| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 156345310 | With means for passing discrete workpiece through plural chambers (e.g., loadlock) | 45 |
| 20090000739 | Vacuum processing apparatus - A vacuum processing apparatus comprising a transfer unit disposed at a center thereof, plural processing chambers, each processing chamber having a processing table for supporting an object to be processed and carrying out processing using a gas; and amass flow controller unit interposed between two processing chambers for supplying gas to the chambers. | 01-01-2009 |
| 20090078372 | VACUUM PROCESSING APPARAUTS - A vacuum processing apparatus having an improved wafer processing efficiency and an improved working efficiency is provided. The vacuum processing apparatus includes a vacuum container in which a specimen is processed with plasma generated from a processing gas supplied to the vacuum container; a transfer container through which the specimen processed in the vacuum container is transferred, the transfer container being coupled to the vacuum container under ambient pressure; a blower for generating an ambient gas flow in the transfer container and an outlet disposed on the transfer container; a storage container for storing the specimen processed in the vacuum container, the storage container being disposed in the ambient gas flow in the transfer container; and an exhauster for exhausting a gas in the storage container. | 03-26-2009 |
| 20090078373 | APPARATUS FOR MANUFACTURING FLAT-PANEL DISPLAY - Disclosed herein is a flat panel display (FPD) manufacturing apparatus for performing a desired process for a substrate positioned in a chamber after establishing a vacuum atmosphere in the chamber. The vacuum chamber is divided into a chamber body and an upper cover to ensure easy opening/closing operations of the upper cover. | 03-26-2009 |
| 20090133837 | APPARATUS FOR MANUFACTURING FLAT-PANEL DISPLAY - An flat-panel display (FPD) manufacturing apparatus is provided. The apparatus is flexibly configured so that it is capable of easily processing large-size substrates while also simplifying manufacturing, transporting, operating, and repair processes. | 05-28-2009 |
| 20100163185 | Vacuum processing apparatus - A vacuum processing apparatus which includes a vacuum vessel having a processing chamber provided therein into which a processing gas is supplied to form a plasma and which processes a wafer located in the processing chamber, and a vacuum transfer vessel having a vacuumed transfer chamber coupled with the vacuum vessel provided therein into which the wafer is transferred. A resin-made film having a plasma resistance is bonded onto a surface of a lid of the vacuum transfer vessel on the side of the transfer chamber. | 07-01-2010 |
| 20100236718 | SUBSTRATE PROCESSING APPARATUS - In a substrate processing apparatus, a processing module includes a processing unit for performing a predetermined processing on a substrate accommodated in a processing chamber, and a transfer module includes a transfer chamber having a loading/unloading port for mounting thereon a carrier accommodating therein the substrate in a plural number and a transfer mechanism for transferring the substrates between the processing module and the carrier mounted on the loading/unloading port in the transfer chamber. Further, a substrate accommodation unit includes a substrate accommodation chamber communicating with the transfer chamber via a transfer opening and accommodating therein the substrates arranged vertically, a vertically movable gate provided at the transfer opening, the gate separating the substrate accommodation chamber from the transfer chamber and a gas supply unit for supplying a gas into the substrate accommodation chamber. The substrates processed by the processing unit are accommodated in the substrate accommodation chamber. | 09-23-2010 |
| 20100243163 | SUBSTRATE PROCESSING APPARATUS - Disclosed is a substrate processing apparatus for carrying a substrate W in a standing position and performing a predetermined process to the substrate W, including: a plurality of substrate processing chambers; and a common carrying delivery chamber for carrying a substrate to each of the substrate processing chambers, where: at least one of the substrate processing chambers is provided above or below the common carrying delivery chamber; and a substrate passage opening through which the substrate W can pass is provided at the boundaries between the processing chambers and the carrying chamber. | 09-30-2010 |
| 20110168330 | SUPPORT STRUCTURE, LOAD LOCK APPARATUS, PROCESSING APPARATUS AND TRANSFER MECHANISM - A support structure for supporting a processing target object includes a support main body that supports a weight of the processing target object and recess-shaped supporting body accommodating portions formed on a top surface of the support main body. The support structure further includes supporting bodies accommodated in the respective supporting body accommodating portions to be protruded above the top surface of the support main body. The supporting bodies are rollable in the respective supporting body accommodating portions while supporting the processing target object of which bottom surface is in contact with upper peak portions of the supporting bodies. | 07-14-2011 |
| 20110186225 | MAGNETIC RECORDING MEDIUM MANUFACTURING DEVICE - A magnetic recording medium is manufactured without the disappearance of the surface of a substrate that comprises a magnetic recording layer by ion milling and without being influenced by the atmosphere. A magnetic recording medium manufacturing device manufactures a magnetic recording medium by implanting an ion beam into a substrate that comprises a magnetic recording layer and removing by ashing the surface of the substrate that comprises the magnetic recording layer after the ion beam is implanted. The magnetic recording medium manufacturing device comprising an ion implantation chamber for implanting the ion beam into the substrate that comprises the magnetic recording layer coated with a resist film or a metal mask, and an ashing chamber for removing, by ashing, with plasma, the resist film or the metal mask of the substrate that comprises the magnetic recording layer coated with the resist film or the metal mask. The ion implantation chamber and the ashing chamber are coupled in a vacuum state. The magnetic recording medium manufactured device is provided with a substrate carrier for carrying the substrate into which the ion beam is implanted from the ion implantation chamber to the ashing chamber. | 08-04-2011 |
| 20110226419 | Process Chamber, Semiconductor Manufacturing Apparatus and Substrate Processing Method Having the Same - Disclosed herein is a semiconductor manufacturing apparatus including a transfer chamber provided with a substrate moving device to move substrates, a load lock chamber to align the substrates and to load and unload the substrates into and out of the transfer chamber, and at least one process chamber to process the substrates transferred from the transfer chambers. Each of the at least one process chamber includes a chamber body provided with a substrate entrance formed on a side surface thereof, a substrate support provided within the chamber body such that at least two substrates are disposed on the substrate support, and at least one divider provided within the chamber body to align the at least two substrates. | 09-22-2011 |
| 20110232844 | SUBSTRATE PROCESSING APPARATUS - A substrate processing apparatus is presented having a transport chamber defining substantially linear substrate transport paths, a linear array of substrate holding modules, each communicably connected to the chamber. The substrate transport has at least one transporter capable of holding and moving the substrate on more than one substantially linear substrate transport paths. The transport chamber having different transport tubes at least one of which is sealable at both ends of the transport tube and configured to hold an isolated atmosphere different from that of the transport tubes, each of the different transport tubes having one of the substrate transport paths located therein different from another of the transport paths located in another of the transport tubes, and being communicably connected to each other, where at least one of the transport tubes is configured to provide uninterrupted transit of the substrate transport through the transport tubes. | 09-29-2011 |
| 20120067521 | VACUUM PROCESSING SYSTEM - A vacuum processing system including a cassette holder for setting up cassettes in which samples are stored, an air-transfer chamber for transferring the samples, lock chambers for storing the samples transferred from the air-transfer chamber, the lock chambers being capable of switching between air atmosphere and vacuum atmosphere in their inside, a vacuum transfer chamber connected to the lock chambers, vacuum containers for processing the samples transferred via the vacuum transfer chamber, a cooling chamber for cooling the samples down to a first temperature, the samples being processed in at least one of the vacuum containers, and a cooling unit for cooling the samples down to a second temperature, the samples being cooled in the cooling chamber. The cooling unit is deployed in the air transfer chamber, and has a cooling part for cooling the samples, being cooled in the cooling chamber, down to the second temperature. | 03-22-2012 |
| 20120211164 | SYSTEMS FOR PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION AND BEVEL EDGE ETCHING - Embodiments described herein relate to a substrate processing system that integrates substrate edge processing capabilities. Illustrated examples of the processing system include, without limitations, a factory interface, a loadlock chamber, a transfer chamber, and one or more twin process chambers having two or more processing regions that are isolatable from each other and share a common gas supply and a common exhaust pump. The processing regions in each twin process chamber include separate gas distribution assemblies and RF power sources to provide plasma at selective regions on a substrate surface in each processing region. Each twin process chamber is thereby configured to allow multiple, isolated processes to be performed concurrently on at least two substrates in the processing regions. | 08-23-2012 |
| 20120222813 | VACUUM CHAMBERS WITH SHARED PUMP - Embodiments of the present disclosure generally relate to vacuum processing chambers having different pumping requirements and connected to a shared pumping system through a single foreline. In one embodiment, the vacuum processing chambers include a high conductance pumping conduit and a low conductance pumping conduit coupled to a single high conductance foreline. In another embodiment, a plurality of unbalanced chamber groups may be connected to a common pumping system by a final foreline. | 09-06-2012 |
| 20120247670 | SUBSTRATE CLEANING APPARATUS AND VACUUM PROCESSING SYSTEM - A substrate cleaning apparatus includes a supporting unit, provided in a processing chamber having a gas exhaust port, for supporting a substrate; one or more nozzle units, each for ejecting gas clusters to a peripheral portion of the substrate supported by the supporting unit to remove unnecessary substances from the peripheral portion; and a moving mechanism for changing relative positions of the supporting unit and the nozzle unit during ejecting the gas clusters. Each nozzle unit discharges a cleaning gas having a pressure higher than that in the processing chamber so that the cleaning gas is adiabatically expanded to form aggregates of atoms and/or molecules. | 10-04-2012 |
| 20120247671 | SUBSTRATE PROCESSING APPARATUS - Provided is a substrate processing apparatus, including: transportation chamber maintained in an atmospheric environment where a substrate is transported; a vacuum processing chamber connected with the transportation chamber through a load lock chamber; a substrate placing table installed in the vacuum processing chamber and having a body part and a surface part that is attachable to/detachable from the body part; a storage unit installed in the load lock chamber or the transportation chamber and configured to receive the surface part; and a transportation mechanism configured to transport the substrate from the transportation chamber to the vacuum processing chamber through the load lock chamber and transport the surface part between the storage unit and the body part of the vacuum processing chamber. | 10-04-2012 |
| 20120285621 | SEMICONDUCTOR CHAMBER APPARATUS FOR DIELECTRIC PROCESSING - Systems and chambers for processing dielectric films on substrates are described. Vertical combo chambers include two separate processing chambers vertically arranged in a processing stack. A top processing chamber is configured to process the substrate at relatively low substrate temperature. A robot is configured to remove a substrate from the top processing chamber and change height before placing the substrate in a bottom processing chamber. The bottom processing chamber is configured to anneal the substrate to further process the dielectric film. The vertical stacking increases the number of processing chambers which can be included on a single processing system. The separation of the bottom (annealing or curing) chamber and the top chamber allows the top chamber to remain at a low temperature which hastens the start of a process conducted on a new wafer transferred into the top chamber. This configuration of vertical-combo chamber can be used for depositing a dielectric film in the top chamber and then curing the film in the bottom chamber. The configuration is also helpful for dielectric removal processes which create solid residue, in which case the bottom chamber is used to sublimate the solid residue. The separation limits or substantially eliminates the amount of solid residue which accumulates in the top chamber. Simultaneous processing, thermal separation and contamination control afforded by the design of the vertical combo chambers improve the throughput of a processing system. | 11-15-2012 |
| 20130213574 | METHOD AND SYSTEM FOR SUPPLYING A CLEANING GAS INTO A PROCESS CHAMBER - A method and apparatus for cleaning a process chamber are provided. In one embodiment, a process chamber is provided that includes a remote plasma source and a process chamber having at least two processing regions. Each processing region includes a substrate support assembly disposed in the processing region, a gas distribution system configured to provide gas into the processing region above the substrate support assembly, and a gas passage configured to provide gas into the processing region below the substrate support assembly. A first gas conduit is configured to flow a cleaning agent from the remote plasma source through the gas distribution assembly in each processing region while a second gas conduit is configured to divert a portion of the cleaning agent from the first gas conduit to the gas passage of each processing region. | 08-22-2013 |
| 20130220546 | HIGH THROUGHPUT PHYSICAL VAPOR DEPOSITION APPARATUS AND METHOD FOR MANUFACTURE OF SOLID STATE BATTERIES - An apparatus for formation of element(s) of an electrochemical cell using a complete process. The apparatus includes a first work piece configured to a transfer device, a source of material in fluid form, a reaction region operably coupled to the source of material and a second work piece configured within a distance of the reaction region. The apparatus also has an energy source configured to the reaction region to subject a portion of the material to energy to substantially evaporate the portion of the material within a time period and cause deposition of a gaseous species derived from the evaporated material onto a surface region of the second work piece to form a thickness of material for a component of the solid state electrochemical device and a vacuum chamber to maintain at least the first and second work pieces, the reaction region, and the material within a vacuum environment. | 08-29-2013 |
| 20130340939 | SYSTEM FOR SUBSTRATE HANDLING AND PROCESSING - This disclosure relates to a substrate processing system for substrates with a surface area of greater than 1 m | 12-26-2013 |
| 20140048208 | APPARATUS FOR FABRICATING SEMICONDUCTOR DEVICES - An apparatus for fabricating semiconductor devices including a load-lock part arranged adjacent to a front side of a transfer part, a cleaning part and at least two process chambers arranged side by side adjacent to a back side of the transfer part, a plasma supply module arranged at a back side of the cleaning part and configured to supply plasma to the cleaning part, and a reaction gas exhaust part coupled to the cleaning part and arranged below the transfer part and configured to exhaust a reaction gas from the cleaning part may be provided. | 02-20-2014 |
| 20140076494 | PROCESSING SYSTEM - A processing system includes a transfer chamber having therein a transfer unit for transferring a substrate and at least one processing unit connected to the transfer chamber. The transfer chamber is maintained in a vacuum state. The processing unit is configured to perform a processing on a substrate. The processing unit includes a first chamber in which a first processing is performed on a substrate, and a second chamber detachably installed in the first chambers. A second processing is performed on a substrate in the second chamber installed in the first chamber. Wall portions of the first chamber and the second chamber are maintained at different temperatures. | 03-20-2014 |
| 20140209240 | VACUUM PROCESSING APPARATUS - A vacuum processing apparatus for processing a workpiece under vacuum. The vacuum processing apparatus includes a housing having a first vacuum chamber for processing the workpiece and a second vacuum chamber partitioned from the first vacuum chamber by a partition wall and communicating with the first vacuum chamber through a communication opening formed in the partition wall, a shutter for closing the communication opening of the partition wall, a gate for closing a workpiece load/unload opening communicating with the second vacuum chamber, a workpiece holding unit provided in the first vacuum chamber for holding the workpiece, a processing unit for processing the workpiece held by the workpiece holding unit, a first evacuating unit for evacuating the first vacuum chamber, and a second evacuating unit for evacuating the second vacuum chamber. | 07-31-2014 |
| 20140209241 | DRIVE DEVICE AND SUBSTRATE PROCESSING SYSTEM - A drive device is provided to include: a case; a first motor and a second motor having an output shaft extending along a first axial line in the case and a second axial line parallel to the first axial line in the case, respectively; a first output shaft including a first shaft body and roller followers, the roller followers being engaged at a predetermined reduction gear ratio with the rib of the first motor; a second output shaft including a second shaft body and roller followers, the roller followers being engaged at a predetermined reduction gear ratio with the rib of the second motor; a first sealing member located between the case and the outer peripheral surface of the first shaft body; and a second sealing member located between an inner peripheral surface of the first shaft body and an outer peripheral surface of the second shaft body. | 07-31-2014 |
| 20140216658 | VACUUM PROCESSING DEVICE - To provide a vacuum processing device ( | 08-07-2014 |
| 20140246153 | MULTI-STEP AND ASYMMETRICALLY SHAPED LASER BEAM SCRIBING - Methods of dicing substrates by both laser scribing and plasma etching. A method includes laser ablating material layers, the ablating leading with a first irradiance and following with a second irradiance, different than the first. An asymmetrically shaped beam having an asymmetrical spatial profile along the direction of travel, multiple passes of a beam adjusted to have different irradiance levels, and multiple laser beams having various irradiance levels may be utilized to ablate at least a mask with the first irradiance and expose the substrate with the second irradiance. | 09-04-2014 |
| 20140262035 | SEMICONDUCTOR DEVICE MANUFACTURING PLATFORM WITH SINGLE AND TWINNED PROCESSING CHAMBERS - A transfer chamber for semiconductor device manufacturing includes (1) a plurality of sides that define a region configured to maintain a vacuum level and allow transport of substrates between processing chambers, the plurality of sides defining a first portion and a second portion of the transfer chamber and including (a) a first side that couples to two twinned processing chambers; and (b) a second side that couples to a single processing chamber; (2) a first substrate handler located in the first portion of the transfer chamber; (3) a second substrate handler located in the second portion of the transfer chamber; and (4) a hand-off location configured to allow substrates to be passed between the first portion and the second portion of the transfer chamber using the first and second substrate handlers. Method aspects are also provided. | 09-18-2014 |
| 20140262036 | PROCESS LOAD LOCK APPARATUS, LIFT ASSEMBLIES, ELECTRONIC DEVICE PROCESSING SYSTEMS, AND METHODS OF PROCESSING SUBSTRATES IN LOAD LOCK LOCATIONS - A process load lock apparatus is disclosed. The process load lock apparatus includes a load lock chamber adapted to couple between a mainframe section and a factory interface, the load lock chamber including an entry and an exit each having a slit valve, and a load lock process chamber located at a different level than the load lock chamber at the load lock location wherein the load lock process chamber is adapted to carry out a process on a substrate, such as oxide removal or other processes. Systems including the process load lock apparatus and methods of operating the process load lock apparatus are provided. A lift assembly including a containment ring is also disclosed, as are numerous other aspects. | 09-18-2014 |
| 20140290861 | DEPOSITION PLATFORM FOR FLEXIBLE SUBSTRATES AND METHOD OF OPERATION THEREOF - An apparatus for processing a flexible substrate is described. The apparatus includes a vacuum chamber having a first chamber portion, a second chamber portion and a third chamber portion, an unwinding shaft, a coating drum having a rotation axis and a curved outer surface for guiding the substrate along the curved outer surface through a first vacuum processing region and at least one second vacuum processing region, wherein a first portion of the coating drum is provided in the second chamber portion and the remaining portion of the coating drum is provided in the third chamber portion, a first processing station corresponding to the first processing region and at least one second processing station corresponding to the at least one second vacuum processing region, wherein the first processing station and the second processing station each includes a flange portion. | 10-02-2014 |
| 20140374024 | APPARATUS FOR REMOVING PARTICLES FROM A TWIN CHAMBER PROCESSING SYSTEM - Embodiments of an apparatus for removing particles from a twin chamber processing system are provided herein. In some embodiments, an apparatus for removing particles from a twin chamber processing system includes a remote plasma system; and a plurality of conduits fluidly coupling the remote plasma system to each process chamber of a twin chamber processing system to provide a plasma to an exhaust volume of each process chamber, wherein each conduit of the plurality of conduits has an outlet disposed along a boundary of the respective exhaust volumes. | 12-25-2014 |
| 20150083330 | GAS APPARATUS, SYSTEMS, AND METHODS FOR CHAMBER PORTS - An electronic device manufacturing system may include a chamber port assembly that provides an interface between a transfer chamber and a process chamber. In some embodiments, the chamber port assembly may be configured to direct a flow of purge gas into a substrate transfer area of the chamber port assembly. In other embodiments, a process chamber and/or the transfer chamber may be configured to direct a flow of purge gas into the substrate transfer area. The flow of purge gas into a substrate transfer area may prevent and/or reduce migration of particulate matter from chamber hardware onto a substrate being transferred between the transfer chamber and a process chamber. Methods of assembling a chamber port assembly are also provided, as are other aspects. | 03-26-2015 |
| 20150083331 | Process Chamber, Semiconductor Manufacturing Apparatus and Substrate Processing Method Having the Same - Disclosed herein is a semiconductor manufacturing apparatus including a transfer chamber provided with a substrate moving device to move substrates, a load lock chamber to align the substrates and to load and unload the substrates into and out of the transfer chamber, and at least one process chamber to process the substrates transferred from the transfer chambers. Each of the at least one process chamber includes a chamber provided with a substrate entrance formed on a side surface thereof, a substrate support provided within the chamber such that at least two substrates are disposed on the substrate support, and at least one divider provided within the chamber to align the at least two substrates. | 03-26-2015 |
| 20150101754 | APPARATUS FOR TREATING SUBSTRATE AND METHOD FOR CARRYING SUBSTRATE - Provided is an apparatus for treating a substrate. The apparatus for treating the substrate includes a carrying unit between a second chamber and a loadlock chamber. The carrying unit includes an arm, a blade for supporting the substrate, and a rotation driver for rotating the arm. The carrying unit disposed between the second chamber and the loadlock chamber receives the substrate transferred in the loadlock chamber to transfer the substrate onto a substrate supporter in the second chamber. | 04-16-2015 |
| 20150114564 | SUBSTRATE PROCESSING APPARATUS AND SHUTTER MEMBER - In a substrate processing apparatus of the present disclosure, a bearing member includes a decaying mechanism provided with a connecting shaft inserted therein and configured to decay radicals or ions; a first member configured to cover the decaying mechanism; and a second member disposed at the connecting shaft and provided with the connecting shaft inserted therein while being in contact with a sealing member. Further, an end of the first member and an end of the second member are connected to be engaged with each other, an invasion path is formed to allow the radicals to invade from the connected portion of the end of the first member and the end of the second member, and the invasion path is formed to be folded back in an extending direction of the connecting shaft. The sealing member is made of a material having a tensile strength larger than 12.1 MPa. | 04-30-2015 |
| 20150340209 | FOCUS RING REPLACEMENT METHOD FOR A PLASMA REACTOR, AND ASSOCIATED SYSTEMS AND METHODS - A focus ring replacement method for a plasma reactor, and associated systems and methods are disclosed herein. In one embodiment, a plasma processing system includes a plasma reactor and a wafer handler. The plasma reactor includes a processing chamber defining an enclosure and having a chamber opening accessible to the enclosure. A wafer holder assembly is positioned within the enclosure and configured to hold a semiconductor wafer and a focus ring that surrounds the semiconductor wafer. The wafer handler is configured to transport the focus ring through the chamber opening, and the wafer holder assembly is further configured to transfer the focus ring between the wafer handler and the wafer holder assembly. | 11-26-2015 |
| 20150371812 | Substrate Processing System, Gate Valve and Substrate Transfer Method - There is provided a substrate processing system which includes: at least two transfer chambers disposed adjacent each other, each of which including a transfer mechanism configured to transfer a substrate; at least one process chamber connected to each of the at least two transfer chambers, and configured to perform a process on the substrate loaded into the at least one process chamber; a gate valve configured to move into and out of a connection path interconnecting the at least two transfer chambers and configured to separate the at least two transfer chambers from each other; and a substrate holding mechanism attached to the gate valve and configured to hold the substrate. | 12-24-2015 |
| 20160138171 | METHOD FOR MANUFACTURING CORROSION RESISTANT AND CONDUCTIVE NANO CARBON COATING LAYER AND FUEL CELL BIPOLAR PLATE THEREBY USING STAINLESS STEEL SUBSTRATE - The present invention proposed manufacturing device of coating layers with good conductivity and corrosion resistance at high productivity comprising etching the oxide layer on the stainless steel substrate by plasma etching to activate the surface and prevent from decreasing it's conductivity, coating metal nitrides like CrN or TiN in nano size thickness on the etched surface and coating carbon layer at nano size thickness on top of it. According to the present invention, it is possible to produce manufacture fuel cell bipolar plate, electrode material and stainless steel with reinforced conductivity and corrosion resistance in mass. | 05-19-2016 |
| 156345320 | With robot arm connected by doors to plural other chambers (i.e., cluster tool) | 8 |
| 20080202686 | Self-contained process modules for magnetic media processing tool - A substrate processing apparatus is described. The apparatus includes a substrate load lock chamber. A substrate transfer chamber is vacuum coupled to the substrate load lock chamber. A plurality of process chamber modules are vacuum coupled to the substrate transfer chamber. Each of the process chamber modules includes a process chamber coupled to a dedicated support system so that each process chamber module can be disconnected from the substrate transfer chamber without disrupting any of the other process chamber modules. The substrate transfer chamber includes one or more robotic arms for transferring magnetic media substrates between the substrate load lock chamber and the plurality of process chamber modules. | 08-28-2008 |
| 20080202687 | Stacked process chambers for flat-panel display processing tool - A substrate processing apparatus is described. The apparatus includes a substrate load lock chamber. A substrate transfer chamber is vacuum coupled to the substrate load lock chamber. A plurality of process chamber modules are vacuum coupled to the substrate transfer chamber. At least two of the process chamber modules are horizontally clustered around the substrate transfer chamber. In addition, at least two of the process chamber modules are vertically arranged with one process chamber module above the other process chamber module. The substrate transfer chamber includes one or more robotic arms for transferring flat-panel display substrates between the substrate load lock chamber and the plurality of process chamber modules. | 08-28-2008 |
| 20090078374 | APPARATUS AND METHODS FOR TRANSPORTING AND PROCESSING SUBSTRATES - There is described apparatus and methods for transporting and processing substrates including wafers as to efficiently produce at reasonable costs improved throughput as compared to systems in use today. A key element is the use of a transport chamber along the sides of processing chambers for feeding substrates into a controlled atmosphere through a load lock and then along a transport chamber as a way of reaching processing chambers and then out of the controlled atmosphere following processing in the processing chambers. | 03-26-2009 |
| 20090165952 | VACUUM PROCESSING APPARATUS - The invention provides a semiconductor manufacturing apparatus having a high productivity per installed area. In a vacuum processing apparatus provided with a plurality of cassettes on which a cassette is stored, a vacuum feed chamber arranged in a back face side of the atmospheric air feed chamber in a state of being coupled thereto, having a polygonal plane shape and structured such that the wafer is fed in a depressurized inner portion, and a plurality of vacuum processing chambers detachably coupled to a side surface of the vacuum feed chamber, arranged in adjacent thereto and processing the wafer fed to an inner portion from the vacuum feed chamber, a plurality of vacuum processing apparatuses includes a plurality of etching processing chamber carrying out an etching process of the wafer and at least one ashing processing chamber carrying out an ashing process of the wafer, the ashing processing chamber is coupled to a side surface in one of right and left sides as seen from the front face of the vacuum feed chamber, and the atmospheric air feed chamber is arranged so as to be biased to the one side to which the ashing processing chamber is coupled. | 07-02-2009 |
| 20120067522 | VACUUM PROCESSING APPARATUS - A vacuum processing apparatus having an atmospheric-pressure transport chamber for conveying samples, lock chambers that accommodate the samples conveyed in and have an ambient capable of being switched between an atmospheric ambient and a vacuum ambient, a vacuum transport chamber coupled to the lock chambers, and at least one vacuum chamber for processing the samples. The apparatus further includes cooling portions operable to cool the high-temperature samples processed by the vacuum chamber. Each cooling portion has: a sample stage over which the high-temperature samples are placed and which has a coolant channel; gas-blowing tubes disposed closer to the inlet/exit port and acting to blow gas toward the sample stage; and an exhaust port disposed on the opposite side of the sample stage with regard to the inlet/exit port and acting to discharge the gas blown from the gas-blowing tubes. | 03-22-2012 |
| 20140174659 | WATER SOLUBLE MASK FOR SUBSTRATE DICING BY LASER AND PLASMA ETCH - Methods of dicing substrates having a plurality of ICs are disclosed. A method includes forming a mask comprising a water soluble material layer over the semiconductor substrate. The mask is patterned with a femtosecond laser scribing process to provide a patterned mask with gaps. The patterning exposes regions of the substrate between the ICs. The substrate is then etched through the gaps in the patterned mask to singulate the IC and the water soluble material layer is washed off. | 06-26-2014 |
| 20150013910 | SUBSTRATE PROCESSING APPARATUS - A transfer apparatus for transporting substrates in a transfer chamber having a first and second ends and two sides extending between the ends. The transfer apparatus includes a drive section, at least one base arm fixed at one end with respect to the transfer chamber and including at least one arm link rotatably coupled to the drive section and at least one transfer arm rotatably coupled to a common end of the base arm, the at least one transfer arm has two end effectors. The drive section has motors with three independent axes of rotation defining three degrees of freedom. One degree of freedom moves the at least one base arm horizontally for transporting the at least one transfer arm and two degrees of freedom drives the at least one transfer arm to extend and retract the at least one transfer arm and swap the two end effectors. | 01-15-2015 |
| 20150096685 | VACUUM PROCESSING APPARATUS - A plasma processing apparatus includes processing units, each of which subjects a sample to processing inside a processing chamber in a vacuum vessel, vacuum transfer chambers which are coupled to the processing units and each have an interior where a sample is transferred under reduced pressure, an intermediate chamber which has, in an interior, a space where a transferred sample is housed, a buffer chamber which is capable of housing a sample arranged in an interior of the vessel, a mounting table which is arranged in the buffer chamber and is adjusted to a prescribed temperature and on which a sample is placed, an opening through which a sample is taken in or out, and a lid member which opens or hermetically closes the opening, and a sample is transferred between the processing unit and a lock chamber via the buffer chamber. | 04-09-2015 |
