| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 156330000 | Epoxy resin | 85 |
| 20080251201 | Adhesive Tape For Structural Bonding - An adhesive tape for bonding components such as, for example, in a motor vehicle. The adhesive tape comprises a non-perforated or perforated metal layer having opposite first and second major sides, each of the first and second major sides having an adhesive layer defining an adhesive surface on the first and second major sides. The adhesive layer on the first and second major sides comprises domains of pressure sensitive adhesive and domains of an activatable adhesive composition. Each of the domains define a part of the surface of the adhesive layer. A method of adhering components of motor vehicles together. The method comprises (i) providing an adhesive tape between the components to be adhered together, the adhesive tape comprising opposite first and second major adhesive surface, each of the first and second major adhesive surface being defined by an adhesive layer that comprises domains of pressure sensitive adhesive and domains of an activatable adhesive composition, each of the domains defining a part of the surface of the adhesive layer; and (ii) cross-linking the domains of activatable adhesive composition. | 10-16-2008 |
| 20080251202 | HEAT-RESISTANT STRUCTURAL EPOXY RESINS - Epoxy adhesive compositions containing a rubber-modified epoxy resin contain a bisphenol. The bisphenol can be pre-reacted with the rubber-modified epoxy resin to advance the resin. The adhesives are resistant to thermal degradation as can occur in so-called “overbake” conditions, in which the adhesive is heated to high temperatures for prolonged periods of time. In addition, expanded microballoons are included in epoxy structural adhesives to promote a desired fracture mode. | 10-16-2008 |
| 20080251203 | Structural Epoxy Resins Containing Core-Shell Rubbers - Core-shell rubbers are incorporated into epoxy adhesives. The adhesives are structural type adhesives that contain an epoxy resin and a toughener, and may contain a liquid rubber in addition to the core-shell rubber. The adhesives have good modulus and tensile strength, which are obtained without loss of elongation and adhesive properties. | 10-16-2008 |
| 20080257493 | MONOMERS DERIVED FROM PENTACYCLOPENTADECANE DIMETHANOL - The invention is based on the discovery that certain well-defined compounds derived from pentacyclopentadecane dimethanol are useful components in adhesive formulations. In particular, the invention compounds described herein provide high Tg values and low shrinkage. Compounds of the invention are useful as adhesives for use in the semiconductor packaging industry. | 10-23-2008 |
| 20080302478 | Adhesive agent and inkjet head and manufacturing method thereof - Disclosed is an adhesive agent which is curable and has flexibility at low temperature, and further has resistant to solvent type ink. The adhesive agent includes a base and an activator, wherein the base includes at least any one of: bisphenol F epoxy compound; bisphenol F epoxy compound mixed with an epoxy compound having three or more epoxy groups; and bisphenol A epoxy compound mixed with an epoxy compound having three or more epoxy groups, wherein the activator includes: 100 parts by mass of polyamide composed of a condensation reaction product of C36 unsaturated fatty acid dimer and polyamine; and 5 to 200 parts by mass of alicyclic polyamine, and wherein the base is mixed with the activator with a ratio of 10 to 200 parts by mass of the activator with respect to 100 parts by mass of the base. | 12-11-2008 |
| 20080314517 | Alternative Polyolefin Composite Veil/Compatibilizing Mat Materials - A compatibilized polyolefin/polyolefin composite material includes a polyolefin/polyolefin composite substrate and a reinforcing mat formed from reinforcing fibers and a thermoplastic polymer powder. The mat may also incorporate an optional emulsion polymer binder. In addition the compatibilized polyolefin/polyolefin composite material may incorporate an additional film layer so that the mat is sandwiched between the substrate and the film layer. A method of producing such materials from a to polyolefin/polyolefin composite substrate that is topologically/mechanically bonded to a reinforcing mat formed from reinforcing fibers and thermoplastic polymer powder is also described. | 12-25-2008 |
| 20090000736 | Oxidant-Containing Adhesive Enabling Disassembly - An object of the present invention is to provide an easily disassemblable adhesive that is an adhesive for forming a structure by adhering members and enables easy disassembly of the adhered structure owing to possessing disassemblability. The invention provides a disassemblable adhesive containing an organic adhesive component and an oxidant. | 01-01-2009 |
| 20090065143 | TWO-COMPONENT EPOXY ADHESIVE COMPOSITION - The present invention relates to a two-component epoxy adhesive composition comprising
| 03-12-2009 |
| 20090107632 | ADHESIVE COMPOSITIONS FOR HIGH TEMPERATURE SENSORS AND METHODS OF MAKING THE SAME - An adhesive composition is provided which effectively bonds a sensor to a surface having a temperature up to approximately 250° C. The adhesive composition comprises an epoxy resin and a latent cationic cure catalyst effective to cure the epoxy resin. The invention also provides a method of preparing an adhesive composition comprising blending an epoxy resin and a latent cationic cure catalyst effective to cure the epoxy resin, wherein the composition is capable of effectively bonding a sensor to a surface having a temperature up to approximately 250° C. The invention further provides a method of bonding a sensor to a surface comprising the steps of applying an adhesive composition to a first surface of the sensor or to a surface area of an object to be monitored, the adhesive composition comprising an epoxy compound and a latent cationic cure catalyst effective to cure the epoxy resin. The first surface of the sensor is contacted with the surface area of the object whereby the adhesive composition is located therebetween, and wherein the composition effectively bonds the sensor to the object surface at a temperature up to approximately 250° C. | 04-30-2009 |
| 20090120576 | ADHESIVE STRIP THAT CAN BE ACTIVATED BY HEAT AND IS BASED ON NITRILE RUBBER AND POLYVINYL BUTYRAL FOR STICKING TOGETHER ELECTRONIC COMPONENTS AND STRIP CONDUCTORS - Heat-activable adhesive tape for producing and further processing flexible conductor tracks, with an adhesive composed at least of
| 05-14-2009 |
| 20090133833 | Epoxy Resin Composition and Die Bonding Material Comprising the Composition - A composition comprising
| 05-28-2009 |
| 20090242122 | METHOD FOR MOUNTING SEMICONDUCTOR DEVICE, AS WELL AS CIRCUIT BOARD, ELECTROOPTIC DEVICE, AND ELECTRONIC DEVICE - A method of forming a bonded structure comprises the steps of: mounting a semiconductor device having an electrode; a convexity protruding higher than the electrode and formed of a resin; and a conductive unit electrically coupled to the electrode and extending over the surface of the convexity, onto a specific substrate with an intermediary of a bonding material; and mounting the semiconductor device by hot pressing within a temperature range including the glass transition temperature of the resin. | 10-01-2009 |
| 20090255629 | Fluid ejection device utilizing a one-part epoxy adhesive - A fluid ejection device, including a substrate carrier having a substrate receiving-surface, and a substrate having at least one fluid ejector actuator disposed on the substrate. In addition the fluid ejection device includes a one-part adhesive disposed between the substrate and the substrate-receiving-surface. The one-part adhesive is an epoxy resin having a polyglycidyl ether of a polyhydric phenol, a solid cylcoaliphatic amine curing agent. | 10-15-2009 |
| 20090260761 | HEAT-ACTIVABLE ADHESIVE TAPE PARTICULARLY FOR BONDING ELECTRONIC COMPONENTS AND CONDUCTOR TRACKS - Heat-activable adhesive tape particularly for producing and further processing electronic components and conductor tracks, with an adhesive composed at least of
| 10-22-2009 |
| 20090288769 | Surface-Promoted Cure of Cationically Curable Compositions Comprising Vinyl Ethers - The present invention relates to cationically curable compositions for curing on a surface comprising a cationically curable component, an accelerator species comprising at least one vinyl ether functional group and an initiator component capable of initiating cure of the cationically curable component. The initiator comprises at least one metal salt, which is chosen so that it is reduced at the surface, and where the standard reduction potential of the initiator component is greater than the standard reduction potential of the surface, and where when the composition is placed in contact with the surface, the metal salt of the initiator component of the composition is reduced at the surface, thereby initiating cure of the cationically curable component of the composition. The accelerator species comprising at least one vinyl ether functional group greatly enhances the rate of cure. No catalytic component is required in the composition for efficient cure | 11-26-2009 |
| 20090294057 | CURABLE EPOXY RESIN-BASED ADHESIVE COMPOSITIONS - This invention relates to compositions useful as adhesives and more particularly to the preparation of epoxy-based adhesive composition with improved impact resistance and good adhesion to oily metal substrates. | 12-03-2009 |
| 20090308534 | NEXT GENERATION, HIGHLY TOUGHENED TWO PART STRUCTURAL EPOXY ADHESIVE COMPOSITIONS - This invention relates to two part, epoxy-based adhesive compositions with improved toughness suitable for structural applications. | 12-17-2009 |
| 20090321016 | Epoxy-modified vinyl chloride-vinyl ester copolymer solid resin - A process for the preparation of epoxy-modified vinyl chloride-vinyl ester copolymers in the form of the solid resins involves aqueous, free radical polymerization of a mixture comprising | 12-31-2009 |
| 20100000679 | METHOD FOR BONDING MEA AND GDL OF FUEL CELL STACK - The present invention provides a method for bonding a membrane electrode assembly (MEA) and a gas diffusion layer (GDL) of a fuel cell stack, which facilitates stacking of an electrode catalyst layer of the MEA and the GDL and, at the same time, facilitates the keeping of the stacked layers for mass production of the fuel cell stack. | 01-07-2010 |
| 20100012271 | HEAT-ACTIVABLE ADHESIVE TAPE PARTICULARLY FOR BONDING ELECTRONIC COMPONENTS AND CONDUCTOR TRACKS - Heat activable adhesive tape for bonding electronic components and conductor tracks, with an adhesive composition having at least an acid-modified or acid anhydride-modified vinylaromatic block copolymer, and epoxide compound and a metal chelate | 01-21-2010 |
| 20100018647 | Manufacturing method of inkjet head, and adhesive agent composition - Disclosed are an adhesive agent composition which has high chemical resistance and solvent resistance and is curable at around room temperature, an inkjet head which has good durability and jetting performance even in the case of using solvent ink, and a manufacturing method of the inkjet head. For these characteristics, the adhesive agent composition contains, as an activator, an imidazole derivative in which an alkyl group or a substituted alkyl group is substituted at the 1-postion or at the 1- and 2-positions, and as a base, a compound having three or more epoxy groups. | 01-28-2010 |
| 20100065210 | FLOWABLE NON-SAGGING ADHESIVE COMPOSITIONS - This invention provides an acrylic epoxy adhesive as a two part composition, wherein each part is of suitable viscosity for use in pumping apparatus, but after mixing, the composition increases in viscosity, so that it will not sag, drip, or migrate after application to a surface during the open time. This effect is achieved with a reactive acid component that gels on mixing with the epoxy portion of the composition. Also provided is a method of preparing the adhesive composition, and method of using the composition to form laminated materials. | 03-18-2010 |
| 20100096082 | ADHESIVE RESIN COMPOSITION AND BONDING METHOD - The present invention relates to an inexpensive adhesive resin composition which is applicable even to a base material having a poor bonding property. The adhesive resin composition comprises (A) a polymer having no radical-polymerizable double bond and (B) a radical generating agent in which the radical generating agent (B) is present in an amount of 0.1 to 10 parts by weight on the basis of 100 parts by weight of the polymer (A). In the preferred embodiment of the present invention, the adhesive resin composition further comprises (C) a radical-polymerizable monomer wherein the monomer (C) is present in an amount of 0.1 to 10 parts by weight on the basis of 100 parts by weight of the polymer (A). The radical-polymerizable monomer (C) is a glycidyl group-containing monomer, and the glycidyl group-containing monomer is 4-hydroxybutyl acrylate glycidyl ether. | 04-22-2010 |
| 20100108259 | Low Temperature Curing Of Toughened Adhesives - Surfaces are bonded together using a thermoplastic toughened epoxy adhesive wherein the adhesive contains an epoxy component, a thermoplastic component, a core/shell particle component and a curing agent. The thermoplastic toughened epoxy adhesive is only heated during bonding to a relatively low curing temperature of between 140° C. and 160° C. for a sufficient time to cure the adhesive and provide surfaces that are bonded together with a high-strength bond. | 05-06-2010 |
| 20100116433 | Low-Temperature Impact Resistant Thermosetting Epoxide Resin Compositions With Solid Epoxide Resins - The invention relates to compositions containing at least one solid epoxide resin A, at least one polymer B of formula (I), at least one thixotropic agent C made from a urea derivative and at least one curing agent for epoxide resins D activated by high temperatures. The compositions are particularly suitable for use as adhesives. Low-temperature impact-resistant adhesives can be produced for use in particular as structural adhesives. | 05-13-2010 |
| 20100147462 | METHOD FOR BONDING FLEXIBLE PRINTED CONDUCTOR TRACKS WITH AN ADHESIVE STRIP THAT CAN BE ACTIVATED BY HEAT AND IS BASED ON CARBOXYLATED NITRILE RUBBER - Heat-activable adhesive tape for producing and further processing flexible conductor tracks, with an adhesive composed at least of
| 06-17-2010 |
| 20100212830 | THERMOSETTING SOLVENT-FREE SINGLE-COMPONENT COMPOSITIONS AND THEIR USE - We propose a thermosetting solvent-free single-component composition having a storage stability at room temperature of at least 2 weeks, consisting of
| 08-26-2010 |
| 20100294429 | EPOXY RESIN FORMULATIONS - A curable halogen-free epoxy resin composition comprising from 40 to 80 percent by weight of a phenol aldehyde condensation product, from 10 to 40 percent by weight of a phosphorous-containing phenolic epoxy resin, and from 10 to 40 percent by weight of an aromatic hardening agent having a sulphone group and an amine group. A prepreg and laminate can be formed from this composition. | 11-25-2010 |
| 20100307682 | THERMALLY-ACTIVATED AND -HARDENABLE ADHESIVE FOIL, ESPECIALLY FOR ADHESION OF ELECTRONIC COMPONENTS AND FLEXIBLE PRINTED CIRCUIT PATHS - Thermally-activated and hardenable adhesive foil for adhesion of electronic components and flexible printed circuit paths having an adhesive material composed of at least a) one chemically crosslinked or at least partially crosslinked polyurethane, b) one at least bifunctional epoxy resin, c) one hardener for the epoxy resin, in which the epoxy groups react chemically with the hardener at high temperatures, in which at least one of the starting materials of the polyurethane is a hydroxyl-functionalized polycarbonate and at least one of the starting materials of the polyurethane has a functionality greater than two | 12-09-2010 |
| 20110011533 | Oxygen barrier compositions and related methods - Oxygen barrier compositions for electrical devices and their related methods are provided. In certain embodiments, the oxygen barrier compositions comprise a meta-substituted aromatic resin and an additional aromatic epoxy resin. In some embodiments, the compositions have a chlorine content of less than approximately 1000 ppm. The compositions may have an oxygen permeability of less than approximately 0.4 cm | 01-20-2011 |
| 20110024039 | ONE-PART EPOXY-BASED STRUCTURAL ADHESIVE - A one-part epoxy structural adhesive comprising an epoxy resin, a toughening agent, a reactive liquid modifier present in an amount ranging from about 5% to about 15% by weight structural adhesive, and a latent amine curing agent. The structural adhesive may optionally include reactive diluents, synthetic mineral fibers, fillers, pigments and combinations th The structural adhesive may be used to form bonded joints between metal parts having clean surfaces, as well as those having surfaces contaminated with hydrocarbon-containing materials, such as oils, processing aids and lubricating agents. | 02-03-2011 |
| 20110048640 | METHOD FOR PRODUCING CIRCUIT CARRIERS - A method for the automated production of circuit carriers, comprising providing a substrate for accommodating electronic components, applying an electrically conductive, metal-containing base structure on the substrate. Electronic components are also provided on the substrate and are connected to each other by the structure. Electrically conductive, metal-containing conductive adhesive structures are applied onto the substrate, and the electronic components are connected to the base structure in an electrically conductive way by the structures. The conductive adhesive structures are optically differentiated from the base structure by a colored electrically conductive, metal-containing conductive adhesive applied onto the substrate in order to produce the conductive adhesive structure. A contrast, which is necessary for the automated optical monitoring of the conductive adhesive structures and the base structure, is established between the conductive adhesive structures and the base structure. | 03-03-2011 |
| 20110067812 | CURE ACCELERATORS - An epoxy resin composition comprising an epoxy resin component combined with a sufficient amount of an imidazole curative to provide curing of the epoxy resin composition. The epoxy resin composition further includes a non-hydroxyl containing cure accelerator for the imidazole curative. | 03-24-2011 |
| 20110067813 | HEAT-CURING EPOXY RESIN COMPOSITION COMPRISING AN ACCELERATOR HAVING HETEROATOMS - A heat-curing epoxy resin composition that includes an epoxy resin, a curing agent, an accelerator, and an optional toughener. The epoxy resin compositions are suitable in particular for use as bodyshell adhesives and for preparation of structural foams. An accelerator of formula (I) results in increased impact strength the of heat-curing epoxy resin compositions. | 03-24-2011 |
| 20110120646 | TWO-PART EPOXY-BASED STRUCTURAL ADHESIVES - A two-part structural adhesive composition comprising a curable epoxy resin, an amine curing agent, a toughening agent, and a reactive liquid modifier. The structural adhesive may also include secondary curatives, initiators, reactive diluents and combinations thereof. The structural adhesives may be used to replace or augment conventional joining means such as welds or mechanical fasteners in bonding parts together. | 05-26-2011 |
| 20110126980 | TWO-PART EPOXY-BASED STRUCTURAL ADHESIVES - A two-part epoxy-based structural adhesive composition comprising a curable epoxy resin, an amine curing agent, a toughening agent, and an oil-displacing agent. The structural adhesive may optionally include reactive liquid modifiers, fillers, secondary curatives, reactive diluents, surfactants, metal salts, pigments and combinations thereof. The structural adhesive may be used to form bonded joints between adherends having clean surfaces, as well as those having surfaces contaminated with hydrocarbon-containing materials, such as oils, processing aids and lubricating agents. | 06-02-2011 |
| 20110126981 | ONE-PART STRUCTURAL EPOXY RESIN ADHESIVES CONTAINING ELASTOMERIC TOUGHENERS CAPPED WITH PHENOLS AND HYDROXY-TERMINATED ACRYLATES OR HYDROXY-TERMINATED METHACRYLATES - Structural adhesives are prepared from an elastomeric toughener that contains urethane and/or urea groups, and have some terminal isocyanate groups that are capped with a phenol and other terminal isocyanate groups that are capped with a hydroxy-functional acrylate or a hydroxy-functional methacrylate. In certain embodiments, the presence of both types of capping on the toughener leads to higher impact peel strengths and a greater level of cohesive failure, than when the toughener is capped with a phenol an hydroxy-functional acrylate or hydroxy-functional methacrylate alone. | 06-02-2011 |
| 20110155320 | SILANE/UREA COMPOUND AS A HEAT-ACTIVATABLE CURING AGENT FOR EPOXIDE RESIN COMPOSITIONS - Silanes of formula (I), or of substrates whose surface is coated or derivatized with a silane of formula (I), as a curing agent for epoxy resins which is activatable at elevated temperature. Such thermosetting epoxy resin compositions allow a large reduction in the curing temperature without great impairment of their storage stability. | 06-30-2011 |
| 20110247757 | CIRCUIT CONNECTION MATERIAL, FILM-FORM CIRCUIT CONNECTING MATERIAL USING THE SAME, CIRCUIT MEMBER CONNECTING STRUCTURE, AND METHOD OF MANUFACTURING THE SAME - The present invention is a circuit connecting material used for the mutual connection of a circuit member in which electrodes and insulating layers are formed adjacent to each other on the surface of a board, and a circuit member in which electrodes and insulating layers are formed adjacent to each other on the surface of a board, with the edge parts and of the insulating layers being formed with a greater thickness than the electrodes on the basis of the main surfaces, wherein this circuit connecting material contains a bonding agent composition and conductive particles that have a mean particle size of 1 μm or greater but less than 10 μm and a hardness of 1.961 to 6.865 GPa, and this circuit connecting material exhibits a storage elastic modulus of 0.5 to 3 GPa at 40° C. and a mean coefficient of thermal expansion of 30 to 200 ppm/° C. at from 25° C. to 100° C. when subjected to the curing treatment. | 10-13-2011 |
| 20110284160 | 2-Component Adhesives - The invention relates to 2-component adhesives comprising one or more epoxy resins as a first component (E) and one or more amphiphilic epoxy resin hardeners as a second component (H), wherein the first component (E) and the second component (H) are reacted in water in a phase inversion polymerization. | 11-24-2011 |
| 20110297316 | LOW TEMPERATURE METHOD AND SYSTEM FOR FORMING FIELD JOINTS ON UNDERSEA PIPELINES - A method for forming a field joints between sections of coated or insulated pipe which are to be welded together and incorporated into an undersea pipeline for carrying single or multi-phase fluids such as oil, gas and water. The method includes the application of a liquid epoxy layer which overlaps a lip of the factory-applied FBE coating protruding beyond a chamfered end of the factory-applied insulation layer, and which may be applied over the entire weld joint area. The liquid epoxy layer is partially cured by application of heat, and a layer of powdered adhesive is applied onto the partially cured liquid epoxy layer. The adhesive is subsequently sintered and activated by application of heat to its outer surface. The outer surfaces of the adhesive layer and the chamfers are then preheated and the thermal joint insulation is injection molded over the entire joint area. Throughout the entire method the temperature of the factory-applied FBE coating is maintained below its glass transition temperature so as to avoid weakening the bond between the FBE coating and the underlying steel pipe. The number and sequence of steps can be varied, depending at least partly on whether the liquid epoxy and adhesive layers are applied in a pipe coating facility or in the field. | 12-08-2011 |
| 20110297317 | ONE-PART STRUCTURAL EPOXY RESIN ADHESIVES CONTAINING DIMERIZED FATTY ACID/EPOXY RESIN ADDUCT AND A POLYOL - Structural adhesives containing a non-rubber-modified epoxy resin, an elastomeric toughener and a curing agent further include an epoxy-functional fatty acid oligomer and a polyol. The presence of the epoxy-functional fatty acid oligomer and a semi-crystalline or crystalline polyester polyol in combination increase the storage stability of the structural adhesive. | 12-08-2011 |
| 20110297318 | METAL-TO-POLYMER BONDING USING AN ADHESIVE BASED ON EPOXIDES - A process of bonding a metal substrate to a non-halogenated polymer, especially of bonding a polyolefin overcoat to a metallic tube or pipe, using an epoxy-based adhesive which comprises at least one salt of a metal ion M in an oxidation state of n which has a standard reduction potential E | 12-08-2011 |
| 20110315317 | METHOD FOR ASSEMBLING DISPLAY MODULE - A display module includes a panel module and a frame and is able to be assembled to a cover to form a display device. At first, the panel module is provided that includes the first side and the second side and then a frame is provided, where the frame has an opening. Then, the second side of the panel module is adhered to the frame and covers the opening to form the display module, where the frame is the only structure substantially providing support to the panel module and the first side of the panel module includes a display region. Finally, a cover is fixed to the frame to form the display device, where a sidewall of the cover is snapped to the frame. The cover and the frame provide support to the panel module to strengthen a structural strength of the display module. | 12-29-2011 |
| 20120024477 | ROOM TEMPERATURE CURING EPOXY ADHESIVE - Room temperature curing epoxy adhesives are described. The adhesives contain an epoxy resin, an acetoacetoxy-functionalized compound, a metal salt catalyst, a first amine curing agent having an equivalent weight of at least 50 grams per weight of amine equivalents and a second amine curing agent having an equivalent weight of no greater than 45 grams per weight of amine equivalents. | 02-02-2012 |
| 20120055631 | HEAT CURABLE EPOXY RESIN COMPOSITION WITH WATER AS FOAMING AGENT - Heat-curable epoxy resin compositions and the use thereof, for example, in motor vehicle construction and sandwich panel construction, are disclosed. Exemplary heat-curable epoxy resin compositions include, in addition to epoxy resin components A1, optionally A2, a hardener component B, a carboxylic acid C and a hydroxyalkylamide or hydroxyalkylurea H, an accelerator E for activation of the conversion of components A1, A2 and B. The compositions and the structural foams produced therefrom are notable for high mechanical strength, high glass strength and good adhesion capacity on metallic and nonmetallic substrates, and it is possible at the same time to dispense with the use of toxic or inflammable blowing agents. | 03-08-2012 |
| 20120103517 | HEAT-RESISTANT STRUCTURAL EPOXY RESINS - Epoxy adhesive compositions containing a rubber-modified epoxy resin contain a bisphenol. The bisphenol can be pre-reacted with the rubber-modified epoxy resin to advance the resin. The adhesives are resistant to thermal degradation as can occur in so-called “overbake” conditions, in which the adhesive is heated to high temperatures for prolonged periods of time. In addition, expanded microballoons are included in epoxy structural adhesives to promote a desired fracture mode. | 05-03-2012 |
| 20120111499 | NANOSCALE SUPERPARAMAGNETIC POLY(METH)ACRYLATE POLYMERS - The invention relates to hybrid materials comprising polymers which envelop nanoscale, superparamagnetic, ferromagnetic, ferrimagnetic or paramagnetic powders, to a process for producing these materials and to their use. | 05-10-2012 |
| 20120145321 | CURABLE PROTECTANT FOR ELECTRONIC ASSEMBLIES - Latent thermal initiators and protectant compositions that remain shelf stable at elevated temperatures, yet readily cure during a solder bump reflow process or other high temperature processing. The thermal initiators comprise thermally labile cation-anion pairs where the blocked cation prevents cure at low temperatures, and the unblocked cation initiates cure at high temperatures. Also provided is a method of making a preferred initiator comprising the cation [N-(4-methylbenzyl)-N,N-dimethylanalinium] and the anion [N(SO | 06-14-2012 |
| 20120152458 | METHOD FOR PREPARING MULTILAYER ARTICLE BY CURING A CURABLE COMPOSITION COMPRISING IMIDAZOLIUM MONOCARBOXYLATE SALT - A method for preparing a laminated multilayer article is disclosed. In one embodiment, the multilayer article is a conformally sealed printed wiring board. The method comprises contacting a first substrate having a coating to a second substrate such that said coating is disposed between said first and second substrate, forming an uncured multilayer article, applying heat and pressure to said multilayer article thereby forming a cured multilayer article, said coating comprising an uncured epoxy composition comprising a combination of an epoxy, a phenolic curing agent, and an imidazolium monocarboxylate salt, In one embodiment the second substrate is a printed wiring board. Of particular utility are compositions comprising 2-ethyl-4-methyl imidazolium monocarboxylate salts. | 06-21-2012 |
| 20120175059 | Ballistic-resistant fabrications - A ballistic-resistant fabrication including a matrix formed by a number of elongated used tire segment layers along with high strength sheeting material which may be held together with an interstitial material, such as epoxy. More layers may be utilized as needed. These layers may be non-bonded, partially, or completely bonded and/or covered with other materials to produce a finished product. Due to the deformable and frictional properties of the rubber, along with the tensile strength of the sheeting, the fabrication has the ability to absorb and protects against multiple projectile impacts. These ballistic-resistant fabrications are much less expensive to produce than similar conventional products due to the use of recycled rubber tires and/or recycled plastic material, but are very efficient in resisting penetration by ballistic projectiles. | 07-12-2012 |
| 20120211161 | STRUCTURAL EPOXY RESIN ADHESIVES CONTAINING ELASTOMERIC TOUGHENERS CAPPED WITH KETOXIMES - Structural adhesives are prepared from an elastomeric toughener that contains urethane and/or urea groups, and have terminal isocyanate groups that are capped with ketoxime compound. The adhesives have very good storage stability and cure to form cured adhesives that have good lap shear and impact peel strengths, even at −40° C. | 08-23-2012 |
| 20130000842 | METHODS AND SYSTEMS FOR ADHERING MICROFEATURE WORKPIECES TO SUPPORT MEMBERS - Methods and systems for adhering microfeature workpieces to support members are disclosed. A method in accordance with one embodiment of the invention includes disposing a first adhesive on a surface of a microfeature workpiece, and disposing a second adhesive on a surface of a support member. The method can further include adhesively attaching the microfeature workpiece to the support member by contacting the first adhesive with the second adhesive while the second adhesive is only partially cured. In further particular embodiments, the first and second adhesives can have different compositions, and the second adhesive can be fully cured after the microfeature workpiece and support member are adhesively attached. | 01-03-2013 |
| 20130037213 | AMINO GROUP TERMINATED IMPACT STRENGTH MODIFIER AND USE THEREOF IN EPOXY RESIN COMPOSITIONS - The present disclosure relates to impact strength modifiers, the derivative products thereof, and the use thereof in producing two-component epoxy resin compositions. The disclosure in particular relates to amino group terminated impact strength modifiers prepared by reacting a polyurethane prepolymer having isocyanate groups, a primary diamine, and optionally at least one Michael acceptor. The two-component epoxy resin compositions thus formulated are characterized by a great increase in impact strength while retaining an acceptable tensile shear strength. The impact strength modifiers according to the disclosure and the epoxy resin compositions comprising same are in particular suitable for vehicle manufacturing. | 02-14-2013 |
| 20130042976 | FILM ADHESIVES AND PROCESSES FOR BONDING COMPONENTS USING SAME - Processes are provided for forming film adhesives ( | 02-21-2013 |
| 20130056152 | ADHESIVE TAPE AND SOLAR CELL MODULE USING THE SAME - The present invention provides an adhesive tape | 03-07-2013 |
| 20130056153 | STRUCTURAL ADHESIVES - A solid dry to the touch at ambient temperature structural adhesive which can be cured at elevated temperature and which can be moulded at an intermediate temperature is provided as well as the use of the adhesive for bonding metals. | 03-07-2013 |
| 20130139964 | AMORPHOUS METALS AND COMPOSITES AS MIRRORS AND MIRROR ASSEMBLIES - A mirror or mirror assembly fabricated by molding, pressing, assembling, or depositing one or more bulk metal glass (BMG), bulk metal glass composite (BMGMC), or amorphous metal (AM) parts and where the optical surface and backing of the mirror can be fabricated without machining or polishing by utilizing the unique molding capabilities of this class of materials. | 06-06-2013 |
| 20130192755 | Multilayer assembly - A multilayer assembly comprising a first inner layer (L1) made from a first composition (C1), said first composition (C1) comprising at least one polymer comprising recurring units derived from ethylene (E) and from chlorotrifluoroethylene (CTFE), and at least one Ti compound; and a second outer layer (L2) made from a second composition, said second composition (C2) being free from TiO | 08-01-2013 |
| 20130199724 | CURATIVES FOR EPOXY COMPOSITIONS - The invention provides epoxy and oxetane compositions including the novel acyloxy and N-acyl curing agents described herein. Use of invention curing agents result in cured adhesive compositions with remarkably increased adhesion and reduced hydrophilicity when compared to resins cured with other types of curing agents. Furthermore, the curatives of this invention do not interfere with free-radical cure and are thus suited for use in hybrid cure thermoset compositions. | 08-08-2013 |
| 20130248110 | SEALING COMPOSITION AND METHOD FOR MANUFACTURING DISPLAY PANEL USING THE SAME - A sealing composition and a method of manufacturing a display panel using the sealing composition are disclosed. The sealing composition includes about 10% by weight to about 80% by weight of a denatured epoxy resin having a methacrylate group, about 5% by weight to about 40% by weight of a photo-curing acrylate monomer, about 1% by weight to about 10% by weight of a heat-curing agent, about 1% by weight to about 10% by weight of a photo-polymerization initiator, about 5% by weight to about 50% by weight of a filler, about 1% by weight to about 10% by weight of a flexibility improving agent and about 0.001% by weight to about 8% by weight of an additive. | 09-26-2013 |
| 20130255879 | CURABLE ADHESIVE COMPOSITION - The present invention relates to a curable adhesive composition comprising a first part and a second part, the curable adhesive composition comprising: in the first part at least one epoxy resin and in the second part at least one curing agent in the form of an epoxy-amine and/or epoxy-thiol adduct obtainable by reacting at least one primary amine, secondary amine and/or a thiol with at least one polyol compound comprising at least one terminal epoxy group. | 10-03-2013 |
| 20130333840 | POLYETHER HYBRID EPOXY CURATIVES - This invention relates to a polyether-amido-amine corn-pound, obtainable by a two-step reaction of a poly-etheramine with an alkyl acrylate and a polyalkyle-neimine, whereas the polyetheramine and the polyalkyleneimine have at least one primary or secondary amine group, in which the first step comprises the reaction of the polyetheramine with the alkyl acrylate and the second step comprises the reaction of the polyalkyleneimine with the product of the first step. The invention also relates to a method for synthesising a polyether-amido-amine compound by a two-step-reaction. Another object of this invention is a curable composition containing at least one polyether-amido-amine-compound of this invention and a method for coating the surface of a substrate or for binding at least two substrates together using such a curable composition. | 12-19-2013 |
| 20130340936 | METHOD FOR EX-SITU LIFT-OUT SPECIMEN PREPARATION - A method for mounting a specimen on a specimen carrier for milling in an ex-situ lift-out (EXLO) milling process is described where “cross-section” specimens, plan view specimens, or bulk specimens may be lifted-out for analysis. The method comprising positioning the specimen on a recessed surface within a specimen carrier top surface so that a region to be milled is centered about a carrier opening formed through the specimen carrier. Peripheral edges of the specimen are then wedged against inwardly sloping side walls framing the recessed surface. Finally, the specimen is mounted to the specimen carrier so that a path of a milling beam intersects the region to be milled and carrier opening. | 12-26-2013 |
| 20140069583 | Epoxy Resins With High Thermal Stability and Toughness - Epoxy resin compositions contain (i) a polyepoxide resin; (ii) a benzofuran diol component, a benzofuran di-epoxide component, or mixture thereof; and (iii) a curing agent, which upon curing, provides a cured resin exhibiting improved chemical and physical characteristics. The epoxy resin composition may also contain a toughening agent to further enhance the cured resin's physical characteristics. | 03-13-2014 |
| 20140138028 | STRUCTURAL EPOXY RESIN ADHESIVES CONTAINING ELASTOMERIC TOUGHENERS CAPPED WITH KETOXIMES - Structural adhesives are prepared from an elastomeric toughener that contains urethane and/or urea groups, and have terminal isocyanate groups that are capped with ketoxime compound. The adhesives have very good storage stability and cure to form cured adhesives that have good lap shear and impact peel strengths, even at −40° C. | 05-22-2014 |
| 20140150973 | EPOXY RESIN COMPOSITION AND MANUFACTURING METHOD OF BONDING STRUCTURE - An epoxy resin composition includes: epoxy resin as a main component; and diamine having phenylene oxide skeleton indicated by an equation of: | 06-05-2014 |
| 20140216655 | SILANE/UREA COMPOUND AS A HEAT-ACTIVATED CURING AGENT FOR EPOXIDE RESIN COMPOSITIONS - Silanes of formula (I): | 08-07-2014 |
| 20140299270 | ADHESIVE COMPOSITIONS CONTAINING GRAPHENIC CARBON PARTICLES - Disclosed herein are adhesive compositions comprising (a) a first component; (b) a second component that chemically reacts with said first component; and (c) graphenic carbon particles having an oxygen content of no more than 2 atomic weight percent. Disclosed herein are associated methods for forming the adhesive compositions and applying the adhesive compositions to a substrate to form a bonded substrate. | 10-09-2014 |
| 20140352888 | ADHESIVE AGENT, AND METHOD FOR CONNECTING ELECTRONIC COMPONENT - Provided are an adhesive agent capable of providing sufficient electrical continuity to a substrate to which a preflux treatment has been applied and a method for connecting electronic components. There is used an adhesive agent including a (meth)acrylate having an epoxy group in one molecule and a radical polymerization initiator having a one minute half-life temperature of 110 degrees C. or more. A surplus adhesive agent component between terminals flows, whereby an imidazole component in a preflux, the component binding to an epoxy group of an epoxy group-containing acrylate, is drawn out thereby to be removed from a surface of the terminal. | 12-04-2014 |
| 20150007939 | Devices and Methods for Solder Flow Control in Three-Dimensional Microstructures - Structures, materials, and methods to control the spread of a solder material or other flowable conductive material in electronic and/or electromagnetic devices are provided. | 01-08-2015 |
| 20150068679 | REINFORCING METHOD AND REINFORCING STRUCTURE FOR STEEL STRUCTURE AND ELASTIC LAYER FORMING MATERIAL FOR REINFORCING STEEL STRUCTURE - A reinforcing method and structure for a steel structure and an elastic layer forming material for reinforcing a steel structure are provided that can prevent a reinforcing effect from being lowered by direct sunlight, can obtain a sufficient reinforcing effect, and can prevent a fiber sheet from being peeled away from a steel structure surface before the fiber sheet is torn. The reinforcing method for a steel structure, in which a fiber sheet including reinforcing fibers is bonded to a surface of the steel structure to integrate the fiber sheet with the steel structure, includes (a) a step of applying and hardening a polyurea resin putty to the surface of the steel structure to form an elastic layer, and (b) a step of bonding the fiber sheet to the surface of the steel structure having the elastic layer formed thereon with an adhesive agent. | 03-12-2015 |
| 20150096680 | AQUEOUS PRIMER COMPOSITION FOR ENHANCED FILM FORMATION AND METHOD OF USING THE SAME - A water-based bonding primer composition and a method of applying the same onto a metallic surface prior to adhesive bonding. The bonding primer composition is a water-based dispersion containing water, one or more epoxy resins, one or more curing agents, a silane compound, a low amount of propylene carbonate (PC), and optional additives. The bonding primer composition can form substantially smooth films by spraying, and at the same time, meet environmental regulations and provide high bonding performance. | 04-09-2015 |
| 20150129128 | METHOD FOR MAKING IMPROVED COMPOSITE MATERIALS - A strip of curable prepreg comprising unidirectional fibres aligned with the length of the strip, the fibres being at least partially impregnated with curable thermosetting resin and comprising a flexible polymeric sheet on an outer face of the strip, wherein the strip has a substantially rectangular cross-section defining a width and a thickness of the strip. | 05-14-2015 |
| 20150299537 | STRUCTURAL ADHESIVES - A solid dry to the touch at ambient temperature structural adhesive which can be cured at elevated temperature and which can be moulded at an intermediate temperature is provided as well as the use of the adhesive for bonding metals. | 10-22-2015 |
| 20160017190 | METHOD FOR PRODUCING A BONDED BOW CONTACT FOR CURRENT COLLECTORS - The invention relates to a method for producing a connection between a carbon strip and a metal mounting of a bow contact for current collectors by means of an adhesive containing electrically conductive particles. The method is characterised in that the adhesive contains 40 to 50 parts by weight of a first adhesive component on the basis of a phenolic resin, 5 to 20 parts by weight of a second adhesive component on the basis of an epoxy resin, and 40 to 50 parts by weight of conductive particles. | 01-21-2016 |
| 20160039192 | PANEL EDGE ENCLOSURES - The present invention contemplates a method for enclosing a panel edge comprising forming a panel structure having at least one edge, applying a reformable epoxy resin material onto the at least one edge, and contacting the reformable epoxy resin material within about 10 minutes, or even about 5 minutes of applying the reformable epoxy resin material such that the reformable epoxy resin material is below its glass transition temperature and dry to the touch upon contact. | 02-11-2016 |
| 20160051017 | DECORATIVE JEWELRY AND METHODS OF MAKING SAME - An article of jewelry includes a stone having a viewing surface and a back surface and epoxy. The stone preferably is transparent or translucent in that it preferably internally and externally reflects and refracts light. The epoxy preferably is provided on the back surface of the stone, the color of which is preferably viewable, including from the stone's front surface. The epoxy may be colored, transparent, translucent or colorless. The design is such that the epoxy surface and the viewing surface of the stone are intended to be left at least partially exposed and viewable in the final article of jewelry. | 02-25-2016 |
| 20160083633 | STRUCTURAL ADHESIVE COMPOSITIONS - Disclosed herein are compositions including (a) a first component comprising (1) an epoxy-adduct that is the reaction product of reactants comprising a first epoxy compound, a polyol, and an anhydride and/or a diacid and (2) a second epoxy compound; (b) rubber particles having a core/shell structure and/or graphenic carbon particles; and (c) a second component that chemically reacts with the first component at ambient or slightly thermal conditions. Also disclosed herein are compositions including (a) an epoxy-capped flexibilizer; (b) a heat-activated latent curing agent; and optionally (c) rubber particles having a core/shell structure and/or graphenic carbon particles; (d) an epoxy/CTBN adduct; and/or (e) an epoxy/dimer acid adduct. The heat-activated latent curing agent may include at least one reaction product of reactants including an epoxy compound and an amine and/or an alkaloid. | 03-24-2016 |
| 20160152764 | Curable composition and process for the manufacture of an epoxy thermoset | 06-02-2016 |
| 20160160087 | IMPROVEMENTS IN OR RELATING TO THERMOSETTING ADHESIVE FILMS - Flexible films of thermosetting adhesive materials which are non-tacky to the touch are storage stable at room temperature and can be cured at elevated temperature with a short cure time and can be cured to produce a tough flexible adhesive layer including bonding to oily surfaces, the materials are particularly useful in bonding together dissimilar substrates. | 06-09-2016 |
| 20160161095 | System and Technique for Tensioned Wall of Individual LED Tiles - Support wires can be used to hold up light tiles to provide a lightweight display system or technique. | 06-09-2016 |
| 20160376477 | THERMALLY CONDUCTIVE FLEXIBLE ADHESIVE FOR AEROSPACE APPLICATIONS - Provided are methods of forming thermally conductive flexible bonds for use in electronic boards of unmanned spacecrafts and other types of aircraft. Also provided are methods of preparing adhesive materials to form these bonds including methods of preparing treated filler particles. In some aspects, an adhesive material includes filler particles having organofunctional groups, such as boron nitride particles treated in silane. These particles may be combined with a urethane modified epoxy to form the adhesive material. The weight ratio of the particles in the adhesive material may be about 40-60%. The adhesive material may be thermally cured using a temperature of less than 110° C. to prevent damage to bonded electronic components. The cured adhesive may have a thermal conductivity of at least about 2 W/m K measured in vacuum and may have a glass transition temperature if less than −40° C. | 12-29-2016 |
| 20190144717 | Repositionable, Moisture-Curing Adhesive Tape | 05-16-2019 |
| 20190144724 | Curable Adhesive Compound and Reactive Adhesive Tapes Based Thereon | 05-16-2019 |
