| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 156295000 | Adhesive applying to restricted area and spreading thereof by assembly pressure | 19 |
| 20080196831 | METHOD OF ADHESIVELY BONDING A FIRST COMPONENT TO A SECOND COMPONENT - A method of adhesively bonding a first component to a second component, which comprises a peripheral zone with which the first component is adhesively bonded in overlapping manner is provided. In such method, a) at least one body of hot-melt adhesive is adhesively bonded to the first component in such a way that it comes into contact with the peripheral zone upon adhesive bonding of the first component to the second component, b) the peripheral zone is heated locally at at least one point, at which the applied body of hot-melt adhesive comes into contact with the peripheral zone upon adhesive bonding of the first component, indirectly or directly by electromagnetic induction to a temperature above the melting temperature of the hot-melt adhesive, c) the first component is brought into contact with the peripheral zone of the second component in such a way that the body of the hot-melt adhesive comes into contact with the point of the peripheral zone heated in step b), such that the hot-melt adhesive melts at the point of contact with the peripheral zone and bonds the first component to the peripheral zone of the second component after cooling. In addition, prior to step b) or after step c) a reactive adhesive is introduced in such a way between the first and the second component that it bonds the first component to the peripheral zone of the second component, the reactive adhesive being cured or allowed to cure. | 08-21-2008 |
| 20080230178 | Method for manufacturing liquid crystal display device - Smectic liquid crystal is dropped by a dropping method in which a plurality of droplets of smectic liquid crystal are dropped to an alignment film so that the droplets are aligned in a line which is parallel to a rubbing direction of the alignment film which is formed in a region surrounded by a seal pattern of a sealant having an opening over a substrate. Excess liquid crystal is drained away from the seal pattern of a sealant through the opening of the seal pattern. | 09-25-2008 |
| 20080230179 | Method for manufacturing liquid crystal display device - To prevent alignment disorder of liquid crystal molecules, which is caused in manufacturing steps, and to manufacture a liquid crystal display device including a uniform liquid crystal layer in which liquid crystal molecules are aligned with high accuracy. In addition, to provide a technique for manufacturing a liquid crystal display device which is capable of fast response and high performance, and has high image quality with reduced display defects, with high yield. A method for manufacturing a liquid crystal display device, including dropping smectic liquid crystal by a dropping method in which a plurality of droplets of smectic liquid crystal are dropped to an alignment film so that the droplets are aligned in a line which is parallel to a rubbing direction of the alignment film which is formed in a region surrounded by a seal pattern of a sealant over a substrate. | 09-25-2008 |
| 20090056868 | Adhesive bonding of vehicle external panels to reduce bond-line read-out - The bonding of polymeric panels with thermosetting adhesive compositions may lead to an unsightly image of the adhesive bond line on an external surface of the joined articles. This bond-line read-out is reduced or eliminated using an adhesive material with filler particles characterized by nanometer size clay platelets when the content of the filler particles does not exceed about five percent by volume of the uncured adhesive. Selective placement of the adhesive extending to the edges of the bonding surfaces of the polymeric members also reduces bond-line read-out. | 03-05-2009 |
| 20090151868 | ENCAPSULATED ORGANIC LUMINESCENT DISPLAY PANEL AND METHOD FOR MANUFACTURING THE SAME - Provided is a display panel comprised of a white color organic luminescent element and a color filter for full color implementation, wherein a substrate in which an organic luminescent element is formed and a color filter are assembled and fixed to face each other with an adhesive pattern therebetween, and liquid oil is filled between the color filter and the substrate inside of the adhesive pattern so as to block external moisture or oxygen, so that deterioration of luminous characteristics due to the external moisture or oxygen may be prevented by encapsulating the organic luminescent element and the color filter with the liquid oil, which leads to enhance reliability and stability of the element, and also allows the encapsulation process to be performed with relatively simple steps and low cost. | 06-18-2009 |
| 20090165947 | Crank for bicycle and method for manufacturing the same - Disclosed are a method for manufacturing a crank for a bicycle by bonding structural members to each other with an adhesive comprising; a step for applying the adhesive in a line-like or dot-like form in correspondence with an intervention region of the adhesive; a step for disposing a fabric in correspondence with the intervention region of the adhesive; a step for expanding the adhesive applied in a line-like or dot-like form in the fabric; and a step for bonding the structural members to each other with the adhesive expanded in the fabric, and a crank for a bicycle manufactured by the method. When the crank for a bicycle is manufactured by bonding the structural members to each other with the adhesive, the adhesive can be applied easily at a high accuracy and a good repeatability, variations of application condition and amount of used adhesive can be suppressed, and variation in quality can be suppressed. | 07-02-2009 |
| 20090288767 | ELECTRONIC COMPONENT MOUNTING METHOD - By an electronic component mounting method for electrically connecting bumps to board electrodes, in a contact process for placing a thermosetting resin in a liquid glob state on the board surface and bringing the lower surface of the electronic component in contact with the thermosetting resin, the bumps are pressurized against the electrodes in positional alignment in a liquid glob distribution state where one portion of the liquid glob is arranged inside an electronic component mounting region and a remaining portion greater in liquid measure than the portion is arranged outside the electronic component mounting region. The thermosetting resin enters into a gap between the electronic component and the board by capillarity in a thermocompression bonding process. This prevents voids occurring in the sealing resin, reinforces bonded portions of bumps and electrodes with thermally cured thermosetting resin, thereby preventing bonded portion breakage due to thermal stress generated during a cooling process. | 11-26-2009 |
| 20100000677 | DEVICE FOR PRODUCING A DENTAL WORKPIECE - The invention includes a support frame for producing a dental workpiece. The frame has a Z axis and comprising wall sections defining a hole that extends along the Z axis through the frame. At least one of the wall sections comprises an adhesive-directing surface extending along the Z axis in a non-parallel relationship. Such a configuration provides optimized methods for affixing a blank to the support frame and optimized properties of the blank after fixation to the support frame. | 01-07-2010 |
| 20100032091 | METHOD OF BONDING TWO STRUCTURES TOGETHER WITH AN ADHESIVE LINE OF CONTROLLED THICKNESS - A method of bonding two structures together with an adhesive line of controlled thickness is provided. The method includes: applying an adhesive of controlled thickness to a first surface of a first structure; at least partially curing the adhesive; applying additional adhesive to the partially cured adhesive applied to the first surface or to a second surface of a second structure; holding the first structure and the second structure in alignment with the first surface and the second surface disposed in spaced, opposing relation; applying a force to the first structure and/or the second structure to squeeze the additional adhesive between the second surface and the partially cured adhesive applied to the first surface to reduce a thickness of the additional adhesive; and at least partially curing the additional adhesive to bond the first and second structures together. | 02-11-2010 |
| 20100038029 | ADJUSTABLE FLOW EDGE SEAL APPLICATOR - An apparatus for an adjustable flow edge seal applicator comprises a housing, a moveable applicator, and at least one channel. The housing has a cavity. The moveable applicator is moveably attached to the housing. The at least one channel has an inlet in communication with the cavity and an outlet in communication with the moveable applicator. | 02-18-2010 |
| 20100051198 | Method of manufacturing a chemical mechanical polishing pad - A method of manufacturing a chemical mechanical polishing pad is provided, comprising: providing a polishing layer; providing a chemical mechanical polishing pad manufacturing assembly, comprising: a subpad layer having a top surface, a bottom surface and at least two wrap around tabs; a backing plate having a top side and a bottom side; a sacrificial layer having at least two recessed areas designed to facilitate attachment of the subpad layer to the backing plate; an unset reactive hot melt adhesive applied to the top surface of the subpad layer, wherein the unset reactive hot melt adhesive is applied in a pattern of parallel lines; wherein the subpad layer is disposed on the top side of the backing plate and the sacrificial layer is disposed on the bottom side of the backing plate, and wherein the at least two wrap around tabs extend to the bottom side of the backing plate; stacking the polishing layer and the chemical mechanical polishing pad manufacturing assembly with the unset reactive hot melt adhesive interposed between the polishing layer and the subpad layer forming a stack; applying an axial force to the stack; allowing the unset reactive hot melt adhesive to set forming a reactive hot melt adhesive bond between the subpad layer and the polishing layer; separating the at least two wrap around tabs from the subpad layer; and, removing the subpad layer with the polishing layer bonded thereto from the backing plate. | 03-04-2010 |
| 20110024037 | Method for Manufacturing A Micro Tube Heat Exchanger - A method including disposing a first end plate adjacent to a second end plate, wherein the first end plate and second end plate each define a pattern of apertures. The first end plate is aligned with the second end plate such that the pattern of apertures in the first end plate is substantially aligned with the pattern of apertures in the second end plate. The method includes placing an end portion of each of a plurality of micro tubes in contact with the first end plate, the micro tubes being substantially vertically disposed and substantially perpendicular to a top surface of the first end plate, so as to place the micro tubes on the first end plate, and vibrating at least one of the micro tubes while the micro tubes are on the first end plate, thereby causing the micro tubes to insert into and through respective aligned apertures of the patterns of apertures in the first end plate and the second end plate. The method further includes separating the first end plate from the second end plate while the micro tubes extend therethrough, until the first end plate and the second end plate are disposed proximate to respective end portions of the micro tubes extending therethrough, and affixing each end portion of the micro tubes to a respective end plate, thereby forming a pathway in a micro tube heat exchanger component for the flow of an internal fluid to be heated or cooled by external flow of an external fluid. | 02-03-2011 |
| 20110308724 | METHOD FOR THICKNESS-CALIBRATED BONDING BETWEEN AT LEAST TWO SUBSTRATES - A bonding method between at least two substrates comprises deposition of at least one drop of liquid adhesive on one of the two substrates and bringing the two substrates into contact causing spreading of the liquid adhesive followed by formation of a solidified adhesive layer between the two substrates. One of the two substrates is further provided, at the surface thereof, with at least one salient rim in which at least one slit is formed, designed to remove the excess liquid adhesive when the two substrates are brought into contact. Finally, the volume of liquid adhesive deposited on one of the two substrates is greater than the volume of the bonding space delineated by said rim between the contacted substrates, and the deposited drop of liquid adhesive presents a strictly greater height than the height of the rim. A defect-free solidified adhesive layer of calibrated thickness can thus be obtained. | 12-22-2011 |
| 20120312470 | Rigid Panel Adhesion Method and a Smearing Module Utilized Thereby - The invention discloses a rigid panel adhesion method including a smearing step and a pressing step. The smearing step smears glue on a surface of a first rigid panel to form a glue layer. The glue layer has a single contact portion being in one-dimensional form of a dot or line. The glue layer has a coverage ratio of no less than 50% over the surface of the first rigid panel. The pressing step touches the contact portion of the glue layer with a second rigid panel, and slowly presses the first and second rigid panels together to discharge gases between the first and second rigid panels, thereby adhering the first and second rigid panels to each other. | 12-13-2012 |
| 20130062011 | LIQUID ADHESIVE LAMINATION FOR PRECISION ADHESIVE CONTROL - Methods for liquid adhesive lamination for precision adhesive control are provided. Precision liquid adhesive control can be obtained by first patterning liquid adhesive in a thin pre-coat layer on a substrate. A second adhesive layer can then be patterned on top of the pre-coat layer. When the second substrate is pressed onto the first substrate, the second substrate first comes into contact with the second adhesive layer. The adhesive can then be spread uniformly across the two substrates without forming voids. Alternatively, a single liquid adhesive layer can be formed in a three dimensional gradient pattern. | 03-14-2013 |
| 20130333837 | METHOD OF BONDING A THERMOPLASTIC COMPONENT TO A CARPETED COMPONENT - A method of bonding a thermoplastic component to a carpeted component is provided. The method includes providing a base component, a thermoplastic component and a fibrous carpet or mat between the components. The carpet has a large number of cavities. The carpet is made of a thermoplastic material adapted to bond to the thermoplastic component in response to heat at the interface between the thermoplastic component and the carpet. The method also includes heating the thermoplastic component and the carpet at the interface between the thermoplastic component and the carpet for a period of time to soften the carpet. The method finally includes pressing the components and the softened carpet together under a pressure to cause the softened carpet to flow and at least partially fill the cavities. The carpet at the interface is transformed into a solid bonding layer to bond the components together to create a finished structure. | 12-19-2013 |
| 20140116617 | METHOD OF BUSWAY CONSTRUCTION - A busway and a method of assembling the same in which a flowable, uncured epoxy is applied between insulated busbar conductors that are stacked on top of one another and inner surfaces of the busway housing into which the stacked conductors are placed to form an enclosed busway. The busbar conductors are insulated by an epoxy powder coat, which can develop pinholes during the curing of the epoxy powder. A flowable, curable dielectric material, such as epoxy, is applied between the outermost busbar conductors and the inner surfaces of the top and bottom pieces of the busway housing. Optionally, epoxy is also applied between adjacent pairs of busbar conductors, which are stacked and arranged into the housing. Pressure is applied to the housing stack, and the epoxy is allowed to cure, resulting in a busway having superior thermal performance, dielectric integrity, and mechanical strength compared to conventional busways. | 05-01-2014 |
| 20140299269 | JIG ASSEMBLY, LAMINATING APPARATUS, AND LAMINATING METHOD USING THE LAMINATING APPARATUS - Provided are laminating apparatus and method. A laminating apparatus includes a jig assembly, which includes the first jig and an elastic member, and a second jig. A laminating method includes placing a first plate on a jig assembly, placing a second plate on a second jig which is placed to face the first jig, bringing the second plate into contact with the adhesive layer by making the jig assembly and the second jig approach each other, and, attaching the first plate and the second plate to each other by making the jig assembly and the second jig approach closer to each other. The jig assembly includes a first jig and an elastic member which comprises a top portion and sloping portions sloping downward from the top portion. An adhesive layer is disposed between the first plate and the second plate. | 10-09-2014 |
| 20150136321 | METHOD OF BONDING A THERMOPLASTIC COMPONENT TO A CARPETED COMPONENT AND THE CARPETED COMPONENT TO A CELLULOSE-BASED CORE IN A SINGLE PRESSING STEP - A method of bonding a thermoplastic component to a carpeted component and the carpeted component to cellulose-based core in a single pressing step is provided. The method includes providing a base component of a reinforced thermoplastic material, the thermoplastic component, a fibrous thermoplastic carpet or mat between the components, a sheet of thermoplastic adhesive and a core of cellulose-based material. The method also includes heating the thermoplastic component and the carpet at the interface between the thermoplastic component and the carpet for a period of time to soften the carpet. The method finally includes pressing the components, the sheet, the core and the softened carpet together under a pressure to cause the softened carpet to flow. The carpet at the interface is transformed into a solid bonding layer to bond the components together and the sheet bonds the base component and the core together to create a finished structure. | 05-21-2015 |
