Class / Patent application number | Description | Number of patent applications / Date published |
156153000 | With abrading or grinding of lamina | 83 |
20080210362 | One Step Fiber End-Face Polishing Process - Disclosed is a one step fiber optic connector polishing method. The method is a sequence of processes that may include severing a fiber ( | 09-04-2008 |
20080251188 | METHOD FOR MANUFACTURING DEVICE - A method for manufacturing a device, in which a wafer having a plurality of devices formed on the face thereof is divided into the individual devices, and an adhesive film is mounted on the back side of each device. This method comprises: a cutting groove forming step of cutting the back side of the wafer along predetermined division lines by a cutting blade to form cutting grooves, while leaving an uncut portion, which is thinner than the target thickness of the device, on the front side of the wafer; a back side grinding step of grinding the back side of the wafer to the target thickness of the device, while allowing the cutting grooves to remain in the back side of the wafer; an adhesive film mounting step of mounting an adhesive film to the back side of the wafer; a wafer supporting step of sticking the adhesive film side of the wafer, on which the adhesive film has been mounted, to the surface of a dicing tape; a wafer severing step of cutting the front side of the wafer along the predetermined division lines by a cutting blade to sever the uncut portion, thereby dividing the wafer into the individual devices and cutting the adhesive film; and an adhesive film separating step of expanding the dicing tape to separate the adhesive film per device. | 10-16-2008 |
20080314507 | Ic Chip Manufacturing Method - It is an object of the invention to provide a method for producing an IC chip capable of producing an IC chip with a thickness as extremely thin as 50 μm or thinner, for example, about 25 to 30 μm at a high productivity. | 12-25-2008 |
20080314508 | Method of protecting a bond layer in a substrate support adapted for use in a plasma processing system - A method of protecting a bond layer in a substrate support adapted for use in a plasma processing system. The method includes the steps of attaching an upper member of a substrate support to a lower member of a substrate support with a bonding material. An adhesive is applied to an outer periphery of the upper member and to an upper periphery of the lower member, and a protective ring is positioned around the outer periphery of the upper member and the upper periphery of the lower member. The protective ring is originally fabricated with dimensions that provide mechanical stability and workability. The protective ring is then machined to an exact set of final dimensions consistent with the design of the substrate support application. | 12-25-2008 |
20090065124 | METHOD FOR THE ANTICORROSION COATING AND THE THERMALLY INSULATING COATING OF TUBULAR BODIES AND CONDUITS FOR THE TRANSPORT OF FLUID AND APPARATUS FOR IMPLEMENTING SUCH METHOD - Method for the anticorrosion and thermally insulating coating of tubular bodies and conduits for the transport of fluids, comprising the following stages in sequence. a) positioning on a tubular body ( | 03-12-2009 |
20090078360 | Method of manufacturing apparatus for spatial and temporal control of temperature on a substrate - An apparatus for control of a temperature of a substrate has a temperature-controlled base, a heater, a metal plate, a layer of dielectric material. The heater is thermally coupled to an underside of the metal plate while being electrically insulated from the metal plate. A first layer of adhesive material bonds the metal plate and the heater to the top surface of the temperature controlled base. This adhesive layer is mechanically flexible, and possesses physical properties designed to balance the thermal energy of the heaters and an external process to provide a desired temperature pattern on the surface of the apparatus. A second layer of adhesive material bonds the layer of dielectric material to a top surface of the metal plate. This second adhesive layer possesses physical properties designed to transfer the desired temperature pattern to the surface of the apparatus. The layer of dielectric material forms an electrostatic clamping mechanism and supports the substrate. | 03-26-2009 |
20090084491 | Cementless Tibial Tray - The present teachings provide a tibial tray and a method for making the same. According to one example, a substrate having a superior surface can be formed. Porous metal material can be attached onto the superior surface of the substrate. Selected areas of the substrate can be removed to form first features of the tibial tray. Selected areas of the polymer portion can be removed to form second features of the tibial tray. | 04-02-2009 |
20090095409 | METHODS OF MANUFACTURING ELECTROCHEMICAL CELLS - Methods of manufacturing electrochemical cells having a current collector which, at least in part, underlies a catalyst layer are discussed. A method comprises patterning a current collector to have at least one electrolyte opening, disposing an electrolyte into or through the at least one opening, and disposing a catalyst, at least in part, over the disposed electrolyte. Optionally, the method comprises pattering a substrate and attaching a patterned current collector to each side thereof. Patterning of the current collector can include patterning a continuous sheet, which comprises at least a first and a second separable current collector. In one such example, a continuous carbon-fiber sheet impregnated or laminated with a non-porous material is patterned. In another such example, a continuous plastic material sheet impregnated with one or more electrical conductive particles is patterned. Among other things, the pattern of the current collector can include an extruded slot or adjacently-disposable strips. | 04-16-2009 |
20090133812 | LAMINATE BODY, METHOD, AND APPARATUS FOR MANUFACTURING ULTRATHIN SUBSTRATE USING THE LAMINATE BODY - Provided is a laminated body comprising a substrate to be ground and a support, where the substrate is ground to a very small thickness and can then be separated from the support without damaging the substrate. One embodiment of the present invention is a laminated body comprising a substrate to be ground, a joining layer in contact with the substrate to be ground, a photothermal conversion layer comprising a light absorbing agent and a heat decomposable resin, and a light transmitting support. After grinding the substrate surface which is opposite that in contact with the joining layer, the laminated body is irradiated through the light transmitting layer and the photothermal conversion layer decomposes to separate the substrate and the light transmitting support. | 05-28-2009 |
20090165931 | Method For Molding Composite Structures - Method for making, modifying and using machinable composite molds for use in molding composite structures. The mold includes a mold body having a tool surface that is shaped to provide the molded surface of the composite structure. The mold body is made up of at least one mold layer composed of a quasi-isotropic material composed of a plurality of randomly oriented fiber bundles or chips impregnated with a resin. The use of randomly oriented fiber chips allows post-cure machining of the mold body. | 07-02-2009 |
20090294028 | PROCESS FOR FABRICATING HIGH DENSITY STORAGE DEVICE WITH HIGH-TEMPERATURE MEDIA - A method of fabricating an information storage device comprises providing a media substrate including a first side and a second side, forming a media on the first side of the media substrate, adhesively associating the media with a carrier substrate, thinning a surface of the second side of the media substrate while supporting and protecting the media with the carrier substrate, and forming circuitry on the thinned second side of the media substrate. | 12-03-2009 |
20090314416 | METHOD FOR FABRICATING A MIXING DEVICE HAVING A CORRUGATED CONVEYING PLATE AND A DISPENSING DEVICE USING THE SAME - A method for fabricating a mixing device comprises the steps of:
| 12-24-2009 |
20100101706 | COMPOSITE BEVEL SIDING - A method is disclosed. The method includes forming a groove in at least one of opposing planar surfaces of a cellular thermoform plastic substrate. The groove is formed at an edge region of the substrate. A stiffener is positioned in the groove, and a fiber matt is laid on the at least one planar surface containing the groove. The stiffener and fiber matt are embedded in a thermoset resin. The thermoset resin is cured to form a fiber reinforced thermoset plastic reinforcement. The substrate is then cross-sectionally cut to form a profile. The profile can be further finished to form a beveled siding for buildings. | 04-29-2010 |
20100163160 | METHOD FOR PRODUCING A CLADDING ELEMENT - The invention relates to a method for producing a cladding element ( | 07-01-2010 |
20100206464 | STEEL PLATE FOR REFRIGERATOR DOOR AND MANUFACTURING METHOD THEREOF - Provided are a steel plate for a refrigerator door and a method for manufacturing the steel plate. The steel plate includes a stainless steel plate provided on and forming an exterior of a refrigerator door with a vertical length of 1250 mm or more. The stainless steel plate surface is processed to form a finished texture oriented in a horizontal direction with respect to the refrigerator door. The method includes cutting a section from a rolled stainless steel plate base material corresponding in length to a length of a refrigerator door, rotating the cut section by a 90° angle, and surface processing through grinding a surface of the cut section in a direction perpendicular to a rolled direction thereof. | 08-19-2010 |
20100230035 | PROCESS OF MANUFACTURING CEMENT BASED ARMOR PANELS - A process for making a fiber reinforced cementitious product such as a panel which hardens to an ultra-high compressive strength composite for use in making panels with ballistic and blast resistant properties. The panel has a continuous phase resulting from curing an aqueous mixture, in the absence of silica flour, of inorganic cement binder, inorganic mineral filler having a particle size of about 150-450 microns, pozzolanic mineral filler, and polycarboxylate based superplasticizer self-leveling agent, and water. The mixture may also include alkanolamine and acid or acid salt. The continuous phase may be reinforced with fiber distributed in the continuous phase before curing to form a panel. The panel may be reinforced with a fiber reinforced skin attached to at least one surface of the core, e.g., by lamination with an adhesive, e.g., epoxy, to form a ballistic and blast resistant cementitious armor panel. | 09-16-2010 |
20100236696 | METHOD OF MANUFACTURING GLASSES FRAME MADE OF POLYETHERIMIDE RESIN - Disclosed is a method of manufacturing a glasses frame using a polyetherimide resin, through injection molding and cutting, in order to realize excellent properties of the polyetherimide resin. The method of manufacturing a glasses frame made of a polyetherimide resin includes subjecting a polyetherimide resin to injection molding, thus producing a preformed sheet, inputting designs for various glasses models to the preformed sheet, cutting the preformed sheet into the glasses frame according to the input design through laser cutting or CNC cutting, forming lens grooves and hinge grooves in the cut glasses frame, subjecting the rough surface of the glasses frame, having the grooves, to surface treatment through tumbling or polishing, and subjecting the glasses frame, having been subjected to surface treatment, to thermal molding and then to pressing using a mold, thus forming the shape of glasses, and attaching hinges to the formed glasses frame. | 09-23-2010 |
20110005662 | Method for Fabricating Multilayer Panels - A method for fabricating a plurality of touch sensor panels is disclosed. In one embodiment, the method includes forming a plurality of touch substrate units having a plurality of drive lines and sense lines on at least one of first and second surfaces of a touch substrate mother sheet; forming an adhesive layer on the first surface of the touch substrate mother sheet covering at least part of each of the plurality of touch substrate units; affixing a cover glass mother sheet having a plurality of cover glass units to the adhesive layer of the touch substrate mother sheet to form a laminate; and separating the laminate into a plurality of panels, each panel including a touch substrate unit laminated to a cover glass unit. | 01-13-2011 |
20110030881 | ADHESIVE SHEET FOR SUPPORTING AND PROTECTING SEMICONDUCTOR WAFER AND METHOD FOR GRINDING BACK OF SEMICONDUCTOR WAFER - An adhesive sheet for supporting and protecting a semiconductor wafer has an adhesive layer formed on one side of a base film, the adhesive layer having a thickness of 4 to 42 μm and an elastic modulus at 25° C. of 0.5 to 9 MPa. The adhesive sheet of the present invention is useful in the broader application such as an adhesive sheet for affixing a wafer and for protecting a wafer, and the like in various steps of working the semiconductor wafers, that needs re-peelable. | 02-10-2011 |
20110030882 | ADHESIVE SHEET FOR SUPPORTING AND PROTECTING SEMICONDUCTOR WAFER AND METHOD FOR GRINDING BACK OF SEMICONDUCTOR WAFER - An adhesive sheet for supporting and protecting a semiconductor wafer has an intermediate layer and an adhesive layer formed on a one side of a base film in this order, the adhesive layer being made of a radiation curing type adhesive, and having a thickness of 1 to 50 μm and a shear stress of 0.5 to 10 MPa, the intermediate layer having a thickness of 10 to 500 μm and an elastic modulus of 0.01 to 3 MPa. The adhesive sheet of the present invention is useful in the broader application such as an adhesive sheet for affixing a wafer and for protecting a wafer, and the like in various steps of working the semiconductor wafers, that needs re-peelable. | 02-10-2011 |
20110041987 | METHOD FOR MANUFACTURING COMPOSITE SUBSTRATE - A method for manufacturing a composite substrate according to the present invention includes a formation step of forming a structural element portion on a front surface of a first substrate, a grinding step of fixing the first substrate and grinding a back surface of the first substrate, and a bonding step of bonding a second substrate to the ground back surface with an adhesion layer composed of an adhesive. In such a manner, before forming the adhesion layer, the handling properties of which are affected by heating, and before grinding the first substrate, the strength of which is decreased by grinding, a process of forming the structural element portion, including a heating step, is performed. Furthermore, a piezoelectric substrate may be used as the first substrate, and a supporting substrate which supports the piezoelectric substrate may be used as the second substrate. | 02-24-2011 |
20110079345 | METHOD FOR SURFACE TREATMENT OF METAL PLATE AND VEHICLE TREATED THEREBY - When surface grinding finish for decoration or other purposes is performed by applying a film to the front surface of a metal plate that is welded linearly with penetration from the rear surface side thereof. In this manner, the metal plate can be subjected to the surface grinding finish such that an appearance similar to weld marks is not created. | 04-07-2011 |
20110120628 | Module, Filter, And Antenna Technology For Millimeter Waves Multi-Gigabits Wireless Systems - A method of fabricating an ultra-high frequency module is disclosed. The method includes providing a top layer; drilling the top layer; milling the top layer; providing a bottom; milling the bottom layer to define a bottom layer cavity; aligning the top layer and the bottom layer; and adhering the top layer to the bottom layer. The present invention also includes an ultra-high frequency module operating at ultra-high speeds having a top layer, the top layer defining a top layer cavity; a bottom layer, the bottom layer defining a bottom layer cavity; and an adhesive adhering both the top layer to the bottom layer, wherein the top layer and the bottom layer are formed from a large area panel of a printed circuit board. | 05-26-2011 |
20110265940 | METHOD FOR PRODUCING A MULTIPLICITY OF SEMICONDUCTOR WAFERS BY PROCESSING A SINGLE CRYSTAL - A method for producing a plurality of semiconductor wafers includes processing a single crystal. The single crystal is provided in a grown state and has a central longitudinal axis with an orientation that deviates from a sought orientation of a crystal lattice of the semiconductor wafers. A block is sliced from the single crystal along cutting planes perpendicular to a crystallographic axis corresponding to the sought orientation of the crystal lattice of the semiconductor wafers. A lateral surface of the block is ground around the crystallographic axis. A plurality of semiconductor wafers are then sliced from the ground block along cutting planes perpendicular to the crystallographic axis. | 11-03-2011 |
20120031545 | Customizable Financial Transaction Instrument - Disclosed is a system for customizing a gift card. The system includes a indicia carrier having a machine readable medium for an encoded account number supported on one side of the indicia carrier and being devoid of embossed account indicia on an opposite side. The system also includes a self-adhesive label adapted for application onto at least part of a surface of the indicia carrier. The system further includes means for customizing the label with a customized display. The system also includes a printer to print the customized display on the label. Additionally, the system includes a label applicator that facilitates alignment of the label with the indicia carrier for joining the label and the indicia carrier. | 02-09-2012 |
20120080138 | METHOD OF PROCESSING PLATE-SHAPED BODY HAVING RUGGED SURFACE - A method of processing a plate-shaped body, for grinding or polishing the back side of a plate-shaped body having ruggedness on the face side thereof, includes: a coating step of coating the face side of the plate-shaped body with a water-soluble protective film; a protective tape adhering step of adhering a protective tape composed of a substrate and a paste layer to the face side of the plate-shaped body coated with the water-soluble protective film so as to bury the ruggedness in the paste layer; a processing step of holding the protective tape side of the plate-shaped body, with the protective tape adhered thereto, by a chuck table and grinding or polishing the back side of the plate-shaped body; and a removing step of peeling, after the processing step, the protective tape from the face side of the plate-shaped body and removing the water-soluble protective film. | 04-05-2012 |
20120186728 | METHOD FOR ELIMINATING UNEVENNESSES IN SEALING SURFACES - A connecting point between first and a second devices is sealed with respect to the passage of liquids through the connecting point by applying a soft solid onto the surface and pressing the soft solid into depressions in the surface for sealing purposes. | 07-26-2012 |
20120247650 | SOLID IMAGING OBJECTIVE AND ASSEMBLY TECHNIQUE FOR SMALL SCALE SENSOR APPLICATIONS - An imaging optic comprising a first combination element comprised of at least two individual lens elements, aligned with each other along an optical axis and adhered to each other, a second combination element comprised of at least one individual lens element and an aperture disposed between the first and second combination elements, the surfaces of the imaging optic having less than about 3 minutes tilt relative to the optical axis and less than about 0.005 mm de-center relative to the optical axis. A method of making the imaging optic and an endoscope comprising the imaging optic. | 10-04-2012 |
20120305171 | Asphalt Shingle with Lightweight Structural Aggregate and Method for Making Same - A shingle includes a reinforcing mat layer, an asphalt layer and an exterior layer. The asphalt layer is on top of the mat layer. The exterior layer includes structural-grade lightweight aggregate granules that are disposed on top of the asphalt layer. In making a roofing shingle, a mineral composition is heated to cause the mineral composition to fuse. The fused and expanded mineral composition is milled to form lightweight structural-grade aggregate granules. An asphalt layer is deposited onto a top surface of a reinforcing mat layer. A layer of structural-grade lightweight aggregate granules is applied onto the top layer. An adhesive asphalt strip is applied onto the layer of structural-grade lightweight aggregate granules. A lightweight aggregate pulverized dust is applied to a bottom surface of the mat layer. | 12-06-2012 |
20130056136 | ADVANCED COMPOSITE RIM HAVING MOLDED IN SPOKE HOLES - Embodiments of the present invention comprise a composite rim used in spoked wheels, such as bicycle wheels, having molded-in spoke holes along with a method of fabricating the composite rim. Advantageously, the present invention dramatically improves the bearing and loading strength of prior art composite rims, which drill the spoke holes therein after fabrication of the rim hoop. | 03-07-2013 |
20130240121 | METHOD FOR APPLYING STONES TO METALLIC ELEMENTS, PARTICULARLY FOR THE ADHESIVE BONDING OF GLASS CRYSTALS TO SURFACES OF TUBULAR ELEMENTS - A method for applying stones to metallic elements, particularly for the adhesive bonding of glass crystals to surfaces of tubular elements, which includes the steps of preparing an application surface ( | 09-19-2013 |
20130276960 | Method of Making a Substrate-Guided Optical Device Utilizing Polarization Beam Splitters - There is provided an optical device, including a light waves-transmitting substrate having two major surfaces and edges, optical means for coupling light into the means for coupling light into the substrate by total internal reflection, and plurality of partially reflecting surfaces ( | 10-24-2013 |
20130276961 | MULTILAYER COMPOSITE PRESSURE VESSEL AND METHOD FOR MAKING THE SAME - A pressure vessel for containing materials under elevated pressures includes a metal liner and an adhesive layer, applied to the outer surface of the metal liner, where the adhesive layer is treated with a vacuum bag in order to secure the adhesive lo the outer surface of the liner. An overwrap layer is applied on top of the adhesive on the outer surface of the metal finer, where the overwrap layer is formed by winding a filamentary material around the liner, such that the filamentary material adheres to the adhesive forming an overwrap layer on the outer surface of the metal liner, forming the pressure vessel. | 10-24-2013 |
20140158286 | METHOD FOR PRODUCING A CLADDING ELEMENT - Method for producing a cladding element. The method includes applying a resin to a visible surface and to a contact surface of a wood material base board, applying at least one non-resin impregnated paper ply to the visible surface and at least one non-resin impregnated paper ply to the contact surface of the wood material base board, and pressing the at least one non-resin impregnated paper ply onto the resin applied visible surface and the at least one non-resin impregnated paper ply onto the resin applied contact surface. In this manner, the at least one paper ply on the visible surface and at least one paper ply on the contact surface are fully impregnated. | 06-12-2014 |
20140196835 | METHOD FOR PRODUCING MOLDED PRODUCTS USING COFFEE GROUNDS - A method for producing molded products using coffee grounds in which coffee grounds are collected from coffee shop and then dried, fractioned, and ground, after which the thus-processed coffee grounds are mixed with purified water and binding agent, and the resultant mixture is poured into a mold to be compression molded into various shapes, e.g. cubes. The thus-molded articles may replace existing soaps used for practicing carving so as to prevent wasted resources and environmental contamination. The method for producing molded products using coffee grounds according to the present invention enables a minimal addition of chemicals during molding so as to provide practice materials which are harmless to the human body. | 07-17-2014 |
20140299257 | COMPOSITE HAT STIFFENER, COMPOSITE HAT-STIFFENED PRESSURE WEBS, AND METHODS OF MAKING THE SAME - There is provided a method of making a composite hat stiffener. The method has the steps of curing a composite hat stiffener in a hat tool to form a pre-cured composite hat stiffener. The pre-cured composite hat stiffener has a composite hat section, a plurality of composite stiffening plies with a body ply, a wrap ply, and a base ply, all coupled to the composite hat section, wherein the body ply is coupled to a first side of the composite hat section, the wrap ply is coupled to the body ply, and the base ply is coupled to the body ply and the wrap ply, a pair of radius filler noodles coupled to the composite hat section and disposed between the plurality of composite stiffening plies, and an outer ply coupled to the composite hat section. The method further includes bonding the pre-cured composite hat stiffener to a structure surface. | 10-09-2014 |
20150075701 | Mold for thermoplastic resin molding, cavity mold, and process for producing the cavity mold - A process for producing a heat-insulating cavity mold, characterized by producing two members, i.e., a metallic surface layer member ( | 03-19-2015 |
20150328874 | METHOD OF MAKING A COMPOSITE ARTICLE HAVING AN INTERNAL PASSAGEWAY - In one particular embodiment, a method for making a fiber-reinforced, composite article having an internal passageway includes providing a layup tool, fiber placing a base layup onto the layup tool, and generating a groove in the base layup. The method further includes placing a mandrel in the groove, fiber placing a top layup onto the base layup and the mandrel, curing the base layup and the top layup, and removing the mandrel from the base layup and the top layup. In another particular embodiment, the mandrel is replaced with a non-removable tube. | 11-19-2015 |
20150336326 | TRACTION SURFACE AND METHODS THEREFOR - Devices and methods are contemplated in which a plurality of microfractures are generated on the surface of an article to so generate a non-abrasive surface having a COF of at least 0.6. Most preferably, the surface is the surface of a transparent polymer and is the surface is structured to allow high-resolution display of an image that is disposed on a surface opposite the surface with the microfractures. Consequently, numerous anti-slip products with such surfaces are contemplated. | 11-26-2015 |
20150360977 | Method of Producing an Electrostatic Field Generator - The present invention relates generally to a method of producing an electrostatic field generating plate. More specifically, the method enables an electrostatic field generating plate to be produced made from PVC for a water purification system wherein the plate generates an electric field. | 12-17-2015 |
20160059479 | WELDED STRUCTURAL JOINT BETWEEN A HIGH-PERFORMANCE THERMOPLASTIC MATRIX COMPOSITE MATERIAL AND AN ELASTOMER BY POWDER FUNCTIONALIZATION - A method for producing, by welding, a joint between a thermoplastic matrix composite material and an elastomeric material. The elastomeric material is functionalized by forming a thin layer of elastomeric material incorporating particles of thermoplastic material and melting the thin layer onto the surface of the elastomeric material during the pressure-vulcanization of the elastomer. The functionalized surface of the elastomeric material is welded to the thermoplastic material of the composite. The welding operation includes interposing a metal fabric coated with thermoplastic material between the surfaces of the elastomer and the composite that are welded to each other, and passing an electric current through same, resulting in the surface melting of the two materials. | 03-03-2016 |
20160131126 | Microelectromechanical Systems Fabricated with Roll to Roll Processing - Roll to roll processing techniques are described to produce microelectromechanical systems having releasable and moveable mechanical structures. A micro-pump that includes a pump body having compartmentalized pump chambers, with plural inlet and outlet ports and valves and plural membranes enclosing the pump chambers is described as a representative example. | 05-12-2016 |
20220134693 | REFLECTOR MANUFACTURING METHOD AND ASSOCIATED REFLECTOR - Disclosed is a method of manufacturing a reflector. The method comprises polishing ( | 05-05-2022 |
156154000 | Subsequent to assembly | 40 |
20090038742 | IMAGE MAKING LAMINATES - A laminate for making signs, the laminate comprising a readily-abraded layer and an abrasion-resistant layer. A method of making signs is also disclosed. The method includes providing a laminate comprising a first layer that is readily etched by abrasives and a second layer disposed beneath the first layer and substantially resistant to abrasive etching. A mask is applied to the top of the laminate; and abrasives are used to selectively remove a portion of the first layer, so as to form a relief image with a controlled and uniform relief depth. | 02-12-2009 |
20090038743 | METHOD OF MANUFACTURING GLASS SUBSTRATE - A glass block is formed by stacking, fixing, and integrating a plurality of thin glass plates having a predetermined thickness. An annular glass block is formed by coring the glass block. Surfaces of an inside circumference and an outside circumference of the annular glass block are ground. The annular glass block of which the surfaces of the inside circumference and the outside circumference are ground are separated into individual annular glass substrates, and separated annular glass substrates are cleaned. Then, edge portions of the inside circumference and the outside circumference of a cleaned annular glass substrate are chamfered. | 02-12-2009 |
20090199957 | METHOD OF BONDING, THINNING, AND RELEASING WAFER - An adhesive agent layer for bonding a support plate ( | 08-13-2009 |
20090283205 | METHOD OF MANUFACTURING A THIN-FILM MAGNETIC HEAD - A method of manufacturing a thin-film magnetic head is capable of planarizing and forming the upper surface of a main magnetic pole with high precision, of forming a trailing gap with a precise form, and of efficiently and precisely forming side shields and a trailing shield. A stopper layer is formed so as to cover a magnetic pole and so that a thickness thereof at positions on both sides of the magnetic pole is a predetermined side shield gap width. After a resist layer has been formed so that a thickness thereof at positions on both sides of the magnetic pole is a predetermined side shield width, an insulating layer is formed thereupon and then lapping according to a CMP process is carried out until the stopper layer becomes exposed. After this, the stopper layer is removed by dry etching until the upper surface of the magnetic pole becomes exposed, and then the upper surface of the magnetic pole is lapped by a CMP process until the surface is planarized. Next, the resist layer is removed and the stopper layer that becomes exposed due to such removal is also removed to form the trailing shield and the side shields. | 11-19-2009 |
20090314417 | METHOD OF GRINDING BACK SIDE OF SEMICONDUCTOR WAFER AND ADHESIVE SHEET FOR USE IN THE METHOD OF GRINDING BACK SIDE OF SEMICONDUCTOR WAFER - The present invention provides a method of grinding a back side of a semiconductor wafer, which includes applying an adhesive sheet including a substrate and an adhesive layer formed on one side of the substrate to a front side of a semiconductor wafer to provisionally fix the semiconductor wafer to the adhesive sheet, followed by grinding the back side of the semiconductor wafer, in which the adhesive layer contains 100 parts by weight of a base polymer for radiation-curable adhesives, 0.02 to 10 parts by weight of a phosphoric ester compound having an alkyl group having 10 or more carbon atoms, and more than 10 parts by weight but 200 parts by weight or less of at least one polyfunctional acrylate oligomer and/or monomer having one or more carbon-carbon double bonds, the polyfunctional acrylate oligomer and/or monomer having a weight-average molecular weight per carbon-carbon double bond of 250 to 6,500. | 12-24-2009 |
20100000664 | METHOD FOR MANUFACTURING OPTICAL SURFACE MOUNTING WAVEGUIDE SUBSTRATE - A cladding layer | 01-07-2010 |
20100170627 | LENS PAD, LENS PAD MANUFACTURING METHOD, LENS MANUFACTURING METHOD, AND ADHESIVE MEMBER - A lens pad includes a blank, first adhesive layer, and release sheet. The first adhesive layer is formed on one surface of the blank. The release sheet comes into tight contact with the surface of the first adhesive layer to protect this surface. The arithmetic average roughness of the surface of the release sheet on the side of the first adhesive layer is 0.1 μm or less. The surface of the first adhesive layer from which the release sheet is peeled off is attached onto a lens as an edging target. A lens pad, a lens pad manufacturing method, a lens manufacturing method, and an adhesive member are also disclosed. | 07-08-2010 |
20100186878 | Method For Molding Composite Structures - Method for making, modifying and using machinable composite molds for use in molding composite structures. The mold includes a mold body having a tool surface that is shaped to provide the molded surface of the composite structure. The mold body is made up of at least one mold layer composed of a quasi-isotropic material composed of a plurality of randomly oriented fiber bundles or chips impregnated with a resin. The use of randomly oriented fiber chips allows post-cure machining of the mold body. | 07-29-2010 |
20100230036 | SUBSTRATE-LESS PRESSURE-SENSITIVE ADHESIVE SHEET FOR PROTECTION OF SEMICONDUCTOR WAFER, METHOD FOR GRINDING BACK SIDE OF SEMICONDUCTOR WAFER USING PRESSURE-SENSITIVE ADHESIVE SHEET, AND METHOD FOR PRODUCING PRESSURE-SENSITIVE ADHESIVE SHEET - The present invention provides a substrate-less pressure-sensitive adhesive sheet for protection of semiconductor wafer, which is to be stuck to a front surface of a semiconductor wafer in grinding a back surface of the semiconductor wafer, the pressure-sensitive adhesive sheet consisting of a pressure-sensitive adhesive layer, in which the pressure-sensitive adhesive layer is formed of a UV-curable pressure-sensitive adhesive containing a polymer composed mainly of an acrylic monomer polymerizable compound, the pressure-sensitive adhesive force of a surface of the pressure-sensitive adhesive layer to be stuck to the front surface of the semiconductor wafer is larger than the pressure-sensitive adhesive force of the opposite surface thereof, and the pressure-sensitive adhesive layer has an initial elastic modulus of from 0.01 MPa to 500 MPa. | 09-16-2010 |
20100300604 | IMAGE TRANSFER BELT WITH CONTROLLED SURFACE TOPOGRAPHY TO IMPROVE TONER RELEASE - A three-layer image transfer belt having an uppermost surface that has been altered to reduce surface gloss and induce a desirable surface topography is presented. The image transfer belt can comprise a three layer laminate. In one embodiment, the base layer can be a polyimide, the intermediate layer can be a rubber/elastomer and the surface layer can be a fluoropolymer. In another embodiment, the base layer can also comprise a fabric for belt reinforcement. The desired surface topography improves toner release and print quality. The reduction of surface gloss of the image transfer belt is achieved by creating a linear pattern oriented in the machine direction or a grid-like pattern into the uppermost surface of the image transfer belt. The reduction of surface gloss of the image transfer belt is achieved without a significant change in surface rougheness. | 12-02-2010 |
20110024026 | METHOD FOR PRODUCING AN IMPROVED HULL - The present invention relates to a method for manufacturing a hull for vessels, containers or equivalents. The method comprises the steps: preparing an elastic or viscoelastic glue through mixing of at least two components; monitoring and/or controlling the mixing for determining if a correct desired mixing product has been achieved; applying a layer of the glue onto the hull ( | 02-03-2011 |
20110048615 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SURFACE PROTECTIVE TAPE - A method for manufacturing a semiconductor device includes adhering an adhesive layer of a surface protective tape including a base material film, an intermediate layer disposed on the base material film, and the adhesive layer disposed on the intermediate layer to one surface of a semiconductor substrate; curing the intermediate layer while a flat plate is pressed against the base material film of the surface protective tape; grinding the other surface of the semiconductor substrate; curing the adhesive layer; and separating the surface protective tape from the semiconductor substrate. | 03-03-2011 |
20110139347 | ADHESIVE COMPOSITION, ADHESIVE SHEET, AND BACK GRINDING METHOD FOR SEMICONDUCTOR WAFER - The present invention relates to a pressure-sensitive adhesive composition including a polymer of a monomer mixture containing isobonyl (meth)acrylate, a pressure-sensitive adhesive sheet, and a semiconductor wafer backgrinding method. In the present invention, by using isobonyl (meth)acrylate which is a hard-type monomer and has a low hydrophilic property, a pressure-sensitive adhesive composition having superior releasing and re-releasing properties and wettability with respect to the wafer, and having an excellent wafer-proofing property; a pressure-sensitive adhesive sheet prepared by using the pressure-sensitive adhesive composition; and a backgrinding method using the pressure-sensitive adhesive sheet can be provided. | 06-16-2011 |
20110180201 | METHOD FOR PRODUCING AN OUTER LIMITING ELEMENT FOR A SLIDING BOARD BODY AND METHOD FOR PRODUCING A SLIDING BOARD BODY EQUIPPED THEREWITH - The invention relates to a method for producing an outer limiting element for a sliding board body, such as a ski or a snowboard, and a method for producing a sliding board body equipped with said limiting element. The limiting element is formed by a one-piece part component composed of at least one cover layer and at least one part of the strengthening top band. The limiting element is then connected in a subsequent method step to the additional components of the sliding board body, such as its running surface and its strengthening lower band. It is essential in this case that the limiting element prior to connection with the additional components of the sliding board body is connected to at least one strip-like side wall element forming a lateral wall section of the sliding board body, in that the at least one strip-like side wall element is adhered to at least one longitudinal side edge of the cover layer or to the top band arranged on the lower side of the cover layer. The corresponding production method enables as far as possible an inexpensive and error-free production sequence for creating a high quality sliding board body with combined shell and side wall construction. | 07-28-2011 |
20110297300 | TEMPORARY ADHESIVE COMPOSITION, AND METHOD OF PRODUCING THIN WAFER - A temporary adhesive for which temporary adhesion is simple and subsequent detachment is also simple, meaning productivity can be improved. Also, a method of producing a thin wafer that uses the temporary adhesive. The temporary adhesive composition comprises:
| 12-08-2011 |
20120006467 | Method of manufacturing through electrode-attached glass substrate and method of manufacturing electronic component - A method of manufacturing a through electrode-attached glass substrate includes: forming a plurality of electrode through holes and a dummy through hole in plate-shaped glass; inserting electrode members into the electrode through holes; welding the plate-shaped glass and the electrode members by heating the plate-shaped glass at a temperature that is higher than a softening point thereof; and grinding both sides of the plate-shaped glass together with the electrode members so as to expose a plurality of the electrode members to both sides of the plate-shaped glass and configure the plurality of the electrode members as a plurality of through electrodes that are electrically separated from each other. | 01-12-2012 |
20120061010 | OPTICAL DEVICE WAFER PROCESSING METHOD - An optical device wafer has a device area where a plurality of optical devices are formed on the front side of a sapphire substrate, and a peripheral marginal area surrounding the device area. The device area projects from the peripheral marginal area. A break start point is formed on the front side of the sapphire substrate by applying a laser beam along the boundary between the device area and the peripheral marginal area. A protective member is attached to the front side of the optical device wafer. The optical device wafer is held on a chuck table of a grinding apparatus so that the protective member comes into contact with a holding surface of the chuck table. The back side of the sapphire substrate is ground to reduce the thickness thereof to a predetermined thickness. | 03-15-2012 |
20120067508 | FIRE RESISTANT VENEER ASSEMBLY FOR AIRCRAFT INTERIORS - A flame resistant wood veneer assembly in the four embodiments, includes a decorative wood veneer layer, and a combination of aluminum foil layer(s)/backing(s) and a non-decorative wood veneer layer(s)/backing(s), the aluminum foil layer is bonded to the decorative wood veneer layer and between the non-decorative wood veneer layer(s)/backing(s) with phenolic adhesive at high pressure and high temperature wherein the high pressure is at least 150 pounds per square inch and the high temperature is at least 275 degrees Fahrenheit and where such high pressure and temperature is applied for at least four minutes. The resulting assembly is preferably wide belt sanded to produce a smooth, flat veneer product. | 03-22-2012 |
20120160397 | MOUNTED WAFER MANUFACTURING METHOD - A liquid adhesive is applied to a circuit surface of a semiconductor wafer. A carrier is joined to a surface of the semiconductor wafer coated with the adhesive. A rear face of the semiconductor wafer is ground while the carrier is held. The semiconductor wafer is supported on a ring frame via a support adhesive tape. The carrier is removed from the semiconductor wafer. The adhesive tape is separated integrally with the film-like adhesive from the semiconductor wafer through joining a separation tape having a width larger than a diameter of the semiconductor wafer to the adhesive on the semiconductor wafer and then separating the separation tape. | 06-28-2012 |
20120168062 | Linear roller bearing with separate rolling surface parts - A guide carriage for a linear roller bearing is supportable in a longitudinally displaceable manner via at least one row of rollers on a guide rail which extends in a longitudinal direction, a separate rolling surface part which includes a rolling surface for the rollers is assigned to each row of rollers, and the rolling surface part is connected via an adhesive layer to a carrier body. The adhesive layer is designed essentially planar on the back side of the rolling surface part which faces away from the rolling surface, the rolling surface part being accommodated in a recess—which has an L-shaped cross section—of the carrier body. | 07-05-2012 |
20120175045 | TEMPORARY ADHESIVE COMPOSITION, AND METHOD OF PRODUCING THIN WAFER - A temporary adhesive for which temporary adhesion and subsequent detachment are simple. The temporary adhesive composition includes: (A) an organopolysiloxane having a weight-average molecular weight of at least 15,000, obtained by a hydrosilylation reaction between (A1) and (A2) described below, and (B) an organic solvent having a boiling point of not more than 220° C., wherein (A1) is an alkenyl group-containing organopolysiloxane having a weight-average molecular weight exceeding 2,000, comprising 35 to 99 mol % of T siloxane units and 1 to 25 mol % of M siloxane units, and in which alkenyl groups bonded to silicon atoms represent at least 2 mol % of all the organic groups bonded to silicon atoms, and (A2) is a specific organohydrogenpolysiloxane having at least two silicon atom-bonded hydrogen atoms or a specific hydrosilyl group-containing compound. | 07-12-2012 |
20120193014 | REDUCTION OF EDGE CHIPPING DURING WAFER HANDLING - Methods and systems for reinforcing the periphery of a semiconductor wafer bonded to a carrier are disclosed. In one embodiment, additional adhesive is applied to the semiconductor wafer prior to bonding. The additional adhesive seeps into a crevice between the carrier and wafer and provides reinforcement. In another embodiment, adhesive is applied to the crevice by a dispenser after the wafer is bonded to the glass carrier. | 08-02-2012 |
20120216944 | LOW DUST WALL REPAIR COMPOUND - A wall repair compound useful for filling and repairing cracks, holes, and other imperfections in a wall surface includes a conventional filler material, a conventional binder material, and a dust reducing additive which reduces the quantity of airborne dust particles generated when sanding the hardened joint compound. Airborne dust reducing additives include oils, surfactants, solvents, waxes, and other petroleum derivatives. The additive can be added to conventional ready-mixed joint compounds and to setting type joint compounds. A method of reducing the quantity of airborne dust generated when sanding a fully hardened joint compound includes mixing a sufficient quantity of the dust reducing additive with the joint compound prior to when the joint compound has been applied to the wall. | 08-30-2012 |
20120273117 | COMPOSITE SUBSTRATE AND MANUFACTURING METHOD THEREOF - A supporting substrate and a piezoelectric substrate are prepared. A surface of the supporting substrate is bonded to the backside of the piezoelectric substrate with an organic adhesive layer interposed therebetween to form a laminated substrate. Subsequently, a peripheral surface of the laminated substrate is ground such that a peripheral surface of the piezoelectric substrate, a peripheral surface of the organic adhesive layer, and a peripheral surface of the supporting substrate on the side of the organic adhesive layer are made flush with each other. Subsequently, the surface of the piezoelectric substrate is polished to reduce the thickness of the piezoelectric substrate and performing mirror polishing of the surface. | 11-01-2012 |
20130087268 | SUBSTRATE FOR WALLBOARD JOINT TAPE AND PROCESS FOR MAKING SAME - A multi-ply paper substrate is provided, which comprises at least two plies bonded to one another by an adhesive; a basis weight of 80-200 gsm; an internal bond of 10-180 milli-ft.-lb/sq. in. as measured by TAPPI method 541; an MD tensile of 20-300 lb | 04-11-2013 |
20130199705 | METHOD OF POLISHING A METAL SURFACE OF A BARRIER DOOR OF A GATE VALVE USED IN A SEMICONDUCTOR CLUSTER TOOL ARCHITECTURE - The method of preserving the anodized finish of a barrier door of a process module includes bonding a seal to a metal surface, anodizing the metal surface, and then using a CNC machine to polish the metal surface without damaging the seal. The metal surface is polished by traversing a polishing path along the metal surface with a polishing head maintaining frictional contact with the metal surface. The integrity of the seal is preserved by bounding the polishing head to skirt the edge of the seal by following the polishing path. | 08-08-2013 |
20130255859 | DECORATIVE PANELS AND PROCESSES FOR THE MAKING THEREOF - The present invention relates to processes for making decorative or artistic panels on glass surfaces and polymeric surfaces in multiple layers and their application in commercial and artistic decoration, such as dividing walls, ceilings, pictorial pictures, sculptures, floor lamps, desk or ceiling lamps, spectacular domes, stained glass, shower wall, as well as to decorate residential and industrial spaces. | 10-03-2013 |
20130255860 | METHOD FOR PRODUCING AN OPHTHALMIC LENS COMPRISING A BASE LENS AND A FILM STRUCTURE - A method for producing an ophthalmic lens comprised of a base lens and a film structure bound to said base lens includes a pressure-free heating. Said heating is performed after assembling the film structure with a semi-finished lens (1), and before said semi-finished lens is machined for obtaining the base lens. Although a maximum heating temperature is higher than a glass-transition temperature of the semi-finished lens, no image distortion and optical aberration is produced for the final ophthalmic lens. The maximum heating temperature is also lower than a glass-transition temperature of the film structure. | 10-03-2013 |
20130299068 | METHOD AND ARRANGEMENT FOR TREATMENT OF LINER SLEEVE - A method for preparing a resizing sleeve for lining a joining point in a pipe assembly having pipes of thicker and thinner diameter. The method includes stretching the resizing sleeve in diameter to the size of the thicker pipe in diameter of the pipe assembly, installing an installation hat according to the thicker pipe in diameter of the pipe assembly by airtightly gluing it onto the stretched resizing sleeve, and returning the resizing sleeve to the size of the thinner pipe in diameter of the pipe assembly to be lined. A suitable tool for implementing the method is also disclosed. | 11-14-2013 |
20140000793 | METHOD OF MANUFACTURING AN LED | 01-02-2014 |
20140102624 | FLEXOGRAPHIC PRINTING PRECURSORS AND METHODS OF MAKING - A mixture of an elastomer, carbon black, and inorganic fillers provides a highly useful laser-ablatable flexographic printing plate precursor formulation. This formulation is sensitive to infrared radiation. Both flexographic printing plates and printing sleeves can be made using the mixture. | 04-17-2014 |
20140130962 | THIN WAFER HANDLING METHOD - A method includes receiving a carrier with a release layer formed thereon. A first adhesive layer is formed on a wafer. A second adhesive layer is formed over the first adhesive layer or over the release layer. The carrier and the wafer are bonded with the release layer, the first adhesive layer, and the second adhesive layer in between the carrier and the wafer. | 05-15-2014 |
20140144575 | INSULATING LAYER CONDUCTION METHOD - Disclosed herein is an insulating layer conduction method, and more particularly, an insulating layer conduction method of conducting between the insulating layers through a bump. The method includes providing a hard insulating layer; configuring a land on the hard insulating layer; configuring a bump on the land; laminating a soft insulating layer on the hard insulating layer while being penetrated by the bump; curing the laminated soft insulating layer; and polishing, by a polishing machine, the cured soft insulating layer and an upper surface of the bump. | 05-29-2014 |
20140150957 | METHODS FOR MAKING ENHANCED END PORTIONS OF LEADS OF ELECTRICAL STIMULATION SYSTEMS - A method of forming a lead includes providing an elongated lead body defining an annular groove disposed around a circumference of the lead body along one of a distal end or a proximal end of the lead body. A pre-contact is disposed around the circumference of the lead body within the annular groove. The pre-contact includes a pre-contact body having opposing first and second ends and first and second tabs extending outwardly from the opposing first and second ends, respectively. The first and second tabs are crimped together and folded flat against an outer surface of the pre-contact body. A polymeric material of the lead body is re-flowed to facilitate coupling of the pre-contact to the lead body. An outer surface of the pre-contact body is ground down to form a contact disposed along the one of the distal end or the proximal end of the lead body. | 06-05-2014 |
20140261978 | TEMPORARY ADHESIVE COMPOSITION, AND METHOD OF PRODUCING THIN WAFER - A temporary adhesive for which temporary adhesion and subsequent detachment are simple. The temporary adhesive composition includes: (A) an organopolysiloxane having a weight-average molecular weight of at least 15,000, obtained by a hydrosilylation reaction between (A1) and (A2) described below, and (B) an organic solvent having a boiling point of not more than 220° C., wherein (A1) is an alkenyl group-containing organopolysiloxane having a weight-average molecular weight exceeding 2,000, comprising 35 to 99 mol % of T siloxane units and 1 to 25 mol % of M siloxane units, and in which alkenyl groups bonded to silicon atoms represent at least 2 mol % of all the organic groups bonded to silicon atoms, and (A2) is a specific organohydrogenpolysiloxane having at least two silicon atom-bonded hydrogen atoms or a specific hydrosilyl group-containing compound. | 09-18-2014 |
20150059963 | PRODUCTION METHOD OF SCINTILLATOR ARRAY - A method for producing a scintillator array comprising fixing a scintillator substrate to a support plate via a double-coated adhesive sheet, at least an adhesive surface thereof to be in contact with the scintillator substrate being thermally peelable; providing the scintillator substrate with lattice-patterned grooves to form pluralities of scintillator cells; filling gaps between the scintillator cells with a liquid hardening reflector resin; curing the liquid hardening reflector resin by heating to form a resin-hardened scintillator cell body; and then peeling the double-coated adhesive sheet from the resin-hardened scintillator cell body by heating. | 03-05-2015 |
20150144254 | METHOD FOR PRODUCING AN ENDLESS TRANSPORT BELT - A method for producing an endless transport belt for guiding substrates during the printing operation of a printing press is disclosed. The ends of a transport belt are welded together. The transport belt is ground, after one or multiple welding operations without or with the addition of material, to a nominal thickness that is smaller than or equal to the minimal thickness of the transport belt. | 05-28-2015 |
20150315797 | METHOD FOR MAKING A COVERING - A method for making a covering is described. The covering includes a first layer made of a flexible material; a second and a third layers made of a preferably rigid material engaged on opposite sides to the first layer. The second and the third layers respectively have a plurality of V-shaped grooves defining respective adjacent rigid and corresponding structural portions. Each rigid structural portion can be oriented with respect to the adjacent rigid structural portion, by folding the first layer so as to model the covering according to three-dimensional configurations and/or a simple or double curvature. The method is preferably performed through a virtual designing of the shape desired to be obtained and a processing of the same for the obtainment of the grooves required to attain such shape. | 11-05-2015 |
20150332911 | METHOD OF PROCESSING WAFER - A wafer has a device region on a front surface where a plurality of devices are disposed and an outer circumferential excess region surrounding the device region. The wafer has a chamfered portion of arcuate cross section on an outer circumferential edge thereof, the chamfered portion extending from the front surface to a reverse side of the wafer. A sheet having an adhering capability and tack strength with respect to the wafer is applied to the front surface of the wafer with an adhesive placed on the outer circumferential excess region. Then a cutting blade cuts into the chamfered portion by a predetermined depth from the front surface of the wafer, and the wafer is cut along the outer circumferential edge thereof to remove part of the chamfered portion and keep part of the adhesive adjacent to at least the device region unremoved. | 11-19-2015 |
20160250840 | METHOD FOR PRODUCING CYLINDRICAL RELIEF PRINTING ORIGINAL PLATE | 09-01-2016 |