Class / Patent application number | Description | Number of patent applications / Date published |
174667000 | Plastic filled | 13 |
20090095524 | CORE SUBSTRATE AND METHOD OF PRODUCING THE SAME - The core substrate is capable of securely preventing short circuit between an electrically conductive core section and a plated through-hole section. The core substrate comprises: an electrically conductive core section having a pilot hole, through which a plated through-hole section is formed; electrically conductive layers coating the inner face of the pilot hole and a surface of the core section; a gas purging hole being formed in the conductive layer coating the surface of the core section; an insulating material filling a space between the inner face of the pilot hole and an outer circumferential face of the plated through-hole section; and cable layers being laminated on both side faces of the core section. | 04-16-2009 |
20090211808 | Conductor leadthrough, housing device, field apparatus and method for producing a conductor leadthrough - A conductor leadthrough for a field device is for connecting two electrical conductors. The conductor leadthrough comprises an external conductor and a sealing apparatus. The sealing apparatus is divided into a first separation device and a second separation device. The external conductor comprises a hollow internal region that extends along a longitudinal axis of the external conductor. The first separation device and the second separation device are arranged along the longitudinal axis of the external conductor so as to be spaced apart so that they can separate a section of the hollow internal region of the external conductor. A pourable-sealing device is filled into the separated section of the hollow internal region of the external conductor so that the sealing apparatus can provide a leakage rate whose value is below a predeterminable value of a leakage rate. A signal of a predeterminable frequency can be transmitted along the longitudinal axis. | 08-27-2009 |
20100025104 | Electrical bushing, pressure applications, and method for manufacturing such a bushing - Electrical bushing, in particular for pressure applications, with a housing with at least one housing passage and with at least one electrical conductor, which is passed through the housing passage, protrudes at both ends on two housing sides, which are spaced apart from one another, out of in each case one opening of the housing passage out of the housing and is fixed in the housing by means of a tightly sealing material which fills at least the majority of the housing passage. | 02-04-2010 |
20100307818 | SEALED ELECTRICAL FEED-THROUGH ASSEMBLY AND METHODS OF MAKING SAME - An electrical feed-through assembly and method of making an electrical feed-through assembly provide an electrical feed-through assembly that can survive exposure in a high pressure liquid, for example, seawater at least 9000 psi, for substantial periods of time, for example, twenty years, without substantial leakage of the high pressure liquid into or through the electrical feed-through assembly. | 12-09-2010 |
20110083897 | ELECTRIC POWER TERMINAL FEED-THROUGH - A power terminal feed-through includes a housing, at least one current conducting pin and a sealing glass hermetically sealing the at least one current conducting pin to the housing. The at least one current conducting pin defines a peripheral indentation in the surface of the current conducting pin. The sealing glass fills in the peripheral indentation when fused to both the current conducting pin and housing. | 04-14-2011 |
20110259637 | SLEEVE FOR BARRIER CONNECTOR, AND BARRIER CONNECTOR - A barrier connector has a through bore for the passage of cables ( | 10-27-2011 |
20140020951 | METHOD OF FABRICATING HIGH-DENSITY HERMETIC ELECTRICAL FEEDTHROUGHS - A method of fabricating electrical feedthroughs selectively removes substrate material from a first side of an electrically conductive substrate (e.g. a bio-compatible metal) to form an array :of electrically conductive posts in a substrate cavity. An electrically insulating material (e.g. a bio-compatible sealing glass) is then flowed to fill the substrate cavity and surround each post, and solidified. The solidified insulating material is then exposed from an opposite second side of the substrate so that each post is electrically isolated from each other as well as the bulk substrate. In this manner a hermetic electrically conductive feedthrough construction is formed having an array of electrical feedthroughs extending between the first and second sides of the substrate from which it was formed. | 01-23-2014 |
20140048328 | WAVEGUIDE TUBE AND METHOD OF USE THEREOF - A waveguide tube includes a penetration tube and a shielding pipe. The penetration tube extends from an anechoic chamber. The shielding pipe is connected to a distal end of the penetration tube. The penetration tube and the shielding pipe are made of metal and metallic powders are poured into the pipe to sealing and surround an internal electrical cable. An input pipe for the powders extends upward from a top of the shielding pipe. A top end of the input pipe is sealed with a removable upper sealing cap. | 02-20-2014 |
20140110164 | SYSTEM FOR CONTINUOUS ELECTRICAL WELL CABLE FEED-THROUGH FOR A WELLHEAD AND METHOD OF INSTALLATION - An epoxy sealant combined with a transition seal body system for a down hole electric cable transition from a protected cable to separate conductors of three-phase electrical service provides an effective vapor and pressure seal preventing premature failure from temperature and pressure changes in the well bore. The use of epoxy completely surrounding the transition seal body within the penetrator mandrel permits safe and effective field installation of continuous electrical conductors from a wellbore through a pressure sealing wellhead to the surface that is easier to install and more protective than previous mechanical connections. | 04-24-2014 |
20140345934 | LASER BRAZE CERAMIC TO AN IMPLANTABLE MEDICAL DEVICE HOUSING - One aspect is a method of coupling a feedthrough assembly to a surrounding case of an implantable medical device. An insulator having a plurality of conducting elements extending therethrough is provided. The insulator is placed with conducting elements within an opening of a case, thereby defining a narrow space between the insulator and the case. A braze preform is placed adjacent the insulator and case in the narrow space. The insulator is heated with a laser until raising the temperature of the adjacent preform above its melting point such that it fills the space between the insulator and the case. | 11-27-2014 |
20160104947 | Terminal Pin, Feedthrough of an Implantable Electromedical Device and Process for Making the Same - Terminal pin for electrically connecting a carrier of electrical leads or an electronic component by means of a solder connection between the carrier or component and the terminal pin, wherein an end of a pin body is provided with a swaged cap of a material which is harder than the material of the pin body and which has an outer surface which is suitable for making the solder connection, wherein the cap has an inner circumferential edge where the cap is at least locally narrowed to inside of the outer circumference of the pin body, and wherein there is no additional material between the pin body and the cap. | 04-14-2016 |
20160126713 | CERAMIC FEEDTHROUGH BRAZED TO AN IMPLANTABLE MEDICAL DEVICE HOUSING - One aspect is an implantable medical device with a feedthrough assembly having an insulator and a plurality of conducting elements extending therethrough. The feedthrough assembly is placed in a case with an opening defining a narrow space therebetween. A braze material fills the narrow space, thereby hermetically sealing the feedthrough assembly to the case. One of the feedthrough assembly and the case include a feature configured to securely hold the braze and in that the implantable medical device does not include a ferrule. | 05-05-2016 |
20160254080 | METHOD OF FABRICATING HIGH DENSITY HERMETIC ELECTRICAL FEEDTHROUGHS USING INSULATED WIRE BUNDLES | 09-01-2016 |