| Entries |
| Document | Title | Date |
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| 20080210462 | METHOD FOR MANUFACTURING CIRCUIT MODULES AND CIRCUIT MODULE - A module substrate defined by an aggregate substrate is prepared, and circuit components are mounted on the module substrate. An insulating resin layer is formed on substantially the entire top surface of the module substrate such that the circuit components are disposed in the insulating resin layer, and a top-surface-shielding layer is formed on the top surface of the insulating resin layer. First through holes are formed in the module substrate and the insulating resin layer at locations corresponding to portions of boundary lines of small substrates so as to extend in a thickness direction of the module substrate and the insulating resin layer. First electrode films are formed on the inner surfaces of the first through holes so as to be connected to the first shielding layer, and the first through holes are filled with a filling material. Next, second through holes are formed at locations corresponding to the remaining portions of the boundary lines of small substrates so as to extend in the thickness direction, and second electrode films are formed on the inner surfaces of the second through holes so as to be connected to the top-surface-shielding layer and the first electrode films. The filling material, with which the first through holes are filled, is cut along the boundary lines of small substrates, resulting in a division of the aggregate substrate into small substrates to obtain circuit modules. | 09-04-2008 |
| 20080251290 | SHIELDING APPARATUS - A shielding apparatus for electromagnetic testing comprises a platform, a lid, a driving unit, a pulley system, and a counterbalance. The platform is for placing an electronic device to be tested. The lid is for covering the platform to define a closed space. The driving unit is for lifting and lowering the lid. The counterbalance connected to the lid via the pulley system is for partly or substantially counterbalancing a weight of the lid. | 10-16-2008 |
| 20080296058 | Antenna Device and Shield Cover Thereof - A circuit board has a first face and a second face opposite to the first face. An antenna element is mounted on the first face. A shield cover is attached to the second face. The shield cover includes a polygonal base portion, a first wall provided on a first side of the polygonal base portion, a second wall provided on a second side of the polygonal base portion, a third wall provided on a corner defined by the first side and the second side, and disposed between the first wall and the second wall, a first extending portion extended from the first wall so as to overlap with the third wall, and a second extending portion extended from the second wall so as to overlap with the third wall. The shield cover is soldered on the second face. | 12-04-2008 |
| 20090008148 | INDUCTOR BUILT-IN WIRING BOARD HAVING SHIELD FUNCTION - There is provided a wiring board having a shield function. The wiring board includes: a plurality of conductive shield patterns adapted to surround a circumference of at least one electronic component mounting area on the wiring board, the plurality of conductive shield patterns being adjacent to each other; and at least one inductor formed of a conductive pattern and provided between the conductive shield patterns. | 01-08-2009 |
| 20090025974 | Shield Box - A shield box is composed of metal-made upper box and lower box, which are combined with each other. The shield box houses therein a plurality of shield connectors interconnecting shield wires, and thereby electromagnetically shields entirety of the shield connectors and the shield wires. On an upper surface of a lower surface plate of the lower box, clamp fittings capable of restraining the respective shield connectors in axial, axial rotation, left-and-right and up-and-down directions thereof are provided. On opposite surfaces of the upper and lower boxes, press fittings are provided to sandwich shield terminal portions from upper and lower sides and conduct the shield terminal portions to the upper and lower boxes when the upper and lower boxes are matched with each other. The shield terminal portions, which are electrically connected to shield conductors of respective shield wires and are exposed to both ends of the respective shield connectors, are grounded. | 01-29-2009 |
| 20090032300 | Method of and apparatus for providing an RF shield on an electronic component - A shielding assembly is configured to provide electromagnetic shielding and environmental protection to one or more electronic components coupled to a substrate. The shielding assembly includes a non-conductive mold compound layer, such as a dielectric epoxy. The mold compound layer is applied to a top surface of the substrate, thereby covering the electronic components and providing protection against environmentally induced conditions such as corrosion, humidity, and mechanical stress. The shielding assembly also includes a conductive layer applied to a top surface of the mold compound layer. The conductive layer is coupled to a ground plane in the substrate, thereby enabling the electromagnetic shielding function. The conductive layer is coupled to the ground plane via one or more metallized contacts that are coupled to the substrate and extend through the mold compound layer. | 02-05-2009 |
| 20090126985 | SHIELD SHELL UNIT - A shield shell unit includes a shield shell that is attached to an end portion of a shield member for covering a wire, and an attached portion that is attached to the shield shell. The shield shell includes a shell main body, and a fixing portion which projects from the shell main body and is mounted on the attached portion in a direction of intersecting with a direction of attaching the shield shell to the attached portion when the shield shell is attached to the attached portion. The fixing portion and the attached portion have holes which are communicated with each other for passing a screw member therethrough when the fixing portion is mounted on the attached portion. | 05-21-2009 |
| 20090139762 | METAMATERIAL SPHERIC ALIGNMENT MECHANISM - A chamber or series of chambers is formed from layers of nested shells and used to manipulate a work product within the chambers. The shells are formed from highly ordered material structures, such as superconductors and metamaterials, and the work product is manipulated using energy that is directed from the outside of the chamber, through the nested shells and into the chamber. The nested shells have an open position and a closed position or have a bridge through which a working material can be passed from one set of nested shells to another set of nested shells. The superconducting shells can be type-1 or type-2, and the metamaterial shells can include any combination of a frequency agile metamaterial, a split ring resonator, an artificial structure of a wire medium, a unit cell of an artificial magnetic metamaterial, metamaterial superlattices and any combination thereof, or other highly ordered composite metamaterials. | 06-04-2009 |
| 20090151999 | Frame Member for Electromagnetic Interference Shielded Panel - An electromagnetic interference shielded panel and method of manufacture. The panel includes one or more frame members having a rib adapted to provide sacrificial material when a first skin member is welded to the frame member. The first skin member is welded to the frame members of a frame assembly prior to bonding of a core member and a second skin member to the first skin member and frame assembly. | 06-18-2009 |
| 20090159329 | Electrical Device - The invention relates to an electrical device comprising a supporting substrate ( | 06-25-2009 |
| 20090183912 | Corrosion resistant faraday cage electronic enclosure assembly - A corrosion resistant Faraday cage assembly includes an electrically conductive cover and a coated die cast housing having a ledge extending around the perimeter of the housing. A fence is positioned adjacent to the ledge and a track is positioned between the ledge and the fence. A plurality of serrated contact points are positioned on the fence and are used for making electrical contract with the electrically conductive cover extending over the track. The contact points are either masked prior to the protective coating process or they are mechanically or chemically modified afterward to expose a plurality of electrically-conductive surfaces to be in contract with the electrically-conductive cover. | 07-23-2009 |
| 20090183913 | CASING WITH SHIELDING FUNCTION, METHOD FOR MANUFACTURING THE SAME AND ELECTRONIC DEVICE USING THE SAME - A casing with a shielding function, a method for manufacturing the same and an electronic device using the same are disclosed. The electronic device has at least an electronic element and a casing. The casing includes a casing substrate and a film integrally formed with the casing substrate via an in-mold decoration process. The film includes a shielding layer for providing an electromagnetic shielding function for the electronic element and an adhesive layer for combining the casing substrate and the shielding layer. | 07-23-2009 |
| 20090211800 | ELECTROMAGNETIC SHIELDING DEVICE - An electromagnetic shielding device includes a frame and a cover. The frame is formed by bending a strip structure and disposed on a circuit board with an electronic component, and it encloses the electronic component. The cover has a top portion and a plurality of side portions. The side portions are expended and bent from the top portion. When the cover is combined with the frame to enclose the electronic component, the side portions are closely connected to the frame. The cover and the frame are combined to form a shielding space. | 08-27-2009 |
| 20090211801 | OPTICAL TRANSCEIVER PROVIDING INDEPENDENT SPACES FOR ELECTRICAL COMPONENTS AND FOR OPTICAL COMPONENTS - An optical transceiver that reduces the EMI noise leaked therefrom is reduced is disclosed. The optical transceiver of the invention provides a metal housing, an optical subassembly, and an electronic circuit. The metal housing includes a first space that installs the electronic circuit and a second space that installs the optical subassembly. The first space and the second space are electrically shielded to each other, in addition that both spaces are shielded from the external. In the optical transceiver of the invention, even the second space provides the optical path to the optical connector, which becomes a definite leak path for the EMI noise, the leakage from the first space to the external through the optical path is prevented. | 08-27-2009 |
| 20090250261 | SEAL STRUCTURE - To provide a seal structure which has a seal member integrally formed on a flexible wiring board without peeling off an insulating layer (top coat) of the flexible wiring board, has excellent sealing performance and can be manufactured at a low cost, the seal structure is composed of a housing, to which the flexible wiring board is inserted, and the seal member, which is integrally formed with the flexible wiring board and seals a gap between the housing and the flexible wiring board, the flexible wiring board is composed of a base FPC composed of an elastic material, a patterned copper foil and an adhesive layer, conductive electromagnetic shielding layers formed on surfaces of the base FPC, and insulating layers covering surfaces of the electromagnetic shielding layers, and the seal member is integrally formed directly on the insulating layers by using a self-adhesive liquid rubber. | 10-08-2009 |
| 20090266601 | PROTECTIVE COVER FOR PREVENTION OF ELECTROMAGNETISM INTERFERENCE - A protective cover for prevention of electromagnetism interference includes a shell and a metal cladding layer. The shell is comprised of a plastic material, and includes a base plate. An edge of the base plate bends upwardly with respect to the base plate and forms an enclosure plate. At least one separator is disposed on the base plate inside of the enclosure plate. The base plate, the enclosure plate and the at least one separator cooperatively define a plurality of isolation areas. | 10-29-2009 |
| 20090266602 | ELECTROMAGNETIC INTERFERENCE SHIELD - This present invention is an electromagnetic interference shield, comprising a shielding cap, an insulator, and an electric conductive paste, wherein protruding edges of the shielding cap are mounted with electric conductive paste on a PCB and the insulator is placed between the shielding cap and the PCB to keep them from touching with each other to provide the EMI prevention to the PCB. | 10-29-2009 |
| 20090266603 | ELECTROMAGNETIC SHIELDING DEVICE - An electromagnetic shielding device suitable for a PCB includes a cover and a conductive rubber frame. The cover is made of a conductive material and has a through hole and a containing space. The conductive rubber frame is contacted with the through hole of the cover. The conductive rubber frame contacts with the PCB and is electrically connected to the ground end. The electronic component is enclosed by the cover and the conductive rubber frame. | 10-29-2009 |
| 20090277680 | INSULATING FILM, PRINTED CIRCUIT BOARD SUBSTRATE AND PRINTED CIRCUIT BOARD INCLUDING SAME - An insulating film includes a first polymer layer, a second polymer layer and an electromagnetic shielding layer sandwiched between the first polymer layer and the second polymer layer. The electromagnetic shielding layer includes a number of carbon nanotube films that are substantially parallel to the first and second polymer layer. Each of the carbon nanotube films includes a number of carbon nanotubes that are substantially parallel to each other. The insulating film can provide anti-EMI effect in printed circuit boards without employing additional electromagnetic shielding layers. | 11-12-2009 |
| 20090308653 | SHIELDING DEVICE - A shielding device for serving as an electromagnetic shield includes a shield body having a top piece and a plurality of sidewall pieces, and an electromagnetic band-gap (EBG) structure disposed on the top piece of the shield body. | 12-17-2009 |
| 20100012369 | SPRING RETAINED SHIELD FOR PRINTED WIRING BOARDS - A spring retained shield releasably securable to a printed wiring board (PWB). The shield preferably comprises a body that is compliant such that it bends under pressure and springs back to its original shape when released. The shield further comprises a releasable attachment mechanism that engages the PWB when the body is released or no longer under pressure. Preferably, the body has an open ended box shape with front and back walls, a top wall and first and second side walls. A passageway or cutout is formed in the front and back walls. The body is preferably formed of a conductive material. To releasably mount or couple the shield to a PWB, the releasable attachment mechanism comprises first and second mounting legs extending from the first side wall and third and fourth mounting legs extending from the second side wall. | 01-21-2010 |
| 20100051344 | TESTING DEVICE - A testing device includes a shielding case and a driving member opening and closing the shielding case. The shielding case includes a receiving space for receiving an electronic device therein, a cover, and a base. The driving member includes a first driving member mechanically connected to an outside of the cover of the shielding case and a second driving member mechanically connected to an outside of the base of the shielding case. The first driving member moves the cover vertically relative to the base. The second driving member moves the base horizontally relative to the cover. Movement of the shielding case in an open position allows the electronic device to be received in or removed from the shielding case. Movement of the shielding case in a closed position allows the electronic device to be tested. | 03-04-2010 |
| 20100084180 | ELECTRONIC DEVICE WITH A SHIELDING MEMBER - An electronic device includes a circuit board and a shielding member. The circuit board includes a pair of frames and a plurality of mounting holes disposed between the frames. The pair of frames surround at least one electronic component positioned within an area defined within the pair of frames. The shielding member is configured for shielding the electronic component from electromagnetic interference (EMI), and includes a top wall, a plurality of sidewalls, and a plurality of mounting portion extending from end portions of the sidewalls. The top wall and the sidewalls cooperatively bound a receiving space to receive the at least one electronic component. The mounting portions are received in the corresponding mounting holes to attach the shielding member to the circuit board. | 04-08-2010 |
| 20100126766 | ELECTRO-CONDUCTIVE CONTACT STRUCTURE FOR ENCLOSURE SEALING IN HOUSINGS - An electro-conductive contact structure for sealing the interior of an enclosure from interference includes first and second electro-conductive contact surfaces. In one embodiment, the first electro-conductive contact surface includes a plurality of projections, and the second electro-conductive contact surface includes a plurality of slots. The projections are configured for insertion into the slots to form an electro-conductive interface between the first and second portions of the enclosure. In another embodiment, the electro-conductive contact structures are formed on first and second housing parts, respectively. In another embodiment, the electro-conductive contact surfaces each include a series of fingers and a plurality of pockets between the fingers. | 05-27-2010 |
| 20100132999 | ELECTROMAGNETIC SHIELDING CONFIGURATION - An electromagnetic shielding configuration comprising a first electrically conductive wall having a first surface and a second electrically conductive wall having a second surface. The first surface is oppositely disposed from the second surface, wherein interfacing of the first conductive wall and the second conductive wall forms an enclosure wall. The first surface comprises at least one stepped edge forming a plurality of surfaces of unequal lateral displacement, and a corrugated surface on at least one of the plurality of surfaces, the corrugated surface formed by a series of apices extending radially from the first surface. The second surface is substantially a conjugate of the first surface. | 06-03-2010 |
| 20100206627 | ELECTROMAGNETIC INTERFERENCE SHIELDING APPARATUS AND METHOD - A shielding apparatus has first and second electrically conductive sheets attached to an interior of a housing. A gap between the first and second electrically conductive sheets has a size based on a predefined desired cutoff frequency, and the widths of the first and second electrically conductive sheets are no more than twice the size of the gap. The lengths of the first and second electrically conductive sheets are at least four times the size of the gap. | 08-19-2010 |
| 20100224401 | METHODS AND APPARATUS FOR SHIELDING CIRCUITRY FROM INTERFERENCE - This is directed to methods and apparatus for shielding a circuitry region of an electronic device from interference (e.g., EMI). A conductive dam may be formed about a periphery of the circuitry region. A non-conductive or electrically insulating fill may then be applied to the circuitry region within the dam. Next, a conductive cover may be applied above the fill. The cover may be electrically coupled to the dam. The dam may include two or more layers of conductive material stacked on top of one another. In some embodiments, the conductive cover may be pad printed or screen printed above the fill. In other embodiments, the conductive cover may be a conductive tablet that is melted above the fill. | 09-09-2010 |
| 20100252319 | ELECTROMAGNETIC BANDGAP STRUCTURE AND PRINTED CIRCUIT BOARD HAVING THE SAME - Disclosed herein are an electromagnetic bandgap structure and a printed circuit board having the same. The bandgap structure includes a conductive layer including a plurality of conductive plates; and a metal layer disposed over or under the conductive layer and including a stitching pattern to electrically connect a first conductive plate to a second conductive plate of the plurality of conductive plates. The bandgap structure includes a spiral stitching pattern formed in a metal layer different from the conductive layer, thus offering a stop-band having a desired bandwidth in a compact structure. | 10-07-2010 |
| 20100252320 | ELECTROMAGNETIC BANDGAP STRUCTURE AND PRINTED CIRCUIT BOARD HAVING THE SAME - Disclosed herein are an electromagnetic bandgap structure and a printed circuit board having the same. The bandgap structure includes a conductive layer including a plurality of conductive plates, a first metal layer disposed under the conductive layer and including a first stitching pattern electrically connected to a first conductive plate of the plurality of conductive plates, and a second metal layer disposed under the first metal layer and including a second stitching pattern electrically connected to both the first stitching pattern and a second conductive plate of the plurality of conductive plates. The bandgap to structure includes stitching patterns formed in two layers different from the conductive layer, thus offering a stop-band having a desired bandwidth in a compact structure. | 10-07-2010 |
| 20100270069 | CNT-INFUSED EMI SHIELDING COMPOSITE AND COATING - A composite for use in electromagnetic interference (EMI) shielding applications includes a carbon nanotube(CNT)-infused fiber material disposed in at least a portion of a matrix material. The composite is capable of absorbing or reflecting EM radiation, or combinations thereof in a frequency range from between about 0.01 MHz to about 18 GHz. The electromagnetic interference (EMI) shielding effectiveness (SE), is in a range from between about 40 decibels (dB) to about 130 dB. A method of manufacturing the composite includes disposing a CNT-infused fiber material in a portion of a matrix material with a controlled orientation of the CNT-infused fiber material within the matrix material, and curing the matrix material. A panel includes the composite and is adaptable to interface with a device for use in EMI shielding applications. The panel is further equipped with an electrical ground. | 10-28-2010 |
| 20100294558 | ELECTROMAGNETIC INTERFERENCE SUPPRESSION SHEET COMPRISING PRESSURE-SENSITIVE ADHESIVE LAYER WITH STRUCTURED SURFACE - The present invention addresses the prevention of local entrapment of air between an electromagnetic interfere suppression sheet attached to an adherend and the adherend, and thereby achieve placement of the electromagnetic interference suppression layer at a constant distance from the adherend surface and obtain a uniform electromagnetic interference suppression effect across the entire attachment surface. There is provided an electromagnetic interference suppression sheet comprising an electromagnetic interference suppression layer that contains a soft magnetic powder and an organic binder, and a pressure-sensitive adhesive layer having a structured surface with the side opposite the structured surface being laminated in contact with the electromagnetic interference suppression layer, wherein a continuous groove reaching to the outer perimeter of the pressure-sensitive adhesive layer is formed in the structured surface. | 11-25-2010 |
| 20110031007 | Electromagnetic interference noise reduction board using electromagnetic bandgap structure - As a multi-layered board, an EMI noise reduction board, having an electromagnetic bandgap structure with band stop frequency properties inserted into an inner portion of the board, includes a first area, in which a ground layer and a power layer are formed, and a second area, placed on a side surface of the first area, in which it has the electromagnetic bandgap structure formed therein so as to shield an EMI noise radiated to the outside through the side surface of the first area. The electromagnetic bandgap structure includes a plurality of first conductive plates, placed along the edge of the board, a plurality of second conductive plates, disposed on a planar surface that is different from the first conductive plates such that the second conductive plates are alternately disposed with the first conductive plates, and a via, which connects the first conductive plates to the second conductive plates. | 02-10-2011 |
| 20110031008 | ELECTROMAGNETIC-WAVE-ABSORBING FILM AND ELECTROMAGNETIC WAVE ABSORBER COMPRISING IT - An electromagnetic-wave-absorbing film comprising a plastic film, and a single- or multi-layer, thin metal film formed on at least one surface of the plastic film, the thin metal film being provided with large numbers of substantially parallel, intermittent, linear scratches with irregular widths and intervals. | 02-10-2011 |
| 20110042133 | CARD GUARD - The functionality or viability of this invention (Metallic Card Shield) is based on the properties of the natural chemical element Aluminum, which is known and proven to block or reflect both micro wave energy and radio wave energy. It is these two energies, the microwave and the radio wave, which are suspected of being the main culprits in the demagnetization of cards that employ a magnetic stripe to carry information. It is also by means of the radio wave that cards carrying an RFID enabled microchip may be hacked and their information read by unauthorized persons. Therefore it is the pure element Aluminum, which this invention seeks to capitalize upon and use to protect cards from having their information either erased or accessed by unauthorized persons. | 02-24-2011 |
| 20110042134 | System And Method For Protection Against Skimming Of Information From Contactless Cards - Contactless payment cards with on-card microchips are transported in mailers with RF shielding. The RF shielding is designed to prevent communication with and skimming of information from the contactless cards enclosed in the mailers while in transit. | 02-24-2011 |
| 20110056742 | EMI SHIELDS AND METHODS OF MANUFACTURING THE SAME - An electromagnetic interference (EMI) shielding apparatus generally includes a lid and a framework. The lid includes a top portion having at least one projection joining part thereon. The at least one projection joining part has a peripheral contour. The framework includes a top portion and a lateral side extending downward from the top portion. The top portion includes at least one joining opening having a peripheral contour coinciding with the peripheral contour of the at least one projection joining part of the lid. Accordingly, the at least one projection joining part of the lid is engagable with the at least one joining opening of the framework via an interference fit. | 03-10-2011 |
| 20110061925 | Printed circuit board having electromagnetic bandgap structure - Disclosed is a printed circuit board including an electromagnetic bandgap structure. The electromagnetic bandgap structure for blocking a noise is inserted into the printed circuit board. The electromagnetic bandgap structure can include a first conductive plate; a second conductive plate arranged on a planar surface that is different from that of the first conductive plate; a third conductive plate arranged on a planar surface that is different from that of the second conductive plate; and a stitching via unit configured to connect the first conductive plate and the third conductive plate by bypassing the planar surface on which the second conductive plate is arranged and including a first inductor element. | 03-17-2011 |
| 20110073360 | SHIELDING ENCLOSURES - Disclosed herein are various exemplary embodiments of shielding enclosures. In an exemplary embodiment, a shielding enclosure generally includes a frame and a lid. The frame includes vertically extending sidewalls and horizontally inwardly extending lateral flanges therefrom. The lateral flanges define a top opening of the frame and include outwardly extending detent legs. The lid includes a top portion for covering the top opening of the frame. The lid also includes flanges downwardly extending from edges of the top portion. At least one of the flanges has a detent structure, such that when the lid is installed on the frame the detent legs of the frame are engaged by the detent structure. The detent structure may, for example, be detent slots or detent protrusions. | 03-31-2011 |
| 20110094791 | FIXING DEVICE FOR SHIELD CAN - A shield can fixing device of an electronic device is provided. The fixing device includes a base having a specific length and attached to a shield can fixing line of the printed circuit board, a pair of panels, each of which is bent upwards and formed on the base to have a slit between them for inserting a lateral portion of the shield can, at least one opening portion formed in any one or both of the panels, and an insertion protrusion formed in the lateral portion located in a corresponding position to the opening portion in a protruding manner to ensure a fixing force of the shield can. The shield can fixing device is fixed by inserting a lateral portion of a shield can between double walls. | 04-28-2011 |
| 20110114380 | ELECTROMAGNETIC BANDGAP STRUCTURE AND PRINTED CIRCUIT BOARD COMPRISING THE SAME - Disclosed herein is an electromagnetic bandgap structure, including: a dielectric layer; a plurality of conductive plates formed on one side of the dielectric layer; a stitching via serving to electrically connect two adjacent conductive plates of the plurality of conductive plates; and a first dummy via formed each of the plurality of conductive plates in a direction of thickness of the dielectric layer, and a printed circuit board comprising the electromagnetic bandgap structure. The printed circuit board comprising the electromagnetic bandgap structure can solve a mixed signal problem even when an analog circuit and a digital circuit are simultaneously mounted therein. | 05-19-2011 |
| 20110114381 | Electromagnetic Frequency Radiation for Non-Ionizing Radiation Harmonizer and method of use - The present invention is an electromagnetic frequency and non-ionizing radiation harmonizer that can be a film, a sheet or a textile that harmonizes or mitigates electromagnetic frequency (EMF) radiation from non-ionizing EMF emitting devices while allowing an integration of vibrations or frequency mediums. The invention also includes a method of using an electromagnetic frequency radiation and non-ionizing radiation harmonizer that includes the steps of obtaining a film, a sheet or a textile that harmonizes or mitigates electromagnetic frequency (EMF) radiation from one or more non-ionizing EMF emitting devices and disposing the film, sheet or textile in direct contact or within dose proximity of one or more non-ionizing EMF emitting devices. | 05-19-2011 |
| 20110120763 | STRUCTURE AND METHOD OF FORMING A FILM THAT BOTH PREVENTS ELECTROMAGNETIC INTERFERENCE AND TRANSMITS AND RECEIVES SIGNALS - The present invention is a film for prevention of electromagnetic interference and transmission of wireless signals. A conductive lamination is integrally attached to a preset position of a substrate and shaped as a film and a signal transceiver. The method of forming the film includes selecting a substrate and selecting a signal transmitting and receiving mode and a form of the conductive surface according to a specific need. A film-shaped signal transceiver and conductive lamination are integrally formed on a preset area of the substrate. By plating and/or coating, the present invention can form a conductive lamination on the substrate with both functions as a signal transceiver and a shield. | 05-26-2011 |
| 20110120764 | SERVICEABLE CONFORMAL EM SHIELD - A conformal electro-magnetic (EM) shield and a method of applying such a shield are provided herein as well as variations thereof. Variations include, but are not limited to, frequency-selective shielding, shields containing active and/or passive electronic components, and strippable shields that can easily be applied to and removed from underlying components. Variations of a shield structure include at least an insulating layer between the underling component and the shield, and shielding and/or capping layers disposed over the insulating layer. | 05-26-2011 |
| 20110127081 | Electromagnetic Limiter and a Use of an Electromagnetic Limiter - The invention relates to an electromagnetic limiter. The limiter comprises a multilayer having an electrically conducting pattern superposed on a dielectric structure. Further, the multilayer is provided with at least one electromagnetically transparent aperture that is electromagnetically transparent for plane wave incidence. In addition, the limiter comprises a non-controlled non-linear structure interconnecting opposite edges of the electromagnetically transparent aperture. | 06-02-2011 |
| 20110168440 | BROADBAND ELECTROMAGNETIC WAVE-ABSORBER AND PROCESS FOR PRODUCING SAME - Disclosed is an electromagnetic wave absorbent which exhibits high electromagnetic wave absorption performance over a wide band. The electromagnetic wave absorbent contains a conductive fiber sheet which is obtained by coating a fiber sheet base with a conductive polymer and has a surface resistivity within a specific range. The conductive fiber sheet is formed by impregnating a fiber sheet base such as a nonwoven fabric with an aqueous oxidant solution that contains a dopant, and then bringing the resulting fiber sheet base into contact with a gaseous monomer for a conductive polymer, so that the monomer is oxidatively polymerized thereon. | 07-14-2011 |
| 20110180314 | Filler Panel with Cable Management Feature - A filler panel for an electronics shelf is provided. The electronics shelf includes a number of slots each configured to receive an electronic device. The filler panel includes a non-conductive main body that includes a front wall, a side wall, and a back wall. The front wall and back wall are configured to fill a width of a slot of the electronics shelf and the side wall is configured to extend into a depth of the slot. The filler panel also includes an electromagnetic shielding portion made of a conductive material and coupled to the main body. Furthermore, the main body includes one or more cable clips each configured to retain one or more cables within the main body. | 07-28-2011 |
| 20110180315 | Filler Panel for Air Flow Management - A filler panel for an electronics shelf is provided. The electronics shelf includes a plurality of slots each configured to receive an electronic device. The filler panel includes a non-conductive main body that includes a front wall, a back wall, a top wall, a bottom wall and a single side wall. The front wall, back wall, top wall and bottom wall are configured to fill a width of a slot of the electronics shelf. The side wall is configured to extend into a depth of the slot, The filler panel also includes an electromagnetic shielding portion comprising a conductive material that is coupled to the main body. The main body further includes one or more vents positioned in each of the top wall and the bottom wall, the vents configured to allow air flow though the main body. | 07-28-2011 |
| 20110186343 | SHIELDING ASSEMBLY - A shielding assembly includes a hollow frame, a pair of first resilient clips and a cover. The frame defines a receiving room and includes a pair of opposite first sidewalls, a second sidewall, a third sidewall opposite to the second sidewall, and a plurality of platforms configured along at least two diagonal corners of the hollow frame. Each of the resilient clip includes a clamping portion extending to suspend in the receiving room. The first resilient clips and the platforms are cooperatively defining a pair of guiding grooves. The cover is inserted into the guiding grooves and positioned between the platforms and first resilient clips by the clamping portions and the platforms resisting on two sides of the cover respectively. | 08-04-2011 |
| 20110192643 | ELECTROMAGNETIC RADIATION ATTENUATOR AND METHOD FOR CONTROLLING THE SPECTRUM THEREOF - The invention relates to an electromagnetic radiation attenuator and a method for controlling the spectrum thereof. The attenuator of the invention is formed from an attenuating sheet located such that, in the position of use of the attenuator, said electromagnetic radiation is incident on the attenuator sheet, and from a conductive base located, in the position of use of the attenuator, beneath said attenuator sheet. The attenuator sheet is formed by two layers, the first layer, made of dielectric material and of thickness d | 08-11-2011 |
| 20110203843 | MULTILAYER SUBSTRATE - To provide more compact dimensions of a via structure formed by signal via pairs and ground vias in multilayer substrate. A multilayer substrate is provided such that the multilayer substrate comprising a high-isolated via cell wherein the high-isolated via cell comprises: two signal via pairs; a shield structure around two signal via pairs consisting of ground vias and ground strips connected to ground vias wherein the shield structure is formed symmetrically in respect to two via pairs to reduce the transformation between mixed modes and also leakage from two signal via pairs; a clearance hole separating signal via pairs from other conductive parts of the multilayer substrate and having predetermined dimensions to provide broadband operation of the high-isolated via cell; and the separating strip disposed symmetrically between said signal via pairs to provide crosstalk reduction between two signal via pairs and common mode decrease. | 08-25-2011 |
| 20110203844 | Composite Conductive Plastic Filler Panel - A filler panel for blocking an unused portion of a communications system. That filler panel may include an electromagnetic shielding base and a base cover removably coupled to the electromagnetic shielding base. The filler panel may also include an air dam composed substantially of low-cost, nonconductive material coupled to either the electromagnetic shielding base or to the base cover through the electromagnetic shielding base. | 08-25-2011 |
| 20110220407 | FLEX-RIGID WIRING BOARD AND METHOD OF MANUFACTURING THE SAME - A flex-rigid wiring board includes a flexible board including a flexible substrate and a conductor pattern formed over the flexible substrate, a non-flexible substrate disposed adjacent to the flexible board, an insulating layer including an inorganic material and covering the flexible board and the non-flexible substrate, the insulating layer exposing at least one portion of the flexible board, a conductor pattern formed on the insulating layer, and a plating layer connecting the conductor pattern of the flexible board and the conductor pattern on the insulating layer. | 09-15-2011 |
| 20110226523 | ELECTRONIC DEVICE - An electronic device includes an upper shield arranged on a front side of a circuit board, and a lower shield arranged on a back side thereof. The lower shield includes a contact portion at an edge thereof. The contact portion is in contact with a lower surface of the circuit board. A plate spring portion is formed in the contact portion. An end portion of the plate spring portion abuts on the upper shield. Thus, it is possible to improve a shield effect against an electromagnetic wave using the shields. | 09-22-2011 |
| 20110253442 | EMC Protection System and Tower with EMC Protection System - An electromagnetic compatibility protection system for electrical cables inside a tower with an internal down-conductor is disclosed. The electromagnetic compatibility protection has a U-shaped shield with a base portion and two adjoining side portions. The base portion and the side portions define a protected space for the electrical cables. A tower with the electromagnetic compatibility protection system is also disclosed. | 10-20-2011 |
| 20110272189 | SHIELDING DEVICE FOR SHIELDING AN ELECTRONIC COMPONENT - A shielding device for shielding an electronic component ( | 11-10-2011 |
| 20110303455 | ANTENNA UNIVERSAL MOUNT JOINT CONNECTORS - An antenna mount assembly is disclosed. The antenna mount assembly includes an output contact and an antenna mount body. The antenna mount body includes an output portion, a shielding compartment for housing and electromagnetically shielding a connection between a coaxial cable and the output contact, and an access port to permit access to the shielding compartment around the connection between the coaxial cable and the output contact. An antenna mount nut is mechanically attachable to the output portion of the antenna mount body. The antenna mount nut is configured for mechanically attaching an antenna to the antenna mount body. The output contact is coupled to the antenna mount body. The output contact extends from the output portion and into the shielding compartment for electrically connecting the coaxial cable to the output portion. Antenna mount bodies, connector assemblies and methods of making and installing antenna mounts, and connectors are also disclosed. | 12-15-2011 |
| 20120006593 | ELECTROMAGNETIC INTERFERENCE (EMI) DIVERTER - An external EMI diverting structure to electrically shield an electronic device from EMI is presented. The electronic device is physically isolated from the case ground which interrupts the EMI or lightning fault path. This shield provides a return path to ground for the EMI away from the electronic device and replaces conventional EMI filter capacitors, which are not connected to case ground. The external EMI diverter comprises a first conducting enclosure enclosing the electrical circuit and is electrically coupled to the electric circuit and a second conducting enclosure enclosing the first conducting enclosure and being electrically isolated from the first conducting enclosure and the electric circuit. The diverter is physically and electrically connected to the case ground at an attachment point. | 01-12-2012 |
| 20120012381 | SHIELDING ASSEMBLY - A shielding assembly includes a frame including a catch protruding near one end thereof; and a cover including a main body. The main body is punched to form an opening and a latching portion protruding from the main body and aligned with the opening; the latching portion latches with the catch, the latching portion shields the opening to improve the shielding affect of the shielding assembly. | 01-19-2012 |
| 20120024587 | RADIATION AMOUNT REDUCING DEVICE - There is provided a radiation amount reducing device including a plurality of slit formed to a band-shape in a cover region, which is set in a plane of a metal plate capable of entirely covering at least one surface of an electromagnetic wave generation source, and spaced apart from each other, each of the plurality of slits including a drawing slit formed extending from a ferromagnetic field position towards a central part of the cover region and a coupling slit formed extending in parallel with another slit from an end in a central part direction of the cover region in the drawing slit. | 02-02-2012 |
| 20120024588 | METHODS AND APPARATUS FOR SHIELDING CIRCUITRY FROM INTERFERENCE - This is directed to methods and apparatus for shielding a circuitry region of an electronic device from interference (e.g., EMI). A conductive dam may be formed about a periphery of the circuitry region. A non-conductive or electrically insulating fill may then be applied to the circuitry region within the dam. Next, a conductive cover may be applied above the fill. The cover may be electrically coupled to the dam. The dam may include two or more layers of conductive material stacked on top of one another. In some embodiments, the conductive cover may be pad printed or screen printed above the fill. In other embodiments, the conductive cover may be a conductive tablet that is melted above the fill. | 02-02-2012 |
| 20120031661 | ELECTROMAGNETIC SHIELDING DEVICE - A shielding device includes a frame, a shielding enclosure and a shaft. The frame includes sidewalls and at least one hinged portion. The shielding enclosure includes a cover and flanges extending therefrom for engagement with the sidewalls of the frame. A barrel portion is formed on the shielding enclosure and is aligned with the hinged portion. The shaft extends through the hinged portion and the barrel portion for rotatably connecting the shielding enclosure to the frame. | 02-09-2012 |
| 20120031662 | SENSOR MODULE HAVING AN ELECTROMAGNETICALLY SHIELDED ELECTRICAL COMPONENT - In a module having an electrical component, which is situated between two ground planes for electromagnetic shielding, a trough-shaped composite component is provided between an inner and an outer housing, into which the rear side of the inner housing is inserted, the composite component having an insulator trough and, on its inside, a ground plane formed at least on the trough bottom, which forms the shielding of a rear side of the electrical component. The composite component is advantageously designed as an MID component. The outer housing of the module may be manufactured in the two-component injection molding process by extrusion-coating initially using an elastomer and subsequently a thermoplast. | 02-09-2012 |
| 20120061134 | SHIELDABLE BAG SYSTEM AND DEVICES - A storage system and devices are provided for containing items and shielding the items from electromagnetic radiation, in particular, RF radiation, and holding the items in a waterproof environment. The storage system includes a first storage component which is constructed from a fabric having shieldable properties and is configured to envelope contents held therein in a shielded environment, and a second storage component which is constructed to receive the first storage component therein and provide waterproof storage for the contents. The storage system protects contents from unauthorized or surreptitious reads of stored data that may be carried on the content items by readers. The storage components of the storage system may be used independently of each other or together, as needed or desired. | 03-15-2012 |
| 20120145449 | SHIELDING ASSEMBLY AND METHOD FOR MANUFACTURING SAME - A shielding assembly includes a frame including a main body, the main body defining at least one retaining hole; and a cover including a main board, the main panel including retaining elements and rims. The number of the retaining elements is the same as the number of the retaining holes, each rim protruding outwardly from a distal end of one of retaining elements. Each retaining element passes through one of the retaining holes, and each rim is latched with the portions of the frame surrounding the retaining holes. | 06-14-2012 |
| 20120193136 | Folding Methods for Making Frames of Board Level Electromagnetic Interference (EMI) Shields - Disclosed herein are exemplary embodiments of methods of making frames for electromagnetic (EMI) shielding apparatus. An exemplary method generally includes forming a frame to have at least a first frame portion, a second frame portion, and a common sidewall including at least a portion shared by and connecting the first and second frame portions. The second frame portion is repositioned from being disposed within a footprint of the first frame portion to outside the footprint of the first frame portion. Another exemplary embodiment includes a frame having first and second frame portions. The second frame portion is of a size sufficient to fit within an interior region defined by the first frame portion. The first and second frame portions share at least a portion of a common sidewall having a bendable hinge portion that connects the second frame portion to the first frame portion. | 08-02-2012 |
| 20120193137 | EMI-Shielding Solutions for Computer Enclosures Using Combinations of Two and Three-Dimensional Shapes Formed in Sheet Metal - The present invention provides a configuration of a computer-chassis containment or other electromagnetic device method for manufacture in which a “one-hit” solution may be implemented to provide adequate electromagnetic interference shielding (EMC shielding) and is configured such that shielding gaskets, “spoons” or other excessive structures may be reduced or eliminated completely. Patterned sinusoidal “patterns” that are stamped, molded, cut, or extruded into one or more sides of a “box” provide sufficient EMI shielding, such that the need for gaskets is reduced or eliminated. | 08-02-2012 |
| 20120228019 | Apparatus and Associated Methods - A printed wiring board including a conductive layer, the conductive layer including a network of nanotubes with respective longitudinal axes, the nanotubes arranged such that their longitudinal axes are aligned substantially parallel to one another in a configuration such that electrical current passing through the conductive layer along a first axis substantially parallel to the longitudinal axes of the nanotubes experiences one degree of dissipation, and electrical current passing through the conductive layer along a second axis experiences a higher degree of dissipation. | 09-13-2012 |
| 20120241210 | COVER FOR ELECTRONIC EQUIPMENT - Cover for electronic equipment including at least two movable metal panel elements. The panel elements are joined together along their respective edges, so they are joined together and in relation to each other immobile state form the cover. The invention is wherein the cover includes a respective connector for mechanical joining and good electric contacting along each one of the edges along which the panel elements are arranged to be joined together, in that each connector includes a respective resilient metal contacting device, which contacting device is arranged between the respectively joined together panel elements and in direct contact with both panel elements when the panel elements are in the joined together state, and thereby is compressed against the spring force of the contacting device, so that the spring force acts against the surfaces of both the respective joined together panel elements and connects them to each other electrically. | 09-27-2012 |
| 20130000969 | SHIELDING PLATE AND SHIELDING ASSEMBLY WITH SAME - A shielding structure includes a frame and a removable plate. The frame includes a peripheral wall, and the removable plate located in the opening may be fixed to the connecting board, the removable plate defining an access hole. A scored line is defined between the removable plate and the connecting board. The shielding structure further defines an arcuate gap between the removable plate and the connecting board and communicating with the scored line, and a mating hole, the arcuate gap is for increasing the shearing stresses on shielding structure the scored line when the removable plate must be removed. | 01-03-2013 |
| 20130025928 | ELECTROMAGNETIC INTERFERENCE SHIELDING ARRANGEMENT - An electromagnetic interference shielding arrangement comprises a first and a second electro-conductive components that are arranged to be joined. The first electro-conductive component includes a first electro-conductive contact surface. The second electro-conductive component includes a second electro-conductive contact surface and a shielding member extending from the second electro conductive component at a location adjacent the second electro-conductive surface. The arrangement is such that, in the joined configuration of the first and the second electro-conductive components the first and the second electro-conductive surfaces abut to create an electro conductive engagement region that is adjacent the shielding member. | 01-31-2013 |
| 20130068520 | ELECTROMAGNETIC SHIELDING DEVICE AND ELECTRONIC APPARATUS - An electromagnetic shielding device for shielding electromagnetic energy generated by an electronic apparatus. The electromagnetic shielding device includes a base board and a number of protrusions formed on the base board. The length of each protrusion along a direction perpendicular to the base board is adjustable. The amount of electromagnetic energy can be absorbed by the electromagnetic shielding device is adjusted according to the length of the protrusion. | 03-21-2013 |
| 20130153285 | MAGNETIC FIELD SHIELDING RAISED FLOOR PANEL - A magnetic field shielding raised floor panel having a plurality of grain-oriented electrical steel (GOES) sections. The orientation of each GOES section is parallel to a top surface of the section. The plurality of GOES sections can include sidewall and lip portions. The plurality of GOES sections can be perforated to permit air flow through the GOES section. Openings in adjacent perforated GOES sections do not substantially overlap. | 06-20-2013 |
| 20130153286 | SHIELDING SYSTEM FOR MOBILE DEVICE AND METHOD FOR ASSEMBLING THE SYSTEM - A shielding system for a mobile device and a method for assembling the system are provided. The shielding system includes a Printed Circuit Board (PCB) with a first area and a thickness, and a shield enclosure, spaced apart and above a front side of the PCB at a certain distance, for enclosing components on the PCB. Parts of the shield enclosure are coupled to at least one of a lateral side and a back side of the PCB. | 06-20-2013 |
| 20130284510 | ELECTROMAGNETIC SHIELDING COVER AND DEVICE HAVING THE SAME - An electromagnetic shielding cover and a device having the same are introduced. The device comprises a casing and is coupled to a base having a printed circuit board on which an electronic component is mounted. The casing is defined with a receiving region. The electromagnetic shielding cover is disposed within the receiving region and coupled thereto. The electromagnetic shielding cover is marked with a plurality of peripheral folding lines. The electromagnetic shielding cover is folded along the peripheral folding lines by an angle to form a plurality of walls and a shielding space. Coupling the casing and the base together allows the electromagnetic shielding cover to shield an electronic component mounted on the circuit board and received in the shielding space, thereby shielding the electronic component from electromagnetic interference. The electronic component can be easily changed and tested during a rework process. | 10-31-2013 |
| 20130299229 | SHIELDING STRUCTURE FOR WIRE HARNESS - A shielding structure for a wire harness includes a seal member which has a wire through hole that allows the wire to pass therethrough while sealing a circumference of the wire. The wire has a structure where an insulating resin layer is formed on an outer circumference of a conductor, and a predetermined range in a length direction of the conductor is coated with a shield layer formed by resin plating to cover an outer circumferential surface of the insulating resin layer. A terminal portion of the wire is passed through the wire through hole of the seal member to be introduced into the shield wall to a position where the shield layer exists, whereby an inner circumference of the wire through hole is made in close contact with the shield layer to cause the shield layer and the seal member to be electrically conducted with each other. | 11-14-2013 |
| 20130319751 | ELECTROMAGNETIC INTERFERENCE SHIELDING ASSEMBLY AND ELECTRONIC DEVICE HAVING SAME - An electromagnetic interference shielding assembly for use in an electronic device is disclosed. The electronic device includes a circuit board and an alternating current cable including one end connected to the circuit. The electromagnetic interference assembly includes an electromagnetic interference shielding plate. The circuit board is mounted on the electromagnetic interference shielding plate. The alternating current cable includes a segmental portion arranged adjacent to the electromagnetic interference shielding plate. The segmental portion extends substantially parallel to the electromagnetic interference shielding plate. The electromagnetic interference shielding plate defines a plurality of slots each extending in a direction perpendicular to an extending direction of the segmental portion of the alternating current cable. The parallel slots, as a whole, extend along the extending direction of the segmental portion and spatially corresponding to the segmental portion. | 12-05-2013 |
| 20140027171 | PLATE FOR A SHIELD CAN FOR AN SMD PROCESS, MANUFACTURING METHOD THEREOF, AND SHIELD CAN USING THE PLATE - The shield can plate for a SMD process in accordance with the present invention, includes: a metal conductive layer which is made of one selected from a group consisting of copper (Cu), zinc (Zn), nickel (Ni), silver (Ag), iron (Fe) and chromium (Cr) or an alloy thereof, or clad metal, performs an electromagnetic shielding function and maintains a physical structure when a shield can is constructed; an insulating layer which is made of one or more of polyethylene terephthalate (PET) and polyethylene naphthalate (PEN), which are crystalline polymers, wherein the insulating layer is laminated on one side of the metal conductive layer; and a silane-based coupling layer interposed between the metal conductive layer and the insulating layer. | 01-30-2014 |
| 20140034377 | THIN-SLEEVE APPARATUS FOR REDUCING RF COUPLING OF DEVICES IN MRI ENVIRONMENTS - An RF shield for medical interventional devices includes elongated inner and outer conductive tubes, and an elongated dielectric layer of MRI compatible material sandwiched between the inner and outer conductive tubes and surrounding the inner conductor. The inner and outer conductive tubes are electrically connected to each other at only one of the adjacent end portions thereof. The opposite respective end portions are electrically isolated from each other. | 02-06-2014 |
| 20140048326 | MULTI-CAVITY WIRING BOARD FOR SEMICONDUCTOR ASSEMBLY WITH INTERNAL ELECTROMAGNETIC SHIELDING - A multi-cavity wiring board includes a coreless substrate, an adhesive, and a stiffener having a plurality of apertures with lateral shielding sidewalls. The coreless substrate covers the stiffener and includes electrical pads exposed from the apertures of the stiffener as electrical contacts for semiconductor devices packaged within the apertures. The aperture sidewalls of the stiffener can serve as effective lateral electromagnetic shields for the semiconductor devices within the apertures. | 02-20-2014 |
| 20140060914 | ENCLOSURE WITH SHIELD APPARATUS - An enclosure includes a sidewall defining a number of first vents and a shield apparatus installed to the sidewall. The shield apparatus includes a shield plate spaced from the sidewall. A distance between the sidewall and the shield plate is greater than a size of the first vent. The shield plate defines a number of second vents respectively aligning with the first vents. | 03-06-2014 |
| 20140097016 | EMI SHIELDING MATERIAL HAVING IMPROVED DELAMINATION BEHAVIOR - Disclosed herein are thermoplastic compositions that provide electromagnetic/radio frequency interference (EMI/RFI) shielding characteristics to a molded article. The compositions offer improved delamination behavior. The compositions include a polycarbonate resin, a polysiloxane block co-polycarbonate, a conductive filler capable of providing EMI shielding characteristics and optionally other pigments and/or processing additives. The compositions can be used in a variety of applications such as personal computers, notebook and portable computers, cameras, or other electronic devices. | 04-10-2014 |
| 20140116770 | Arrangment for Energy Conditioning - Circuit arrangement embodiments that use relative groupings of energy pathways that include shielding circuit arrangements that can sustain and condition electrically complementary energy confluences. | 05-01-2014 |
| 20140151110 | SHIELD STRUCTURE FOR ELECTRONIC APPARATUS - A shield structure for an electronic apparatus includes a frame member and a shield box. The frame member is a conductive frame to which the wiring substrate is attached and covering a back surface of the wiring substrate. The shield box is formed on a front surface of the wiring substrate having an electronic component mounted thereon, to cover an area of a portion of the front surface. The wiring substrate includes a plurality of connecting portions formed thereon that ground the front surface and the back surface to the frame member. On a side on which the wiring substrate protrudes from the shield box, the shield box includes a shield wall member forming a wall surface substantially perpendicular to the wiring substrate. The shield wall member is grounded to at least one location of the connecting portions of the wiring substrate in the vicinity of the wall surface. | 06-05-2014 |
| 20140174814 | ELECTROMAGNETIC INTERFERENCE SHIELD AND ELECTRONIC DEVICE USING THE SAME - An electromagnetic interference shield includes a shell body and a magnetic material layer formed on the shell body. A number of holes are defined in the shell body. A number of through holes are defined in the magnetic material layer aligned with the holes. An electronic device having the electromagnetic interference shield is also provided. | 06-26-2014 |
| 20140182924 | Thermally Conductive EMI Suppression Compositions - An interface pad for suppressing electromagnetic and radio frequency radiation includes first and second generally opposing sides which define a thickness therebetween, with the interface pad exhibiting thermal conductivity, electrical resistivity, and a hardness of between 10-70 Shore 00 at 20° C. The interface pad is capable of attenuating electromagnetic and/or radio frequency radiation that is commonly associated with interference of electronic components. | 07-03-2014 |
| 20140202756 | BRAID AND WIRE HARNESS - A braid having a function as an exterior member as well as an electromagnetic shielding function is provided. Also, a wire harness including such a braid in a configuration is provided. A braid is used for a wire harness cabled to a hybrid vehicle. Also, the braid is formed by knitting multiple ultrathin strands in a tubular shape. The braid includes two kinds of strands, a metal strand made of metal having conductivity and a resin strand made of synthetic resin having abrasion resistance etc., and ensures abrasion resistance and impact resistance by the portion made of the resin strand while performing an electromagnetic shielding function by the portion made of the metal strand. | 07-24-2014 |
| 20140262475 | 3D Shielding Case and Methods for Forming the Same - A package includes a die, and a molding material molding the die therein. A metal shield case includes a first metal mesh over and contacting the molding material and the die, a second metal mesh underlying the die, and a Through-Assembly Via (TAV) in the molding material and forming a ring encircling the die. The TAV is electrically connected to the first metal mesh and the second metal mesh. | 09-18-2014 |
| 20140284095 | DEVICE FOR ELIMINATING CELL PHONE TRACKING - A shielding system includes a resealable enclosure configured to receive a handheld device. An electroconductive layer is configured to magnetically and/or electrically shield the handheld device. | 09-25-2014 |
| 20140367160 | ELECTRIC MAGNETIC SHIELDING STRUCTURE IN PACKAGES - A package includes a device die, a molding material molding the device die therein, and a through-via penetrating through the molding material. A redistribution line is on a side of the molding material. The redistribution line is electrically coupled to the through-via. A metal ring is close to edges of the package, wherein the metal ring is coplanar with the redistribution line. | 12-18-2014 |
| 20150014049 | SHIELDING APPARATUS - A shielding apparatus is provided. The apparatus includes a printed circuit board including a plurality of catching parts, a shield member configured to cover the printed circuit board, and at least one shield fastening part provided in the shield member and configured to be one of fastened to and separated from the plurality of catching parts by a resilient force while not protruding. | 01-15-2015 |
| 20150047894 | SHELL OF ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME - A shell of an electronic device includes a resin base formed by injecting molten resin into an injection mold, and a film layer including a base layer attached to the resin base and an electro magnetic interference shielding layer attached to the base layer and opposite to the resin base. | 02-19-2015 |
| 20150068797 | ELECTROMAGNETIC FREQUENCY RADIATION FOR NON-IONIZING RADIATION HARMONIZER AND METHOD OF USE - An electromagnetic frequency and non-ionizing radiation harmonizer that may be a film, a sheet or a textile that harmonizes or mitigates electromagnetic frequency radiation from non-ionizing EMF emitting devices while allowing an integration of vibrations or frequency mediums. The harmonizer includes a method of utilizing an electromagnetic frequency radiation and non-ionizing radiation harmonizer that includes the steps of obtaining a film, a sheet or a textile that harmonizes or mitigates electromagnetic frequency radiation from one or more non-ionizing EMF emitting devices and disposing the film, sheet or textile in direct contact or within dose proximity of one or more non-ionizing EMF emitting devices. | 03-12-2015 |
| 20150334882 | SHIELDED CONDUCTIVE PATH - A shielded conductive path capable of being easily managed in terms of a length of a portion of a single core wire protruding from a shield pipe includes a shield pipe electromagnetically shielding a plurality of single core wires inserted therein and a spacer having insertion holes individually receiving the single core wires. Each single core is made of a single conductor as a core wire. The spacer is fitted inside of the shield pipe while being restricted from displacement in directions perpendicular to an axial direction of the shield pipe. | 11-19-2015 |
| 20150334883 | ELECTROMAGNETIC INTERFERENCE SUPPRESSOR - The present invention relates to an electromagnetic interference suppression sheet comprising a conductive layer comprising a conductive metal filler and having a surface electrical resistance of 100 to 5000 Ω/□, and a magnetic layer comprising a magnetic material mixed therein and having a real part μ′ of a magnetic permeability of 3 to 45 as measured at 100 MHz which is laminated on the conductive layer. The electromagnetic interference suppression sheet of the present invention is suitable for high-density packaging of electronic devices, and has an excellent low-pass filter characteristic in a near electromagnetic field in a wide frequency band ranging from a low frequency to a high frequency. | 11-19-2015 |
| 20150351291 | SHIELD STRUCTURE OF ELECTRONIC DEVICE UNIT AND CONTROL PANEL HOUSING - In an electrical shield structure of an electronic device unit and a control panel housing, a metal frame includes a plurality of protrusions having conductivity and having heights to come into contact with the control panel housing. The plurality of protrusions are provided at positions which surround an electronic component. A packing includes a plurality of holes through which the protrusions are inserted at positions corresponding to the positions of the protrusions. | 12-03-2015 |
| 20150366109 | SHIELDING CAGE WITH OVERINSERTION PREVENTION ASPECT - A shielding cage is disclosed that has an EMI gasket integrally formed on its exterior. In order to prevent the over-insertion of the cage into a faceplate opening, a plurality of stop members are formed integrally with the cage walls and comprise angled tabs that are bent outwardly away from the cage walls at an angle of between about 30 and 90. The stop members are flanked by a pair of EMI gasket spring fingers and are positioned so that they are located above the centers of modules inserted into module-receiving bays of the shielding cage. | 12-17-2015 |
| 20160057898 | SHIELDING FILM AND METHOD OF MANUFACTURING SAME - A shielding film includes an insulation layer, a conductive shielding layer and an adhesive layer; and is manufactured in a method including the steps of connecting a conductive shielding layer to a substrate material and forming a plurality of cavities on them; forming an insulation layer on the conductive shielding layer to fill up all the cavities; forming a carrier film on a top of the insulation layer; removing the substrate material from the conductive shielding layer, such that a plurality of downward protruded metal grounding electrodes are formed on a lower side of the conductive shielding layer corresponding to the cavities; and providing an adhesive layer on the lower side of the conductive shielding layer, such that the metal grounding electrodes are exposed from the adhesive layer to present a geometric pattern. The produced shielding film shows good grounding effect and bonding strength to ensure enhanced electromagnetic shielding effect. | 02-25-2016 |
| 20160100511 | Aluminum EMI / RF Shield with Fins - A shield made from aluminum (AL) or an aluminum-based alloy coated with a solderable plating such as nickel or tin provides thermal improvement over existing shielding materials. The shield for electronic components on a circuit board comprising a base having an upper surface and one or more sidewalls extending from a perimeter of the upper surface, the sidewalls configured to engage a fence of the circuit board, and a fin array attached to the upper surface of the base, the fin array having a plurality of stackable fins, each of the stackable fins having a wall and one or more engagement tabs extending from one or more edges of the wall, the engagement tabs interlocking the plurality of stackable fins together. | 04-07-2016 |
| 20160120077 | ELECTROMAGNETIC WAVE SHIELD FILM, PRINTED WIRING BOARD USING SAME, AND ROLLED COPPER FOIL - An electromagnetic wave shield film in which peeling off between a metal thin film and an adhesive layer is prevented and a printed wiring board employing the electromagnetic wave shield are provided. An electromagnetic wave shield film is formed by laminating at least a metal thin film and an adhesive layer in order, and the water vapor permeability of the electromagnetic wave shield film according to JISK7129 is 0.5 g/m | 04-28-2016 |
| 20160157394 | MAGNETIC SHIELDING | 06-02-2016 |
| 20160165764 | Heat-Dissipating EMI/RFI Shield - A heat-dissipating EMI/RFI shield ( | 06-09-2016 |
| 20160183417 | Shielding Device | 06-23-2016 |
| 20160205814 | INTELLIGENT MODULAR AEROSPACE TECHNOLOGY SYSTEM (IMATS) | 07-14-2016 |
| 20170238447 | ELECTROMAGNETIC WAVE SHIELDING TAPE USING NANOMATERIALS | 08-17-2017 |
| 20190150331 | Electromagnetic Wave Shield Film, Printed Wiring Board Using Same, and Rolled Copper Foil | 05-16-2019 |
