Class / Patent application number | Description | Number of patent applications / Date published |
174267000 | Termination post | 47 |
20080202804 | PRINTED CIRCUIT BOARD AND METHOD OF PRODUCING THE SAME - There is provided a printed circuit board in which space between pads used for surface mounting can be narrowed and an FPC can be mounted along with electronic components by the reflow method even when the FPC is mounted and a method of producing the same. A printed circuit board is configured such that a solder resist | 08-28-2008 |
20080223612 | WIRING SUBSTRATE AND MANUFACTURING METHOD THEREOF - In a wiring substrate, a wiring pattern is formed on a substrate. An insulating layer covers the substrate. A connection part of the wiring pattern is exposed from the insulating layer. A pedestal for mark is formed on the substrate. An alignment mark is formed on the top part of the pedestal for mark. The alignment mark is formed in a shape in which a length of a horizontal direction and a length of a vertical direction are respectively longer than a length of a horizontal direction and a length of a vertical direction of the top part of the pedestal for mark and a shape in which an area present in the top part of the pedestal for mark is smaller than an area of the top part of the pedestal for mark. An upper surface part of the alignment mark is exposed from the insulating layer. | 09-18-2008 |
20080236882 | Circuit board and method of manufacturing same - The present invention provides a circuit board and a method for manufacturing the circuit board, the circuit board and method allowing a further shorter connection distance between electrodes of a semiconductor device, and also allowing a sufficient thickness of a solder pre-coat in a soldering process. The circuit board comprises bonding pads for being connected with bumps of a semiconductor element, which act as connection terminals, the bonding pads being arrayed in parallel lines on a surface of the circuit board, and, on the adjacent parallel lines, the bonding pads being positioned to form a zigzag pattern along the parallel lines longitudinally. | 10-02-2008 |
20080245559 | Variable interconnect geometry for electronic packages and fabrication methods - Disclosed is a variable interconnect geometry formed on a substrate that allows for increased electrical performance of the interconnects without compromising mechanical reliability. The compliance of the interconnects varies from the center of the substrate to edges of the substrate. The variation in compliance can either be step-wise or continuous. Exemplary low-compliance interconnects include columnar interconnects and exemplary high-compliance interconnects include helix interconnects. A cost-effective implementation using batch fabrication of the interconnects at a wafer level through sequential lithography and electroplating processes may be employed. | 10-09-2008 |
20090151997 | CIRCUIT BOARD - An exemplary embodiment of a circuit board is provided. The circuit board is compatible to a first chip with a first pin number, and a second chip with a second pin number, comprising a plurality of first pads, second pads and third pads. The arrangements of the first and second pads are fit to the pin arrangement of the first chip, and the arrangements of the first and third pads are fit to the pin arrangement of the second chip. The first chip can be placed on the circuit board via the first and second pads, and the second chip can be placed on the circuit board via the first and third pads. | 06-18-2009 |
20090183911 | WIRING BOARD AND METHOD OF MANUFACTURING THE SAME - A wiring board includes an external connection terminal of a cylindrical shape, in which an electrode terminal of the electronic component to be mounted is fitted. In one configuration, a portion of the external connection terminal is electrically connected to a pad portion formed on an electronic component mounting surface side of the wiring board, and the external connection terminal is curvedly formed in such a shape that the outer periphery of the electrode terminal comes into close contact with the inner periphery of the middle portion of the external connection terminal when the electrode terminal is inserted into the external connection terminal. | 07-23-2009 |
20090236139 | PRINTED WIRING BOARD ASSEMBLY AND RELATED METHODS - A method is for making a printed wiring board (PWB) assembly. The method may include forming a first PWB having a plurality of first electrically conductive pads, forming a second PWB including a plurality of electrically conductive traces having exposed ends on an edge surface of the second PWB, and covering the edge surface of the second PWB with an electrically conductive layer. The method may also include selectively removing portions of the electrically conductive layer to define a plurality of second electrically conductive pads electrically connected to corresponding ones of the exposed ends of the electrically conductive traces, and assembling the first and second PWBs together so that the first and second electrically conductive pads are electrically coupled together to define the PWB assembly. | 09-24-2009 |
20090242262 | MULTI-LAYER WIRING BOARD AND METHOD OF MANUFACTURING THE SAME - A multi-layer wiring board without a core substrate includes: a multi-layer laminated structure; first terminals provided on a front surface of the multi-layer laminated structure; second terminals provided on a rear surface of the multi-layer laminated structure; terminal pins bonded to a corresponding one of the second terminals, wherein each of the terminal pins is formed in a nailhead shape that includes a shaft portion and a head portion, and a diameter of the head portion is larger than that of the shaft portion; and a reinforcing plate which has pin insertion openings formed at positions corresponding to the terminal pins and which is fixed to the rear surface, wherein the diameter of the pin insertion openings is smaller than the diameter of the head portion and is larger than the diameter of the shaft portion. | 10-01-2009 |
20090250260 | High density circuit board and manufacturing method thereof - The present invention relates to a high density circuit board for increasing the density of a circuit by impregnating fine circuit patterns inside a top part of a substrate, and a method for manufacturing the same. | 10-08-2009 |
20090283317 | WIRING BOARD - A wiring board between which and a chip to be mounted a resin is filled includes: a substrate body on which a conductor portion to be connected to an electrode terminal of the chip is formed; and an insulating protection film formed on the substrate body and having an opening portion formed therein to expose the conductor portion. The opening portion is formed in such a manner that the edge thereof is positioned along and outside the outer shape of the chip except for a specific corner portion, and that the edge in the specific corner portion is positioned on a side of or inside the outer shape of the chip. | 11-19-2009 |
20090314538 | Dual epoxy dielectric and photosensitive solder mask coatings, and processes of making same - A microelectronic device mounting substrate includes a bond pad with a side wall and an upper surface. A dielectric first layer is disposed on the mounting substrate and a solder mask second layer is disposed on the dielectric first layer. A uniform recess is disposed through the solder mask second layer and the dielectric first layer that exposes the portion of the bond pad upper surface. | 12-24-2009 |
20100000779 | BONDED STRUCTURE AND METHOD OF PRODUCING THE SAME - The invention provides a bonded body including: a ceramic base that is mainly composed of alumina, includes a printed electrode embedded therein and composed of a high-melting-point conductive carbide and alumina, and has a concavity concaved at one surface concaved toward the printed electrode, and a terminal hole extending from the bottom of the concavity to the printed electrode; a terminal that is made of a sintered body of niobium carbide (NbC) /alumina (Al | 01-07-2010 |
20100044097 | Connector, printed circuit board, connecting device connecting them, and method of testing electronic part, using them - The invention has an object of providing a connector for connecting between a printed circuit board and a test device, capable of easily attaching and detaching the connector at low cost. The connector includes at least one conducting pin | 02-25-2010 |
20100132998 | Substrate having metal post and method of manufacturing the same - The invention relates to a substrate having a metal post and a method of manufacturing the same, in which a round solder bump part formed on a metal post melts and flows down along a lateral surface of the metal post by being subjected twice to a reflow process, thus forming a solder bump film for preventing oxidation and corrosion of the metal post. | 06-03-2010 |
20100139970 | WIRING BOARD HAVING LEAD PIN, AND LEAD PIN - A wiring board having a lead pin is provided. The wiring board having the lead pin includes a connecting pad which is formed on the wiring board, and to which the lead pin is bonded through a conductive material. The lead pin includes: a shaft portion; a head portion which is provided on one end of the shaft portion; a protruded portion which is formed on a surface side of the head portion opposed to the connection pad; and a first taper portion which is formed between the head portion and a base part of the shaft portion. | 06-10-2010 |
20100187004 | LEAD PIN FOR MOUNTING SEMICONDUCTOR AND PRINTED WIRING BOARD - A lead pin comprising including a body having a shaft portion and a flange portion. The flange portion has at least one flat portion configured to face a connection pad and groove portions positioned to face toward the connection pad and extending from a peripheral portion toward a center portion of the flange portion, the flat portion includes extending portions extending from a center of the flange toward the peripheral portion of the flange and connected at the center of the flange, and the groove portions are tilted to become deeper toward the peripheral portion of the flange. | 07-29-2010 |
20100270067 | PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - A printed circuit board and a method of manufacturing the printed circuit board are disclosed. In accordance with an embodiment of the present invention, the method includes providing a substrate having a pad formed thereon, forming a resist on the substrate, in which the resist has an opening formed therein such that the pad is exposed, forming a metal post inside the opening such that the metal post is electrically connected to the pad, forming a through-hole in the resist by removing a portion of the resist such that the through-hole surrounds the metal post, and forming a solder layer inside the through-hole and on an upper surface of the metal post so as to cover an exposed surface of the metal post. | 10-28-2010 |
20100300743 | Modified Pillar Design for Improved Flip Chip Packaging - A pillar for flip chip interconnect in an electronic package. The pillar includes an electrically conductive material and a solder wicking inhibitor deposited on the sides of the pillar. The pillar also includes an exposed face for contacting the electrically conductive material and solder material on the substrate. In another embodiment, a method of forming a pillar composed of an electrically conductive material which inhibits solder wicking is provided. The method includes coating the pillar with a solder wicking inhibitor and polishing a face of the pillar to expose the underlying electrically conductive material. | 12-02-2010 |
20110017504 | Z-Directed Ferrite Bead Components for Printed Circuit Boards - A Z-directed ferrite bead component for insertion into a printed circuit board while allowing electrical connection to internal conductive planes contained with the PCB. In one embodiment the Z-directed component is housed within the thickness of the PCB allowing other components to be mounted over it. Signal and dual conductor Z-directed ferrite bead component embodiments are provided. The body may include one or more surface channels or wells extending along at least a portion of the length of the body. Methods for mounting Z-directed components are also provided. | 01-27-2011 |
20110017505 | Z-Directed Connector Components for Printed Circuit Boards - A Z-directed connector component for insertion into a printed circuit board and providing electrical connections to internal conductive planes contained with the PCB and/or to external conductive traces on the surface of the PCB.. In one embodiment the Z-directed component is housed within the thickness of the PCB allowing other components to be mounted over it. The body of the Z-directed connector component may contain one or more conductors and may include one or more surface channels or wells extending along at least a portion of the length of the body. Methods for mounting Z-directed components are also provided. | 01-27-2011 |
20110048791 | PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - A plurality of wiring traces and a plurality of lead wires for plating are formed on a base insulating layer. Each wiring trace and each lead wire for plating are integrally formed with each other. An electrode pad is provided at an end of each wiring trace, and the lead wire for plating is provided to extend from each electrode pad toward the opposite side to the wiring trace. A width of each lead wire for plating is set larger than a width of each wiring trace. | 03-03-2011 |
20110100700 | MULTILAYER PRINTED WIRING BOARD - A multilayer printed wiring board | 05-05-2011 |
20110155443 | Method of Manufacturing Multilayer Wiring Substrate, and Multilayer Wiring Substrate - In a build-up step, a plurality of resin insulation layers and a plurality of conductive layers are alternately laminated in multilayer arrangement on a metal foil separably laminated on a side of a base material, thereby forming a wiring laminate portion. In a drilling step, a plurality of openings are formed in an outermost resin insulation layer through laser drilling so as to expose connection terminals. Subsequently, in a desmear step, smears from inside the openings are removed. In a base-material removing step performed after the build-up step, the base material is removed and the metal foil is exposed. | 06-30-2011 |
20110174530 | Solder Ball Pin - A solder ball pin substantially includes a pillar pin body and an insulator whose opposite end facing a solder ball is formed by a soldering end. On the soldering end, a solderable metal layer is disposed concentrically with the insulator. A small opening whose dimension fits to a diameter of the pin body is defined on a center of the solderable metal layer. A reball end of the pin body penetrates the small opening on the solderable metal layer for fixing to the insulator body. The shape of the pin body could be alternatively formed by a terrace or shaped like a light beam without limitation of apertures with any varied diameters, which results in a flexible structure and the enhanced productivity. The solderable metal layer on the insulator allows the insulator to be solderable; a connection between the pin body and the insulator with the solderable metal layer becomes more compact, and the reliability of the soldering is promoted. Except the soldering part of the pin body, other non-soldered part of the pin body is wrapped in the insulator, which prevents the pin body from the oxidization and an inferior quality. Moreover, the assemblage of the insulator and the pin body does not readily deviate in view of any external force even after the soldering is processed. Thus, the assemblage is precise and controllable. | 07-21-2011 |
20110186342 | SINGLE-LAYERED PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF - A single layered printed circuit board and a method of manufacturing the same are disclosed. In accordance with an embodiment of the present invention, the method can include forming a bonding pad, a circuit pattern and a post on a surface of an insulation film, in which one end part of the post is electrically connected to at least a portion of the circuit pattern, pressing an insulator on the surface of the insulation film, in which the circuit pattern and the post are buried in the insulator, selectively etching the insulator such that the other end part of the post is exposed, and opening a portion of the insulation film such that at least a portion of the bonding pad is exposed. | 08-04-2011 |
20110192641 | MOUNTING BOARD AND METHOD OF MANUFACTURE - A mounting board having a plurality of terminals. The ends of each of the plurality of terminals are inserted into and soldered to through-holes positioned in a printed board, and the terminals are mounted on the printed board. A plurality of pedestals are disposed on one side of the printed board. The pedestals support the terminals. The pedestals are integrally coupled to one another through deformable coupling portions. Mutual displacements among the pedestals are allowed by the coupling portions. | 08-11-2011 |
20110247873 | ADHESIVE FOR BONDING CIRCUIT MEMBERS, CIRCUIT BOARD AND PROCESS FOR ITS PRODUCTION - An adhesive for bonding and securing a semiconductor chip to a circuit board and electrically connecting the electrodes of the two, and containing an adhesive resin composition and an inorganic filler being contained in an amount of 10 to 200 parts by weight of 100 parts by weight of the adhesive resin composition. | 10-13-2011 |
20110247874 | ADHESIVE FOR BONDING CIRCUIT MEMBERS, CIRCUIT BOARD AND PROCESS FOR ITS PRODUCTION - An adhesive for bonding and securing a semiconductor chip to a circuit board and electrically connecting the electrodes of the two, and containing an adhesive resin composition and an inorganic filler being contained in an amount of 10 to 200 parts by weight of 100 parts by weight of the adhesive resin composition. | 10-13-2011 |
20120006592 | WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A wiring board including a first insulation layer, a conductive pattern formed on the first insulation layer, a second insulation layer formed on the conductive pattern and the first insulation layer and having an opening portion exposing at least a portion of the conductive pattern, and a connection conductor formed in the opening portion of the second insulation layer such that the connection conductor is positioned on the portion of the conductive pattern. The connection conductor has a tip portion which protrudes from a surface of the second insulation layer and which has a tapered side surface tapering toward an end of the tip portion. | 01-12-2012 |
20120067638 | ELECTRONIC APPARATUS - First and second terminals project from a circuit board and lie adjacent to each other with an interspace formed between the first and second terminals. An electronic apparatus further includes a projecting member projecting along a neighboring terminal which is one of the first and second terminals at such a position that the neighboring terminal is located between the projecting member and the interspace. The projecting member is located at an adjacent position adjacent to the neighboring terminal, to attract molten solder from the interspace toward the projecting member during soldering to join the first and second terminals to the circuit board. | 03-22-2012 |
20120085575 | Electronic Apparatus Manufacturing Method, Electronic Component, and Electronic Apparatus - According to one embodiment, a manufacturing method for an electronic apparatus, which includes a housing, a substrate, pads on the substrate, and an electronic component, which includes a component body including a bottom surface, terminals arranged on the bottom surface of the component body, and a thermosetting resin disposed on the bottom surface of the component body and configured to remove an oxide film when heated, and is mounted on the substrate, the method includes putting the electronic component on the substrate, heating the electronic component, thereby softening the resin, causing the softened resin to flow, thereby forcing out a gas between the electronic component and the substrate and filling the resin between the electronic component and the substrate, and further heating the electronic component, thereby solder-bonding the terminals and the pads to one another and curing the resin between the electronic component and the substrate. | 04-12-2012 |
20120111626 | PRINTED CIRCUIT BOARD WITH GOOD PERFORMANCE ON IMPEDANCE - A printed circuit board, comprises an insulative substrate, a grounding layer located on a surface of the insulative substrate and defining a through slot, a plurality of conductive pins located on an outer surface of the printed circuit board; and a fence layer located between the conductive path and the grounding layer. Each conductive pin defines at least a soldering portion. The soldering portion is alignment to the through slot along a vertical direction. | 05-10-2012 |
20120181077 | PRINTED CIRCUIT BOARD UNIT - A printed circuit board unit includes: a printed circuit board including a through hole including first and second inner surfaces opposite to each other; a terminal pin including an insertion portion inserted into the through hole; solder filled into the through hole, and joining the printed circuit board with the terminal pin, wherein the insertion portion includes a base portion abutting the first inner surface, and a protruding portion including: a projection surface projecting from the base portion to the second inner surface and abutting the second inner surface; and a recess surface located at a rear side of the projection surface and spaced apart from the first inner surface, and a length of the protruding portion a thickness direction of the printed circuit board is greater than a thickness of the printed circuit board. | 07-19-2012 |
20120181078 | MULTILAYER PRINTED WIRING BOARD - An IC chip for a high frequency region, particularly a packaged substrate in which no malfunction or error occurs even if 3 GHz is exceeded. A conductive layer on a core substrate is formed at a thickness of 30 μm and a conductor circuit on an interlayer resin insulation layer is formed at a thickness of 15 μm. By thickening the conductive layer, the volume of the conductor can be increased and resistance can be reduced. Further, by using the conductive layer as a power source layer, the capacity of supply of power to an IC chip can be improved. | 07-19-2012 |
20130087376 | INTERPOSER, CIRCUIT BOARD MODULE, AND METHOD FOR MANUFACTURING INTERPOSER - An interposer includes a substrate having first and second opposing surfaces, the substrate having a sheet shape; and a plurality of spring electrodes fixed to the substrate in a certain arrangement, each of the plurality of the spring electrodes including a first pad disposed opposite the first surface of the mesh and extending in a first direction, a second pad disposed opposite the second surface of the mesh and extending in the first direction, and a post extending through the substrate between the first and second surfaces and connecting an end of the first pad to an end of the second pad. | 04-11-2013 |
20130161085 | PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME - Disclosed herein are a printed circuit board (PCB) and a method for manufacturing the same. The PCB includes a base substrate, a circuit layer formed on the base substrate and including a connection pad, a solder resist layer formed on an upper portion of the base substrate and having an opening exposing the connection pad, a metal post formed on upper portions of the connection pad and the solder resist layer and having a plurality of diameters, and a seed layer formed on the upper portion of the solder resist layer and inner walls of the opening along an interface of the metal post. | 06-27-2013 |
20130284509 | CONNECTION STRUCTURE, WIRING SUBSTRATE UNIT, ELECTRONIC CIRCUIT PART UNIT, AND ELECTRONIC APPARATUS - A connection structure includes a column electrode; a first connecting portion connected to one end of the column electrode; and a second connecting portion connected to another end of the column electrode via solder, wherein a height of the column electrode is a width of the first connecting portion or greater. | 10-31-2013 |
20130341078 | Z-DIRECTED PRINTED CIRCUIT BOARD COMPONENTS HAVING A REMOVABLE END PORTION AND METHODS THEREFOR - A Z-directed component for mounting in a mounting hole in a printed circuit board according to one example embodiment includes a main body portion and a tapered end portion that facilitates insertion of the Z-directed component into the mounting hole in the printed circuit board. The tapered end portion is removably attached to the main body portion such that the tapered end portion may be removed after the Z-directed component is inserted into the mounting hole in the printed circuit board. A method for installing a Z-directed component having a removable tapered lead-in into the mounting hole according to one example embodiment includes inserting the Z-directed component into the mounting hole in the printed circuit board with the removable tapered lead-in leading the insertion and after the Z-directed component is inserted into the mounting hole, removing the removable lead-in from the rest of the Z-directed component. | 12-26-2013 |
20140151108 | BASE SUBSTRATE, MOUNTING STRUCTURE, MODULE, ELECTRONIC APPARATUS, AND MOVING OBJECT - An insulating container as a base substrate includes a loading portion disposed on the other surface side, and mounting electrodes (mounting terminals) which are provided on a bottom surface having a front and rear relationship with the other surface and are connected to lands (external terminals) disposed on a printed circuit board using solder, a first end of each of the mounting electrodes on a center portion side of the bottom surface is disposed on a center portion side of the bottom surface with respect to a second end of each of the lands positioned on a center portion side of the bottom surface, and a third end on a side opposite to the first end in a plan view is disposed on a center portion side of the bottom surface with respect to a fourth end on a side opposite to the second end in a plan view. | 06-05-2014 |
20140174811 | PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF - Disclosed herein are a printed circuit board and a manufacturing method thereof. The manufacturing method of the printed circuit board according to an exemplary embodiment of the present invention includes forming an insulating layer for a circuit pattern protection on a base substrate having a predetermined circuit pattern on at least one surface thereof; removing a part of the insulating layer to form an opened region having a predetermined pattern; applying copper particles onto the insulating layer including the opened region and then irradiating laser on a portion corresponding to the opened region; and fusing the copper particles applied onto the opened region by the laser irradiation to one another to form a copper post on the opened region. | 06-26-2014 |
20140262470 | Metal Post Bonding Using Pre-Fabricated Metal Posts - A method includes forming a plurality of metal posts. The plurality of metal posts is interconnected to form a metal-post row by weak portions between neighboring ones of the plurality of metal posts. The weak portions include a same metal as the plurality of metal posts. A majority of each of the plurality of metal posts is separated from respective neighboring ones of the plurality of metal posts. An end portion of each of the plurality of metal posts is plated with a metal. The plurality of metal posts is disposed into a metal post-storage. The method further includes retrieving one of the metal posts from a metal-post storage, and bonding the one of the metal posts on a metal pad. | 09-18-2014 |
20140318849 | FLAT CIRCUIT BODY WITH TERMINAL AND MANUFACTURING METHOD THEREOF - A portion of a flat conductor is exposed from an insulating layer covering at least one of surfaces of the flat conductor. A terminal includes a bottom plate on which the exposed portion of the flat conductor is provided, and crimp claws which are raised at two side edges of the bottom plate so that the exposed portion is disposed therebetween. The exposed portion is folded so as to define a bottom layer which faces the bottom plate and a top layer which faces opposite to the bottom plate. The top layer is configured to be plastically deformed so as to fill a gap between the top layer and inner surfaces of the crimp claws when the crimp claws are crimped onto the top layer, so that the bottom layer is in surface contact with the bottom plate. | 10-30-2014 |
20150041208 | MICRO MECHANICAL ANCHOR FOR 3D ARCHITECTURE - Components and methods of making the same are disclosed herein. In one embodiment, a method of forming a component comprises forming metal anchoring elements at a first surface of a support element having first and second oppositely facing surfaces, the support element having a thickness extending in a first direction between the first and second surfaces, wherein each anchoring element has a downwardly facing overhang surface; and then forming posts having first ends proximate the first surface and second ends disposed above the respective first ends and above the first surface, wherein a laterally extending portion of each post contacts at least a first area of the overhang surface of the respective anchoring element and extends downwardly therefrom, and the overhang surface of the anchoring element resists axial and shear forces applied to the posts at positions above the anchoring elements. | 02-12-2015 |
20150096798 | Interconnections for a substrate associated with a backside reveal - An apparatus relating generally to a substrate is disclosed. In this apparatus, a post extends from the substrate. The post includes a conductor member. An upper portion of the post extends above an upper surface of the substrate. An exterior surface of the post associated with the upper portion is in contact with a dielectric layer. The dielectric layer is disposed on the upper surface of the substrate and adjacent to the post to provide a dielectric collar for the post. An exterior surface of the dielectric collar is in contact with a conductor layer. The conductor layer is disposed adjacent to the dielectric collar to provide a metal collar for the post, where a top surface of each of the conductor member, the dielectric collar and the metal collar have formed thereon a bond structure for interconnection of the metal collar and the conductor member. | 04-09-2015 |
20160037634 | INTERPOSER SUBSTRATE AND METHOD FOR FABRICATING THE SAME - A method of fabricating an interposer substrate provides a carrier having a first wiring layer. The first wiring layer has a plurality of first conductive pillars. A first insulating layer is formed on the carrier. The first conductive pillars are exposed from the first insulating layer. External connection pillars are formed above the first conductive pillars and electrically connected to the first conductive pillars. Then the carrier is removed. The process of fabricating the via can be bypassed in the process by forming a coreless interposer substrate on the carrier, such that the overall cost of the process can be decreased, and the process is simple. The interposer substrate is also provided. | 02-04-2016 |
20160037635 | INTERPOSER SUBSTRATE AND A METHOD OF FABRICATING THE SAME - A method for fabricating an interposer substrate is provided, including forming a wiring layer on a carrier, forming an insulating layer on the carrier, forming on the wiring layer a wiring build-up layer structure that is electrically connected to the wiring layer, forming on the wiring build-up layer structure external connection pillars that are electrically connected to the wiring build-up layer structure, and removing the carrier, with the wiring layer is exposed from a surface of the insulating layer. The fabrication process of the via can be bypassed in the fabrication process by forming coreless interposer substrate on the carrier, such that the overall cost of the fabrication process can be decreased, and the fabrication process is simple. This invention further provides the interposer substrate. | 02-04-2016 |
20160141776 | PRESS FIT ELECTRICAL TERMINAL HAVING A SOLDER TAB SHORTER THAN PCB THICKNESS AND METHOD OF USING SAME - A method of assembling a circuit board may include inserting a first electrical terminal into a first side of a circuit board, and applying a second layer of solder paste to a second side of the circuit board, the second side disposed opposite of the first side. The first electrical terminal may include a solder tab, a maximum length of the solder tab may be shorter than a minimum thickness of the circuit board, and if the first electrical terminal is inserted into the circuit board, the solder tab may extend at least partially into the circuit board without extending entirely through the circuit board. One or more electrical terminals with short and/or long solder tabs may be inserted into the second side of the circuit board and/or one or more electrical components may be attached to second side of circuit board. | 05-19-2016 |