Class / Patent application number | Description | Number of patent applications / Date published |
174094000 | Bare-conductor | 38 |
20090139765 | FEEDTHRU ASSEMBLY - A feedthru assembly configured to provide a conductive path extending between an interior of an enclosure and an exterior of the enclosure includes a flange, at least one conductive pin, and at least one insulative member. The flange is configured to couple to the enclosure and has one or more holes therein. The at least one conductive pin includes a hollow lumen extending therethrough and is configured to extend through the at least one or more holes of the flange such that a proximal end of the at least one pin is in communication with the interior of the enclosure and a distal end of the at least one pin is in communication with the exterior of the enclosure. The at least one insulative member is configured to prevent the at least one pin from making physical contact with the flange. | 06-04-2009 |
20090229881 | Method for Interconnecting Electric Cables - A method for interconnecting a first electric cable, constituted by a carbon fibre bundle enveloped in a first insulating sheath, with a second cable constituted by a metallic conductor enveloped in a second insulating sheath; the method provides for the removal of a first portion of the first sheath that covers a first end of the carbon fibre bundle, and the removal of a second portion of the second sheath that covers a second end of the metallic conductor, for an extension greater than that of the first portion. The method then provides for the spiral-like winding of the second end of the metallic conductor, starting from the first end of the first cable, until such metallic conductor affects the first sheath, and then the change of direction of advancement of the spiral defined by such second end, to provide at least one loop that covers the first sheath. The method then provides for the spiral-like winding of the metallic conductor in a direction of the first end of the bundle and the mutual alignment of the first and second cables, and then the addition of at least one layer of tin or other conductor or covering element to totally cover the second end of the metallic conductor. | 09-17-2009 |
20100096185 | WIRING HARNESS AND A METHOD FOR PRODUCING THE SAME, AND A METHOD FOR CONNECTING INSULATED WIRES - A wiring harness which is excellent in peel strength at a joining portion where conductors of electric wires are joined together, even if at least one of the electric wires have a small diameter. A wiring harness includes insulated wires whose conductors are partly exposed, and a metal leaf with which the exposed conductors are bound, where the bound conductors are welded preferably by ultrasonic welding, and the conductors including elemental wires have a joining portion where the elemental wires are joined together, the joining portion being inside the metal leaf. The elemental wires and the metal leaf are preferably made from copper, a copper alloy, aluminum and/or an aluminum alloy, and are preferably made from a same metal or a same alloy. At least one of the conductors preferably has a cross-sectional area of 0.35 mm | 04-22-2010 |
20100101859 | CONDUCTIVE CONNECTOR FOR ELECTRONIC COMPONENTS - A conductive connector for electrically connecting electronic components comprises a first conductive body and a second conductive body. At least one protrusion is defined in the second conductive body. The first conductive body and the second conductive body are joined together. The at least one protrusion abuts the first conductive body. | 04-29-2010 |
20100206632 | Connection Structure, Power Module and Method of Manufacturing the Same - In ultrasonic bonding of a metal terminal to a substrate pad, a thin buffer metal layer which is formed of a soft metal or a highly slidable metal is interposed between a terminal edge and a pad so as to prevent direct contact between an end of the terminal and the pad upon bonding. This makes it possible to prevent abrasion and a crack in the pad at the end of the terminal caused by pressure and an ultrasonic wave upon the ultrasonic bonding. This makes it possible to realize a compact bonded structure with high reliability. | 08-19-2010 |
20100230161 | Joint Structure Between a Wound Coil and An IC-Chip for a Noncontact RFID Device and Methods of Manufacturing The Same - The present invention aims to provide such a joint structure of a wound coil | 09-16-2010 |
20100294565 | LEAD-FREE SOLDER FOR VEHICLES AND AN VEHICLE-MOUNTED ELECTRONIC CIRCUIT - A Sn—Ag—Cu—Bi lead-free solder which can be used for soldering of vehicle-mounted electronic circuits and which has excellent resistance to heat cycles and mechanical strength is provided. The solder consists essentially of Ag: 2.8-4 mass %, Bi: 1.5-6 mass %, Cu: 0.8-1.2 mass %, and a remainder of Sn. | 11-25-2010 |
20100294566 | WINDOWPANE HAVING AN ELECTRICAL FLAT CONNECTING ELEMENT - The present invention describes a windowpane, in particular vehicle windowpane, having at least one flat-conductor soldered connecting element for making electrical contact, which flat-conductor soldered connecting element has at least one electrically insulating plastic layer and one electrically conductive layer or foil which is connected to a soldering surface for soldering on a line connection which leads on from the windowpane, and which flat-conductor soldered connecting element is adhesively attached to an outer surface of the windowpane, characterized in that at least one electrically insulating buffer layer is provided between a section of the electrically conductive layer or foil with a freely exposed soldering surface, on the one hand, and the surface of the windowpane, on the other. | 11-25-2010 |
20110036628 | SOLDER BONDING STRUCTURE AND SOLDERING FLUX - Disclosed is a solder bonding structure which is capable of retaining sufficient solder bonding strength and ensuring high bonding reliability even in severe environments having an extremely large temperature difference. In the solder bonding structure, an electronic component | 02-17-2011 |
20110100709 | SPD FILMS AND LIGHT VALVE LAMINATES WITH IMPROVED BUS-BAR CONNECTIONS - A connection between a power bus and a conducting layer of a suspended particle device in accordance with an embodiment of the present application includes an adhesive combined with metallic particles to impart both good adhesion and electrical conductivity. The adhesive is applied to a surface of the conducting layer. A conducting copper foil or conducting fabric is adhered to the adhesive and forms at least a portion of the power bus. | 05-05-2011 |
20110192647 | PARALLEL STRUCTURE HIGH CONDUCTIBILITY CABLE WITH CONDUCTOR KEEPER - A cable has a conductor keeper, multiple bare conductors, a dielectric tape, a plastic jacket and two copper cylinders. The conductor keeper has multiple grooves. Each bare conductor is mounted in a corresponding groove of the conductor keeper and has a first end and a second end. The first end and second end of the bare conductor protrude out of the conductor keeper respectively so as to form two spaces. The dielectric tape is wrapped around the conductor keeper. The plastic jacket is coated around the dielectric tape. Two copper cylinders are mounted in the spaces of the bare conductors respectively to make the bare conductors surround the copper cylinders and the bare conductors connect to each other in parallel. Therefore, the skin effect is minimized and the bare conductors are efficient in that power consumption and emission of carbon dioxide during copper-smelting are significantly reduced. | 08-11-2011 |
20110278063 | Precise-Aligned Lock-and-Key Bonding Structures - Copper (Cu)-to-Cu bonding techniques are provided. In one aspect, a bonding method is provided. The method includes the following steps. A first bonding structure is provided having at least one copper pad embedded in a first insulator and at least one via in the first insulator over the copper pad, wherein the via has tapered sidewalls. A second bonding structure is provided having at least one copper stud embedded in a second insulator, wherein a portion of the copper stud is exposed for bonding and has a domed shape. The first bonding structure is bonded to the second bonding structure by way of a copper-to-copper bonding between the copper pad and the copper stud, wherein the via and the copper stud fit together like a lock-and-key. A bonded structure is also provided. | 11-17-2011 |
20120199393 | LEAD-FREE SOLDER ALLOY, CONNECTING MEMBER AND A METHOD FOR ITS MANUFACTURE, AND ELECTRONIC PART - A lead-free solder which can reduce the occurrence of voids and a connecting member which uses the solder and has excellent adhesion, bonding strength, and workability are provided. The lead-free solder alloy has a composition consisting essentially of Sn: 0.1-3% and/or Bi: 0.1-2%, and a remainder of In and unavoidable impurities and has the effect of suppressing the occurrence of voids at the time of soldering. The connecting member is prepared by melting the lead-free solder alloy, immersing a metal substrate in the melt, and applying ultrasonic vibrations to the molten lead-free solder alloy and the metal substrate to form a lead-free solder alloy layer on the surface of the metal substrate. | 08-09-2012 |
20120228026 | ANISOTROPIC CONDUCTIVE FILM, CONNECTION STRUCTURE AND METHOD OF PRODUCING THE SAME - An anisotropic conductive film is obtained by dispersing conductive particles in an insulating adhesive composition including a (meth)acrylate-based monomer composition, a radical polymerization initiator, and a film-forming resin. The (meth)acrylate-based monomer composition includes a (meth)acrylate-based monomer which has a cyclic ester residue or a cyclic amide residue represented by the formula (1): | 09-13-2012 |
20120241216 | COMPRESSION AND COLD WELD SEALING METHODS AND DEVICES - Compression cold welding methods, joint structures, and hermetically sealed containment devices are provided. The method includes providing a first substrate having at least one first joint structure which comprises a first joining surface, which surface comprises a first metal; providing a second substrate having at least one second joint structure which comprises a second joining surface, which surface comprises a second metal; and compressing together the at least one first joint structure and the at least one second joint structure to locally deform and shear the joining surfaces at one or more interfaces in an amount effective to form a metal-to-metal bond between the first metal and second metal of the joining surfaces. Overlaps at the joining surfaces are effective to displace surface contaminants and facilitate intimate contact between the joining surfaces without heat input. Hermetically sealed devices can contain drug formulations, biosensors, or MEMS devices. | 09-27-2012 |
20130000978 | Joint Structures Having Organic Preservative Films - The inventive concept provides methods for inhibiting the formation of one or more oxides on metal bumps during the formation of solder joint structures and solder joint structures including one or more preservative films. In some embodiments, the solder joint structure includes a metal bump having a preservative film disposed on the surface thereof. | 01-03-2013 |
20130056268 | ELECTRICAL CONNECTOR, AN INSERT FOR AN ELECTRICAL CONNECTOR AND AN ELECTRICAL ASSEMBLY - An electrical connector, an insert for an electrical connector, and an electrical assembly are disclosed. The electrical connector includes a conductive housing and a conductive insert positioned within the conductive housing. The conductive housing includes a configuration for receiving a conductor and being in electrical communication with the conductor through the insert. | 03-07-2013 |
20130140083 | ADHESIVE COMPOSITION, FILM-LIKE ADHESIVE, ADHESIVE SHEET, CIRCUIT CONNECTION STRUCTURE, METHOD FOR CONNECTING CIRCUIT MEMBERS, USE OF ADHESIVE COMPOSITION, USE OF FILM-LIKE ADHESIVE AND USE OF ADHESIVE SHEET - An adhesive composition for bonding a first circuit member including a first circuit electrode formed on a first circuit substrate and a second circuit member including a second circuit electrode formed on a second circuit substrate, the first circuit electrode and the second circuit electrode being electrically connected, wherein at least one substrate among the first circuit substrate and the second circuit substrate includes a thermoplastic resin having a glass transition temperature of not more than 200° C. The adhesive composition contains core-shell type silicon particles having a core layer and a shell layer provided for coating the core layer. | 06-06-2013 |
20130140084 | Alloyed 2N Copper Wires for Bonding in Microelectronics Devices - An alloyed 2N copper wire for bonding in microelectronics contains 2N copper and one or more corrosion resistance alloying materials selected from Ag, Ni, Pd, Au, Pt, and Cr. A total concentration of the corrosion resistance alloying materials is between about 0.009 wt % and about 0.99 wt %. | 06-06-2013 |
20130140085 | ANISOTROPIC CONDUCTIVE MATERIAL AND PROCESS FOR PRODUCTION THEREOF, AND MOUNTING BODY AND PROCESS FOR PRODUCTION THEREOF - A process margin is improved and high connection reliability is obtained. Disclosed is an anisotropic conductive material including an adhesive composite and conductive particles dispersed in the adhesive composite, the adhesive composite containing a film forming resin, an ethylene vinyl acetate copolymer, a radical polymerizable resin, and a radical polymerization initiator, wherein the ethylene vinyl acetate copolymer to be used has a melt flow rate of not less than 400 g/10 min. | 06-06-2013 |
20130233618 | CONDUCTIVE MATERIAL, BONDING METHOD USING THE SAME, AND BONDED STRUCTURE - A conductive material that includes a metal component consisting of a first metal and a second metal having a melting point higher than that of the first metal, wherein the first metal is Sn or an alloy containing 70% by weight or more of Sn, and the second metal is a metal or alloy which forms an intermetallic compound having a melting point of 310° C. or higher with the first metal and has a lattice constant difference of 50% or greater between itself and the intermetallic compound generated at the circumference of the second metal. | 09-12-2013 |
20130264116 | Nanotube Material Having Conductive Deposits to Increase Conductivity - An apparatus having a conductive body defined by a plurality of nanotubes forming a planar structure. The apparatus further includes a plurality of junctions, formed by adjacent nanotubes, and a plurality of conductive deposits positioned at the junctions to electrically join the adjacent nanotubes at the junctions and reduce electrical resistance between the nanotubes, thereby increasing overall conductivity of the body. | 10-10-2013 |
20130319762 | Transient liquid phase, pressureless joining of aluminum nitride components - A monolithic, substantially hermetic joining or bonding of two or more aluminum nitride (“AlN”) ceramic components is made by promoting transient liquid phase sintering near the contact areas between the components. In a first approach, AlN particles are combined with a rare earth oxide sintering additive such as yttrium oxide (Y2O3) in a joining paste can be applied between the joining surfaces of fired ceramic preformed components prior to final firing to weld the components together. In a second approach, the additive is added to green mixture, and the components having different shrinkage aspect ratios are mated and cofired in an atmosphere containing a partial pressure of the additive. The additive encourages wetting and diffusion of the liquid phases present on the surfaces of ceramic interface particles in the contact areas during final firing. Such processes can be used to form complex ceramic structures such as a ceramic susceptor used in integrated circuit fabrication. The components can have a plurality of embedded metallized electronic traces which can be electrically interconnected across the interface between the components. | 12-05-2013 |
20140138155 | GLAZING WITH A SOLDERED CONNECTOR - A glazing is disclosed comprising at least one ply of glass having an electrically conductive component on at least one surface, and an electrical connector electrically connected to the electrically conductive component through a soldered joint, the solder of the joint having a composition comprising 0.5 wt % or more indium, wherein the electrical connector comprises a nickel plated contact for contacting the solder. Also disclosed are solders having a composition comprising 14 to 75 wt % In, 14 to 75 wt % Sn, to 5 wt % Ag, to 5 wt % Ni, and less than 0.1 wt % Pb. Also disclosed is use of a solder having a composition comprising 0.5 wt % or more indium to solder a nickel plated electrical connector to an electrically conductive component on the surface of a ply of glass. The aspects of the invention improve the durability of electrical connections on glazing. | 05-22-2014 |
20140144701 | COMPONENT COMPOSITE BETWEEN TWO COMPONENTS USED FOR CURRENTCONDUCTION AND METHOD FOR MANUFACTURING A COMPONENT COMPOSITE - A component composite between two components used for current conduction, having a receptacle opening formed on the first component and a connection section of the second component, which is situated in the receptacle opening, the connection section of the second component being configured to be pin-shaped and a press-fit connection being formed between the receptacle opening and the connection section. In particular, it is provided that the receptacle opening is configured to be a blind hole. | 05-29-2014 |
20140158423 | Rapidly solidifying Pb-free Sn-Ag-Cu-Al or Sn-Cu-Al solder - A solder alloy includes Sn, optional Ag, Cu, and Al wherein the solder alloy composition together with the solder alloy superheat temperature and rapid cooling rate from the superheat temperature are controlled to provide a dispersion of fine hard Cu—Al intermetallic particles in an as-solidified solder alloy microstructure wherein the particles are retained even after multiple solder reflow cycles often used in modern electronic assembly procedures to provide a particle strengthening to the solder joint microstructure as well as exert a grain refining effect on the solder joint microstructure, providing a strong, impact- and thermal aging-resistant solder joint that has beneficial microstructural features and is substantially devoid of Ag | 06-12-2014 |
20140158424 | METHOD FOR PRODUCING A PANE HAVING AN ELECTRICAL CONNECTION ELEMENT - A method of producing a pane having at least one electrical connection element is described. The method includes: applying soldering compound to at least one contact face of the connection element, arranging the connection element over the soldering compound on a region of an electrically conductive structure on a substrate, and connecting the connection element to the electrically conductive structure by means of the soldering compound with introduction of heat. | 06-12-2014 |
20140262501 | DURABLE COPPER TO ALUMINUM WELDED CONNECTION - A welded electrical connection includes an aluminum electrical conductor welded to a copper electrical conductor. The copper electrical conductor and the aluminum electrical conductor form a butt joint, A ferrule is over the butt joint and attached to the copper electrical conductor and the aluminum electrical conductor. The ferrule is not directly attached to welded portions of the copper electrical conductor and the aluminum electrical conductor. In some embodiments, weld flash is between the butt joint and the ferrule. | 09-18-2014 |
20140291021 | JUNCTION STRUCTURE FOR AN ELECTRONIC DEVICE AND ELECTRONIC DEVICE - A junction structure for electronic device having an excellent bonding strength is provided. A junction structure for electronic device in accordance with one aspect of the present invention includes a first metal layer containing nickel and a second metal layer containing gold, tin, and nickel, while the second metal layer includes an AuSn eutectic phase. | 10-02-2014 |
20140326501 | Electric cable, method for producing an electric cable, and welding device for producing an electric cable - Electric cable | 11-06-2014 |
20140345939 | JOINING METHOD, METHOD FOR PRODUCING ELECTRONIC DEVICE AND ELECTRONIC PART - In joining a first metal member composed of a first metal to a second metal member composed of a second metal with a joining material interposed therebetween, the joining material including a low melting point metal having a lower melting point than the first metal and/or the second metal, the low melting point metal composing the joining material is Sn or an alloy containing Sn, at least one of the first metal and the second metal is a metal or an alloy which forms an intermetallic compound with the low melting point metal composing the joining material, and heat treatment is performed at a temperature at which the low melting point metal melts in a state of locating the joining material between the first metal member and the second metal member. | 11-27-2014 |
20150014055 | ELECTRICAL GROUNDING AND STRUCTURAL DEVICE FOR DISSIMILAR METAL COMPONENTS - In one exemplary embodiment of the invention, an electrical grounding device for dissimilar metals is provided. The device includes a body comprising adjacent first and second plate portions, the body including a first surface formed from a first metal and an opposite second surface formed from a second metal. The first plate portion is folded onto the second plate portion such that a portion of the first surface of the first plate portion contacts a portion of the first surface of the second plate portion. The first surface of the first plate portion is configured to couple to a first component formed from the first metal and the second surface of the second plate portion is configured to couple to a second component formed from the second metal, the body electrically coupling the first component and the second component to facilitate electrically connecting the first and second components. | 01-15-2015 |
20150068803 | PLUG CONNECTOR WITH IMPROVED INSULATIVE HOUSING FOR RETAINING TERMINALS - An electrical connector includes an insulative housing defining a chamber, a number of terminals mounted in the insulative housing, and an insulative block mounted to the insulative housing. Each terminal includes a mounting section mounted in the insulative housing, a contacting section protruding forwards from the mounting portion, and a soldering section protruding backwards from the mounting portion. The contacting sections are exposed to the chamber. The insulative block has a number of guiding ribs and a number of stopping ribs located behind the guiding ribs respectively. Two adjacent guiding ribs define a receiving slot for receiving the soldering section. The stopping rib has a top blocking section preventing the soldering sections from moving upwards. | 03-12-2015 |
20150380833 | WIRE TERMINATION USING FIXTURING ELEMENTS - A method for forming a connection between a wire and a pin includes placing a fixturing element over the pin, capturing the wire between an upper surface and a lower surface of the fixturing element, compressing the fixturing element to hold the wire around the pin and forming a fixed connection between the wire and the pin. A system for forming an electrical connection includes a pin, a fixturing element disposed around the pin, and a wire placed around pin and sandwiched between an upper surface and a lower surface of the fixturing element. | 12-31-2015 |
20160172837 | POWER CABLE POLYMER JOINT | 06-16-2016 |
20110120770 | ELECTRONIC PACKAGE, DISPLAY DEVICE AND ELECTRONIC APPARATUS - Provided is an electronic package wherein a built-in chassis (CS) and an FPC substrate ( | 05-26-2011 |
20130062121 | ELECTRONIC UNIT - An electronic unit includes: a plate-shaped support member having an insulating surface and a conductive surface that are opposed to each other; a cut-and-raised section provided in the support member, and having a contact that is bent to protrude toward the conductive surface, and a pair of through holes provided at side faces of the cut-and-raised section; and a substrate inserted into the pair of through holes, and with which the contact is in elastic and electric contact. | 03-14-2013 |
20140151119 | COMPONENT COMPOSITE OF TWO COMPONENTS USED FOR CURRENT CONDUCTION, METHOD FOR MANUFACTURING A COMPONENT COMPOSITE, AND USE OF A COMPONENT COMPOSITE - A composite of two components which are used for current conduction, includes: a through opening formed in a first component; and a connection section of a second component which is insertable into the through opening in an installation direction so that a friction-locked connection in the form of a press-fit connection is formed at least regionally between the through opening and the connection section. The connection section and a holding section of the second component protrude beyond the first component in the area of the through opening in the installation direction in the installed state, and the holding section has at least one area for an installation aid which is reduced in cross section in relation to the cross-sectional area of the through opening. | 06-05-2014 |
174094000 | Separable | 3 |
20090139765 | FEEDTHRU ASSEMBLY - A feedthru assembly configured to provide a conductive path extending between an interior of an enclosure and an exterior of the enclosure includes a flange, at least one conductive pin, and at least one insulative member. The flange is configured to couple to the enclosure and has one or more holes therein. The at least one conductive pin includes a hollow lumen extending therethrough and is configured to extend through the at least one or more holes of the flange such that a proximal end of the at least one pin is in communication with the interior of the enclosure and a distal end of the at least one pin is in communication with the exterior of the enclosure. The at least one insulative member is configured to prevent the at least one pin from making physical contact with the flange. | 06-04-2009 |
20090229881 | Method for Interconnecting Electric Cables - A method for interconnecting a first electric cable, constituted by a carbon fibre bundle enveloped in a first insulating sheath, with a second cable constituted by a metallic conductor enveloped in a second insulating sheath; the method provides for the removal of a first portion of the first sheath that covers a first end of the carbon fibre bundle, and the removal of a second portion of the second sheath that covers a second end of the metallic conductor, for an extension greater than that of the first portion. The method then provides for the spiral-like winding of the second end of the metallic conductor, starting from the first end of the first cable, until such metallic conductor affects the first sheath, and then the change of direction of advancement of the spiral defined by such second end, to provide at least one loop that covers the first sheath. The method then provides for the spiral-like winding of the metallic conductor in a direction of the first end of the bundle and the mutual alignment of the first and second cables, and then the addition of at least one layer of tin or other conductor or covering element to totally cover the second end of the metallic conductor. | 09-17-2009 |
20100096185 | WIRING HARNESS AND A METHOD FOR PRODUCING THE SAME, AND A METHOD FOR CONNECTING INSULATED WIRES - A wiring harness which is excellent in peel strength at a joining portion where conductors of electric wires are joined together, even if at least one of the electric wires have a small diameter. A wiring harness includes insulated wires whose conductors are partly exposed, and a metal leaf with which the exposed conductors are bound, where the bound conductors are welded preferably by ultrasonic welding, and the conductors including elemental wires have a joining portion where the elemental wires are joined together, the joining portion being inside the metal leaf. The elemental wires and the metal leaf are preferably made from copper, a copper alloy, aluminum and/or an aluminum alloy, and are preferably made from a same metal or a same alloy. At least one of the conductors preferably has a cross-sectional area of 0.35 mm | 04-22-2010 |
20100101859 | CONDUCTIVE CONNECTOR FOR ELECTRONIC COMPONENTS - A conductive connector for electrically connecting electronic components comprises a first conductive body and a second conductive body. At least one protrusion is defined in the second conductive body. The first conductive body and the second conductive body are joined together. The at least one protrusion abuts the first conductive body. | 04-29-2010 |
20100206632 | Connection Structure, Power Module and Method of Manufacturing the Same - In ultrasonic bonding of a metal terminal to a substrate pad, a thin buffer metal layer which is formed of a soft metal or a highly slidable metal is interposed between a terminal edge and a pad so as to prevent direct contact between an end of the terminal and the pad upon bonding. This makes it possible to prevent abrasion and a crack in the pad at the end of the terminal caused by pressure and an ultrasonic wave upon the ultrasonic bonding. This makes it possible to realize a compact bonded structure with high reliability. | 08-19-2010 |
20100230161 | Joint Structure Between a Wound Coil and An IC-Chip for a Noncontact RFID Device and Methods of Manufacturing The Same - The present invention aims to provide such a joint structure of a wound coil | 09-16-2010 |
20100294565 | LEAD-FREE SOLDER FOR VEHICLES AND AN VEHICLE-MOUNTED ELECTRONIC CIRCUIT - A Sn—Ag—Cu—Bi lead-free solder which can be used for soldering of vehicle-mounted electronic circuits and which has excellent resistance to heat cycles and mechanical strength is provided. The solder consists essentially of Ag: 2.8-4 mass %, Bi: 1.5-6 mass %, Cu: 0.8-1.2 mass %, and a remainder of Sn. | 11-25-2010 |
20100294566 | WINDOWPANE HAVING AN ELECTRICAL FLAT CONNECTING ELEMENT - The present invention describes a windowpane, in particular vehicle windowpane, having at least one flat-conductor soldered connecting element for making electrical contact, which flat-conductor soldered connecting element has at least one electrically insulating plastic layer and one electrically conductive layer or foil which is connected to a soldering surface for soldering on a line connection which leads on from the windowpane, and which flat-conductor soldered connecting element is adhesively attached to an outer surface of the windowpane, characterized in that at least one electrically insulating buffer layer is provided between a section of the electrically conductive layer or foil with a freely exposed soldering surface, on the one hand, and the surface of the windowpane, on the other. | 11-25-2010 |
20110036628 | SOLDER BONDING STRUCTURE AND SOLDERING FLUX - Disclosed is a solder bonding structure which is capable of retaining sufficient solder bonding strength and ensuring high bonding reliability even in severe environments having an extremely large temperature difference. In the solder bonding structure, an electronic component | 02-17-2011 |
20110100709 | SPD FILMS AND LIGHT VALVE LAMINATES WITH IMPROVED BUS-BAR CONNECTIONS - A connection between a power bus and a conducting layer of a suspended particle device in accordance with an embodiment of the present application includes an adhesive combined with metallic particles to impart both good adhesion and electrical conductivity. The adhesive is applied to a surface of the conducting layer. A conducting copper foil or conducting fabric is adhered to the adhesive and forms at least a portion of the power bus. | 05-05-2011 |
20110192647 | PARALLEL STRUCTURE HIGH CONDUCTIBILITY CABLE WITH CONDUCTOR KEEPER - A cable has a conductor keeper, multiple bare conductors, a dielectric tape, a plastic jacket and two copper cylinders. The conductor keeper has multiple grooves. Each bare conductor is mounted in a corresponding groove of the conductor keeper and has a first end and a second end. The first end and second end of the bare conductor protrude out of the conductor keeper respectively so as to form two spaces. The dielectric tape is wrapped around the conductor keeper. The plastic jacket is coated around the dielectric tape. Two copper cylinders are mounted in the spaces of the bare conductors respectively to make the bare conductors surround the copper cylinders and the bare conductors connect to each other in parallel. Therefore, the skin effect is minimized and the bare conductors are efficient in that power consumption and emission of carbon dioxide during copper-smelting are significantly reduced. | 08-11-2011 |
20110278063 | Precise-Aligned Lock-and-Key Bonding Structures - Copper (Cu)-to-Cu bonding techniques are provided. In one aspect, a bonding method is provided. The method includes the following steps. A first bonding structure is provided having at least one copper pad embedded in a first insulator and at least one via in the first insulator over the copper pad, wherein the via has tapered sidewalls. A second bonding structure is provided having at least one copper stud embedded in a second insulator, wherein a portion of the copper stud is exposed for bonding and has a domed shape. The first bonding structure is bonded to the second bonding structure by way of a copper-to-copper bonding between the copper pad and the copper stud, wherein the via and the copper stud fit together like a lock-and-key. A bonded structure is also provided. | 11-17-2011 |
20120199393 | LEAD-FREE SOLDER ALLOY, CONNECTING MEMBER AND A METHOD FOR ITS MANUFACTURE, AND ELECTRONIC PART - A lead-free solder which can reduce the occurrence of voids and a connecting member which uses the solder and has excellent adhesion, bonding strength, and workability are provided. The lead-free solder alloy has a composition consisting essentially of Sn: 0.1-3% and/or Bi: 0.1-2%, and a remainder of In and unavoidable impurities and has the effect of suppressing the occurrence of voids at the time of soldering. The connecting member is prepared by melting the lead-free solder alloy, immersing a metal substrate in the melt, and applying ultrasonic vibrations to the molten lead-free solder alloy and the metal substrate to form a lead-free solder alloy layer on the surface of the metal substrate. | 08-09-2012 |
20120228026 | ANISOTROPIC CONDUCTIVE FILM, CONNECTION STRUCTURE AND METHOD OF PRODUCING THE SAME - An anisotropic conductive film is obtained by dispersing conductive particles in an insulating adhesive composition including a (meth)acrylate-based monomer composition, a radical polymerization initiator, and a film-forming resin. The (meth)acrylate-based monomer composition includes a (meth)acrylate-based monomer which has a cyclic ester residue or a cyclic amide residue represented by the formula (1): | 09-13-2012 |
20120241216 | COMPRESSION AND COLD WELD SEALING METHODS AND DEVICES - Compression cold welding methods, joint structures, and hermetically sealed containment devices are provided. The method includes providing a first substrate having at least one first joint structure which comprises a first joining surface, which surface comprises a first metal; providing a second substrate having at least one second joint structure which comprises a second joining surface, which surface comprises a second metal; and compressing together the at least one first joint structure and the at least one second joint structure to locally deform and shear the joining surfaces at one or more interfaces in an amount effective to form a metal-to-metal bond between the first metal and second metal of the joining surfaces. Overlaps at the joining surfaces are effective to displace surface contaminants and facilitate intimate contact between the joining surfaces without heat input. Hermetically sealed devices can contain drug formulations, biosensors, or MEMS devices. | 09-27-2012 |
20130000978 | Joint Structures Having Organic Preservative Films - The inventive concept provides methods for inhibiting the formation of one or more oxides on metal bumps during the formation of solder joint structures and solder joint structures including one or more preservative films. In some embodiments, the solder joint structure includes a metal bump having a preservative film disposed on the surface thereof. | 01-03-2013 |
20130056268 | ELECTRICAL CONNECTOR, AN INSERT FOR AN ELECTRICAL CONNECTOR AND AN ELECTRICAL ASSEMBLY - An electrical connector, an insert for an electrical connector, and an electrical assembly are disclosed. The electrical connector includes a conductive housing and a conductive insert positioned within the conductive housing. The conductive housing includes a configuration for receiving a conductor and being in electrical communication with the conductor through the insert. | 03-07-2013 |
20130140083 | ADHESIVE COMPOSITION, FILM-LIKE ADHESIVE, ADHESIVE SHEET, CIRCUIT CONNECTION STRUCTURE, METHOD FOR CONNECTING CIRCUIT MEMBERS, USE OF ADHESIVE COMPOSITION, USE OF FILM-LIKE ADHESIVE AND USE OF ADHESIVE SHEET - An adhesive composition for bonding a first circuit member including a first circuit electrode formed on a first circuit substrate and a second circuit member including a second circuit electrode formed on a second circuit substrate, the first circuit electrode and the second circuit electrode being electrically connected, wherein at least one substrate among the first circuit substrate and the second circuit substrate includes a thermoplastic resin having a glass transition temperature of not more than 200° C. The adhesive composition contains core-shell type silicon particles having a core layer and a shell layer provided for coating the core layer. | 06-06-2013 |
20130140084 | Alloyed 2N Copper Wires for Bonding in Microelectronics Devices - An alloyed 2N copper wire for bonding in microelectronics contains 2N copper and one or more corrosion resistance alloying materials selected from Ag, Ni, Pd, Au, Pt, and Cr. A total concentration of the corrosion resistance alloying materials is between about 0.009 wt % and about 0.99 wt %. | 06-06-2013 |
20130140085 | ANISOTROPIC CONDUCTIVE MATERIAL AND PROCESS FOR PRODUCTION THEREOF, AND MOUNTING BODY AND PROCESS FOR PRODUCTION THEREOF - A process margin is improved and high connection reliability is obtained. Disclosed is an anisotropic conductive material including an adhesive composite and conductive particles dispersed in the adhesive composite, the adhesive composite containing a film forming resin, an ethylene vinyl acetate copolymer, a radical polymerizable resin, and a radical polymerization initiator, wherein the ethylene vinyl acetate copolymer to be used has a melt flow rate of not less than 400 g/10 min. | 06-06-2013 |
20130233618 | CONDUCTIVE MATERIAL, BONDING METHOD USING THE SAME, AND BONDED STRUCTURE - A conductive material that includes a metal component consisting of a first metal and a second metal having a melting point higher than that of the first metal, wherein the first metal is Sn or an alloy containing 70% by weight or more of Sn, and the second metal is a metal or alloy which forms an intermetallic compound having a melting point of 310° C. or higher with the first metal and has a lattice constant difference of 50% or greater between itself and the intermetallic compound generated at the circumference of the second metal. | 09-12-2013 |
20130264116 | Nanotube Material Having Conductive Deposits to Increase Conductivity - An apparatus having a conductive body defined by a plurality of nanotubes forming a planar structure. The apparatus further includes a plurality of junctions, formed by adjacent nanotubes, and a plurality of conductive deposits positioned at the junctions to electrically join the adjacent nanotubes at the junctions and reduce electrical resistance between the nanotubes, thereby increasing overall conductivity of the body. | 10-10-2013 |
20130319762 | Transient liquid phase, pressureless joining of aluminum nitride components - A monolithic, substantially hermetic joining or bonding of two or more aluminum nitride (“AlN”) ceramic components is made by promoting transient liquid phase sintering near the contact areas between the components. In a first approach, AlN particles are combined with a rare earth oxide sintering additive such as yttrium oxide (Y2O3) in a joining paste can be applied between the joining surfaces of fired ceramic preformed components prior to final firing to weld the components together. In a second approach, the additive is added to green mixture, and the components having different shrinkage aspect ratios are mated and cofired in an atmosphere containing a partial pressure of the additive. The additive encourages wetting and diffusion of the liquid phases present on the surfaces of ceramic interface particles in the contact areas during final firing. Such processes can be used to form complex ceramic structures such as a ceramic susceptor used in integrated circuit fabrication. The components can have a plurality of embedded metallized electronic traces which can be electrically interconnected across the interface between the components. | 12-05-2013 |
20140138155 | GLAZING WITH A SOLDERED CONNECTOR - A glazing is disclosed comprising at least one ply of glass having an electrically conductive component on at least one surface, and an electrical connector electrically connected to the electrically conductive component through a soldered joint, the solder of the joint having a composition comprising 0.5 wt % or more indium, wherein the electrical connector comprises a nickel plated contact for contacting the solder. Also disclosed are solders having a composition comprising 14 to 75 wt % In, 14 to 75 wt % Sn, to 5 wt % Ag, to 5 wt % Ni, and less than 0.1 wt % Pb. Also disclosed is use of a solder having a composition comprising 0.5 wt % or more indium to solder a nickel plated electrical connector to an electrically conductive component on the surface of a ply of glass. The aspects of the invention improve the durability of electrical connections on glazing. | 05-22-2014 |
20140144701 | COMPONENT COMPOSITE BETWEEN TWO COMPONENTS USED FOR CURRENTCONDUCTION AND METHOD FOR MANUFACTURING A COMPONENT COMPOSITE - A component composite between two components used for current conduction, having a receptacle opening formed on the first component and a connection section of the second component, which is situated in the receptacle opening, the connection section of the second component being configured to be pin-shaped and a press-fit connection being formed between the receptacle opening and the connection section. In particular, it is provided that the receptacle opening is configured to be a blind hole. | 05-29-2014 |
20140158423 | Rapidly solidifying Pb-free Sn-Ag-Cu-Al or Sn-Cu-Al solder - A solder alloy includes Sn, optional Ag, Cu, and Al wherein the solder alloy composition together with the solder alloy superheat temperature and rapid cooling rate from the superheat temperature are controlled to provide a dispersion of fine hard Cu—Al intermetallic particles in an as-solidified solder alloy microstructure wherein the particles are retained even after multiple solder reflow cycles often used in modern electronic assembly procedures to provide a particle strengthening to the solder joint microstructure as well as exert a grain refining effect on the solder joint microstructure, providing a strong, impact- and thermal aging-resistant solder joint that has beneficial microstructural features and is substantially devoid of Ag | 06-12-2014 |
20140158424 | METHOD FOR PRODUCING A PANE HAVING AN ELECTRICAL CONNECTION ELEMENT - A method of producing a pane having at least one electrical connection element is described. The method includes: applying soldering compound to at least one contact face of the connection element, arranging the connection element over the soldering compound on a region of an electrically conductive structure on a substrate, and connecting the connection element to the electrically conductive structure by means of the soldering compound with introduction of heat. | 06-12-2014 |
20140262501 | DURABLE COPPER TO ALUMINUM WELDED CONNECTION - A welded electrical connection includes an aluminum electrical conductor welded to a copper electrical conductor. The copper electrical conductor and the aluminum electrical conductor form a butt joint, A ferrule is over the butt joint and attached to the copper electrical conductor and the aluminum electrical conductor. The ferrule is not directly attached to welded portions of the copper electrical conductor and the aluminum electrical conductor. In some embodiments, weld flash is between the butt joint and the ferrule. | 09-18-2014 |
20140291021 | JUNCTION STRUCTURE FOR AN ELECTRONIC DEVICE AND ELECTRONIC DEVICE - A junction structure for electronic device having an excellent bonding strength is provided. A junction structure for electronic device in accordance with one aspect of the present invention includes a first metal layer containing nickel and a second metal layer containing gold, tin, and nickel, while the second metal layer includes an AuSn eutectic phase. | 10-02-2014 |
20140326501 | Electric cable, method for producing an electric cable, and welding device for producing an electric cable - Electric cable | 11-06-2014 |
20140345939 | JOINING METHOD, METHOD FOR PRODUCING ELECTRONIC DEVICE AND ELECTRONIC PART - In joining a first metal member composed of a first metal to a second metal member composed of a second metal with a joining material interposed therebetween, the joining material including a low melting point metal having a lower melting point than the first metal and/or the second metal, the low melting point metal composing the joining material is Sn or an alloy containing Sn, at least one of the first metal and the second metal is a metal or an alloy which forms an intermetallic compound with the low melting point metal composing the joining material, and heat treatment is performed at a temperature at which the low melting point metal melts in a state of locating the joining material between the first metal member and the second metal member. | 11-27-2014 |
20150014055 | ELECTRICAL GROUNDING AND STRUCTURAL DEVICE FOR DISSIMILAR METAL COMPONENTS - In one exemplary embodiment of the invention, an electrical grounding device for dissimilar metals is provided. The device includes a body comprising adjacent first and second plate portions, the body including a first surface formed from a first metal and an opposite second surface formed from a second metal. The first plate portion is folded onto the second plate portion such that a portion of the first surface of the first plate portion contacts a portion of the first surface of the second plate portion. The first surface of the first plate portion is configured to couple to a first component formed from the first metal and the second surface of the second plate portion is configured to couple to a second component formed from the second metal, the body electrically coupling the first component and the second component to facilitate electrically connecting the first and second components. | 01-15-2015 |
20150068803 | PLUG CONNECTOR WITH IMPROVED INSULATIVE HOUSING FOR RETAINING TERMINALS - An electrical connector includes an insulative housing defining a chamber, a number of terminals mounted in the insulative housing, and an insulative block mounted to the insulative housing. Each terminal includes a mounting section mounted in the insulative housing, a contacting section protruding forwards from the mounting portion, and a soldering section protruding backwards from the mounting portion. The contacting sections are exposed to the chamber. The insulative block has a number of guiding ribs and a number of stopping ribs located behind the guiding ribs respectively. Two adjacent guiding ribs define a receiving slot for receiving the soldering section. The stopping rib has a top blocking section preventing the soldering sections from moving upwards. | 03-12-2015 |
20150380833 | WIRE TERMINATION USING FIXTURING ELEMENTS - A method for forming a connection between a wire and a pin includes placing a fixturing element over the pin, capturing the wire between an upper surface and a lower surface of the fixturing element, compressing the fixturing element to hold the wire around the pin and forming a fixed connection between the wire and the pin. A system for forming an electrical connection includes a pin, a fixturing element disposed around the pin, and a wire placed around pin and sandwiched between an upper surface and a lower surface of the fixturing element. | 12-31-2015 |
20160172837 | POWER CABLE POLYMER JOINT | 06-16-2016 |
20110120770 | ELECTRONIC PACKAGE, DISPLAY DEVICE AND ELECTRONIC APPARATUS - Provided is an electronic package wherein a built-in chassis (CS) and an FPC substrate ( | 05-26-2011 |
20130062121 | ELECTRONIC UNIT - An electronic unit includes: a plate-shaped support member having an insulating surface and a conductive surface that are opposed to each other; a cut-and-raised section provided in the support member, and having a contact that is bent to protrude toward the conductive surface, and a pair of through holes provided at side faces of the cut-and-raised section; and a substrate inserted into the pair of through holes, and with which the contact is in elastic and electric contact. | 03-14-2013 |
20140151119 | COMPONENT COMPOSITE OF TWO COMPONENTS USED FOR CURRENT CONDUCTION, METHOD FOR MANUFACTURING A COMPONENT COMPOSITE, AND USE OF A COMPONENT COMPOSITE - A composite of two components which are used for current conduction, includes: a through opening formed in a first component; and a connection section of a second component which is insertable into the through opening in an installation direction so that a friction-locked connection in the form of a press-fit connection is formed at least regionally between the through opening and the connection section. The connection section and a holding section of the second component protrude beyond the first component in the area of the through opening in the installation direction in the installed state, and the holding section has at least one area for an installation aid which is reduced in cross section in relation to the cross-sectional area of the through opening. | 06-05-2014 |