| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 174521000 | Encapsulated (potted, molded, plastic filled) | 52 |
| 20080236885 | THIN FILM DEVICE AND METHOD FOR MANUFACTURING THE SAME - A terminal electrode body on a substrate is exposed relative to a resin layer, protruding out beyond the side of the resin layer. That is, the terminal electrode body is not covered by the resin layer. The electronic element is covered by an insulating layer and the terminal electrode body and the electronic element are electrically connected. Hence, an electric signal applied to the terminal electrode body can be transmitted to the electronic element. A cover layer covers the terminal electrode body and the boundary between the terminal electrode body and the resin layer. | 10-02-2008 |
| 20090038843 | Functional element-mounted module and a method for producing the same - A functional element-mounted module can be decreased in size and requires no costly and special members for a light transition member. A substrate is used, on which an optical functional element having an optical function part and bonding pads therearound is mounted by wire bonding, with an upper face of the element upward. A bank to dam a liquid sealing resin is provided around the optical functional element on the substrate, and the liquid sealing resin is dropped and filled between the optical functional element and the bank such that the bonding pads and partial gold wires for the wire bonding are exposed. A package-component member having a hole corresponding to the optical functional element is abutted to the bank such that the hole is opposed to the function part of the functional element. Thereby, the package-component member is contacted to the liquid sealing resin. The package-component member is fixed to the substrate by curing the liquid sealing resin, and the bank is cut away. | 02-12-2009 |
| 20090057006 | ELECTRONIC UNIT AND PRODUCTION METHOD OF THE SAME - A method of producing an electronic unit in which components are housed in a case and molded with resin, wherein an opening portion of the case housing the components of the unit is closed by a lid plate, the resin is poured into the case through the hole provided in the lid plate to fill the case with the resin while allowing air to be exhausted through a hole provided in a bottom wall portion of the case, with the lid plate of the case directed downward, then the resin in the case is discharged to the outside through the hole provided in the lid plate, and thus a resin mold layer that continuously covers entire surfaces of the components housed in the case and an inner surface of the case is formed with space in contact with the resin mold layer remaining in the case. | 03-05-2009 |
| 20090114441 | ELECTRONIC COMPONENT - An electronic component includes: a first substrate; a second substrate; a sealing member surrounding a sealing space formed between the first substrate and the second substrate; and a functional element at least a part of which is disposed in the sealing space. In the electronic component, the sealing member includes a core part formed on the first substrate and having elasticity and a metal film formed on a surface of the core part, and the metal film is bonded to the second substrate. | 05-07-2009 |
| 20090120685 | Method For Encapsulating Electrical And/Or Electronic Components In A Housing - The invention relates to a method for encapsulating electrical and/or electronic components in a housing, the components being arranged on a printed circuit or a strip conductor in an assembly. Said assembly is positioned in the housing and is encapsulated with a curing, electrically insulating moulding compound. The method according to the invention is characterized by encapsulating preferably in a molding chamber at a pressure below atmospheric pressure and by removing the negative pressure after encapsulation and before curing. | 05-14-2009 |
| 20090145656 | Electrical device - A device embodied as a measuring- and/or switching-device of industrial measurements and automation technology and/or an electronic, device, has at least one housing with at least one chamber, especially a chamber accommodating electrical, electronic and/or electromechanical components and/or assemblies of the device, especially a chamber which is sealed pressure-tightly and/or explosion-resistantly. A space of such chamber surrounding the components and/or assemblies is at least partially, especially completely and/or in an ignition protection type “Ex-m” guaranteeing manner, filled with embedding compound. Additionally incorporated in the embedding compound are hollow bodies, especially essentially spherically shaped, hollow bodies and/or hollow bodies filled with gas, especially hollow bodies e.g. in the form of microballoons. | 06-11-2009 |
| 20090194325 | ELECTRONIC COMPONENT PACKAGE - The strength of an electronic component package against an external pressure is improved. According to the invention, in order to realize this, in an electronic component package in which an electronic component mounted on a mounting substrate via external electrodes placed on the mounting substrate is covered by a mold resin, the electronic component has a component cover which covers elements placed on the lower face of a component substrate, and which forms cavities, and a protective member which is lower in elastic modulus than the mold resin is disposed in a portion which excludes portions joined with the external electrodes in a lower face of the component cover, and which is opposed to the cavities. | 08-06-2009 |
| 20090266606 | ELECTRIC APPARATUS MODULE - The invention provides an electric apparatus unit which can be easily assembled. The electric apparatus module includes an upper case, a lower case assembled with the upper case and having an opening, an electric apparatus unit accommodated in the upper case and the lower case, a connection unit including a board, a connector mounted on the board and connected to the electric apparatus unit, and a connecting member, a first end of the connecting member attached to the board and a second end of the connecting member guided to outside of the lower case through the opening, and an assembling portion provided on the connection unit and the lower case and assembling the connection unit to the lower case, the assembling portion enabling the board to move along surficial direction of the board and restricting the board to move in a direction perpendicular to the surface of the board. | 10-29-2009 |
| 20090277682 | PROTECTIVE STRUCTURE FOR A CIRCUIT BOARD AND METHOD FOR FABRICATING THE SAME - In a protective structure for a circuit board ( | 11-12-2009 |
| 20100044100 | BOARD STRUCTURE AND ELECTRONIC DEVICE - A substrate structure whereby a resin part for coating a plurality of electronic components by one operation is given a shielding property and the mounting strength of electronic components with respect to the substrate is secured and an electronic device including the substrate structure are provided. | 02-25-2010 |
| 20100051345 | PACKAGE, METHOD OF MANUFACTURING A PACKAGE AND FRAME - The package comprises a chip and a plurality of frame contact pads. The chip is attached to the frame contact pads in a die attach area with a die attach adhesive. The chips is coupled to frame contact pads outside the die attach area with connecting elements. The chip, the connecting elements and the frame contact pads outside the die attach area are anchored in an electrically insulating encapsulation. The frame contact pads each comprise a first patterned layer and a second patterned layer, which second layer has the surface that is exposed outside the encapsulation. At least a portion of the frame contact first patterned layer with a first pattern that comprises at least one flange/lead that is outside the second patterned layer when seen in perpendicular projection of the first layer on the second layer. | 03-04-2010 |
| 20100059269 | Electrical Equipment Receptacle Cover - A soft rubber protective safety cover for positioning over a projecting receptacle portion of an electrical equipment box to minimize the safety hazard caused by such projecting portion. The cover is of generally cylindrical configuration with oppositely disposed generally rectangular portions positioned along the elongate dimension of the cover to encapsulate the receptacle when the cover is in position thereover so as to prevent sharp and/or projecting portions thereof from causing injury to a person who comes in contact with the receptacle. | 03-11-2010 |
| 20100089636 | NANOPARTICULATE ENCAPSULATION BARRIER STACK - A barrier stack for encapsulating a moisture and/or oxygen sensitive electronic device is provided. The barrier stack comprises a multilayer film having at least one barrier layer having low moisture and/or oxygen permeability, and at least one sealing layer arranged to be in contact with a surface of the barrier layer, wherein the sealing material comprises reactive nanoparticles capable of interacting with moisture and/or oxygen, thereby retarding the permeation of moisture and/or oxygen through defects present in the barrier layer. | 04-15-2010 |
| 20100133001 | Electronic Housing - An electronic housing, which includes at least two housing parts, has at least one housing base, a housing cover, and at least one electronic connection in the form of a printed circuit board between electronic substrates disposed in the housing interior and components positioned outside the housing, with the electronic connection being fixed on the housing base. The housing cover has a filling port for a casting compound, and the filling port is closed by a label. A method for the production of such an electronic housing and the use thereof for transmission control of a motor vehicle, are also provided. | 06-03-2010 |
| 20100193240 | DEVICE - A device includes: a package having a bottom and a side wall surrounding the bottom; an element adhered to the bottom of the package; an internal contact formed inside the package; a resin encapsulation material with which a space between the package and the element is filled; and a coating formed to cover an end surface of the internal contact near the element, and made of a material whose thermal expansion coefficient is greater than or equal to the thermal expansion coefficient of the package and less than the thermal expansion coefficient of the resin encapsulation material. | 08-05-2010 |
| 20100230155 | APPARATUS COMPRISING AN ELECTRONICS MODULE AND METHOD OF ASSEMBLING APPARATUS - An apparatus comprising: a substrate; an electronics module mounted on the substrate; and an injection molded layer in contact with the substrate; wherein the substrate and the injection molded layer form a portion of a rigid housing. | 09-16-2010 |
| 20100258346 | PACKAGE OF ENVIRONMENTALLY SENSITIVE ELECTRONIC DEVICE AND FABRICATING METHOD THEREOF - A package of an environmentally sensitive electronic device including a first substrate, a second substrate, an environmentally sensitive electronic device, a plurality of barrier structures, and a fill is provided. The second substrate is disposed above the first substrate. The environmentally sensitive electronic device is disposed on the first substrate and located between the first substrate and the second substrate. The barrier structures are disposed between the first substrate and the second substrate, wherein the barrier structures surround the environmental sensitive electronic device, and the water vapor transmission rate of the barrier structures is less than 10 | 10-14-2010 |
| 20110011640 | INSULATING MEDIUM AND ITS USE IN HIGH VOLTAGE DEVICES - An insulating composition for use in high voltage devices is formed from a soft dielectric casting compound, such as a silicone gel, comprising ferroelectric particles such as barium titanate dispersed within it. Low levels of particles, from 1% to 20% by volume of the insulating composition, are highly effective yet do not cause excessive thickening of the soft dielectric casting compound when it is in its liquid state. The insulating composition is particularly effective for coating, enrobing or encapsulating alternating high voltage devices such as power electronics devices in order to prevent electrical discharge. | 01-20-2011 |
| 20110017506 | MODULAR OVER-MOLD HARNESS - An over-molded harness including a plurality of bundled flexible electric wires, an electrical or electronic element electrically connected between at least two of the wires, and at least a portion of the bundled electrical wires having an over-molded insulative covering, whereby the electrical or electronic element is unsupported by other than primarily by the over-molded insulative covering and secondarily by the flexible electric wires, the electrical or electronic element being both precisely located and completely enclosed within the insulative covering. | 01-27-2011 |
| 20110061927 | HOUSING COMPONENT FOR DOOR LATCH ASSEMBLY AND METHOD OF MAKING - A component for a vehicle latch assembly is provided, the component having: an electrical sub-system having a plurality of circuit paths each being electrically connected to a common ground, the electrical sub-system being molded into a pre-mold by a first molding process, the pre-mold comprising an encapsulation layer molded around the common ground and an at least one structural member secured to the encapsulation layer and at least one of the plurality of circuit paths, the structural member providing rigidity to the pre-mold; and a plurality of locating features extending from at least one of the encapsulation layer and the structural member. | 03-17-2011 |
| 20110079425 | TREATMENT METHOD OF A GETTER MATERIAL AND ENCAPSULATION METHOD OF SUCH GETTER MATERIAL - A treatment method for a getter material, comprising at least one oxidation and/or nitriding step of getter material conducted under dry atmosphere of dioxygen and/or dinitrogen at pressure greater than approximately 10 | 04-07-2011 |
| 20110114383 | POTTED ELECTRONIC COMPONENT AND METHOD FOR ITS MANUFACTURE - A method of manufacturing an electronic component assembly is disclosed comprising disposing an electronic component in a housing such that there is at least one void space between the component and the housing, disposing non-conductive microspheres in the void space to substantially fill the void space, and disposing a fluid potting material in the housing and hardening or curing the potting material to pot the component in the housing. An assembly is also disclosed comprising a housing, an electronic component disposed in the housing such that there is at least one space between the component and the housing and the space is substantially filled with non-conductive microspheres, and a material that potting the first electronic component in the housing. The invention enables an electronic component in a housing with a space left between the housing to be potted with reduced formation of bubbles in the hardened potting material. | 05-19-2011 |
| 20110272191 | POTTING FOR ELECTRONIC COMPONENTS - A potting material for an electronic component, an electronic component, and a process for positioning ferrites in an electronic material are disclosed. The potting material is formed by curing a mixture. The mixture includes an epoxy component, an organic amine hardener, a viscosity-controlling agent, and a silica. The potting material has a coefficient of thermal expansion between an inorganic ferrite coefficient of thermal expansion and an organic substrate coefficient of thermal expansion of the electronic component. The potting material includes a rigidity permitting via drilling by one or more of mechanical drilling and laser burning. | 11-10-2011 |
| 20110290552 | METHOD AND SYSTEM FOR PACKAGING MEMS DEVICES WITH INCORPORATED GETTER - Methods and systems for packaging MEMS devices such as interferometric modulator arrays are disclosed. One embodiment of a MEMS device package structure includes a seal with a chemically reactant getter. Another embodiment of a MEMS device package comprises a primary seal with a getter, and a secondary seal proximate an outer periphery of the primary seal. Yet another embodiment of a MEMS device package comprises a getter positioned inside the MEMS device package and proximate an inner periphery of the package seal. | 12-01-2011 |
| 20120043131 | Method for Producing a Sensor with Seamless Extrusion Coating of a Sensor Element - A method for producing a sensor with seamless extrusion coating of a sensor element and a sensor produced by said method. The sensor element is enclosed in as sealed a manner as possible by the extrusion mass, thus permanently preventing the ingress of water, acids, oils or other aggressive materials to the region of the sensor. The method includes inserting the sensor element into a mould cavity, mechanically fixing the sensor element in the mould cavity by at least one movable fixing element that engages the sensor with the mould cavity in a second region of the mould cavity, injection of an extrusion mass into the mould cavity, waiting until the extrusion mass has hardened in a first region of the mould cavity to fix the sensor element in position, removal of the moving fixing element, before the extrusion mass in the second region hardens, such that the still liquid extrusion mass at least partly fills the cavity left in the mould cavity by the removed fixing element. | 02-23-2012 |
| 20130264110 | ELECTRICAL GROUNDING PLANE - An electrical assembly including electrical raft having electrical conductors embedded in a rigid material is provided. The electrical assembly has an electrically conductive screen layer. The electrically conductive screen layer provides electromagnetic protection to the electrical conductors. The electrically conductive screen layer is electrically connected to a mounting fixture, which in turn may be electrically connected to an apparatus on which the electrical assembly may be mounted. The electrical raft is used to transport electrical signals (which may be, for example power and/or control signals), for example around a gas turbine engine. | 10-10-2013 |
| 20140000955 | Conformal Coating Capable of Scavenging a Corrosive Agent | 01-02-2014 |
| 20140027172 | HOUSING-SIDE SEPARATING LAYER FOR THE STRESS DECOUPLING OF POTTED ELECTRONICS - The invention relates to a device, which includes a substrate for carrying an electrical circuit, a housing for enclosing the substrate, and a potting compound accommodated in the housing, which potting compound at least partially encloses the substrate. The potting compound can adhere to the housing. Furthermore, the device has a wall, from which the potting compound can detach. | 01-30-2014 |
| 20140034381 | HOUSING COMPONENT FOR DOOR LATCH ASSEMBLY AND METHOD OF MAKING - A component for a vehicle latch assembly is provided, the component having: an electrical sub-system having a plurality of circuit paths each being electrically connected to a common ground, the electrical sub-system being molded into a pre-mold by a first molding process, the pre-mold comprising an encapsulation layer molded around the common ground and an at least one structural member secured to the encapsulation layer and at least one of the plurality of circuit paths, the structural member providing rigidity to the pre-mold; and a plurality of locating features extending from at least one of the encapsulation layer and the structural member. | 02-06-2014 |
| 20140083760 | METHOD FOR PRODUCTION OF SEALED BODY, FRAME-SHAPED SPACER FOR PRODUCTION OF SEALED BODY, SEALED BODY AND ELECTRONIC INSTRUMENT - Provided is a method for production of a sealed body which is capable of improving workability and reducing costs owing to resin-sealing in which a mold is not used, while an electronic instrument obtained has no performance failure and the like. The method for production of a sealed body according to the present invention includes: an adherend providing step of providing an adherend on which at least one electronic component is so mounted as to be displaced from a first main surface; a frame-shaped spacer providing step of providing a frame-shaped spacer having an opening formed at a position corresponding to the electronic component; a step of superimposing the frame-shaped spacer and a lead frame so that the electronic component is accommodated in the opening; a first pressure-bonding step of pressure-bonding a sheet-shaped thermosetting resin composition to a second main surface on a side opposite to the first main surface in a state of superimposing the frame-shaped spacer; a frame-shaped spacer removing step of removing the frame-shaped spacer; and a second pressure-bonding step of pressure-bonding a sheet-shaped thermosetting resin composition, which is the same as or different from the sheet-shaped thermosetting resin composition, to the first main surface so as to embed the electronic component. | 03-27-2014 |
| 20140190736 | RADIATION-CURABLE RUBBER ADHESIVE/SEALANT - A radiation-curable adhesive/sealant composition comprises a radiation-curable rubber resin, one or more photoinitiators or photosensitizers, and optionally, one or more inorganic or organic fillers. | 07-10-2014 |
| 20140291011 | ELECTRONIC DEVICE AND METHOD FOR FABRICATING THE SAME - An electronic device includes a substrate and a lid bonded on the substrate with a resin layer to seal an inside of the lid. The resin layer is formed at a part of the substrate to which the lid is mounted. A part where the lid is bonded on the substrate with resin layer forms a sealing portion. A glass layer is formed so as to cover the sealing portion. | 10-02-2014 |
| 20140291012 | Electronic Device - An electronic device is disclosed having a housing with a single opening, and an inner space accessible solely through the opening. A covering plate is positioned within the opening. An electrically conductive contact pin extends through the covering plate and into the inner space. | 10-02-2014 |
| 20150047897 | METHOD AND APPARATUS FOR USE IN PROVIDING WIRE STRAIN RELIEF WITH ENVIRONMENTALLY PROTECTED IRRIGATION DEVICES - Some embodiments comprise apparatuses providing an electrical conductor guide for use with an irrigation device comprising: a housing having a volume and containing an electronic component and one or more electrical conductors coupled thereto; a support structure having one or more apertures each configured to allow at least one of the one or more electrical conductors to extend therethrough; and a potting material at least partially filling and sealing the volume from an external environment, wherein the one or more electrical conductors extend out of the potting material and the housing; wherein the support structure is cooperated with the one or more electrical conductors and is configured to inhibit movement of the one or more electrical conductors relative to the potting material due to external forces applied to the one or more electrical conductors to reduce the forces applied to the potting material or to electronic component. | 02-19-2015 |
| 20150096800 | Electronic Module for Operation in a Transmission - An electronic module for a vehicle includes a can housing and a circuit carrier having at least one connecting element. The circuit carrier is positioned in the can housing, and is cast with a cast material. The at least one connecting element protrudes from the cast material and is configured to connect at least one conductive element. The electronic module is positioned in the transmission and is configured to be operated. | 04-09-2015 |
| 20150325379 | TANTALUM CAPACITOR - A tantalum capacitor may include: two capacitor bodies containing a tantalum powder and disposed to have tantalum wires exposed in opposite directions, two anode lead frames connected to the tantalum wires, respectively, and two cathode lead frames having the anode lead frames disposed therebetween and having the capacitor bodies mounted thereon. | 11-12-2015 |
| 20150327376 | ELECTRONIC DEVICE AND METHOD FOR PRODUCING AN ELECTRONIC DEVICE - An electronic device including: an electronic unit accommodated in a circuit housing and a moulded body which surrounds the circuit housing. The moulding compound has a cut-out that exposes the circuit housing, in which cut-out an identification that characterizes the electronic circuit is arranged. | 11-12-2015 |
| 20160099557 | ARRANGEMENT FOR SEALING THE CONNECTION POINT OF ELECTRICAL LINES - An arrangement ( | 04-07-2016 |
| 174522000 | Vent, inlet or exit | 1 |
| 20140196945 | TERMINAL BOX, SOLAR CELL MODULE WITH TERMINAL BOX, AND METHOD FOR MANUFACTURING SOLAR CELL MODULE WITH TERMINAL BOX - A terminal box includes a terminal box main body (M), a terminal plate ( | 07-17-2014 |
| 174524000 | Plural layers | 2 |
| 20090025976 | ELECTRIC COMPONENT - An electric component includes a substrate, a function element provided on the substrate, a first sealing body provided on the substrate to cover the function element at a certain distance, the first sealing body including multiple apertures communicating with an internal space formed between the first sealing body and the substrate, and a second sealing body provided on the first sealing body and configured to occlude the multiple apertures. Here, a boundary between the first sealing body and the substrate is curved in a direction to narrow the internal space. | 01-29-2009 |
| 20110303457 | Electronic Device, Resonator, Oscillator and Method for Manufacturing Electronic Device - An electronic device includes a substrate, a functional structural body formed on the substrate and a covering structure for defining a cavity part having the functional structural body disposed therein, wherein the covering structure is provided with a side wall provided on the substrate and comprising an interlayer insulating layer surrounding the cavity part and a wiring layer; a first covering layer covering an upper portion of the cavity part and having an opening penetrating through the cavity part and composed of a laminated structure including a corrosion-resistant layer; and a second covering layer for closing the opening. | 12-15-2011 |
| 174525000 | Flexible | 1 |
| 20100300746 | ENCAPSULATION PROCESS AND STRUCTURE FOR ELECTRONIC DEVICES - Electronic devices, such as photovoltaic, transistor or doped light-emitting devices, can be manufactured with an air-based manufacturing process and device structure that encapsulates the device with air-stable electrodes and active layers that are reasonably stable in their unexcited state. A sheet of flexible material may act as a substrate and a second sheet of material acts as a cover. Getter materials are included in the encapsulated device, with the getter latent or unreactive during the manufacturing process. | 12-02-2010 |
| 174526000 | Cooled | 1 |
| 20090321130 | Enclosure With Integrated Heat Wick - An electrical enclosure system for transferring heat from a closed environment, includes an electrical device having a heat-generating part, and a polymer-based ventless housing for protecting the electrical device from environmental contaminants. The ventless housing fully encloses the electrical device and includes a base layer forming an impact-resistant portion of the ventless housing. The base layer includes one or more open areas in close proximity to the heat-generating part. The ventless housing further includes an integrated thermally conductive layer that forms a heat-flow path for conducting heat away from the heat-generating part towards an exterior environment. The integrated thermally conductive layer is molded around the base layer such that portions of the integrated thermally conductive layer cover the open areas of the base layer. | 12-31-2009 |
| 174527000 | External terminals | 9 |
| 20090071711 | ELECTRONIC COMPONENT PACKAGE - An electronic component package comprises: an electronic component where device elements are mounted inside cavities formed between a component substrate and a component cover that covers the component substrate; and a mounting substrate. The component cover is placed on the mounting substrate, and the electronic component is mounted on the mounting substrate and molded by a resin. At least one of a ground electrode and a dummy electrode is provided on a surface of the component cover, the surface being placed on the mounting substrate. At least one of the ground electrode and the dummy electrode is provided in a position opposed to at least part of the cavities. | 03-19-2009 |
| 20090242268 | Semiconductor device capable of switching operation modes - A semiconductor device according to the present invention includes first through fourth internal terminals placed along the perimeter of a substrate, a circuit coupled to the first internal terminal, a first external terminal coupled to the second internal terminal, a second external terminal coupled to the third internal terminal, and a third external terminal coupled to the fourth internal terminal. The circuit outputs a signal indicative of a connection state the first internal terminal and the first external terminal. A distance between centers of the first and second internal terminals is L | 10-01-2009 |
| 20100025101 | METHOD AND APPARATUS FOR ELECTRICAL COMPONENT PHYSICAL PROTECTION - A method and apparatus for protecting a heat sensitive component from high temperature, mechanical shock and moisture are provided. An enclosure includes an outer housing surrounding an inner cavity configured to receive a heat sensitive component therein, a cover configured to matingly engage the outer housing such that the inner cavity is sealed from an environment external to the enclosure, wherein at least one of the outer housing and the cover are formed from a ceramic material. | 02-04-2010 |
| 20110079426 | METHOD AND APPARATUS FOR ELECTRICAL COMPONENT PHYSICAL PROTECTION - A method and apparatus for protecting a heat sensitive component from high temperature, mechanical shock and moisture are provided. An enclosure includes an outer housing surrounding an inner cavity configured to receive a heat sensitive component therein, a cover configured to matingly engage the outer housing such that the inner cavity is sealed from an environment external to the enclosure, wherein at least one of the outer housing and the cover are formed from a ceramic material. | 04-07-2011 |
| 20130341082 | CERAMIC ELECTRONIC COMPONENT AND CERAMIC ELECTRONIC APPARATUS - A ceramic electronic component includes a ceramic element, a first inner electrode, a second inner electrode, an outer electrode, and a first auxiliary electrode. The first auxiliary electrode extends to a first surface of the ceramic element. The first inner electrode extends along a first direction on the first surface. The first auxiliary electrode extends outward from the region where the first inner electrode is disposed in the first direction on the first surface. The outer electrode covers the first inner electrode and the first auxiliary electrode. | 12-26-2013 |
| 174528000 | Leads | 3 |
| 20140284097 | Field Device - A field device with a housing for accommodating an electronics unit. The housing is pot shaped and composed of a non-conductive material, wherein at least one line guide passageway with a screw thread is provided on the housing, wherein the line guide passageway is provided with a conductive coating in the region of the thread, and wherein the screw thread has at least one groove in at least one region extending in the axial direction of the line guide passageway. | 09-25-2014 |
| 174529000 | On lead frame | 2 |
| 20100319987 | LEAD FRAME DESIGN TO IMPROVE RELIABILITY - An electronic device package | 12-23-2010 |
| 20120103682 | LEAD FRAME HAVING METAL CUP WITH ENLARGED HEAT-DISSPIATION AREA - A lead frame includes an insulative housing defining a cavity, a plurality of leads mounted with the housing and a metal cup mounted within the housing. Each lead includes contacting section exposed in the cavity. The metal cup includes a bottom plate and an inclined cup wall. The bottom plate is formed with a flange extending outwardly therefrom such that a slot is defined between the flange and the cup wall to receive the resin material of the housing. | 05-03-2012 |
| 174534000 | Lands | 1 |
| 20130220696 | CHIP-TYPE CERAMIC ELECTRONIC COMPONENT AND PRODUCING METHOD THEREOF - The electronic component has a resin electrode which constitutes an external electrode on a face of a ceramic base body. At least a tip portion of a resin electrode region extended around another face of the body is bonded to the ceramic base body, and further a relationship between Rz | 08-29-2013 |
