| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 156241000 | To base coated with adhesive | 14 |
| 20080251190 | Film transfer unit having an integrated further processing device and method for transferring a transfer layer from a carrier film onto a print carrier - A printing machine contains a transfer unit for transferring a transfer layer onto a print carrier in a transfer nip. The printing machine further has at least one applicator unit for applying an adhesive to the print carrier. The applicator unit precedes the transfer unit, and the transfer layer is detached from the carrier film in the transfer unit in the regions in which adhesive is applied. By printing units being converted into transfer units or applicator units, the functionality of the printing unit for a printing operation is lost. If the applicator device and the transfer device are located in this order on an impression cylinder of a printing unit, the applied adhesive is not predried sufficiently. To overcome these disadvantages, the transfer unit is a further processing unit and has at least one further processing device which follows the transfer nip and which acts on the print carrier. | 10-16-2008 |
| 20080302470 | Transfer Sheets - In a transfer sheet which comprises a support and a transfer layer releasable from the support, the transfer layer comprises (i) an adhesive layer formed on one surface of the support and (ii) a masking layer formed on the adhesive layer and containing a masking agent and a binder resin which may have a crosslinking group, and the transfer layer is adjusted to have an elongation at break of not less than 30% (e.g., 30 to 200%). The masking layer may comprise a white pigment such as a titanium oxide and a urethane-series resin which may have an isocyanate group. The transfer sheet may comprise an image-receiving layer at least containing a urethane-series resin particle formed on the masking layer. Moreover, the transfer sheet may comprise an anchor layer between the masking layer and the image-receiving layer. The transfer layer is capable of recording an image thereon the image being transferred from a recording sheet. These transfer sheets may be used for forming the image on a colored object by transferring to the object. | 12-11-2008 |
| 20100147448 | METHODS OF TRANSFERRING A LAMINA TO A RECEIVER ELEMENT - Methods for bonding a donor wafer to a receiver element and transferring a lamina from the donor wafer to the receiver element are disclosed herein. The donor wafer may be, for example, a monocrystalline silicon wafer with a thickness of from about 300 microns to about 1000 microns, and the lamina may be may be less than 100 microns thick. The receiver element may be composed of, for example, metal or glass, and the receiver element may have dissimilar thermal expansion properties from the lamina. Although the lamina and the receiver element may have dissimilar thermal expansion properties, the methods disclosed herein maintain the integrity of the bond between the lamina and the receiver element. | 06-17-2010 |
| 20100200157 | MOLDING SHEET FOR FORMING HARD COAT LAYER - The object of the present invention is to provide a molding sheet for forming a hard coat layer having an excellent shelf life or tracking ability to the mold in a semi-cured state, and having an excellent abrasion resistance after being cured completely, a molded body having a hard coat layer, and a method for manufacturing the same. The present invention relates to a molding sheet for forming a hard coat layer, comprising a layer consisted of a semi-cured material of a composition comprising:
| 08-12-2010 |
| 20100252184 | METHOD FOR PRODUCING CARBON NANOTUBE-CONTAINING CONDUCTOR - The invention is to provide a method for producing an inexpensive carbon nanotube-containing conductor having high transparency and high conductivity as well as excellent durability. The invention is a method for producing a carbon nanotube-containing conductor having a conductive layer on the surface of an objective substrate, and the method includes the steps of pressing a release substrate having a carbon nanotube network layer, via the carbon nanotube network layer thereon, against a transparent objective substrate coated with an electron beam-curable liquid resin composition to infiltrate the liquid resin composition into the carbon nanotube network layer; irradiating it with electron beams to cure the liquid resin composition; and peeling away the release substrate to obtain an objective substrate having a resin composition layer with carbon nanotubes embedded in the surface thereof. According to the invention, a conductor and a conductive film having high conductivity and transparency as well as excellent strength and durability are obtained. | 10-07-2010 |
| 20110048626 | APPLICATION OF A PROCESSING PIN TO A GEMSTONE WHICH IS TO BE CUT OR POLISHED - A next processing pin is applied as a follow-on pin to a stone, wherein the stone is held by a preceding pin and fixed to the stone by way of a first adhesive bonding location. The preceding pin is separated from the stone. The follow-on pin is fixed to the stone by way of a second adhesive bonding location spaced from the first adhesive bonding location. The follow-on pin frontally receives a fluid adhesive at a spacing from the stone and the spacing between the adhesive-coated front end and the stone is reduced until the adhesive front end contacts the stone. The adhesive is hardened at the contact location as the second adhesive bonding location and heat is transferred by way of the preceding pin to the first adhesive bonding location A force component is exerted on the preceding pin to release the pin from the stone and to hold the stone with the next pin. | 03-03-2011 |
| 20110192530 | COMPOSITE BALLISTIC FABRIC STRUCTURES - A multilayered composite fabric which comprises (a) a first fabric comprising non-woven unidirectionally oriented fibers in a first resin matrix, the fibers comprising high tenacity fibers, the first fabric comprising first and second surfaces; and (b) a second fabric comprising multi-directionally oriented fibers optionally in a second resin matrix, the second fabric also comprising high tenacity fibers, the second fabric having first and second surfaces, the first surface of the second fabric being bonded to the second surface of the first fabric thereby forming the composite fabric. Also described is a method of making such fabric wherein the second fabric layer is used as a support during the manufacturing process and is thereafter consolidated into a single structure with the first fabric layer. | 08-11-2011 |
| 20120255673 | METHOD FOR TRANSFERRING ELECTRICAL GRIDLINES ON A LACQUER LAYER - A method is provided for simultaneously forming electrical circuitry and functional light structures on a curable lacquer layer deposited on a base substrate of an optoelectronic device. The method includes contacting a transfer substrate against the curable lacquer layer. The transfer substrate has a mating surface with the electrical circuitry on a first portion and negative impressions of the functional light structures on a second portion. The electrical circuitry is releasably adhered to the mating surface, and adhesion between the transfer substrate and the electrical circuitry is substantially lesser than adhesion between the electrical circuitry and the curable lacquer layer. So, contacting enables simultaneous embedding of the electrical circuitry and replication of the functional light structures onto the curable lacquer layer. | 10-11-2012 |
| 20130153134 | METHODS OF APPLYING SURFACE-COATING MATERIAL TO A SUBSTRATE - A method of applying a surface-coating material to a substrate includes providing a flexible laminate with a carrier and at least one layer of surface-coating material applied to the carrier and comprising a surface-coating material containing a double-bond-containing, OH-functional component A, a double-bond-containing, NCO-functional component B, and, optionally, a double-bond-containing component C which is different from A and B; applying a layer of adhesive to the substrate, contacting the carrier side of the laminate with a surface of the substrate such that the layer of surface-coating material is at least partially cured before or when it contacts the surface of the substrate, and removing the carrier from the layer of surface-coating material. | 06-20-2013 |
| 20140053973 | GRAPHENE LAMINATE AND METHOD OF PREPARING THE SAME - A graphene laminate including a substrate, a binder layer on the substrate, and graphene on the binder layer, wherein the graphene is bound to the substrate by the binder layer. | 02-27-2014 |
| 20140110043 | PROCESS FOR REFLECTIVE PRODUCTS - The subject invention is related to a method for preparing a reflective film, comprising the steps of: (a) providing a first substrate and forming a releasable adhesive layer thereon; (b) applying reflective particles onto the releasable adhesive layer, where the reflective particles are partially embedded in the releasable adhesive layer; (c) applying a pigment onto the reflective particles and the releasable adhesive layer; (d) removing part of the pigment so that the pigment does not completely cover the reflective particles; and (d) forming a reflective layer on the pigment and the reflective particles. The invention further pertains to a method for manufacturing a reflective article by using the reflective film prepared according to the above-mentioned method. | 04-24-2014 |
| 20150041051 | LAMINATED BODY - Laminated body including a substrate and an optically anisotropic layer. This layer satisfies the following expressions (1), (2), and (3): Δn | 02-12-2015 |
| 20160161677 | Method for Fabricating a Metallic Micro/Nanostructure at an Optical Fiber End-facet by the Glue-and-Strip Method - The present invention provides a method for fabricating a metallic micro/nanostructure at an optical fiber end-facet by the glue-and-strip method, wherein, firstly a metallic micro/nanostructure is fabricated on a substrate which has a relatively low binding force with it, then an optical fiber end-facet is applied with an adhesive, or a surface of the metallic micro/nanostructure is applied with the adhesive, after that, the optical fiber end-facet and the metallic micro/nanostructure are glued at a predetermined angle, and finally, the adhesive is cured and the optical fiber end-facet and the metallic micro/nanostructure are stripped off the substrate to complete the fabrication. The present invention is based on the idea in the glue-and-strip method that a noble metal is stripped off a weakly bound substrate, and thus demonstrates a new method which enables fabricating a metallic micro/nanostructure at an optical fiber end-facet with high quality, and the process of which is simple, fast, and low cost. | 06-09-2016 |
| 20160375672 | METHOD FOR MANUFACTURING AN ELECTRONIC DEVICE - A method for manufacturing an electronic device including a substrate, including assembling the substrate, by a joining zone of a first face of the substrate, with a joining zone of a first face of a carrier, and disjoining the substrate relatively to the carrier. After the step of assembling, the method includes formation of a film on the substrate, the film being configured to adhere to an adhesion zone of a second face of the substrate opposite the first face of the substrate, the adhesive force between the film and the adhesion zone of the second face of the substrate being chosen greater than the joining force between the joining zone of the carrier and the joining zone of the first face of the substrate. A traction on the film has a force of traction configured to overcome the joining force without overcoming the adhesive force. | 12-29-2016 |
