| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 156379600 | With means applying wave energy or electrical energy directly to work | 86 |
| 20090000745 | Surface Treatment Apparatus for Printed Sheets - It is an object of the present invention to provide a surface treatment apparatus for printed sheets that is capable of securely preventing radiation of UV rays onto printed sheets when out of use, while efficiently radiating UV rays onto printed sheets when in use. There is provided a surface treatment apparatus that includes a varnishing section for applying UV cure resin varnish on a printed sheet in a printed sheet conveying path; a cylinder for conveying a printed sheet with the UV cure resin varnish applied thereon at the varnishing section; a film pressing part for pressing a transfer film onto a printed sheet on the cylinder; and a UV radiation part for curing UV cure resin varnish of a printed sheet onto which the transfer film is being pressed by the film pressing part. The UV radiation part is positioned close to the cylinder when the film pressing part is positioned close to the impression cylinder; and the UV radiation part is positioned away from the cylinder when the film pressing part is positioned away from the cylinder. | 01-01-2009 |
| 20090025881 | APPARATUS FOR BINDING STACKS OF FLAT COMPONENTS - An apparatus for binding stacks of flat components, in particular paper pads and books, having a binding agent applicator for applying liquid binding agent along a narrow side of the stack by moving the narrow side of the stack and the binding agent applicator relative to each other. The binding agent applicator has a slotted nozzle which extends at an angle, preferably a right angle, to the direction of the relative motion and is provided for dispensing binding agent that is curable by radiation. A radiation source for curing the binding agent is positioned adjacent to the binding agent applicator. | 01-29-2009 |
| 20090025882 | DIE MOLDING FOR FLIP CHIP MOLDED MATRIX ARRAY PACKAGE USING UV CURABLE TAPE - An embodiment of the present invention is a technique to package flip chip molded matrix array package. An ultraviolet (UV) curable tape is laminated on die backside of a strip of array of flip chips. The UV curable tape has an adhesive strength. The strip of flip chip arrays is molded with a mold film. The molded strip of flip chip array is irradiated using UV radiation. In another embodiment, a double functional tape is mounted to backside of a wafer. The double functional tape includes a binding tape and a ultraviolet (UV) curable tape having an adhesive strength. The wafer is singulated into die. The die is attached to a substrate strip to form a strip of array of flip chips. The strip is molded with a mold film. The molded strip is irradiated using UV radiation. | 01-29-2009 |
| 20090173448 | BONDING STRUCTURE AND SEMICONDUCTOR DEVICE MANUFACTURING APPARATUS - The present invention relates to a bonding structure, including: a ceramic member including a hole; a terminal embedded in the ceramic member, an exposed surface exposed to a bottom portion of the hole, and made of a refractory metal having a thermal expansion coefficient substantially equal to a thermal expansion coefficient of the ceramic member; a brazed bond layer including a first tantalum layer in contact with the exposed surface of the terminal, a gold layer formed on the first tantalum layer, and a second tantalum layer formed on the gold layer; and a connecting member inserted in the hole, bonded to the terminal via the brazed bond layer, and made of a refractory metal having a thermal expansion coefficient substantially equal to the thermal expansion coefficient of the ceramic member. | 07-09-2009 |
| 20090173449 | BONDING STRUCTURE AND SEMICONDUCTOR DEVICE MANUFACTURING APPARATUS - A bonding structure according to the present invention includes: a ceramic member including a hole; a terminal embedded in the ceramic member and including an exposed surface exposed to a bottom portion of the hole; a brazed bond layer formed in contact with the exposed surface of the terminal; and a connecting member inserted in the hole, and bonded to the terminal via the brazed bond layer. An inner diameter of the hole is larger than an outer diameter of the connecting member. A clearance is formed between the hole and the connecting member when the connecting member is inserted in the hole. A braze pool space is formed in a surface of the hole and has a substantially semicircular shape in a cross-sectional plane. The braze pool space is partially filled with a braze material. | 07-09-2009 |
| 20090183836 | Apparatus for Glueing Together the Wrap of An Endless Tow of Filter Material - An apparatus for glueing together the wrap of an endless tow of filter material in the manufacture of cigarette filters, with an application station for hot melt adhesive, in which hot melt adhesive is applied to the flat endless web of the wrap, a wrapping station, in which the endless web is laid around the endless tow of filter material, a pre-heating station, in which the hot melt adhesive on the endless web is pre-heated to a preset temperature, while the wrap is brought into immediate contact with a heating surface in the region where adhesive is applied, and with a cooling station, in which the hot melt adhesive is cured, wherein a cooling apparatus is assigned to the pre-heating station, which causes a cooling of the heating surface when the temperature on the heating surface exceeds a preset value. | 07-23-2009 |
| 20090188629 | Apparatus for Applying Labels to Containers - The invention relates to an apparatus for applying labels to containers. In one embodiment according to the invention, the process of applying the labels to the container is carried out by means of a laser unit. In another embodiment according to the invention, a cutting unit is provided for the apparatus, which cutting unit likewise uses a laser and is arranged at least partially inside a cutting roller. In preferred embodiments, the complete application process, i.e. in particular including the bonding of the end sections of the label, is carried out by means of the laser unit. | 07-30-2009 |
| 20090277590 | Device and method for corona treatment of flat material - The invention relates to a device and a method for the corona treatment of flat material ( | 11-12-2009 |
| 20100006230 | LAMINATOR - The present application generally relates to methods, materials, and equipment for manufacturing a signs. Some embodiments of the present application relate to methods of manufacturing a digitally printed, multi-panel sign. Some embodiments of the present application relate to a laminator for use in laminating optically active sheeting to a substrate. | 01-14-2010 |
| 20100006231 | ULTRASONIC BONDING APPARATUS - An ultrasonic bonding apparatus includes a head that includes a tool surface configured to mount an electronic component, an ultrasonic bonding unit configured to ultrasonically bond the electronic component with a substrate, and a wiping unit configured to wipe out pre-cured underfill that has adhered to the tool surface of the head, by using a wiping member on a wiping table. The wiping unit includes a solvent supply unit configured to supply a solvent configured to powder the underfill, to the wiping member on the wiping table, a sealed cartridge configured to house the wiping table and a feed mechanism configured to supply the wiping member to the wiping table and to roll up the wiping member from the wiping table, and a cartridge support member that includes a motor configured to drive the feed mechanism, and is detachably attached to the cartridge. | 01-14-2010 |
| 20100038035 | LAMINATE BODY, METHOD, AND APPARATUS FOR MANUFACTURING ULTRATHIN SUBSTRATE USING THE LAMINATE BODY - Provided is a laminated body comprising a substrate to be ground and a support, where the substrate is ground to a very small thickness and can then be separated from the support without damaging the substrate. One embodiment of the present invention is a laminated body comprising a substrate to be ground, a joining layer in contact with the substrate to be ground, a photothermal conversion layer comprising a light absorbing agent and a heat decomposable resin, and a light transmitting support. After grinding the substrate surface which is opposite that in contact with the joining layer, the laminated body is irradiated through the light transmitting layer and the photothermal conversion layer decomposes to separate the substrate and the light transmitting support. | 02-18-2010 |
| 20100206487 | ULTRASONIC VIBRATION WELDER - The present invention solves the problem that a connecting portion between a horn and a vibration transmission rod has a tendency to get damaged and the problem associated with the structure in which a chip is attached to an end of the vibration transmission rod, which occur with the known ultrasonic vibration welder. A vibration transmission rod has an end surface serving as a vibration-and-pressure application surface, and a polygonal cross section. The vibration transmission rod is disposed at an end of a horn in such a manner that they vibrate together. The vibration transmission rod and a mass are formed separately. The mass applies pressure to a projection formed at a nodal point of the vibration transmission rod. | 08-19-2010 |
| 20110073259 | METHOD AND APPARATUS FOR SEALING A GLASS PACKAGE - An apparatus for sealing a substrate assembly by applying a force to the assembly while simultaneously exposing the substrate assembly, and in particular a sealing material disposed between two substrates of the substrate assembly, to an irradiating beam of electromagnetic energy. The beam heats, cures and/or melts the sealing material, depending upon the sealing material to form the seal. The force is applied by directing a flow of fluid against the substrate assembly, and beneficially improves contact between the substrates of the substrate assembly and the sealing material during the sealing process, therefore assisting in achieving a hermetic seal between the substrates. | 03-31-2011 |
| 20110146913 | INDUSTRIAL FABRIC WITH WEAR RESISTANT COATING - An industrial fabric used in the manufacture or processing of at least one material web includes a base fabric having a board side and a machine side. The base fabric includes a plurality of spirals extending in a cross machine direction (CMD). The spirals are interconnected together with each other along adjacent peripheral edges to form a spiral link fabric. The base fabric has opposite lateral side edges extending in a machine direction (MD). One or more electrostatic control yarns are positioned within a corresponding spiral and extend in the CMD direction to the lateral side edges. A pair of conductive edge coatings are applied to at least the board side of a respective lateral side edge for a predetermined width. The conductive edge coatings and the one or more electrostatic control yarns form an electrostatic grid. A pair of wear resistant coatings are applied to an area adjacent a respective conductive edge coating such that a substantially constant spacing between the wear resistant coatings corresponds to a minimum expected working width of the industrial fabric. The wear resistant coatings are wear resistant with a hardness of between approximately 50 to 66 Shore A Durometer Hardness, and a coefficient of friction greater than approximately 2 on the board side. The industrial fabric has a completely non-marking seam because of its integral nature with the base fabric and the equal amount of the wear resistant coating at the seam and the edges. | 06-23-2011 |
| 20120111503 | HEATING COIL WELDING FITTING - A heating coil welding fitting comprising a cylindrical coupling body for welding pipelines made of thermoplastics or other weldable plastics, containing at least two heating wire windings, each with a plurality of turns which are at any desired distance from one another, and contacts for feeding the electric current, wherein the heating wire winding is wavy, preferably sinusoidal, and the coupling can be deformed as a result. | 05-10-2012 |
| 20120160421 | APPARATUS FOR MAKING BAG ASSEMBLY - A welding apparatus includes first and second die members opposing one another. The first and second die members include opposing respective first and second perimeter-welding electrodes and opposing respective first and second tube-welding electrodes. The first perimeter-welding electrode and first tube-welding electrode define a first welding surface. The second perimeter-welding electrode and second tube-welding electrode define a second welding surface. A single source of high frequency energy is electrically connected to the perimeter-welding electrodes and to the tube-welding electrodes. Dielectric material is selectively disposed on the first welding surface such that the material is disposed on some but not all the first welding surface for reducing a strength of a high frequency electric field between the first and second perimeter-welding electrodes as compared to a strength of the high frequency electric field between at least a portion of the first and second tube-welding electrodes. | 06-28-2012 |
| 20120175064 | ULTRASONIC JOINING APPARATUS AND ABSORBENT ARTICLE MANUFACTURING APPARATUS - An anvil includes a base and projections and. The base is installed at an attachment position on an outer peripheral surface of a rotating drum. The projection protrudes from a front surface of the base in a normal direction H of the rotating drum and is formed in a line shape extending in the cross direction CD along the front surface of the base. On the front surface of the base, one end in the cross direction CD of the projection is provided forward of the other end in a rotation direction R. In the projection, a cut portion is formed to extend in a direction opposite to the protrusion direction of each protrusion. The cut portion extends from the front surface of the projection, protruding from the front surface of the base, to the vicinity of the middle of the projection. | 07-12-2012 |
| 20130025793 | DEVICE FOR WELDING THERMOPLASTIC MEMBRANES - The invention relates to a device ( | 01-31-2013 |
| 20130075039 | SYSTEM FOR FABRICATING SILICON CARBIDE ASSEMBLIES - A system for fabricating silicon carbide assemblies that includes at least two silicon carbide materials; at least one joining interlayer positioned between the at least two silicon carbide materials, wherein the at least one joining interlayer further includes a first material that melts at a first temperature and a second material interspersed throughout the first material, and wherein the second material melts at a temperature that is lower than that of the first material; and at least one apparatus for applying energy to the joining interlayer, wherein applying energy to the joining interlayer is operative to soften the first material and melt the second material, and wherein softening the first material and melting the second material is operative to transform the joining interlayer into a substantially porosity-free adherent material capable of joining together the at least two silicon carbide materials. | 03-28-2013 |
| 20130133835 | Delamination Apparatus and Inline Thermal Imaging System - A delamination apparatus includes a stage, a first roll unit, a gripper, and a second roll unit. The stage includes a peripheral area and a substrate area. An edge of a donor film is attached at the peripheral area. An acceptor substrate, laminated at on the donor film, is disposed at the substrate area. The first roll unit is disposed on the donor film, moves in a lengthwise direction of the acceptor substrate. The gripper is disposed on the donor film, and is configured to separate the edge of the donor film from the stage so as to cause the donor film to contact the first roll unit. The second roll unit is disposed on the stage, contacts the donor film which contacts the first roll unit, and delaminates the donor film from the acceptor substrate by moving in the lengthwise direction with the first roll unit. | 05-30-2013 |
| 20130199730 | Wafer bonding chamber with dissimilar wafer temperatures - A wafer bonding chamber is disclosed, which maintains two wafers to be bonded together at two substantially different temperatures. A lid wafer may be held at a higher temperature than a device wafer, as the device wafer may have delicate structures formed thereon, which cannot withstand higher temperatures. The lid wafer may have an adhesive bonding material formed thereon, which is melted or cured at the higher temperature. The temperature differential may be maintained by applying at least one of a heating mechanism and a cooling mechanism preferentially to one of the wafers to be bonded in the wafer bonding chamber. | 08-08-2013 |
| 20130199731 | SYSTEMS AND METHODS FOR MANUFACTURING COMPOSITE WOOD PRODUCTS TO REDUCE BOWING - The present disclosure includes systems and methods for manufacturing a composite wood product. In some embodiments, the method includes the steps of forming a mat from a plurality of wood elements and an adhesive, the mat having a width W measured substantially perpendicular to a longitudinal axis of the mat and an initial thickness T | 08-08-2013 |
| 20130333844 | ELECTROSTATIC CHARGE APPLICATOR, THE ELECTROSTATIC CHARGE APPLICATOR HAVING AN ACCUMULATING MEMBER AND AN APPLICATION MEMBER AND A SYSTEM FOR ELECTROSTATICALLY SUPPORTING AN OBJECT - There is provided an electrostatic support applicator, which comprises a body including: a first body portion and a second body portion; the first body portion including an electrostatic generating sub-assembly; the second body portion being implemented as an accumulating member for accumulating electrostatic charge; and an application member mounted onto said accumulating member and spaced away from said accumulating member by a separating distance “d”, said separating distance “d” being within an electric field of said accumulating member such that said application member gets charged from said accumulating member, when in use, by means of corona discharge. | 12-19-2013 |
| 20140027062 | APPARATUS AND METHOD FOR MAKING A CORRUGATED PRODUCT - The invention describes a device and method for making corrugated products. The device can be used with any substrate and includes, at least, first and second drive rollers for driving a middle substrate and a single wall corrugated product. In other embodiments the invention includes upper drive rollers, lower drive rollers and middle drive rollers for driving an upper substrate, a lower substrate and a middle substrate. The middle substrate is driven between the upper and lower substrates at a higher velocity to form flutes that are anchored between the upper an lower substrates thereby forming a corrugated product. The invention also provides for customized corrugated products having multiple fluted substrates in various desirable arrangements. Examples of such products include mattress, partition panels, other furniture and construction products. | 01-30-2014 |
| 20140060742 | MACHINE FOR APPLYING FIBERS HAVING A SAFETY SYSTEM - A fiber application machine comprising a fiber application head, a displacing system to displace said fiber application head, a fiber storage, and a fiber conveyor to convey the fibers from the fiber storage to the application head. The machine further comprises a safety system comprising at least one perimeter barrier defining a safety zone wherein the displacing system carrying the application head is placed, the fiber storage being arranged outside of said safety zone. | 03-06-2014 |
| 20140102642 | Optical Fiber Welding Machine - The present disclosure discloses an optical fiber welding machine, including a device for butt joint of the optical fiber's core. The said device comprises a base and a number of units with V-shape groove. The base and the units are shaped respectively. The said units are mounted on the base fixedly. Comparing with the traditional overall molding device for butt joint of the optical fiber's core, the disclosed embodiment spats said traditional device, which has complicated structure and high accuracy requirements, into a base and a number of V-shape groove units, thus simplifies the shape of the components, which are shaped respectively, so as to facilitate the purpose of molding mould and shaping components, and then the v-shape groove units are mounted on the base. After completion of assembly, a v-shaped slot is grooved on top of each v-shape groove unit to ensure enough precision. The disclosed embodiment reduces both the mold manufacturing cost and the molding cost of components. It also solves the long-standing problem of precision within the art of manufacturing mold and molding components, and there is a good application prospect. In addition, an electrode gland is included in the optical fiber welding machine. The said gland includes a gland body and a screw connecting the workbench through the gland body, and a rotation unit is set at the top of each screw. The rotation unit protrudes from the gland body. | 04-17-2014 |
| 20140196850 | METHOD AND SYSTEM FOR WAFER LEVEL SINGULATION - A method of singulating a plurality of semiconductor dies includes providing a carrier substrate and joining a semiconductor substrate to the carrier substrate. The semiconductor substrate includes a plurality of devices. The method also includes forming a mask layer on the semiconductor substrate, exposing a predetermined portion of the mask layer to light, and processing the predetermined portion of the mask layer to form a predetermined mask pattern on the semiconductor substrate. The method further includes forming the plurality of semiconductor dies, each of the plurality of semiconductor dies being associated with the predetermined mask pattern and including one or more of the plurality of devices and separating the plurality of semiconductor dies from the carrier substrate. | 07-17-2014 |
| 20140326411 | WELDING DEVICE AND METHOD FOR WELDING THERMOPLASTIC RESIN ARTICLES, AND PRESSING UNIT FOR THE WELDING DEVICE - A welding device includes a compressor configured to compress a welding part and its adjoining surfaces of thermoplastic resin articles ( | 11-06-2014 |
| 20150059983 | Traction Means Tensioner, Vibration Welding Device Having A Traction Means Tensioner As Well As Production Method For A Traction Means Tensioner - With the traction means tensioner, a traction means having at least two ends is tensionable. The traction means tensioner comprises a first fastening means, a second fastening means and a coupling means. The first fastening means has a first fastening portion at which the first end of the traction means as fastenable. The second fastening means has a second fastening portion at which the second end of the traction means is fastenable. The coupling means couples the first and the second fastening means to each other so that the first and the second fastening means are movable with respect to each other and their movability is at least restricted on one side. Further, the first and the second fastening means are pre-tensionable with respect to each other via at least one spring element. | 03-05-2015 |
| 20150321457 | LAMINATION APPARATUS - A lamination apparatus includes a plurality of fixed frames, each of which has at least one bent portion; a plurality of variable frames, each of which is arranged between one fixed frame and another fixed frame; and a plurality of light sources arranged on the fixed frames and the variable frame. | 11-12-2015 |
| 20150375494 | LASER STRIPPING APPARATUS - Embodiments of the present invention provide a laser stripping apparatus, comprising: a frame; a laser located above the frame and a carrier stage located below the frame; a support mechanism provided on the carrier stage for carrying a flexible display substrate stripping plate; wherein the support mechanism is removably fixed to the carrier stage; the flexible display substrate stripping plate comprises a bearing substrate and a flexible display substrate provided on the bearing substrate; and when the flexible display substrate stripping plate is provided on the laser stripping apparatus, the flexible display substrate comes into contact with the support mechanism. | 12-31-2015 |
| 20160016364 | Apparatus for Reducing Porosities in Composite Resin Parts - An electrical charge is placed on a tool used to cure a composite resin part layup. The charged tool produces an electrostatic force that attracts entrapped gases in the resin to the surface of the tool, thereby reducing porosities in the cured part. | 01-21-2016 |
| 20160052250 | FRIT ENCAPSULATION APPARATUS - A frit encapsulation apparatus includes a carriage, a mask, a laser light source and a pressure element. The carriage is disposed over a first substrate. The mask is disposed in the carriage and has a light-transmitting region. The laser light source is disposed in the carriage and over the mask and is configured to provide laser light through the light-transmitting region of the mask and the first substrate therebeneath to heat the frit beneath the first substrate. The pressure element is disposed beneath the carriage and is configured to provide a pressure to the first substrate, such that the first substrate is adhered to a second substrate by the heated frit, in which the pressure element is not overlapped with a vertical projection of the light-transmitting region on the first substrate. | 02-25-2016 |
| 20160100990 | ULTRASONIC WELDING DEVICE AND METHOD OF PRODUCING DISPOSABLE DIAPER USING SAME - The displacement mechanism includes: an urging mechanism that urges an anvil roller toward an ultrasonic horn in such a manner that output surfaces and a welding surface move closer in the normal direction thereof; and a pressed member that has guide surfaces against which the outer surface of the anvil roller, positioned within non-welding areas, are pressed by an urging force of the urging mechanism, the pressed member being fixed to a sheet holding roller in a state where a pressed surface is disposed within the width-direction range of a slit. In response to the movement of the anvil roller from a welding area to the non-welding areas, the guide surfaces of the pressed member guide the anvil roller in a direction in which the output surfaces and the welding surface move away from each other. | 04-14-2016 |
| 20160121541 | ULTRASONIC SEALING DEVICE - Described is an ultrasonic device for sealing material ( | 05-05-2016 |
| 20160144989 | SEPARATING TOOL OF A JOINING DEVICE FOR FLEXIBLE PACKAGINGS - The invention relates to a separating tool of a joining device, in particular for tubular bag machines, comprising a blade carrier ( | 05-26-2016 |
| 20160190087 | CHIP-STACKING APPARATUS - A chip-stacking apparatus for stacking a chip on a substrate is provided. The chip-stacking apparatus includes a substrate support configured to carry the substrate and a transport device configured to dispose a chip to the substrate. The transport device includes a bond head including a bond base and an attaching element disposed on the bond base and configured to allow the chip to be attached thereon. The center area of the attaching element is higher than an edge area of the attaching element relative to the bond base. | 06-30-2016 |
| 20190148331 | THERMAL BONDING SHEET AND THERMAL BONDING SHEET WITH DICING TAPE | 05-16-2019 |
| 156379700 | To an electrically conductive lamina or component incorporated into the work | 9 |
| 20080210380 | ANODIC BONDING APPARATUS - The present invention provides an anodic bonding apparatus for bonding a laminate including an electrically conductive substrate and a glass substrate, the anodic bonding apparatus including: a container of which pressure is capable of being reduced; an upper electrode disposed in the container and configured in a movable manner in the vertical direction so as to contact to and separate from the laminate, and the upper electrode including: a main body part; an electrically conductive metal thin plate to be contacted with the laminate; and a space part; between the main body part and the electrically conductive metal thin plate, into and from which a fluid is supplied and drained, wherein the electrically conductive metal thin plate has a diaphragm structure being capable of deforming based on a pressure difference between the space part and the inside of the container, the electrically conductive metal thin plate is positioned at the main body part so as to swell in a convex form in the direction to the laminate when the space part is higher in pressure than the inside of the container; and a lower electrode, wherein the electrically conductive substrate and the glass substrate is bonded by: interposing the laminate between the upper electrode and the lower electrode; heating the laminate; and applying a direct current voltage to the laminate such that the electrically conductive substrate is an anode and the glass substrate is a cathode. | 09-04-2008 |
| 20090044913 | DEVICE AND METHOD FOR JOINTING PLASTICS MATERIALS - A jointing strip for jointing by welding at least two portions of a plastics material or of two different plastics materials includes a substantially H-shaped plastic member with apertures defined by opposing jaw portions. Electrically conductive elements, for example foil portions, are located at or near to a surface in the apertures of the respective jaw portions. The edge portions of the plastics materials to be welded are inserted in the apertures. | 02-19-2009 |
| 20100154997 | APPARATUS FOR CONSTRUCTION OF SAFETY MATS - An array of resilient floor tiles is assembled into a continuous sheet after being laid down. An array of included, sacrificial resistive wires is buried along the edges of the tiles and is controllably heated in order to cause welding of the edges of tiles across the paths of the wires to neighbouring tiles. Subsequently the wires may be used to give the array integral tensile strength. The welded array is provided with greater strength for resisting use, expansive and contractile forces caused by environmental heat and cold and also long-term tile contraction owing to loss of plasticiser as may be seen with PVC-based tiles. | 06-24-2010 |
| 20100294435 | BONDING APPARATUS AND WIRE BONDING METHOD - A bonding apparatus including a chamber for maintaining an inert gas atmosphere; a first plasma torch for performing a surface treatment on pads and electrodes, the first plasma torch being attached in the chamber, to apply gas plasma to a substrate and a semiconductor chip that is placed inside the chamber; a second plasma torch for performing a surface treatment on an initial ball and/or wire at a tip end of a capillary that is positioned inside the chamber, the second plasma torch being attached in the chamber, to apply gas plasma to the initial ball and/or wire; and a bonding unit for bonding the surface-treated initial ball and/or wire to the surface-treated pads and electrodes in the chamber, thereby cleaning of the surface of the electrodes and pads as well as the wire can be effectively performed. | 11-25-2010 |
| 20140202638 | HIGH-FREQUENCY INDUCTION HEATING APPARATUS AND FILM LABEL ATTACHING APPARATUS - A high-frequency induction heating apparatus is provided with a high-frequency oscillation apparatus, a heating coil, a high-frequency transformer and the like, the heating coil has a first coil through which prescribed current outputted by the high-frequency oscillation apparatus is flown, a second coil through which current different from the predetermined current is flown by the high-frequency transformer, and the first coil heats a trunk part and a bottom side part of the can body, and the second coil heats the trim side part of the can body. | 07-24-2014 |
| 20150020977 | Thermoplastic Induction-Welding Systems - A flexible ferromagnetic strip is used to induction-weld seams in polymer pipes. The strip is a blend of strontium ferrite, a surfactant, and an LDPE binder. A process to produce the profile is to mix the ingredients together followed by granulation and extrusion or calendering. The strip is used in conjunction with an induction coil sized to fit over a polymer pipe coupling containing the strip and separate segments of polymer pipe. The strip is heated by induction current induced by an electromagnetic field generated by the coil. The heated strip causes the polymer pipe segments to be thermoplastically welded together. | 01-22-2015 |
| 20150034249 | APPARATUS FOR PREPARING ELECTRODE ASSEMBLY - The present disclosure provides an apparatus for preparing an electrode assembly, comprising a printing unit including a charging mean for bringing polymer particles into electric charging to obtain electrically charged polymer particles, and a transferring mean for coating the electrically charged polymer particles by way of transferring on at least one surface of a substrate for an electrochemical device to form an adhesive layer on the substrate, the substrate being at least one of a cathode, an anode and a separator; and a laminating unit that applies heat and pressure to the substrate having the adhesive layer formed thereon so as to obtain the electrode assembly comprising the cathode, the anode and the separator interposed therebetween. | 02-05-2015 |
| 20150114570 | DEVICE FOR HEATING AND CONNECTING SHEETS OF BITUMINOUS OR SYNTHETIC MEMBRANES AND A BITUMINOUS OR SYNTHETIC MEMBRANE THEREOF - A device for heating and connecting sheets ( | 04-30-2015 |
| 20150364630 | THIN FILM STRUCTURES AND DEVICES WITH INTEGRATED LIGHT AND HEAT BLOCKING LAYERS FOR LASER PATTERNING - Selective removal of specified layers of thin film structures and devices, such as solar cells, electrochromics, and thin film batteries, by laser direct patterning is achieved by including heat and light blocking layers in the device/structure stack immediately adjacent to the specified layers which are to be removed by laser ablation. The light blocking layer is a layer of metal that absorbs or reflects a portion of the laser energy penetrating through the dielectric/semiconductor layers and the heat blocking layer is a conductive layer with thermal diffusivity low enough to reduce heat flow into underlying metal layer(s), such that the temperature of the underlying metal layer(s) does not reach the melting temperature, T | 12-17-2015 |
| 156379800 | With means to assemble laminae or position them relative to each other | 17 |
| 20080308231 | FLEXIBLE SUBSTRATE BONDING AND DEBONDING APPARATUS - A flexible substrate bonding and debonding apparatus is disclosed. In one embodiment, the apparatus includes i) a chamber, ii) a lower chuck disposed in a lower portion of the chamber and having a lower heating unit and a cooling conduit built therein, iii) an upper chuck disposed above the lower chuck and having an upper heating unit built therein, iv) a pressurizing unit disposed above the upper chuck and v) a separating unit corresponding to either side of bonding surfaces of a support substrate and a flexible substrate which are disposed between the lower chuck and the upper chuck. The flexible substrate bonding and debonding apparatus can pressurize the flexible substrate and the support substrate simultaneously using a heat-treatment process. Therefore, the flexible substrate can be more reliably bonded and debonded even at low temperature. | 12-18-2008 |
| 20090133841 | FLASHLESS WELDING METHOD AND APPARATUS - A method and apparatus for welding two separate ends of an extrusion or two separate extrusion ends to form a flashless extrudate or gasket by having a first and a second mold for supporting and clamping the extrusion ends, and a spacer bar for positioning the extrusion ends to a location within the mold. A heating element elevates the temperature of the extrusion ends to a welding condition, and a clamping device is used for securing the extrusion ends. A flashless welding operation results by inserting and clamping at least one heated extrusion end into a welding mold until an acceptable contact pressure is obtained against the opposing heated extrusion end. | 05-28-2009 |
| 20090211710 | ADHESIVE TAPE JOINING APPARATUS - An adhesive tape joining apparatus of this invention adopts an inverted “T”-shaped layout configured with a rectangular section that extends laterally when being viewed in a plane and a protrusion section that is coupled on a center of the rectangular section. An adhesive tape joining part is disposed in the protrusion section and joins an adhesive tape to a ring frame and a wafer. A transport mechanism is disposed in the rectangular section and transports the wafer, the ring frame, and the wafer held by the ring frame. An electronic substrate processing unit is disposed in at least one of two regions adjoining to the rectangular section with the protrusion section being interposed therebetween, and is coupled to the transport mechanism. | 08-27-2009 |
| 20090288774 | SUBSTRATE BONDING APPARATUS - To provide a substrate bonding apparatus for manufacturing a substrate with a retainer capable of meeting standard requirements while reducing damage on the information recording surface of the substrate. The apparatus comprises a loading pedestal | 11-26-2009 |
| 20100038036 | APPARATUS AND METHOD FOR FORMING AN OPTICAL FIBER DEVICE - An apparatus for forming an optical fiber device comprising at least one optical fiber includes a mold having a forming surface, means for heating the mold or the optical fiber, and an insert defining at least one optical fiber locator passage for guiding at least one optical fiber toward the forming surface. A method for forming an optical fiber device from at least one optical fiber includes the steps of heating the optical fiber or a forming surface of a mold to a temperature greater than a melting temperature of the optical fiber; advancing the optical fiber into contact with the forming surface of the mold such that a portion of the optical fiber is formed into a shape inversely corresponding to a shape of the forming surface; and withdrawing the optical fiber from the forming surface. | 02-18-2010 |
| 20100084097 | INDUCTION CONNECTING SLEEVE FOR CONNECTING WELDABLE THERMOPLASTIC ELEMENTS BY MEANS OF FUSION - An induction connecting sleeve for connecting weldable thermoplastic elements by means of fusion, with at least two sockets for the insertion of connection sections of the thermoplastic elements to be connected, and with an induction heating element embedded in the sockets, with operative sections of the induction heating element surrounded completely by a weldable thermoplastic material, and with the induction heating element arranged coaxially to the sockets. The induction heating element may be manufactured of metallic material with spring characteristics and to embed it under pre-tension in the thermoplastic material of the sockets. When the induction heating element is heated and the thermoplastic material of the socket of the induction connecting sleeve is plasticized, the induction heating element relaxes which causes radial pressure to build towards the connection section. | 04-08-2010 |
| 20100139867 | Device for the Ultrasound Treatment of Workpieces - The invention relates to a sonotrode ( | 06-10-2010 |
| 20120168084 | ULTRASONIC JOINING APPARATUS AND ABSORBENT ARTICLE MANUFACTURING APPARATUS - An anvil has a temperature adjustment mechanism including a heater. The anvil has a heat transmitter transmitting heat generated by the temperature adjustment mechanism. The anvil has a temperature sensor detecting a temperature of an anvil attachment portion in which the anvil of rotating drum installed. The ultrasonic joining apparatus includes a controller configured to control a temperature to which the rotating drum should be heated by the temperature adjustment mechanism. The controller controls a heat generation amount of the temperature adjustment mechanism on the basis of a detection result by the temperature sensor. The temperature adjustment mechanism and the heat transmitter are installed in each of the multiple anvils. | 07-05-2012 |
| 20130153151 | SYSTEM FOR JOINING SHEETS TO FORM A BELT - A system for joining a first sheet ( | 06-20-2013 |
| 20130153152 | METHOD FOR PRODUCING AN ANALYTICAL CONSUMABLE - A method for producing an analytical consumable is proposed. The analytical consumable comprises at least one carrier and at least one analytical aid connected to the carrier. At least one optically sensitive material is applied to the carrier, said material being designed to carry out at least one optically detectable alteration in the event of action of an electromagnetic radiation. In at least one coding step, at least one function information item about the analytical consumable is introduced into the optically sensitive material by means of electromagnetic radiation. The function information item is designed to enable at least one analytical instrument to use the analytical consumable correctly. | 06-20-2013 |
| 20130220552 | SEALING JAW FOR SEALING A PACKAGING MATERIAL USING ULTRASOUND - A sealing jaw for sealing a packaging material using ultrasound is provided. Said sealing jaw comprises energy directing means ( | 08-29-2013 |
| 20140290864 | DELAMINATION APPARATUS AND INLINE THERMAL IMAGING SYSTEM - A delamination apparatus includes a stage mounted with a lower supporting member, an acceptor substrate positioned on the lower supporting member, and a donor film laminated along with the lower supporting member via the acceptor substrate interposed therebetween according to the edge of the acceptor substrate, a gripper positioned at an end side of the stage to grip the end of the donor film and moving in a direction away from the acceptor substrate, and a peeling roll positioned on the donor film, including a supporting region supporting a portion of the donor film positioned between the acceptor substrate and the gripper, and including a peeling roll main body rotating itself in a direction of the gripper and a blind selectively covering the supporting region. | 10-02-2014 |
| 20140305591 | DELAMINATION APPARATUS AND INLINE THERMAL IMAGING SYSTEM - A delamination apparatus includes a stage mounted with a lower supporting member, a donor film laminated to the lower supporting member, and an acceptor substrate sealed between the lower supporting member and the donor film, a first gripper positioned at an end side of the stage, the first gripper being configured to grip an end of the donor film and to move with the end of the donor film away from the acceptor substrate, and a first filling roll positioned over the donor film, the first filling roll being configured to blow ions toward the donor film while rotating toward the first gripper. | 10-16-2014 |
| 156380100 | With tube-forming means | 1 |
| 20110220290 | Heat Weld Tubing Connectors - The present invention provides thermoplastic tubes, thermoplastic melting plates, thermoplastic tube connecting apparatus, and methods for using the same. | 09-15-2011 |
| 156380200 | With electrode or coil member contacting work | 3 |
| 20080216960 | Flexible Inductor for the Inductive Sealing of Packages - A sealing device for inductive sealing of containers is provided. The sealing device includes at least one induction coil made from an at least partially flexible conductor. The induction coil has two coil halves arranged at a distance (d) apart between which the containers can be moved, in which the conductor in each case extends essentially parallel to a direction of motion (B) of the containers. The coil halves are connected to the induction coil via at least one flexible conductor loop, which extends perpendicular to the direction of motion (B) of the containers. | 09-11-2008 |
| 20080283192 | METHOD AND APPARATUS FOR BONDING OPTICAL DISC SUBSTRATES TOGETHER, AND METHOD FOR SUPPLYING LIQUID MATERIAL - The object of the present invention is to significantly inhibit the formation of voids between substrates bonded together when a liquid adhesive is supplied onto an optical disc substrate or when the optical disc substrate is bonded to another optical disc substrate. Accordingly, the present invention discloses a method for bonding two optical disc substrates together which comprises the steps of joining the optical disc substrates together with an adhesive and curing the adhesive, wherein the adhesive is supplied onto the optical disc substrate by an electric field formed between the adhesive-supplying nozzle, for supplying the adhesive onto the optical disc substrate, and the optical disc substrate, and the two optical disc substrates are then joined together and subjected to spun by a spinning process. | 11-20-2008 |
| 156380300 | Electrodes on opposing sides of smallest dimension of work | 1 |
| 156380400 | With means moving one electrode toward the other electrode | 1 |
| 20090101286 | TEAR SEAL MOVEABLE GROUND JAW FOR A TUBING SEALER - Tubing sealers, whether hand held or desk mounted, heat seal liquid filled plastic tubing on command to develop sealed liquid filled easily separable segments serially attached to one another. The sealer generates a source of RF energy to heat seal the plastic tubing on placement of the tubing between a fixed jaw and a tubing compressing moveable ground jaw. The moveable ground jaw serves as a heat sink to dissipate heat and prevents a heat buildup during rapid repetitive operation of the sealer. The configuration of the moveable ground jaw coming in contact with the tubing primarily, but in combination with the degree of compression of the tubing and the RF power applied, controls both the integrity of the seal and the ease with which the sealed segments of tubing can be separated from one another. | 04-23-2009 |
| 156380600 | With electrode having a mechanical function; e.g., pressing, etc. | 2 |
| 20110048645 | High frequency sewing machine - A high frequency sewing machine for intermittently transferring a work material mounted on a work material mounting plate by means of feed dogs which perform synthetic circular movement in horizontal and vertical directions and which cooperate with a presser foot to effect the continuous bonding of the overlapped portions of a fiber cloth which are continuously bonded together by means of a thermoplastic resin tape held between the overlapped portions of the fiber cloth in the work material to melt under high frequency dielectric heating. High frequency power is applied between a pair of planar electrodes respectively disposed above and below the work material during the time when the transfer by these feed dogs is stopped to effect the melting process. The occurrence of defective products having burn or the like due to heat concentration can be prevented while obtaining assured uniform bonding strength by using the high frequency power. Additionally, the bonding of curvilinear portions and the bonding of stretchable fiber clothes can be sufficiently handled. | 03-03-2011 |
| 20150367567 | HAND-HELD APPARATUS FOR THE TRANSVERSE WELDING OF A TUBE - A hand-held device for the transverse welding of plastic tubes, comprising a welding device for the transverse welding of a tube and a separating device for completely separating the transverse-welded tube on the transverse welding. | 12-24-2015 |
| 156380900 | With radiant heater not touching work | 20 |
| 20080302484 | METHOD AND APPARATUS FOR LASER WELDING THERMOPLASTIC RESIN MEMBERS - A method and apparatus for welding members formed of thermoplastic resin material, with high welding strength and small strength variations. A laser welding apparatus | 12-11-2008 |
| 20090000746 | Apparatus for producing jumbo rolls - The invention relates to an apparatus for producing jumbo rolls during the production of coated abrasive products. | 01-01-2009 |
| 20090165959 | APPARATUS FOR DECORATING OBJECTS - An apparatus for decorating objects through sublimation comprises a kiln for heating the objects, a carousel comprising a plurality of arms having a supporting arrangement for supporting the objects, each object being associated with a transferring sheet provided with a sublimable decoration and further comprises a sucking arrangement for sucking air between the transferring sheet and the object. | 07-02-2009 |
| 20090294072 | EQUIPMENT FOR BONDING BY MOLECULAR ADHESION - The invention relates to equipment for carrying out a process for bonding by molecular adhesion of two substrates to one another during which the surfaces of the substrates are placed in close contact and bonding occurs by propagation of a bonding front between the substrates. The invention includes, prior to bonding, a step of modifying the surface state of one or both of the surfaces of the substrates so as to regulate the propagation speed of the bonding front. The surface can be modified by locally or uniformly heating or roughening the surface(s) of the substrate(s). | 12-03-2009 |
| 20100224329 | APPARATUS FOR STERILE CONNECTION OF TUBING - An apparatus for connecting together two sections of tubing using a laser. A pair of fixtures hold the two tubing sections in opposed, end-to-end relation so that axially facing surfaces of the tube sections at the ends are free from exposure to a surrounding environment. A photodiode laser emits an electromagnetic beam at a separate sheet of material positioned between the axial surfaces at the ends of the tubing sections. The sheet absorbs energy of the electromagnetic beam. The pair of fixtures move the two tubing sections to bring the respective axially facing surfaces of the two tubing sections into engagement with the sheet and after the axially facing surfaces of the two sections are brought into engagement with the sheet, the electromagnetic beam is directed onto the sheet for welding the two sections of tubing together. | 09-09-2010 |
| 20100236720 | APPARATUS FOR MELT-ADHERING RESIN PIPES - An apparatus ( | 09-23-2010 |
| 20100243170 | VACUUM DEBULK AND RADIATION CURE SYSTEM AND APPARATUS - A system for fabricating a composite item from a layup may comprise a debulking device, a vacuum generator and a curing device. The debulking device may include a vacuum chamber, an envelope and a heater. The vacuum chamber may have a chamber pressure. The envelope may be contained within the vacuum chamber and may have an envelope pressure. The layup may be received within the envelope. The heater may heat the layup. The vacuum generator may be in fluid connection with the debulking device. The curing device may cure the layup. | 09-30-2010 |
| 20110139373 | Single Stage Glass Lamination Apparatus and Process - An apparatus for laminating a glass sheet assembly includes a first glass sheet arranged in an opposing parallel configuration with respect to a second glass sheet, with a heat sensitive layer of adhesive laminating film disposed between the first glass sheet and the second glass sheet, the glass sheet assembly having a leading edge and a trailing edge and being of a fixed length and width, the laminating film having a bonding temperature at which melting of the laminating film is initiated. The apparatus includes a heating chamber configured to heat the glass sheet assembly, the heating chamber including an array of heating elements to cause differential heating along the length of the glass sheet assembly such that the temperature at the leading edge of the glass sheet assembly is higher than the temperature at the trailing edge of the glass sheet assembly with uniform heating across the width of the glass sheet assembly, and a pressing station configured to press the first and second glass sheets toward each other to purge air or moisture from the glass sheet assembly until the first and second glass sheets adhere together via the adhesive laminating film, where the pressing at the pressing station is initiated at the leading edge of the glass sheet assembly when the temperature of the laminating film at the leading edge of the glass sheet assembly reaches the bonding temperature of the laminating film. | 06-16-2011 |
| 20120000611 | Laser Beam Irradiation Apparatus and Substrate Sealing Apparatus Including the Same - A laser beam irradiation apparatus comprises: a laser oscillator; an optical fiber for transmitting a laser beam oscillated by the laser oscillator; an optical tube for accommodating an end of the optical fiber, and for performing a rectilinear motion on a plane perpendicular to a direction in which the laser beam is irradiated; and a pair of piezoelectric transducers disposed between the optical tube and the end of the optical fiber, and having first ends supporting the optical fiber. Each piezoelectric transducer performs a rectilinear reciprocating motion in a direction perpendicular to the other piezoelectric transducer on a plane perpendicular to the direction in which the laser beam is irradiated. | 01-05-2012 |
| 20120285625 | SHEET WINDER - Disclosed is a sheet winder which enables a sheet roll paper wound in a roll shape to be used in manufacturing of a corrugated cardboard for packing cases, in which the sheet roll paper is obtained by laminating sheet papers printed one by one using a lithography technique as one of the most general and economical printing methods and a roll paper used as a material for manufacturing the corrugated cardboard for packing cases. | 11-15-2012 |
| 20120298306 | SUBSTRATE BONDING SYSTEM AND MOBILE CHAMBER USED THERETO - A substrate attachment system, including a portable chamber for receiving a pair of substrates which are aligned; a conveyor transportation device which continuously moves the portable chamber and to which a vacuum generator that is connected to a vacuum port of the portable chamber to evacuate the inside of the portable chamber is provided; and a heating device for performing a heating process in which the aligned substrates are attached to each other in the portable chamber, wherein the conveyor transportation device is arranged to pass through the heating device. The substrate attachment system may contribute to high attachment accuracy, and also, since the size of a chamber is reduced, a spatial utilization rate may be high, and also, since an attachment process is continuously performed by using a conveyor transportation device, a process time may be reduced. | 11-29-2012 |
| 20130075040 | System For Cold Foil Relief Production - Disclosed are systems, machines and products for producing foil relief The system includes apparatuses for placing a foil on a curable adhesive deposited on a substrate when the curable adhesive is substantially non-tacky, and applying energy to the adhesive deposited on the substrate while pressing the foil to the adhesive to cause the adhesive to become tacky and to adhere to the foil. The adhesive becomes substantially fully cured prior to completion of the pressing of the foil to the adhesive deposited on the substrate. In some embodiments, the system may further include one or more energy sources for pre-curing the curable adhesive prior to placing the foil on the adhesive to initiate the curing process of the adhesive and manipulate a viscosity level of the adhesive, with the pre-cured adhesive remaining substantially non-tacky. The curable adhesive includes one or more of, for example, a radical type adhesive and/or a cationic adhesive. | 03-28-2013 |
| 20130192762 | ADHESIVE FORCE DEVELOPMENT UNIT, ADHESIVE-LABEL ISSUE DEVICE, AND PRINTER - Provided are an adhesive force development unit, an adhesive-label issue device, and a printer which can develop a stable adhesive force regardless of a thickness of a functional layer made from a resin film or the like while suppressing an occurrence of a blocking phenomenon. A thermal head for adhesive force development having a plurality of heating elements arranged along a width direction of an adhesive label and heating the adhesive label from its adhesive layer side so as to form holes in an functional layer by the heating elements is provided, and heating means for heating at least hole-forming portions in the adhesive label is disposed at an upstream side or a downstream side relative to the thermal head along a carrying direction of the adhesive label. | 08-01-2013 |
| 20130240149 | HEATING DEVICE FOR CORRUGATED PAPER - A heating device for corrugated paper is used in manufacturing process for corrugated cardboard so that the paper surface passing through the heating device may has appropriate temperature for subsequent shaping operation. The heating device of the present invention is formed by a preheat stage and a plurality of infrared lamps provided within the preheat stage. The heat generated by the infrared lamps is absorbed by the preheat stage so as to heat the surface promptly up to a working temperature suitable for the shaping operation of corrugated paper. | 09-19-2013 |
| 20130299093 | MACHINE FOR MAKING ABSORBENT SANITARY ARTICLES, SUCH AS NAPPIES FOR BABIES OR INCONTINENCE PADS FOR ADULTS, SANITARY TOWELS OR THE LIKE - In a machine for making absorbent sanitary articles, such as nappies for babies or incontinence pads for adults, sanitary towels or the like, a plurality of operating stations are equipped with cutting and/or sealing devices for the materials of which the articles ( | 11-14-2013 |
| 20130340943 | BONDING APPARATUS - A bonding apparatus includes: a bonding head including a bonding tool, on which a suction surface for a chip is formed, and a heating unit; a chip supply unit; a bonding stage on which a substrate is arranged; a head movement unit configured to move the bonding head between a chip supply position by the chip supply unit and a bonding position on the bonding stage; and a cooling unit configured to cool the bonding tool. The bonding tool is configured such that the chip is supplied at the chip supply position, then is heated and bonded on the substrate at the bonding position, and is then cooled by the cooling unit. The cooling is performed by making the suction surface come in contact with a cooling surface of the cooling unit. | 12-26-2013 |
| 20140060743 | METHOD OF APPLYING ADHESIVE COATED FILM - An adhesive-applying method is disclosed herein. The method comprises: providing a film comprising pressure sensitive adhesive coated on a major surface thereof; heating the film to a softening point of the film; and pressing the film against a substrate with an application device, the application device comprising a film-contacting portion, the film-contacting portion comprising a foam material and having a thermal conductivity of less than 1.8 BTU/hr-in-ft | 03-06-2014 |
| 20140174664 | LASER BEAM IRRADIATION APPARATUS AND SUBSTRATE SEALING METHOD - Provided is a laser beam apparatus for sealing a first substrate and a second substrate by irradiating a sealant between the first substrate and the second substrate using a laser beam, the laser beam apparatus including a controller, wherein the controller is configured to defocus the laser beam and to move a scanning central axis of the laser beam across a sealing path of the sealant. | 06-26-2014 |
| 20140231021 | Method and Apparatus for Three Dimensional Large Area Welding and Sealing of Optically Transparent Materials - Methods and systems for three dimensional large area welding and sealing of optically transparent materials are disclosed, including generating a beam of ultra-short pulses from an ultra-short pulsed laser; directing the beam to an acoustic-optic modulator to control the repetition rate of the beam; directing the beam to an attenuator after passing through the acoustic-optic modulator to control the energy of the beam; directing the beam to a focusing lens after passing through the attenuator to focus the beam between a top substrate and a bottom substrate in order to weld the top substrate to the bottom substrate, wherein the top substrate and the bottom substrate are in intimate contact; and controlling the position of the top substrate and the bottom substrate relative to the beam using a three-axis stage in order to weld the top substrate to the bottom substrate at different points. Other embodiments are described and claimed. | 08-21-2014 |
| 20150041066 | OPTIMIZATION OF THE ACTIVATION OF ADHESIVE AGENTS BY LASER RADIATION - The present invention relates to devices with which, for example, narrow surfaces of preferably plate-like workpieces can be provided with a coating material. The device includes a laser for outputting a lease beam to a lase bean emitter, wherein the laser beam is directed onto the coating material or onto the workpiece in such a manner that the laser beam forms a plane of reference with solder on the surface of the coating material or the workpiece. | 02-12-2015 |
