Class / Patent application number | Description | Number of patent applications / Date published |
156232000 | Carrier is configured mold | 7 |
20080196825 | METHOD AND APPARATUS FOR MAKING STRUCTURES OF COMPOSITE MATERIAL, IN PARTICULAR AIRPLANE FUSELAGE SECTIONS - A method and a device for manufacturing hollow components out of a composite material, such as in particular sections of airplane fuselage, that include a skin and possibly strengthening elements. The method comprises inserting a multi-articulated arm fitted with a fiber placement head inside a female mold of elongated shape, said female mold being open via a longitudinal slit intended to receive the support means of said multi-articulated arm and a step of applying fibers to the inner molding surface of the female mold using the placement head to form said composite material skin, by displacement of the application head using the multi-articulated arm and relative displacement in translation of said support means of the multi-articulated arm along said longitudinal slit. | 08-21-2008 |
20080202673 | System and method for depositing thin layers on non-planar substrates by stamping - An elastomeric stamp is used to deposit material on a non-planar substrate. A vacuum mold is used to deform the elastomeric stamp and pressure is applied to transfer material from the stamp to the substrate. By decreasing the vacuum applied by the vacuum mold, the elasticity of the stamp may be used to apply this pressure. Pressure also may be applied by applying a force to the substrate and/or the stamp. The use of an elastomeric stamp allows for patterned layers to be deposited on a non-planar substrate with reduced chance of damage to the patterned layer. | 08-28-2008 |
20090139639 | Method of Producing a Sheet - A method of producing a plastic sheet equipped with electrical conductors is disclosed. The method that enables automatic production includes (a) fixing in a frame an electrically conducting wire in a sinusoidal, square wave pattern and in a single plane, (b) bringing into contact the single plane and a surface of a plastic sheet under conditions calculated to bond the plastic to said conductor, and (c) removing the frame. | 06-04-2009 |
20090242107 | METHOD OF MANUFACTURING WIRING SUBSTRATE - A method includes the steps of providing a first tape base material on a single side of a stiffener substrate, forming, on the stiffener substrate, a cavity for accommodating a semiconductor chip therein, inserting the stiffener substrate in the cavity and providing the stiffener substrate on the first tape base material, sealing the semiconductor chip and the stiffener substrate with a sealing resin, and removing the first tape base material and forming a build-up layer on a tape removing surface. | 10-01-2009 |
20100101713 | PRINTING MOLD AND MANUFACTURING METHOD THEREOF, AND METHOD OF FORMING THIN FILM PATTERN USING THE SAME - Disclosed are a printing mold and a manufacturing method thereof, and a method of forming a thin film pattern using the printing mold. The printing mold comprises a polymer-based main body with convex and concave surface portions, and an ink-phobic layer disposed on the concave surface portions of the main body. | 04-29-2010 |
20110277922 | BASE MATERIAL MANUFACTURING METHOD, NANOIMPRINT LITHOGRAPHY METHOD AND MOLD DUPLICATING METHOD - Disclosed are a base material manufacturing method, in which transfer of the structure of a mold to the entire surface of a base material is possible, irrespective of planarity of the mold or the base material, and in-plane uniformity of the transfer and uniformity of in-plane distribution of a remaining layer thickness can be achieved, and a nanoimprint lithography method and a mold duplicating method employing the base material manufacturing method. The method comprises forming on a transfer mold a cured layer composed of a transfer material, superposing on the surface of the cured transfer material layer a base material having a surface capable of adhering to the cured transfer material layer by physical interaction so that the cured material layer and the base material are adhered to each other to form an integrated material, and then separating the integrated material from the transfer mold to obtain a base material with the transfer material layer transferred thereon. | 11-17-2011 |
20160121646 | A METHOD OF DECORATING A SUBSTRATE - A method of decorating a substrate comprises the steps of supplying a substrate, supplying a carrier, providing the carrier with a textured surface, applying a sublimation agent on the carrier, placing the substrate and the carrier including the textured surface and the sublimation agent onto each other, pressing the substrate and the carrier together and subliming the sublimation agent towards the substrate, removing the carrier from the substrate, wherein the textured surface of the carrier is provided by applying a pattern of a hard substance on the carrier. | 05-05-2016 |