Class / Patent application number | Description | Number of patent applications / Date published |
156273900 | Work constitutes conductor of electrical circuit | 15 |
20090107625 | Anisotropic Conductive Film - An anisotropic conductive film is provided which can provide high bonding strength and good conduction reliability when anisotropic conductive bonding is made under the compression bonding conditions of a compression bonding temperature of at most 130° C. for a compression bonding time of at most 3 seconds. The anisotropic conductive film contains a polymerizable acrylic compound, a film-forming rein, conductive particles, and a polymerization initiator. The polymerization initiator contains two types of organic peroxides that do not produce oxygen gas resulting from the decomposition thereof and have different one-minute half-life temperatures. Of the two types of organic peroxides, one organic peroxide that has a higher one-minute half-life temperature produces benzoic acid or a derivative thereof when it decomposes. | 04-30-2009 |
20090199963 | AIRTIGHT CONTAINER MANUFACTURING METHOD, AND IMAGE DISPLAYING APPARATUS MANUFACTURING METHOD USING AIRTIGHT CONTAINER MANUFACTURING METHOD - An airtight container manufacturing method capable of effectively utilizing an energy beam and improving a “takt time” as acquiring desired bonding intensity is provided. That is, a first bonding material is arranged between a first plate structure and a frame, a second bonding material is arranged between a second plate structure and the frame. The energy beam is irradiated to the first bonding material through the first plate structure to bond the first plate structure and the frame. The energy beam is irradiated to the second bonding material through the frame so that the beam transmits through the first plate structure and the surface of the frame on the side of the first plate structure, to bond the second plate structure and the frame. Such bonding processes are performed after an arrangement step. | 08-13-2009 |
20100084089 | METHOD OF FUSING THERMOPLASTIC COMPONENTS - A method of fusing thermoplastics components ( | 04-08-2010 |
20100154988 | Fusible Completion Plug - A fusible completion plug and method for its use includes a cylindrical plug body having a lower portion that includes a fusible element in communication with an electric power supply. The completion plug also includes an elastomeric seal that provides for a temporary seal. A pressure balancing port and equalization valve are provided to relieve the differential pressure across the completion plug as the plug is positioned in place. The pressure equalization valve also includes a fusible element for fusing the valve within the port, thereby preventing a leak path through the plug body. A blind flange may be installed above the completion plug in case the plug fusion fails. The blind flange may be a traditional blind flange or may be a fusible blind flange. | 06-24-2010 |
20100212823 | METHOD FOR PRODUCING FUSION-BONDED BODY - A fusion-bonded body which includes a fusion-bonded part obtained by fusion-bonding to each other a first part to be fusion-bonded which comprises a first thermoplastic resin and first carbon fibers and a second part to be fusion-bonded which comprises a second thermoplastic resin and second carbon fibers. Also provided is a method for producing the fusion-bonded body which comprises a fusion-bonding step in which the first part to be fusion-bonded is brought into close contact with the second part to be fusion-bonded, an electric current is caused to flow through the two parts to generate heat and melt the first thermoplastic resin and second thermoplastic resin, and the molten resins are solidified to form a fusion-bonded part. | 08-26-2010 |
20110017394 | System and Method for Placing a Resistive Implant for Welding Assemblies of Plastic Components - An implant applicator and method for positioning a resistive implant material on a first plastic component to be used to form a resistive implant weld between that first plastic component and a second plastic component. The resistive implant material is heated and pressed into a targeted surface of the first plastic component to tack the resistive implant into place. The second plastic component is positioned over the tacked resistive implant and a weld formed in a known manner. The resistive implant material can be heated for tacking by passing an electric current through it before it is pressed into the first plastic component by a second member or by contacting the resistive implant material against a separately heated surface prior to pressing it into the first plastic component. | 01-27-2011 |
20120145315 | ANISOTROPIC CONDUCTIVE POLYMER MATERIAL - A method for forming a body comprising a mixture of a matrix and conductive particles, whereby the conductive particles are formed into aligned conductive pathways in an alignment step by applying an electric field between alignment electrodes and thereafter stabilizing the mixture wherein the conductive particles have a low aspect ratio; and a polymeric composition and method for producing such composition which is curable by UV light to an anisotropic electrically conductive polymer layer, comprising i) providing a non-conductive matrix of a flowable polymer composition having inherent photocurability, ii) adding to matrix conductive particles having low aspect ratio in an amount to allow the concentration of the conductive particles to be maintained at a level lower than the percolation threshold, and iii) placing the formed composition in a receptacle where exposure to UV light is prevented, and a method for establishing an anisotropic electrically conductive, optionally thermally conductive | 06-14-2012 |
20130075031 | Ramped, Variable Power UV Adhesive Cure Process for Improved Alignment - Methods and apparatuses for adhering optoelectronic components in optical, electronic or optoelectronic devices are disclosed. A UV-active adhesive is applied to an alignment sensitive component of the device. A first, relatively low dose of UV radiation sufficient to solidify an outer layer of the adhesive is applied to the adhesive. A second, relatively high dose of UV radiation sufficient to solidify the remaining thickness of the adhesive is then applied. The methods and apparatuses of the present invention advantageously reduce or eliminate changes in the position of a component during the adhesive curing process. The present method and apparatus allow for shorter total time for solidifying the adhesive, provide stable positioning during the adhesive solidification process, and enable increased manufacturing output and decreased waste. | 03-28-2013 |
20130087277 | METHOD FOR BONDING CONDUCTIVE MATERIAL - A method for bonding conductive materials by using composite adhesive made of carbon nanotubes and epoxy resin. Firstly, this composite adhesive is placed between the joining surfaces of the two conductive plates; thereafter an electric current enters from one conductive plate and passes through this composite adhesive, to the other conductive plate. As the electric current passes through the carbon nanotubes, Joule heating results in the overall temperature of the carbon nanotubes-epoxy composite adhesive increasing, leading to speedily joining and patching of the composite adhesive. This method reduces the electrical resistance of the adhesive material by providing a large area and shortening the path of the electric current, also, improving the homogeneity of the temperature of the adhesive and avoiding the positive feedback effect. The simple equipment of this method is not affected by the environment, and effectively reduces the resources and time needed to harden the epoxy resin. | 04-11-2013 |
20130299081 | APPARATUS AND METHOD FOR MANUFACTURING CAMERA MODULE - An apparatus and a method for manufacturing a camera module. The method for manufacturing a camera module includes: picking up an image sensor by the bonding head and mounting the image sensor on a PCB; compensating for a tilt deviation between the PCB and the image sensor by the gyro unit of the PCB support unit simultaneously when the image sensor is mounted on the PCB; applying heat by the heating unit of the bonding head to cure an adhesive applied between the image sensor and the PCB; and after the image sensor is mounted and the adhesive is cured, picking up a lens housing module by a lens housing module pickup unit and mounting the lens housing module on the PCB and attaching contact portions of the PCB to the lens housing module to complete the manufacture of a camera module. | 11-14-2013 |
20140034230 | FLUID FLOW CONDUITS AND APPARATUS AND METHODS FOR MAKING AND JOINING FLUID CONDUITS - Fluid flow conduits ( | 02-06-2014 |
20140158292 | METHOD OF FABRICATING CRYSTAL UNIT, CRYSTAL UNIT FABRICATION MASK, AND CRYSTAL UNIT PACKAGE - A method of fabricating a crystal unit fills an adhesive from a first opening in a front surface of a mask of each of penetration holes in the mask in a state in which the mask is set on a base, into each penetration hole, and heats, by a heating element, a sidewall region defining a second opening in a back surface of the mask, in order to cure a sidewall part of the adhesive in the sidewall region defining each penetration hole in contact with the adhesive filling each penetration hole. A crystal blank is bonded on the base using the adhesive in order to form the crystal unit, after removing the mask from the base. | 06-12-2014 |
20150047779 | ELECTRICAL HEATING-JOINING DEVICE AND METHOD - An electrical heating bonding device | 02-19-2015 |
20150306862 | RESISTANCE SPOT WELDING SYSTEM AND METHOD - A resistance spot welding system can join two polymeric workpieces and includes a power supply. The power supply has a positive terminal and a negative terminal. The resistance spot welding system further includes a welding electrode assembly electrically connected to the power supply. The welding electrode assembly includes a housing, a first electrically conductive pin and a second electrically conductive pin. The first and second electrically conductive pins both protrude from the housing. The first electrically conductive pin is electrically connected to the positive terminal of the power supply, and the second electrically conductive pin is electrically connected to the negative terminal of the power supply. The second electrically conductive material is electrically insulated from the first electrically conductive pin. The first and second electrically conductive pins are at least partly made of a material having a hardness ranging between 50 HRC and 70 HRC. | 10-29-2015 |
20150306863 | DEVICE FOR HARDENING AN ELECTRICALLY CONDUCTIVE ADHESIVE - A device for curing an electrically conductive adhesive arranged between a first component and a second component. The device includes at least one punch to both apply a compressive force onto the first component in the direction of the second component, and introduce a current into the adhesive via the components. | 10-29-2015 |