| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 156345440 | Electrically coupled to a power supply or matching circuit | 42 |
| 20080223523 | SUBSTRATE PROCESSING APPARATUS AND ELECTRODE STRUCTURE - A substrate processing apparatus capable of preventing the abnormal discharge from being generated on a substrate. A housing chamber houses the substrate. A mounting stage arranged in the housing chamber, is configured to enable the substrate to be mounted thereon. A disc-like electrode structure is connected to a high-frequency power supply, and connected to a gas supply apparatus via at least one gas supply system. The electrode structure has therein at least one buffer chamber and a plurality of connecting sections connected to the gas supply system. The buffer chamber is communicated with the inside of the housing chamber via a number of gas holes, and is communicated with the gas supply system via the plurality of connecting sections. The plurality of connecting sections for the buffer chamber are arranged on the circumference of a circle centering around the center of the electrode structure at equal intervals. | 09-18-2008 |
| 20080271849 | HOLLOW ANODE PLASMA REACTOR AND METHOD - The plasma processing apparatus includes a plasma chamber, a first electrode, a second electrode, and a plasma containment device. The plasma containment device has a plurality of slots and is electrically coupled to the first electrode. The containment device is configured to confine plasma within an inter-electrode volume while facilitating maximum process gas flow. When plasma is generated by applying electric fields to process gas within the inter-electrode volume, the containment device electrically confines the plasma to the inter-electrode volume without significantly restricting the flow of gas from the inter-electrode volume. | 11-06-2008 |
| 20090032191 | High Density Plasma Source - The present invention relates to a plasma source. The plasma source includes a cathode assembly having an inner cathode section and an outer cathode section. An anode is positioned adjacent to the outer cathode section so as to form a gap there between. A first power supply generates a first electric field across the gap between the anode and the outer cathode section. The first electric field ionizes a volume of feed gas that is located in the gap, thereby generating an initial plasma. A second power supply generates a second electric field proximate to the inner cathode section. The second electric field super-ionizes the initial plasma to generate a plasma comprising a higher density of ions than the initial plasma. | 02-05-2009 |
| 20090229756 | PLASMA PROCESSING APPARATUS - In an atmospheric-pressure plasma processing apparatus, a first metal surface | 09-17-2009 |
| 20090242133 | ELECTRODE STRUCTURE AND SUBSTRATE PROCESSING APPARATUS - An electrode structure capable of adequately increasing an electron density in a processing space at a part facing a circumferential edge portion of a substrate. In a processing chamber of a substrate processing apparatus that performs RIE processing on a wafer, an upper electrode of the electrode structure is disposed to face the wafer placed on a susceptor inside the processing chamber. The upper electrode includes an inner electrode facing a central portion of the wafer and an outer electrode facing the circumferential edge portion of the wafer. The inner and outer electrodes are connected with first and second DC power sources, respectively. The outer electrode has its first secondary electron emission surface extending parallel to the wafer and its second secondary electron emission surface obliquely extending relative to the first secondary electron emission surface. | 10-01-2009 |
| 20100071850 | MOUNTING TABLE AND PLASMA PROCESSING APPARATUS - A mounting table for use in a plasma processing apparatus, on which a substrate is mounted, includes: a conductive member connected to a high frequency power supply and a high frequency power supply; a dielectric layer embedded in a central portion on an upper surface of the conductive member; and an electrostatic chuck mounted on the dielectric layer. Further, the electrostatic chuck is connected to a high voltage DC power supply and includes an electrode film satisfying following conditions: δ/z≧85 (where δ=(ρ | 03-25-2010 |
| 20100139864 | METHOD FOR THE PLASMA CLEANING OF THE SURFACE OF A MATERIAL COATED WITH AN ORGANIC SUBSTANCE AND THE INSTALLATION FOR CARRYING OUT SAID METHOD - The invention relates to a method of cleaning the surface of a material that is coated with an organic substance. The inventive method is characterized in that it comprises the following steps, consisting in: introducing the material into a treatment chamber, having a pressure of between 10 mbar and 1 bar therein, which is supplied with a gas stream containing at least 90 volume percent of oxygen; and generating a plasma by passing an electric discharge between the surface of the material and a dielectric-covered electrode in order to break down the organic substance under the action of the free radicals O thus produces. The invention also relates to an installation that is used to carry out said method. | 06-10-2010 |
| 20100147464 | PLASMA TREATMENT APPARATUS - The present invention relates to a plasma treatment apparatus for treating an object to be treated by activating a plasma production gas by an electric discharge, and by blowing this activated plasma production gas onto the object to be treated. A covered electrode is formed by embedding a conductive layer in an insulating substrate made of a ceramic sintered body. The covered electrodes are arranged opposed to each other to form an electric discharge space in a space between the covered electrodes. A power supply is included for causing an electric discharge in the electric discharge space by applying a voltage to the conductive layers. Since no ceramic material is sprayed, it is possible to reduce the costs of the material for the covered electrodes, and to simplify the process for manufacturing the covered electrodes. The ceramic sintered body has a smaller percentage of voids and is thus denser than a coating film formed by spraying a ceramic material, which is less likely to cause dielectric breakdown during an electric discharge. | 06-17-2010 |
| 20100224325 | PLASMA PROCESSING APPARATUS AND ELECTRODE FOR SAME - A plasma processing apparatus includes a processing chamber in which a target object is processed by a plasma, a first and a second electrode that are provided in the processing chamber to face each other and have a processing space therebetween, and a high frequency power source that is connected to at least one of the first and the second electrode to supply a high frequency power to the processing chamber. And at least one of the first and the second electrode includes a base formed of a plate-shaped dielectric material and a resistor formed of a metal and provided between the base and the plasma. | 09-09-2010 |
| 20100252198 | PLASMA PROCESSING APPARATUS AND METHOD - In a plasma processing apparatus in which a radio-frequency power from a radio-frequency power source is supplied to an electrode disposed in a process vessel, to thereby generate, in the process vessel, plasma with which a substrate is processed, a chemical component emitting member which is caused to emit a chemical component necessary for processing the substrate into the process vessel by entrance of ions in the plasma generated in the process vessel is provided in the process vessel in an exposed state, and an impedance varying circuit varying impedance on the chemical component emitting member side of the plasma generated in the process vessel to frequency of the radio-frequency power source is connected to the chemical component emitting member. | 10-07-2010 |
| 20100300622 | CIRCULAR RING-SHAPED MEMBER FOR PLASMA PROCESS AND PLASMA PROCESSING APPARATUS - A plasma processing apparatus includes a processing chamber the inside of which is maintained in a vacuum; a mounting table configured to mount a target substrate and serve as a lower electrode in the processing chamber; a circular ring-shaped member provided at the mounting table so as to surround a peripheral portion of the target substrate; an upper electrode arranged to face the lower electrode thereabove; and a power feed unit for supplying a high frequency power to the mounting table. The apparatus performs a plasma process on the target substrate by plasma generated in the processing chamber. The circular ring-shaped member includes at least one ring-shaped groove configured to adjust an electric field distribution to a desired distribution in a plasma generation space, and the groove is formed in a surface of the circular ring-shaped member and the surface is on an opposite side to the plasma generation space. | 12-02-2010 |
| 20100326601 | PLASMA PROCESSING APPARATUS - In the plasma processing apparatus of the present invention, a first electrode ( | 12-30-2010 |
| 20110088849 | PLASMA PROCESSING APPARATUS - A plasma processing apparatus, comprising:
| 04-21-2011 |
| 20110162802 | PLASMA PROCESSING APPARATUS, ELECTRODE PLATE FOR PLASMA PROCESSING APPARATUS, AND ELECTRODE PLATE MANUFACTURING METHOD - A plasma processing apparatus for performing a plasma process on a target substrate includes a process container configured to accommodate the target substrate and to reduce pressure therein. A first electrode is disposed within the process container. A supply system is configured to supply a process gas into the process container. An electric field formation system is configured to form an RF electric field within the process container so as to generate plasma of the process gas. A number of protrusions are discretely disposed on a main surface of the first electrode and protrude toward a space where the plasma is generated. | 07-07-2011 |
| 20110226421 | PLASMA PROCESSING APPARATUS - An intensity distribution of an electric field of a high frequency power used for generating plasma is controlled by using an electrode made of a homogeneous material and a moving body. There is provided a plasma processing apparatus for introducing a processing gas into an evacuable processing chamber | 09-22-2011 |
| 20110308735 | VACUUM PROCESSING APPARATUS - A discharge chamber formed of a ridge waveguide having ridge electrodes that are disposed facing each other and that generate plasma therebetween; a gas supplying portion that is disposed adjacent to the discharge chamber and that supplies source gas, which is used to form the plasma, toward the ridge electrodes; a substrate that is disposed at a position such that the gas supplying portion is flanked by the substrate and the discharge chamber and that is subjected to the processing by the plasma; a low-pressure vessel that accommodates thereinside at least the discharge chamber, the gas supplying portion, and the substrate; and an exhaust portion that is communicated at a position in the low-pressure vessel such that this position and the gas supplying portion are disposed on either side of the discharge chamber, and that reduces the pressure inside the low-pressure vessel are provided. | 12-22-2011 |
| 20120043023 | SYMMETRIC VHF SOURCE FOR A PLASMA REACTOR - The disclosure pertains to a capactively coupled plasma source in which VHF power is applied through an impedance-matching coaxial resonator having a folded structure and symmetrical power distribution. | 02-23-2012 |
| 20120168082 | PLASMA GENERATING APPARATUS - A plasma generating apparatus irradiates plasma on a treatment object. The plasma is generated under gas pressure equal to or higher than 100 pascals and equal to or lower than atmospheric pressure in an inter-electrode gap between a first electrode to which a power supply is connected and a second electrode arranged to be opposed to the first electrode and grounded. The first electrode has a structure in which the first electrode is retained on a grounded conductive retaining member via a solid dielectric provided on a surface not opposed to the second electrode, and a conductive film is continuously provided on a surface in a predetermined range in contact with the conductive retaining member and a surface in a predetermined range not in contact with the conductive retaining member on a surface of the solid dielectric. | 07-05-2012 |
| 20120168083 | PLASMA PROCESSING APPARATUS - In a plasma processing apparatus including a vacuum-evacuable processing chamber, a first lower electrode for supporting a substrate to be processed thereon is disposed in the processing chamber and an upper electrode is disposed above the first lower electrode to face the first lower electrode. Further, a second lower electrode is disposed under the first lower electrode while being electrically isolated from the first lower electrode. A processing gas supply unit supplies a processing gas into a space between the upper electrode and the first lower electrode. A first high frequency power supply unit applies a first high frequency power of a first frequency to the first lower electrode, and a second high frequency power supply unit applies a second high frequency power of a second frequency higher than the first frequency to the second lower electrode. | 07-05-2012 |
| 20120222817 | PLASMA PROCESSING APPARATUS - A plasma processing apparatus includes: a first ground member provided in processing chamber in such a way that at least a portion of the first ground member is exposed to a processing space, wherein the first ground member forms a ground potential; a second ground member provided in an exhaust space of the processing chamber to face the first ground member in such a way that at least a portion of the second ground member is exposed to the exhaust space, wherein the second ground member forms a ground potential; and a ground rod that moves up and down between the first and second ground members and contacts any one of the first or second ground member to adjust a ground state of the first or second ground member. | 09-06-2012 |
| 20120241092 | PLASMA PROCESSING APPARATUS - In the plasma processing apparatus | 09-27-2012 |
| 20120247677 | SUBSTRATE PROCESSING METHOD - A substrate processing apparatus capable of improving a processing controllability in an etching process is provided. The substrate processing apparatus ( | 10-04-2012 |
| 20120247678 | ELECTRODE ASSEMBLY AND PLASMA PROCESSING APPARATUS - An electrode assembly of a plasma processing apparatus that enables damage to an electrode plate to be prevented, and enables an increase in the number of parts to be prevented, so that the ability to carry out maintenance can be easily maintained. An upper electrode assembly has an upper electrode plate, a cooling plate (C/P) and a spacer interposed between the upper electrode plate and the C/P. The upper electrode plate has therein electrode plate gas-passing holes that penetrate through the upper electrode plate. The C/P has therein C/P gas-passing holes that penetrate through the C/P. The spacer has therein spacer gas-passing holes that penetrate through the spacer. The electrode plate gas-passing holes, the C/P gas-passing holes and the spacer gas-passing holes are not disposed collinearly. | 10-04-2012 |
| 20120279658 | PLASMA TREATMENT SYSTEMS AND METHODS FOR UNIFORMLY DISTRIBUTING RADIOFREQUENCY POWER BETWEEN MULTIPLE ELECTRODES - Plasma treatment systems and methods for distributing RF energy to electrodes in a plasma treatment system. The plasma treatment system includes power and ground busses, positive and negative phase primary electrode busses, and positive and negative phase secondary electrode busses. The power and ground busses are coupled to the secondary electrode busses by isolation transformers so that the negative phase secondary electrode buss is provided with an RF signal that is 180 degrees out of phase with the RF signal supplied to the positive phase secondary electrode buss. The secondary electrode busses are coupled to respective positive and negative phase primary electrode busses by capacitors. The primary electrode busses are each coupled to electrodes in the vacuum chamber. Load coils coupling the primary electrode busses to an RF ground may cooperative with the capacitors to adjust the input impedance at the power buss. | 11-08-2012 |
| 20120279659 | Plasma Processing Chamber Having Electrodes for Cleaning Chamber - Plasma processing chamber having a bottom electrode assembly is disclosed. The assembly has an inner bottom electrode for supporting a substrate and an outer bottom electrode disposed outside of the inner bottom electrode. The outer bottom electrode defines a region for chamber cleaning, and the outer bottom electrode includes a conductive ring and an inductive coil placed under the conductive ring. Further included is a dielectric material disposed between the inner bottom electrode and the outer bottom electrode, and the dielectric material separates the inner bottom electrode from the outer bottom electrode. A switch is provided for connecting radio frequency (RF) power to either the inner bottom electrode or the outer bottom electrode. The chamber also includes a top electrode assembly with a top electrode. The top electrode is disposed above both the inner and outer bottom electrodes. | 11-08-2012 |
| 20120305191 | APPARATUS FOR TREATING SUBSTRATE - Provided is an apparatus for treating a substrate. The apparatus for treating a substrate may include a process chamber having a space formed therein, a chuck positioned in the process chamber and supporting a substrate, a gas supply unit supplying reaction gas into the process chamber, an upper electrode positioned above the chuck and applying high frequency power to the reaction gas, and a heater installed in the upper electrode and heating the upper electrode. | 12-06-2012 |
| 20130025789 | DRY-ETCHING METHOD - A process including a main etching step under a first pressure using a gas containing at least HBr as an etching gas. The main etching is ended before a silicon oxide film is exposed. An over-etching process is effected under a second pressure higher than the first pressure using a gas containing at least HBr so as to completely expose the silicon oxide film. In such a way, the selectivity of a silicon-containing conductive layer with respect to the silicon oxide film is improved. Without etching the silicon oxide film layer, which is an underlying layer, and without marring the shape of the silicon-containing conductive film layer formed by etching, only the desired silicon-containing conductive film layer is removed by etching reliably. | 01-31-2013 |
| 20130075037 | PLASMA PROCESSING APPARATUS - A plasma processing apparatus includes a processing gas supplying unit for supplying a desired processing gas to a processing space between an upper electrode and a lower electrode which are disposed facing each other in an evacuable processing chamber. The plasma processing apparatus further includes a radio frequency (RF) power supply unit for applying an RF power to one of the lower and the upper electrode to generate plasma of the processing gas by RF discharge and an electrically conductive RF ground member which covers a peripheral portion of the electrode to which the RF power is applied to receive RF power emitted outwardly in radial directions from the periphery portion of the electrode to which the RF power is applied and send the received RF power to a ground line. | 03-28-2013 |
| 20130087287 | PLASMA REACTOR FOR REMOVAL OF CONTAMINANTS - Provided is a plasma reactor for removal of contaminants, which is installed between a process chamber and a vacuum pump and removes contaminants emitted from a process chamber. The plasma reactor includes: at least one dielectric body that forms a plasma generation space therein; a ground electrode connected to at least one end of the dielectric body; and at least one driving electrode fixed to an outer peripheral surface of the dielectric body, and connected to an AC power supply unit to receive an AC driving voltage. The ground electrode has a non-uniform diameter along the lengthwise direction of the plasma reactor. | 04-11-2013 |
| 20130098556 | PLASMA PROCESSING APPARATUS - There is provided a plasma processing apparatus that can generate uniform plasma without increasing costs per unit electric power even though the discharge area is increased to adapt to samples in given sizes by arranging a plurality of plasma discharge units. A plasma processing apparatus includes an RF power supply having an RF signal circuit and an RF power circuit, a case, and a discharge electrode. A plasma module is configured of the discharge electrode and the RF power circuit provided in the case. A frequency signal from the RF signal circuit is inputted to a plurality of the plasma modules connected in parallel with each other. | 04-25-2013 |
| 20130213575 | Atmospheric Pressure Plasma Generating Apparatus - One embodiment of the present disclosure provides an atmospheric pressure plasma generating apparatus. The apparatus includes an upper electrode having an air permeable inner structure, a lower electrode separated from the upper electrode, and a power source applying voltage to the upper electrode or the lower electrode. The apparatus further includes a plasma generating region placed in a space between the upper electrode and the lower electrode. The upper electrode serves as a passageway using the air permeable inner structure, through which reaction gas is supplied to the plasma generating region from outside. | 08-22-2013 |
| 20130213576 | PLASMA PROCESSES AT ATMOSPHERIC PRESSURE - The invention relates to an apparatus for the treatment of surfaces of a substrate by means of plasma. Said apparatus comprises a plasma source designed to generate plasma and to eject it into a plasma space with a longitudinal plasma extent, said extent extending along a main motion component of the plasma, an at least partially conductive first holding apparatus designed to hold a first workpiece, and a voltage source connected to the first holding apparatus, said voltage source being designed to generate a first acceleration voltage and to apply it to the first holding apparatus. The first holding apparatus is arranged and designed relative to the plasma source in such a manner that it places the first workpiece in such a manner that the plasma reaches the first workpiece when the first acceleration voltage is applied. | 08-22-2013 |
| 20130292057 | CAPACITIVELY COUPLED PLASMA SOURCE WITH RF COUPLED GROUNDED ELECTRODE - An overhead RF coupling chamber couples RF power to a ceiling electrode of a plasma reactor chamber, the RF coupling chamber having a resonant annular volume defined by coaxial cylindrical conductors, one of which is coupled to an RF power source, the chamber ceiling having an annular gap around the electrode, and the resonant annular volume being aligned with the annular gap so that the resonant annular volume opens into the interior of the main chamber, thereby enhancing the electrical length of the RF coupling chamber. | 11-07-2013 |
| 20130299090 | PLASMA GENERATOR, AND CLEANING AND PURIFYING APPARATUS AND SMALL-SIZED ELECTRICAL APPLIANCE USING PLASMA GENERATOR - A plasma generator | 11-14-2013 |
| 20130306240 | System and Method for Controlling Plasma With an Adjustable Coupling to Ground Circuit - A system and method for controlling plasma. The system includes a semiconductor chamber comprising a powered electrode, another electrode, and an adjustable coupling to ground circuit. The powered electrode is configured to receive a wafer or substrate. There is at least one grounded electrode configured to generate an electrical connection with the powered electrode. At least one of the grounded electrodes is electrically coupled to the adjustable coupling to ground circuit. The adjustable coupling to ground circuit is configured to modify the impedance of the grounded electrode. The ion energy of the plasma is controlled by the adjustable coupling to ground circuit. | 11-21-2013 |
| 20140048210 | SUBSTRATE PROCESSING APPARATUS - A substrate processing apparatus includes a chamber accommodating a wafer, a susceptor disposed inside the chamber and on which the wafer is held, an upper electrode facing the susceptor, and a second high frequency power source connected to the susceptor, wherein the upper electrode is electrically connected to a ground and is moveable with respect to the susceptor. The substrate processing apparatus divides a potential difference between plasma generated in a processing space and the ground into a potential difference between the plasma and a dielectric and a potential difference between the dielectric and the ground by burying the dielectric in the upper electrode, and changes a gap between the upper electrode and the susceptor. Accordingly, plasma density between the upper electrode and the susceptor is changed | 02-20-2014 |
| 20140060740 | Plasma processing device - The invention provides a plasma processing device, wherein the upper electrode and the lower electrode are in the vacuum chamber. The chip is placed in the lower electrode. The first plate is placed between the upper electrode and the lower electrode, and the first plate includes a plurality of first voids. The second plate is placed between the first plate and the lower electrode, and the second plate includes a plurality of second voids. The high frequency power is provided by the upper electrode and the lower electrode in the vacuum chamber, and the plasma is generated between the third plate and the upper electrode. The plasma is filtered by the third void, the first void, and the second void. | 03-06-2014 |
| 20140069584 | DIFFERENTIAL COUNTER ELECTRODE TUNING IN A PLASMA REACTOR WITH AN RF-DRIVEN CEILING ELECTRODE - A plasma reactor includes an RF-driven ceiling electrode overlying a process zone and two (or more) counter electrodes underlying the process zone and facing different portions of the process zones, two (or more) variable reactances connected between respective ones of the counter electrodes and ground, and a controller governing the variable reactances to control distribution of a plasma parameter such as plasma ion density or ion energy. | 03-13-2014 |
| 20140174661 | PLASMA PROCESSING CHAMBER FOR BEVEL EDGE PROCESSING - A process chamber includes a wafer support to mount a wafer to be processed in the process chamber, with the wafer having an annular edge exclusion area. A first electrically grounded ring extends in an annular path radially outward of the edge exclusion area and is electrically isolated from the wafer support. A second electrode is configured with a center area opposite to the wafer support. A second electrically grounded ring extends in an annular path radially outward of the second electrode and the edge exclusion area. The second electrically grounded ring is electrically isolated from the center area. An annular mount section has a DC bias ring, and the DC bias ring opposes the edge exclusion area when the wafer is present. A DC control circuit is provided for applying a DC voltage to the DC bias ring. | 06-26-2014 |
| 20150075719 | SYMMETRIC VHF SOURCE FOR A PLASMA REACTOR - The disclosure pertains to a capacitively coupled plasma source in which VHF power is applied through an impedance-matching coaxial resonator having a symmetrical power distribution. | 03-19-2015 |
| 20150144266 | SUBSTRATE PROCESSING APPARATUS - The substrate processing apparatus includes a lower electrode on which a substrate is capable of being held, a high frequency power source electrically connected to the lower electrode, an upper electrode facing the lower electrode, a plasma processing space being formed between the lower electrode and the upper electrode, wherein the upper electrode includes an inner upper electrode facing a center portion of the lower electrode and an outer upper electrode facing a circumferential portion of the lower electrode, the inner electrode and the outer electrode being electrically insulated from each other, a first direct current power source electrically connected to the inner upper electrode to apply a positive direct current voltage, and a dielectric member covering a bottom surface of the upper electrode, the dielectric member facing the lower electrode with the plasma processing space in-between. | 05-28-2015 |
| 20160056018 | ELECTRIC PRESSURE SYSTEMS FOR CONTROL OF PLASMA PROPERTIES AND UNIFORMITY - This disclosure relates to a plasma processing system for controlling plasma density near the edge or perimeter of a substrate that is being processed. The plasma processing system may include a plasma chamber that can receive and process the substrate using plasma for etching the substrate, doping the substrate, or depositing a film on the substrate. This disclosure relates to a plasma processing system for controlling plasma density near the edge or perimeter of a substrate that is being processed. In one embodiment, the plasma density may be controlled by reducing the rate of loss of ions to the chamber wall during processing. This may include biasing a dual electrode ring assembly in the plasma chamber to alter the potential difference between the chamber wall region and the bulk plasma region. | 02-25-2016 |
