OF PRODUCING OPTICAL RECORDING MEDIUM - A method of producing a stamper for roughening a substrate of an optical recording medium contains the steps of placing a conductive ring having a hole at the center thereof on a major surface of an original metal plate, electroforming a metal layer over a portion of the metal plate exposed in the hole of the conductive ring, an inner end-face of the conductive ring, and a portion of a major surface of the conductive ring, and entirely or partly roughening a major surface of the metal layer by a blasting treatment to obtain an original stamper. | 01-08-2009 |
| 20100213069 | MASTER PLATE AND METHOD OF MANUFACTURING THE SAME - According to one embodiment, a master plate for producing a stamper includes a substrate, and patterns of protrusions and recesses formed on the substrate and corresponding to patterns of recording tracks or recording bits in data areas and to information in servo areas, in which the protrusion has a structure in which a first metal layer, a silicon layer and a second metal layer are stacked on the substrate and a metal oxide film is formed on a surface of the protrusion. | 08-26-2010 |
| 205069000 | Printing plate or electrotype | 2 |
| 20100101961 | Method of duplicating nano pattern texture on object's surface by nano imprinting and electroforming - Disclosed is a method of duplicating a nano-pattern texture of the surface of an object through electroforming using an imprint mold, including selecting the object having the surface texture to be duplicated; disposing the selected object and pre-treating the surface thereof; nano-imprinting the surface of the pretreated object, thus duplicating it on a plastic mold; metallizing the surface of the plastic mold through vapor deposition, and performing electroforming, thus manufacturing metal module master molds; trimming the edges of the metal module master molds, performing micro-processing, connecting the metal module master molds, and then performing electroforming, thus manufacturing a large-area metal unit master mold; and electroforming the metal unit master mold, thus producing a duplicate having the surface texture, thus exhibiting an effect in which the skin of a selected natural object can be duplicated on metal having a uniform thickness. | 04-29-2010 |
| 20130192994 | Method of duplicating nano pattern texture on object's surface by nano imprinting and electroforming - Disclosed is a method of duplicating a nano-pattern texture of the surface of an object through electroforming using an imprint mold, including selecting the object having the surface texture to be duplicated; disposing the selected object and pre-treating the surface thereof; nano-imprinting the surface of the pretreated object, thus duplicating it on a plastic mold; metallizing the surface of the plastic mold through vapor deposition, and performing electroforming, thus manufacturing metal module master molds; trimming the edges of the metal module master molds, performing micro-processing, connecting the metal module master molds, and then performing electroforming, thus manufacturing a large-area metal unit master mold; and electroforming the metal unit master mold, thus producing a duplicate having the surface texture, thus exhibiting an effect in which the skin of a selected natural object can be duplicated on metal having a uniform thickness. | 08-01-2013 |
| 205070000 | Mold, mask, or masterform | 17 |
| 20080237050 | ELECTROCASTING METHOD - The present invention provides an electrocasting method by which the shape of the surface opposite to the surface to be electrodeposited on the mold can be controlled. A molded metal article is electrocast by forming an insulating layer on the side wall faces of a cavity and the outer wall face of a conductive mold in which the cavity is formed, placing the mold in an electrolysis tank and applying voltage, electrodepositing metal on the bottom face of the cavity, and growing the metal layer in the cavity so as to leave a space having a height of at least one-third the width of the cavity. | 10-02-2008 |
| 20090134032 | ELECTROCHEMICAL DEPOSITION METHOD FOR SURFACE METALLIZATION - An electrochemical deposition method includes disposing a mold into an electrolytic bath for forming a first metal layer on a surface of the mold, bonding a first surface of a conductive component to the first metal layer, and disposing the mold bonded to the conductive component into an electrolytic bath for forming a second metal layer on a second surface of the conductive component. | 05-28-2009 |
| 20090255817 | Pin based method of precision diamond turning to make prismatic mold and sheeting - A system, and corresponding method for use, for providing a mass-producible retroreflective material, or sheeting, featuring full cube corner pins is presented. The full cube corner shaping may be provided with the use of a diamond turning tool. The diamond turning tool may be used to simultaneously manufacture a number of pins. The pins may be used to form a mold featuring a triangular or full cube corner surface formation. | 10-15-2009 |
| 20090277795 | PROCESS FOR FABRICATING MOLDING STAMP - A process for fabricating a molding stamp mainly includes the steps of: forming a metal seed film on a substrate; forming a photo resist layer on the metal seed film; exposing the photo resist layer by a direct writing method, and developing the photo resist layer thereby forming a pattern of the photo resist layer, the pattern made of a number of microlens structures and a through hole configured for exposing a portion of the metal seed film therefrom; electroforming a body on the substrate to cover the pattern of the photo resist layer, the body having an extending portion being connected with the metal seed film via the through hole of the photo resist layer; removing the photo resist layer from the substrate; and separating the electroformed body from the substrate. | 11-12-2009 |
| 20090314648 | METHOD OF MANUFACTURING STAMPER - According to one embodiment, a method of manufacturing a stamper used for manufacturing a magnetic recording medium having magnetic patterns corresponding to servo areas including a preamble section, an address section and a burst section and data areas including discrete tracks, the method includes forming additional resist patterns such that protrusions and recesses appear alternately in the radial direction in the preamble section and/or address section, in forming resist patterns corresponding to the servo areas including the preamble section, the address section and the burst section and data areas including discrete tracks are formed on a master plate, depositing a conductive film on the entire surface of the master plate and resist patterns, followed by electroforming a metal layer, and peeling off the metal layer from the master plate. | 12-24-2009 |
| 20100072069 | Method for manufacturing a stamper - A method for manufacturing an imprint stamper includes the steps of forming a first electroformed layer on a concavo-convex pattern of an original disk with the pattern, peeling off the first electroformed layer to provide a first stamper, forming a second electroformed layer on a concavo-convex pattern of the first stamper, peeling off the second electroformed layer to provide a second stamper, forming a third electroformed layer on a concavo-convex pattern of the second stamper, and peeling off the third electroformed layer to provide a third stamper. In addition, a conductive film is formed at least on one of a bottom of the concave portion and a top surface of the convex portion of the concavo-convex pattern at least in one of the first stamper and the second stamper. | 03-25-2010 |
| 20100236934 | MOULD FOR GALVANOPLASTY AND METHOD OF FABRICATING THE SAME - The invention relates to a method ( | 09-23-2010 |
| 20100314253 | STAMPER MANUFACTURING METHOD - According to one embodiment, a three dimensional structure of a stamper is subject to etch by supplying a pulsed electric currentelectric current to the surface of the stamper. | 12-16-2010 |
| 20110180410 | Electrochemically Fabricated Structures Having Dielectric or Active Bases and Methods of and Apparatus for Producing Such Structures - Multilayer structures are electrochemically fabricated on a temporary (e.g. conductive) substrate and are thereafter bonded to a permanent (e.g. dielectric, patterned, multi-material, or otherwise functional) substrate and removed from the temporary substrate. In some embodiments, the structures are formed from top layer to bottom layer, such that the bottom layer of the structure becomes adhered to the permanent substrate, while in other embodiments the structures are formed from bottom layer to top layer and then a double substrate swap occurs. The permanent substrate may be a solid that is bonded (e.g. by an adhesive) to the layered structure or it may start out as a flowable material that is solidified adjacent to or partially surrounding a portion of the structure with bonding occurring during solidification. The multilayer structure may be released from a sacrificial material prior to attaching the permanent substrate or it may be released after attachment. | 07-28-2011 |
| 20110226625 | MASTER MOLD MANUFACTURING METHOD AND MOLD STRUCTURE MANUFACTURING METHOD - Disclosed is a method of manufacturing a master mold having an uneven pattern which includes wide and narrow concave portions using a reactive ion etching process. The method is capable of manufacturing a master mold improved in the uniformity of concave portions of the uneven pattern by performing a main etching step in which etching is performed, using an original plate which includes a processing target layer and a foundation layer, on the processing target layer using the foundation layer as an etch stop layer and an extra etching step in which etching is performed on the original plate degraded by the main etching step in the uniformity of concave portions in order to improve the uniformity using an etching gas which includes a first gas capable of etching the foundation layer and producing a deposit with a bias power of not greater than 15 W. | 09-22-2011 |
| 20110233063 | ELECTROFORMING METHOD - A mold is fabricated with a cavity formed in an insulating layer formed so as to be placed on an upper surface of a conductive base material. This mold is disposed in an electrolyte bath to be applied with a voltage, and a metal is electrodeposited on the bottom surface of the cavity to electroform a metal-formed product in the cavity. In this electrodepositing process, when the width of the cavity is taken as W and a vertical height of a head space between an upper opening of the cavity and an upper surface of a metal layer is taken as H, the growth of the metal layer is stopped so that the height H of the head space left above the metal layer satisfies: H≧W/2.85 where 300 μm≦W; H≧W/3.75 where 200 μm≦W<300 μm; H≧W/4 where 100 μm≦W<200 μm; and H≧W/10 where W<100 μm. | 09-29-2011 |
| 20120247964 | MICROFLUIDIC CONTROL DEVICE FOR MEASURING GLYCOSLYATED HEMOGLOBIN, METHOD FOR MANUFACTURING THE SAME AND METHOD FOR OPERATING THE SAME - Disclosed is a microfluidic control device which may electrochemically and simply measure the value of glycosylated hemoglobin in blood on a chip, a method for manufacturing the same, and a method for operating the same. | 10-04-2012 |
| 20120255863 | Microfabrication of Tunnels - A system and method to form beam tunnels in interaction circuits. Forms, such as fibers or sheets can be located and secured above a substrate at a desired size and desired shape to form the final shape of the beam tunnels. Fiber holders can be utilized to position the forms above the substrate. A photoresist can then be applied over the substrate embedding the forms. A single exposure LIGA process can be performed on the photoresist, including the steps of ultraviolet photolithography, molding, and electroforming. After the process, the forms can be removed to leave the beam tunnels in the interaction circuits. | 10-11-2012 |
| 20130048502 | SYSTEMS AND PROCESSES FOR FORMING MOLDS SUCH AS NICKEL MOLDS - For forming a nickel mold, a metal and a corresponding etchant are selected such that the etchant selectively etches the metal over nickel. The metal is sputtered onto a surface of a template having nano-structures to form a sacrificial layer covering the nano-structures. Nickel is electroplated onto the sacrificial layer to form a nickel mold, but leaving a portion of the sacrificial layer exposed. The sacrificial layer is contacted with the etchant through the exposed portion of the sacrificial layer to etch away the sacrificial layer until the nickel mold is separated from the template. Subsequently, the nickel mold may be replicated or scaled-up to produce a replicate mold by electroplating, where the replicate mold has nano-structures that match the nano-structures on the template. The metal may be copper. | 02-28-2013 |
| 20140027293 | PIN BASED METHOD OF PRECISION DIAMOND TURNING TO MAKE PRISMATIC MOLD AND SHEETING - A system, and corresponding method for use, for providing a mass-producible retroreflective material, or sheeting, featuring full cube corner pins is presented. The full cube corner shaping may be provided with the use of a diamond turning tool. The diamond turning tool may be used to simultaneously manufacture a number of pins. The pins may be used to form a mold featuring a triangular or full cube corner surface formation. | 01-30-2014 |
| 20140202869 | METHOD FOR MANUFACTURING A MOLDING CORE - A method for manufacturing a molding core includes: providing a cylindrical roller having a circumference surface coated with a first film layer; coating a second film layer on the first film layer; coating a preprocessed molding film on the second film layer; engraving a number of molding patterns on the preprocessed molding film to obtain a molding film; separating the molding film from the roller and spreading out the molding film to be a flat plate; and manufacturing the molding core using the molding film by electroforming method. | 07-24-2014 |
| 20150108000 | METHOD OF DUPLICATING NANO PATTERN TEXTURE ON OBJECT'S SURFACE BY NANO IMPRINTING AND ELECTROFORMING - A method of duplicating the nano-pattern of the surface of an object is disclosed | 04-23-2015 |
| 205073000 | Roll, ring, or hollow body | 3 |
| 20110272283 | TUBE ELECTROFORMING METHOD, TUBE BY ELECTROFORMING, AND THIN WIRE MATERIAL FOR PRODUCTION OF TUBES BY ELECTROFORMING - The invention provides a method of producing an electrocast tube having a fine inner diameter, and an electrocast tube. It also provides a thin wire material for production of an electrocast tube having a fine inner diameter. An electrocast tube producing method comprising the steps of forming an elecrtodeposit around a thin wire material ( | 11-10-2011 |
| 20120061243 | ELECTRO-FORMED SHEATH FOR USE ON AIRFOIL COMPONENTS - A method of manufacturing a sheath for protecting an airfoil component includes the steps of establishing an electro-forming solution having cobalt and phosphorus and electro-forming the sheath with a composition that includes the cobalt and the phosphorus using the electro-forming solution. | 03-15-2012 |
| 20120186983 | FLUID DYNAMIC BEARING DEVICE - It is an object of the present invention to provide a bearing member having a highly accurate dynamic pressure generating portion stably at low cost. Dynamic pressure grooves ( | 07-26-2012 |
| 205074000 | Powder, flakes, or colloidal particles | 4 |
| 20100089759 | METHOD FOR PRODUCING CONDUCTOR FINE PARTICLES - A method for producing conductor fine particles in which the advantages of conventional vapor phase method and liquid phase method are utilized while eliminating the drawbacks of both methods remarkably. Furthermore, definite guidelines and measure for improvement are given to the greatest problems common to the vapor phase method and liquid phase method, i.e., enhancement in quality of the unit fine particle and a fine particle production method controllably temporarily and regionally. The method for producing conductor fine particles comprises a step for applying a voltage to a pair of electrode consisting of a positive electrode and a negative electrode arranged in conductive liquid and generating plasma in the vicinity of the negative electrode, and a step for producing conductor fine particles by melting the metal material of the negative electrode and then re-solidifying. | 04-15-2010 |
| 20100176001 | ELECTROPLATING SOLUTION FOR MANUFACTURING NANOMETER PLATINUM AND PLATINUM BASED ALLOY PARTICLES AND METHOD THEREOF - The present invention generally relates to an electroplating solution for manufacturing nanometer platinum and platinum based alloy particles and a method thereof. That is, an acid solution having platinum complex compound and citric acid is provided into a reaction tank to be as an electroplating solution, then a plurality of platinum and platinum based alloy particles are deposited on the surfaces of electrodes under the condition of applying negative potentials. The acid solution is capable of effectively providing the rate of conducting ions. The citric acid can effectively promote the dispersity of the platinum and platinum based alloy particles and reduce the dimensions the platinum and platinum based alloy particles. | 07-15-2010 |
| 20100193363 | ELECTROCHEMICAL METHODS OF MAKING NANOSTRUCTURES - Electrochemical methods for making nanostructures, for example, titanium oxide (TiO | 08-05-2010 |
| 20100206734 | System and Method for Producing Ultrafine Metal Particles Suspended in Aqueous Medium - The present disclosure is drawn to methods and systems for producing solutions containing ultrafine metal particles. The method for producing ultrafine metal particles in an aqueous medium includes providing a reaction chamber having a transition metal anode and a transition metal cathode disposed therein. The reaction chamber can also contain an aqueous medium. An anode and cathode are associated at a distance with respect to one another such that when activated by a power source, a discharge arc occurs between the anode and cathode within the aqueous medium. Activation of a power source causes the discharge arc to occur between the anode and the cathode, thereby generating ultrafine metal particles suspended within the aqueous medium. | 08-19-2010 |
| 205075000 | Perforated or foraminous article | 3 |
| 20130206600 | METHOD FOR PRODUCING ANODIZED FILM - A method for manufacturing an anodized film according to an embodiment of the present invention includes the steps of: (a) providing a multilayer structure that includes a base, a sacrificial layer which is provided on the base and which contains aluminum, and an aluminum layer which is provided on a surface of the sacrificial layer; (b) partially anodizing the aluminum layer to form a porous alumina layer which has a plurality of minute recessed portions; and (c) after step (b), separating the porous alumina layer from the multilayer structure. According to an embodiment of the present invention, a self-supporting anodized film which includes a porous alumina layer can be manufactured more conveniently as compared with the conventional methods. | 08-15-2013 |
| 20140238863 | METHOD FOR PRODUCING METAL FILTERS - A method for producing a metal filter comprises a lamination step, an exposure step, a development step, a plating step, a dissolution step, and a stripping step. The method is useful because it is possible to produce a metal filter in which there are not damages such as wrinkles, folds, scars, and curls and deformation of fine through-holes. | 08-28-2014 |
| 20160375203 | NEBULIZER MESH AND PRODUCTION METHOD THEREOF - The present invention relates to a nebulizer mesh which is used, in a nebulizer for atomizing and nebulizing liquid, for atomizing the liquid, and has plural through holes | 12-29-2016 |
| 205076000 | Sheet, web, wire, or filament | 20 |
| 20100059383 | DEVICE AND METHOD FOR PATTERNING A SURFACE OF A POLYMER LAYER - The present invention relates to a device for forming topographic features on a surface of a polymer layer comprising: a polymer layer ( | 03-11-2010 |
| 20100258443 | Methods of fabricating nanowires and electrodes having nanogaps - A cost-effective and highly reproducible method of fabricating nanowires, and small gaps or spacings in nanowires is disclosed. The nanogaps bridge an important size regime between 1 nm and 100 nm. The nanogaps can be selectively predetermined to be as small as 1.0 nm, or larger than 1000 nm. These electrode gaps can be useful in preparing molecular electronic devices that involve making electrical contact to individual molecules, such as biomolecules, or small clusters of molecules. Microelectrodes having nanogaps for electrical and magnetic applications formed by the method, and as well as biosensors and their use in detecting a biological species, such as DNA, are also disclosed. | 10-14-2010 |
| 20100276290 | PATTERNING METHOD, PATTERNING APPARATUS, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - A patterning method includes supplying an imprint material made of a dielectric in an uncured state onto a workpiece, producing a potential difference between the workpiece and a conductive pattern portion of a template opposed to the workpiece to induce dielectric polarization in the imprint material before curing the imprint material, bringing the pattern portion into contact with the imprint material in the uncured state, curing the imprint material with the pattern portion brought into contact with the imprint material, and stripping the template from the imprint material after curing the imprint material. | 11-04-2010 |
| 20110162968 | PRODUCTION DEVICE AND PRODUCTION METHOD FOR CONDUCTIVE NANO-WIRE - The object of the disclosure is to provide a nano-scale molecular assembly such as a conductive nano-wire. Specifically, there is provided an electrochemical apparatus for forming a molecular assembly, including two electrodes and an electrochemical cell holding an electrolytic solution and the two electrodes, wherein the gap between the two electrodes is from 1 nm to 100 μm, by allowing the electrochemical cell to hold an electrolytic solution containing molecules that is to constitute the molecular assembly, and applying a voltage across the two electrodes in the state wherein the electrolyte and the two electrodes are in contact. | 07-07-2011 |
| 20130180861 | PHOTOCATALYST WITH ENHANCED STABILITY FOR HYDROGEN PRODUCTION AND OXIDATIVE REACTIONS | 07-18-2013 |
| 20130270121 | METHOD FOR FABRICATING COPPER NANOWIRE WITH HIGH DENSITY TWINS - The present invention discloses a method for fabricating a copper nanowire with high density twins, which comprises steps: providing a template having a top surface, a bottom surface and a plurality of through-holes penetrating the top surface and the bottom surface and having a diameter of smaller than 55 nm; placing the template in a copper-containing electrolyte at a low temperature lower than ambient temperature and applying a pulse current to perform an electrodeposition process to form a copper nanowire with twin structures in each through-hole. The pulse current increases the probability of stacking faults in the deposited copper ions. The low temperature operation favors formation of nucleation sites of twins. Therefore, the copper nanowire has higher density of twins. Thereby is effectively inhibited electromigration of the copper nanowire. | 10-17-2013 |
| 20140027294 | Nanowire and Microwire Fabrication Technique and Product - A continuous or semi-continuous process for fabricating nanowires or microwires makes use of the substantially planar template that may be moved through electrochemical solution to grow nanowires or microwires on exposed conductive edges on the surface of that template. The planar template allows fabrication of the template using standard equipment and techniques. Adhesive transfer may be used to remove the wires from the template and in one embodiment to draw a continuous wire from the template to be wound around the drum. | 01-30-2014 |
| 20140151236 | Nanowire Structural Element - Producing a nanowire structural element with a nanowire array between two cover layers forming a hollow chamber permeated in a column-like manner with nanowires. The process includes: preparing a template foil; application of a first surface covering electroconductive cover layer on a first side of the template foil; generation of numerous nanopores in the template foil; generation of nanowires in the nanopores wherein an electroconductive material fills the nanopores by electrochemical deposition, wherein the nanowires grow within the nanopores on the first cover layer; generation of a second surface filling cover layer on the second side of the template foil thus forming a sandwich-like arrangement of the two cover layers and the template foil permeated with nanowires; and clearing the structured hollow chamber between by dissolving of the template foil and removal of the dissolved template substance, wherein the two cover layers remain intact. | 06-05-2014 |
| 20140209469 | Controlling Dimensions of Nanowires - Controlling dimensions of nanowires includes lithographically forming a trench in a layer of a polymer resin with a width less than one micrometer where the polymer resin has a thickness less than one micrometer and is deposited over an electrically conductive substrate, depositing a nanowire material within the trench to form a nanowire, and obtaining the nanowire from the trench with a removal mechanism. | 07-31-2014 |
| 20150068909 | METHOD FOR PREPARING LOW-MELTING-POINT PLATING SOLUTION FOR ALUMINUM ELECTROPLATING, PLATING SOLUTION FOR ALUMINUM ELECTROPLATING, METHOD FOR PRODUCING ALUMINUM FOIL, AND METHOD FOR LOWERING MELTING POINT OF PLATING SOLUTION FOR ALUMINUM ELECTROPLATING - An object of the present invention is to provide a method for preparing a plating solution for aluminum electroplating useful for the production of a high-ductility, high-purity aluminum foil at a high film formation rate, etc., which is an easy-to-handle plating solution that does not solidify and allows for an electroplating treatment even at 25° C. The present invention as a means for achieving the object is characterized in that in a preparation of a plating solution containing at least (1) a dialkyl sulfone, (2) an aluminum halide, and (3) a nitrogen-containing compound, the blending proportions of the dialkyl sulfone, the aluminum halide, and the nitrogen-containing compound are such that per 10 mol of the dialkyl sulfone, the aluminum halide is 3.5+n to 4.2+n mol, and the nitrogen-containing compound is n mol (wherein n is 0.001 to 2.0 mol). In addition, a plating solution for aluminum electroplating prepared by the method of the present invention allows for an electroplating treatment with high aluminum deposition efficiency relative to the current flow, and is thus advantageous in that electricity usage can be reduced, resulting in excellent economic efficiency. | 03-12-2015 |
| 205077000 | Of indeterminate length | 10 |
| 20080217181 | FREE STANDING SINGLE-CRYSTAL NANOWIRE GROWTH BY ELECTRO-CHEMICAL DEPOSITION - The present invention relates to a method for obtaining monocrystalline or single crystal nanowires. Said nanowires are grown in a pattern making use of electro-chemical deposition techniques. Most preferred, the electrolytic bath is based on chlorides and has an acidic pH. Single element as well as combinations of two elements nanowires can be grown. Depending on the element properties the obtained nanowire can have metallic (conductive) or semi-metallic (semi-conductive) properties. The observed nanowire growth presents an unusual behavior compared to the classical nanowire template-assisted growth where a cap is formed as soon as the metal grows out of the pattern. Under given conditions of bath composition and potential (current) settings the nanowires grow out of the pattern up to a few microns without any significant lateral overgrowth. | 09-11-2008 |
| 20090020431 | Electrografting Method for Forming and Regulating a Strong Adherent Nanostructured Polymer Coating - Electrografting method for forming and regulating a strongly adherent nanostructured polymer coating onto an electro-conductive surface profile characterized in that the surface profile is regulated by electrodeposition of nanometre- and/or micrometre-scale nuclei onto the surface profile prior to or simultaneously to the formation of the polymer coating. | 01-22-2009 |
| 20090114541 | Method for Manufacturing Micro Wire, and Sensor Including the Micro Wire and Method for manufacturing the Sensor - The present invention relates to a method for manufacturing a micro wire. More particular, the present invention relates to a method for manufacturing a micro wire, a sensor including the micro wire, and a method for manufacturing the sensor, having improved production efficiency. According to an embodiment of the present invention, a method for manufacturing a micro wire includes applying a three-dimensional electric field to a solution for forming a micro wire. | 05-07-2009 |
| 20090200170 | ELECTROCHEMICAL NANOWIRE ASSEMBLY - A method of growing a crystalline nanowire is disclosed. The method includes providing a pair of electrodes, immersing the electrode pair in a salt solution, and selectively applying a voltage signal to the electrode pair to induce growth of the nanowire between the electrode pairs. | 08-13-2009 |
| 20100181202 | "KIBOL'S MODULE" PLANT FOR PRODUCING INORGANIC FIBERS OF ROCKS - The present invention pertains to plants for producing inorganic fibers from melted rocks, advantageously, with narrow working interval and low diathermy, for example, basalts, diabases, amphibolites, andesites, dacites, rhyolites and other rocks. The plant comprises the furnace for obtaining the melt connected to the feeder, working aperture and a warmed feeder with draw dies located below working aperture where, according to the invention, transition chamber is installed on the feeder exit, such transition chamber is intended for creation of thin layer melt flow, its enclosure contains working aperture, the transition chamber has the heater, the threshold installed at its entrance and adjustable damper located over the threshold, and these components are intended for obtaining the melt flow of needed thickness and quality. The feature of the proposed invention is also the bottom of the transition chamber which has an inclination directed towards the working aperture. The plant has also accumulator tank installed between the exit of the furnace for obtaining the melt and the feeder, which is intended for receiving the melt homogeneous in ten is of composition and temperature. Another feature of the plant is that the plant has the unit for removing iron containing impurities from the melt, such unit being the source of direct or pulsing current with electrodes installed at the feeder entrance, connected to corresponding poles of the current source and intended for creating electric current in the melt. The proposed invention is aimed at creation of such plant which will improve strength, chemical and thermal stability of produced fibers by way of creating conditions near working aperture that will decrease the quantity of external impurities in the flow and allow obtaining of the melt, which is homogenous in terms of composition and temperature, in said zone of the plant. It is attained by means of adjustable damper installed at the entrance of the transition chamber, which does allow upper part of the melt flow (i.e. foam) to pass to the working aperture, and by means of the threshold installed below the adjustable damper, which does not allow lower part of the melt containing heavy unmelted rock particles to pass to the transition chamber. This significantly reduces the possibility of formation of stress concentrators in produced fiber and also the draw dies clogging. | 07-22-2010 |
| 20100213070 | ARTIFICIAL LIPID MEMBRANE FORMING METHOD AND ARTIFICIAL LIPID MEMBRANE FORMING APPARATUS - An object of the present invention is to provide a method for easily forming an artificial lipid membrane in a short period of time and an artificial lipid membrane forming apparatus suitable for carrying out such method. | 08-26-2010 |
| 20130264211 | ENDLESS BELT FOR FIXING, FIXING DEVICE, AND METHOD FOR PRODUCING ENDLESS BELT FOR FIXING - An endless belt for fixing includes a base layer made of nickel, wherein the base layer includes a first layer, a second layer, and a third layer provided between the first layer and the second layer, and a toner parting layer provided on the base layer, wherein a content rate of an element for enhancing hardness in the first layer and the second layer is lower than that in the third layer. | 10-10-2013 |
| 20140346050 | METHOD FOR PRODUCING ALUMINUM FILM AND METHOD FOR PRODUCING ALUMINUM FOIL - A method for producing an aluminum film by electrodepositing aluminum on a base in an electrolytic cell to which a liquid electrolyte containing a molten salt is fed includes adjusting a concentration of an additive in such a manner that a measured value of an overvoltage is within a predetermined range on the basis of a predetermined relationship between the overvoltage and the concentration of the additive added to the molten salt upon electrodepositing aluminum in the liquid electrolyte. | 11-27-2014 |
| 20140360882 | HIGH SPEED HORIZONTAL ELECTROFORMING APPARATUS FOR MANUFACTURING METAL FOIL AND METHOD FOR MANUFACTURING METAL FOIL - The present invention relates to an apparatus and a method for manufacturing metal foil by electroforming. Provided is a horizontal electroforming apparatus comprising: base plate supply means for continuously supplying flexible and conductive base plates to be provided as cathode electrodes in one horizontal direction; a horizontal cell including a conductor roll which contacts a widthwise edge portion of the base plate to transfer the base plate and supply current to the base plate, anode electrodes arranged at one side of the base plate or spaced apart from each other at both respective sides of the base plate, an electrolyte supply device for supplying an electrolyte containing metal ion through a horizontal path formed by the base plates and the anode electrodes, and current supply devices arranged at one side or both sides of the base plate to supply current to the conductor roll and to the anode electrodes so as to enable electroseparation of the metal ion; and delaminating means for delaminating, from the base plate, metal foil electrodeposited at one side or both sides of the base plate. | 12-11-2014 |
| 20160010234 | METHOD FOR PRODUCING A FIXATION BELT | 01-14-2016 |
| 205078000 | Electrical product | 9 |
| 20090134033 | Directed assembly of a conducting polymer - The present invention provides a method for directed assembly of a conducting polymer. A method of the invention comprises providing a template such as an insulated template and electrophorectically assembling a conducting polymer thereon. Preferably, the template comprises a patterned electrode on which the conducting polymer is assembled. Moreover, the invention provides a method for transferring an assembled conducting polymer. For example, a method of the invention comprises providing a substrate such as a polymeric substrate and contacting a surface thereof with an assembled conducting polymer. The assembled conducting polymer can be disposed on a patterned electrode of a template, hi one embodiment, a method comprises removing the substrate. By removing the substrate, the assembled conducting polymer is transferred from the patterned electrode of the template to the substrate. The invention also provides a device with a template or substrate comprising an assembled conducting polymer. | 05-28-2009 |
| 20100051466 | Method of Forming Electrically Isolated Structures Using Thin Dielectric Coatings - Electrochemical fabrication processes and apparatus for producing multi-layer structures where each layer includes the deposition of at least two materials and wherein the formation of at least some layers including operations for providing coatings of dielectric material that isolate at least portions of a first conductive material from (1) other portions of the first conductive material, (2) a second conductive material, or (3) another dielectric material, and wherein the thickness of the dielectric coatings are thin compared to the thicknesses of the layers used in forming the structures. In some preferred embodiments, portions of each individual layer are encapsulated by dielectric material while in other embodiments only boundaries between distinct regions of materials are isolated from one another by dielectric barriers. | 03-04-2010 |
| 20100314254 | METHOD OF MANUFACTURING WIRING SUBSTRATE - There is provided a method of manufacturing a wiring substrate. The method includes: (a) forming a first resist layer having first openings therein on a first surface of a support plate, forming first plated films in the first openings by an electrolytic plating method, and removing the first resist layer; (b) forming a second resist layer having second openings therein on the first surface of the support plate, forming second plated films in the second openings by an electrolytic plating method, and removing the second resist layer; (c) forming a wiring layer and an insulating layer such that the wiring layer is electrically connected to the first and second plated films; and (d) removing the support plate to expose the first and second plated films. | 12-16-2010 |
| 20140209470 | Electrochemically Fabricated Structures Having Dielectric or Active Bases and Methods of and Apparatus for Producing Such Structures - Multilayer structures are electrochemically fabricated on a temporary (e.g. conductive) substrate and are thereafter bonded to a permanent (e.g. dielectric, patterned, multi-material, or otherwise functional) substrate and removed from the temporary substrate. In some embodiments, the structures are formed from top layer to bottom layer, such that the bottom layer of the structure becomes adhered to the permanent substrate, while in other embodiments the structures are formed from bottom layer to top layer and then a double substrate swap occurs. The permanent substrate may be a solid that is bonded (e.g. by an adhesive) to the layered structure or it may start out as a flowable material that is solidified adjacent to or partially surrounding a portion of the structure with bonding occurring during solidification. The multilayer structure may be released from a sacrificial material prior to attaching the permanent substrate or it may be released after attachment. | 07-31-2014 |
| 20140262793 | ADAPTABLE FREE-STANDING METALLIC ARTICLE FOR SEMICONDUCTORS - A free-standing metallic article, and method of making, is disclosed in which the metallic article is electroformed on an electrically conductive mandrel. The metallic article has a plurality of electroformed elements that are configured to serve as an electrical conduit for a photovoltaic cell. A first electroformed element has at least one of: a) a non-uniform width along a first length of the first element, b) a change in conduit direction along the first length of the first element, c) an expansion segment along the first length of the first element, d) a first width that is different from a second width of a second element in the plurality of electroformed elements, e) a first height that is different from a second height of the second element in the plurality of electroformed elements, and f) a top surface that is textured. | 09-18-2014 |
| 20150083599 | METHOD AND SYSTEM FOR THE PRODUCTION OF SEMI-FINISHED COPPER PRODUCTS AS WELL AS METHOD AND APPARATUS FOR APPLICATION OF A WASH - In a method for the production of semi-finished copper products, first copper is melted and cast to produce copper anodes, in one casting procedure, within multiple ingot molds, subsequently copper cathodes are formed by electrolysis, using at least one of the copper anodes, and then these copper cathodes are processed further to produce semi-finished copper products. A long-term coating is applied to at least one of the ingot molds as a wash, a sulfur-free wash is applied to the ingot mold and/or part of the work pieces cast in the ingot molds is directly processed further to produce semi-finished copper products. A method and an apparatus applies a wash to an ingot mold and a system produces semi-finished copper products. | 03-26-2015 |
| 20150294789 | METHOD FOR PRODUCING COIL ELEMENT USING RESIN SUBSTRATE AND USING ELECTROFORMING - A method for manufacturing a coil element including forming a groove in a substrate surface of a resin substrate, forming a metallic coating, forming a resist pattern being a reverse pattern of a coil element pattern on the surface to sandwich the groove, so as to have a thickness, forming a central conductive film of the coil element on the surface including the groove, by electroforming with the resist pattern as a mask, so as to have a height equal to or less than the thickness, removing the resist pattern and the exposed metallic coating forming a surface conductive film by electroforming with the central conductive film as a foundation, to form a coil element made of the central conductive film and surface conductive film, peeling away the coil element from the substrate, and removing a portion formed in the groove, of the central conductive film by reverse electrolytic etching. | 10-15-2015 |
| 20160115610 | ELECTROFORMED COMPONENT PRODUCTION METHOD - A contact element ( | 04-28-2016 |
| 20160153104 | METHOD FOR MANUFACTURING METAL-FILLED MICROSTRUCTURE | 06-02-2016 |
| 205079000 | Optical element | 1 |
| 20080251384 | MANUFACTURING METHOD FOR STAMPER AND MANUFACTURING METHOD FOR LIGHT GUIDE PLATE USING THE STAMPER - A manufacturing method for a stamper is provided. UV light cure adhesive is sprayed on a substrate and cured to form a three-dimensional pattern. Thereafter, a stamper is formed on the substrate and the three-dimensional pattern, such that the stamper has a first pattern opposite to the three-dimensional pattern. Afterwards, the stamper is separated from the substrate and the three-dimensional pattern. The stamper is disposed in a cavity of an injection molding machine to form a light guide plate. The light guide plate has a second pattern identical with the three-dimensional pattern. | 10-16-2008 |
