| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 174536000 | Lead frame | 9 |
| 20090126991 | SUBSTRATE FOR MOUNTING ELECTRONIC PART AND ELECTRONIC PART - The present invention is characterized by a structure having a substrate | 05-21-2009 |
| 20100133002 | APPARATUS, SYSTEM AND METHOD FOR USE IN MOUNTING ELECTRONIC ELEMENTS - The present embodiments provide surface mount devices and/or systems. In some embodiments, the surface mount devices comprise a casing having a recess formed extending at least partially into said casing; and first and second leads each of which is at least partially encased by said casing and each of which has a portion exposed through said recess, wherein at least one of said first and second leads has one or more size reduction features in its said exposed portion that reduces the surface area to provide an increased surface bonding area to said casing around said lead. | 06-03-2010 |
| 20100155135 | ILLUMINATION UNIT - The present invention provides an illumination unit which has the small number of parts and requires relatively small work hour for its assembling. The illumination unit includes a housing; metal terminals which are supported on said housing and are adapted to be supplied with electric power; and an electronic part mounted on said metal terminals. Each of said metal terminals has a mounting portion which is connected by soldering to terminals of said electronic part. | 06-24-2010 |
| 20110042137 | SUSPENDED LEAD FRAME ELECTRONIC PACKAGE - An apparatus and method for packaging an electronic device that mechanically isolates the electronic device from its supporting substrate, eliminating transfer of mechanical stress from the substrate to the device. The apparatus includes a plurality of elongated members that extend from a frame support to a center opening, where the ends of the elongated members together support the electronic device. The shape, material and orientation of the elongated members combine to both support the electronic device and absorb mechanical force transmitted from the substrate to the support frame. In one example, the absorbing portion is substantially perpendicular to the direction of the transmitted force and the transmitted force is absorbed by mechanical displacement of one end of the perpendicular portion. The apparatus and method are particularly effective in eliminating the negative effects of thermal expansion mismatch between the electronic device and its supporting substrate. | 02-24-2011 |
| 20130056261 | LEAD FRAME STRIP WITH IMPROVED PACKAGE SEPARABILITY - A metal lead frame strip is provided for use in manufacturing a packaged electrical device. An engagement portion of the lead frame strip is encapsulated together with the electrical device in a block of encapsulating material to physically secure the lead frame strip to the device package. The device package is later physically separated from the lead frame strip without leaving residual metal exposed on the separated device package. | 03-07-2013 |
| 20130075154 | SILICON-CONTAINING CURABLE COMPOSITION, CURED PRODUCT OF THE SILICON-CONTAINING CURABLE COMPOSITION AND LEAD FRAME SUBSTRATE FORMED OF THE SILICON-CONTAINING CURABLE COMPOSITION - A curable composition includes: 100 parts by mass of a silicon-containing polymer having a Mw of 3,000 to 100,000 obtainable by hydrolysis-condensation of an organosilane mixture including R | 03-28-2013 |
| 20140000958 | CIRCUIT ASSEMBLY | 01-02-2014 |
| 174537000 | Multiple frames | 2 |
| 20090152002 | Optoisolator leadframe assembly - An optoisolator leadframe assembly includes: an emitter leadframe part including a first rail and a plurality of emitter leadframe units, each rail including two rows of emitter leadframes, each having a die-mounting pad; and a receiver leadframe part including a second rail and a plurality of receiver leadframe units, each including two rows of receiver leadframes, each having a die-mounting pad. The die-mounting pads of the emitter leadframes of each row of each of the emitter leadframe units are respectively aligned with and spaced apart from the die-mounting pads of the receiver leadframes of an adjacent row of an adjacent one of the receiver leadframe units. Each of the emitter and receiver leadframe parts is a single piece. | 06-18-2009 |
| 20110180317 | ELECTRONIC COMPONENT PACKAGE, METHOD FOR PRODUCING THE SAME AND INTERPOSER - A package comprising an electronic component, a circuit substrate onto which the electronic component is mounted, and an interposer located between the electronic component and the circuit substrate, allowing them to be electrically connected with each other, wherein the interposer is composed of at least two sub-interposers, and the at least two sub-interposers lie in the same plane to be disposed only on electrode terminal-forming areas of both of the electronic component and the circuit substrate. | 07-28-2011 |
