| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 156890120 | Forming electrical article or component thereof | 78 |
| 20080223504 | METHOD OF MANUFACTURING THERMOELECTRIC CONVERTER - A method of manufacturing a thermoelectric converter including supplying raw materials by mutually supplying a p-type semiconductor raw material and an n-type semiconductor raw material into a piercing hole of a honeycomb made of a non-metal inorganic material. The method also includes sintering the p-type semiconductor raw material and the n-type semiconductor raw material supplied in the honeycomb to form a p-type semiconductor and an n-type semiconductor in the piercing hole of the honeycomb, and connecting the p-type semiconductor and an n-type semiconductor formed in the piercing hole of the honeycomb to each other by an electrode. | 09-18-2008 |
| 20080245467 | LOW LOSS GLASS-CERAMIC MATERIALS, METHOD OF MAKING SAME AND ELECTRONIC PACKAGES INCLUDING SAME - A glass-ceramic is provided having a thermal expansion coefficient in a range of 3-6 ppm/° C., a dielectric constant that is less than 5 and a Quality factor Q of at least 400. The glass-ceramic consists essentially of SiO | 10-09-2008 |
| 20080264545 | Method of Production of an Electronic Device Having Internal Electrode - When transferring an adhesion layer | 10-30-2008 |
| 20080295949 | Production method of multilayer electronic device - A production method of a multilayer electronic device, comprising the steps of forming a lower side green sheet | 12-04-2008 |
| 20090025855 | Insulating Substrate and Manufacturing Method Therefor, and Multilayer Wiring Board and Manufacturing Method Therefor - There is provided a dimensionally accurate insulating substrate in which plane direction-wise shrinkage is practically zero and shrinkage variations are small. The insulating substrate includes a laminated body composed of at least two kinds of insulating layers made of crystallizable glass ceramics. The crystallization temperature of crystallizable glass contained in the first insulating layer is lower than the softening point of crystallizable glass contained in the second insulating layer. The difference in thermal expansion coefficient between the first and second insulating layers is preferably 2×10 | 01-29-2009 |
| 20090078358 | THICK FILM GREEN SHEET SLURRY, PRODUCTION METHOD OF THICK FILM GREEN SHEET SLURRY, PRODUCTION METHOD OF THICK FILM GREEN SHEET AND PRODUCTION METHODS OF THICK FILM GREEN SHEET AND ELECTRONIC DEVICE - A thick film green sheet slurry, a production method of thick film green sheet slurry, a production method of a thick film green sheet, a thick film green sheet and a production method of an electronic device are provided; by which coating of a relatively thick film becomes possible, a sheet formed after coating has excellent cutting property (strength capable of being cut), and a sheet having high air permeability, excellent handleability and a high adhesive force can be formed. In the present invention, a thick film green sheet slurry comprises a ceramic powder, a binder resin including a butyral based resin as the main component, and a solvent: wherein the solvent includes a good solvent for letting the binder resin dissolved well therein and a poor solvent having lower solubility to the binder resin comparing with that of the good solvent; and the poor solvent is included in a range of 30 to 60 wt % with respect to the entire solvent. The good solvent is alcohol, and the poor solvent may be toluene, xylene, mineral spirit, benzyl acetate, solvent naphtha, etc. | 03-26-2009 |
| 20090084487 | Manufacturing method of laminated film and multilayer ceramic electronic device thereof - A laminated film of the invention comprises a core layer made of synthetic resin, and a conductive release layer formed on at least one side of the core layer, wherein the conductive release layer comprises condensation reaction type release binder and conductive polymer, and this laminated film of the invention is preferably used as a process film when manufacturing ceramic green sheet by sheet-forming a ceramic material slurry; is able to manufacture a thin ceramic green sheet constantly having an uniform thickness; and is superior in antistatic and release properties. | 04-02-2009 |
| 20090107616 | MANUFACTURING METHOD OF MULTI-LAYER CERAMIC SUBSTRATE - Provided is a manufacturing method of a multi-layer ceramic substrate. The manufacturing method includes preparing an unsintered ceramic laminated body with a cavity, mounting a chip device within the cavity, filling the cavity, in which the chip device is mounted, with a ceramic slurry, attaching a constrained layer on top and/or bottom of the ceramic laminated body, and firing the ceramic laminated body. Accordingly, since the deformation of the cavity is prevented during the firing of the ceramic laminated body, the dimension precision and reliability of the multi-layer ceramic substrate can be improved. | 04-30-2009 |
| 20090133806 | METHOD OF MANUFACTURING DIELECTRIC SHEET AND MULTILAYER CERAMIC SUBSTRATE - There is provided a method of manufacturing a dielectric sheet and a multilayer ceramic substrate. A method of manufacturing a dielectric sheet according to an aspect of the invention may include: forming an embossed pattern formed of a thermoplastic material on a carrier film; forming a dielectric sheet by casting dielectric slurry onto the carrier film to cover the embossed pattern; removing the carrier film and the embossed pattern to leave an intaglio pattern having the shape corresponding to the embossed pattern on the dielectric sheet; and filling the intaglio pattern of the dielectric sheet with a conductive material. | 05-28-2009 |
| 20090159180 | Method of manufacturing display device, method of preparing electrode, and electrode composition for offset printing - A method of manufacturing a display device, including providing a composition including a conductive material, an organic binder; a glass frit, and a solvent, wherein the organic binder has a glass transition temperature of about −50° C. to about −5° C., loading the composition into grooves of a gravure roll, transferring the composition from the grooves of the gravure roll onto a silicone rubber blanket roll, transferring the composition from the blanket roll onto a glass substrate, and drying and firing the composition transferred on the glass substrate to form an electrode. | 06-25-2009 |
| 20090194222 | METHOD FOR MANUFACTURING A LITHIUM ION SECONDARY BATTERY - A method for manufacturing a lithium ion secondary battery includes a step of preparing a laminate comprising a solid electrolyte and a solid electrode or an electrode green sheet which is laminated on at least one surface of the solid electrolyte, and a step of providing a collector by laminating a collector material in the form of particles on the electrode or the electrode green sheet and sintering the collector material. | 08-06-2009 |
| 20090242099 | METHOD OF PRODUCING A PIEZOSTACK DEVICE - A method of producing a piezostack device including multiple piezoelectric ceramic layers of a crystal-orientated ceramic and multiple electrode-containing layers laminated alternately. A raw material mixture is prepared in the mixing step, as an anisotropically shaped powder of oriented particles and a reactive raw powder are mixed. The anisotropically shaped powder and the reactive raw powder are then mixed in amounts at a stoichiometric ratio giving an isotropic perovskite compound, and a Nb | 10-01-2009 |
| 20090294020 | MULTILAYER CERAMIC SUBSTRATE, METHOD FOR PRODUCING SAME, AND ELECTRONIC COMPONENT - A multilayer ceramic substrate includes an inner layer portion and surface portions that sandwich the inner layer portion in the stacking direction and have an increased transverse strength because of the surface layer portion having a thermal expansion coefficient less than that of the inner layer portion. At least one of the surface portions covers peripheries of main-surface conductive films arranged on a main surface of an inner portion so as to leave central portions of the main-surface conductive films exposed, so that the main-surface conductive films function as via conductors, thereby eliminating the need to provide a via conductor in the surface portions. | 12-03-2009 |
| 20100018630 | Method of manufacturing composite wiring board - In a method for manufacturing a composite wiring board, a through hole is formed in a sheet having a shrinkage-suppressing effect, and the through hole is filled with conductive paste to obtain a sheet for formation of a conductor. The sheet for formation of the conductor and a green sheet for a substrate in their laminated state are fired to obtain a ceramic substrate having a surface provided with a sintered metal conductor. A fired product of the sheet having the shrinkage-suppressing effect is removed from the surface of the ceramic substrate. Finally, a resin layer is formed on the surface of the ceramic substrate. | 01-28-2010 |
| 20100038013 | METHOD FOR MANUFACTURING MULTILAYER CERAMIC ELECTRONIC DEVICE - In a method for manufacturing a multilayer ceramic substrate in which, after firing is performed while restriction layers which are not sintered in the firing are disposed on primary surfaces of an unsintered ceramic laminate, the restriction layers are removed, when a bonding force generated by each restriction layer is increased, the restriction layers cannot be easily removed, and when the restriction layers are designed to be easily removed, the bonding force decreases. In an unsintered ceramic laminate, conductive patterns containing Ag as a primary component are formed, and in addition, at least one first base layer and at least one second base layer are also laminated to each other. The second base layer is disposed along at least one primary surface of the unsintered ceramic laminate, and restriction layers are disposed so as to be in contact with the second base layers. The second base layer is formed to have a composition so that Ag is likely to diffuse during firing as compared to that of the first base layer, and as a result, the glass softening point decreases; hence, a restriction force is improved without using means for decreasing the particle diameter of a sintering resistant ceramic powder contained in the restriction layers. | 02-18-2010 |
| 20100051172 | METHOD FOR MANUFACTURING CERAMIC GREEN SHEET AND METHOD FOR MANUFACTURING MULTILAYER CERAMIC CIRCUIT BOARD - A method for manufacturing a ceramic green sheet includes providing a stamp having an imprinting surface on which a raised structure corresponding to a circuit pattern is formed, imprinting the stamp on the ceramic green sheet to form a depressed pattern in the ceramic green sheet, the depressed pattern being transferred from the raised structure, curing the ceramic green sheet with the stamp imprinted on the ceramic green sheet, separating the stamp from the ceramic green sheet, and providing the depressed pattern of the ceramic green sheet with the conductive material. | 03-04-2010 |
| 20100071836 | Sealing of Mica Wnidows for Geiger-Muller Tubes - The present invention provides a method for manufacturing radiation detectors such as Geiger-Müller detectors. The method includes pre-forming a frit ring via extrusion or stamping. The preformed frit ring is placed in the aperture of a metal cathode body along with a radiation transparent window made of mica. The window is slightly larger than the perimeter of the aperture, thereby forming an overlap area. The frit ring is placed between the cathode and window within this overlap area. The assembled components are then fired at an appropriate temperature to cause fusion of the frit with the metal cathode and window to form a gas-tight seal. | 03-25-2010 |
| 20100101701 | METHOD OF MANUFACTURING NON-SHRINKING MULTILAYER CERAMIC SUBSTRATE - Disclosed is a method of manufacturing a nonshrinking multilayer ceramic substrate. The method includes forming at least one conductive via and an electrode pattern in at least one of a plurality of ceramic green sheets, laminating the ceramic green sheets to form a ceramic laminate, selectively forming a shrinkage inhibiting thin film of sinter-resistant powder on a region including the conductive via and a periphery thereof in at least one of two surfaces of the ceramic laminate using aerosol deposition, disposing a shrinkage inhibiting green sheet for suppressing the shrinkage of the ceramic laminate on at least one of the two surfaces of the ceramic laminate including the shrinkage inhibiting thin film to form a non-sintered multilayer ceramic substrate, and sintering the non-sintered multilayer ceramic substrate. | 04-29-2010 |
| 20100101702 | METHOD OF MANUFACTURING MULTILAYER CERAMIC SUBSTRATE - Disclosed is a method of manufacturing a multilayer ceramic substrate. The method includes providing a plurality of ceramic blocks, each including a ceramic laminate having a first surface and a second surface and having a laminated structure of a plurality of ceramic green sheets containing a glass ceramic component, and a first bonding ceramic green sheet including a glass component and disposed on a surface of the first and second surfaces of the ceramic laminate, which is to contact another ceramic laminate, firing the plurality of ceramic blocks, laminating the plurality of ceramic blocks such that the first bonding ceramic green sheets of the adjacent ceramic blocks face each other, and bonding the plurality of ceramic blocks using the glass component of the first bonding ceramic green sheets. | 04-29-2010 |
| 20100116413 | Methods of manufacturing ceramic board and electronic device - The present invention relates to a method of manufacturing a ceramic board comprises the steps of forming a green ceramic board | 05-13-2010 |
| 20100132874 | Composite Ceramic Substrate for Micro-Fluid Ejection Head - A composite ceramic substrate for receiving an ejection head chip for a micro-fluid ejection head and a method for making the composite ceramic substrate. The substrate includes a high temperature previously fired ceramic base having a substantially planarized first surface and at least one fluid supply slot therethrough. A low temperature co-fired ceramic (LTCC) tape layer bundle having at least two LTCC tape layers is attached to the ceramic base at an interface between the LTCC tape layer bundle and the first surface of the ceramic base. The LTCC tape layer bundle has at least one chip pocket therein and at least one of the LTCC tape layers includes a plurality of conductors. | 06-03-2010 |
| 20100193107 | ELECTRIC FUNCTIONAL UNIT AND METHOD FOR THE PRODUCTION THEREOF - A method of producing an electrical component includes forming a stack of ceramic green films, where the stack has a hole that is accessible from external to the stack, inserting a cover into the hole, and sintering the stack together with the cover. The method may also include boring the hole through the stack of ceramic green films. | 08-05-2010 |
| 20100294419 | Method for Making a Piezoceramic Device - The invention concerns a method for making a piezoelectrical device, whose electrode layers contain copper. The usage of copper in the electrode layers is enabled by a debindering process, which is carried out by steam. | 11-25-2010 |
| 20100300602 | Method for Manufacturing Ceramic Capacitor - A method for manufacturing a ceramic capacitor embedded in a wiring substrate, the ceramic capacitor including a capacitor body which has a pair of capacitor main surfaces and a plurality of capacitor side surfaces also has a structure in which a plurality of internal electrodes are alternately layered through a ceramic dielectric layer, the method has (a) laminating ceramic-made green sheets and combining the green sheets into one, to form a multi-device-forming multilayer unit in which a plurality of product areas, each of which becomes the ceramic capacitor, are arranged in longitudinal and lateral directions along a plane direction, (b) forming a groove portion to form a chamfer portion at a boundary portion between at least one of the capacitor main surfaces and the plurality of capacitor side surfaces, (c) sintering the multi-device-forming multilayer unit, and (d) dividing the product areas into each product area along the groove portion. | 12-02-2010 |
| 20110073242 | PRODUCTION PROCESS FOR SURFACE-MOUNTING CERAMIC LED PACKAGE, SURFACE-MOUNTING CERAMIC LED PACKAGE PRODUCED BY SAID PRODUCTION PROCESS, AND MOLD FOR PRODUCING SAID PACKAGE - The present invention is related to a surface-mounting ceramic LED package and a method for its production comprising: layering a ceramic green sheet which has a hole and a second ceramic green sheet, inserting a mold with a groove to form a partition in the bottom of the ceramic green sheet substrate, and firing the ceramic green sheet substrate. | 03-31-2011 |
| 20110083794 | CAPACITOR TO BE INCORPORATED IN WIRING SUBSTRATE, METHOD FOR MANUFACTURING THE CAPACITOR, AND WIRING SUBSTRATE - A wiring substrate in which a capacitor is provided, the capacitor comprising a capacitor body including a plurality of dielectric layers and internal electrode layers provided between the different dielectric layers, wherein said capacitor body has, in at least one side face of said capacitor body, recesses extending in a thickness direction of said capacitor body from at least one of a first principal face of said capacitor body and a second principal face positioned on the side opposite to the first principal face. | 04-14-2011 |
| 20110100527 | LAMINATED CERAMIC ELECTRONIC COMPONENT AND METHOD FOR PRODUCING THE SAME - A laminated ceramic electronic component includes a plurality of conductor pattern layers for a coil arranged to overlap each other to form substantially U-shaped conductors for the coil. The conductors for the coil are electrically connected in series through via holes for inner layer connection provided in ceramic green sheets to form a spiral coil. A plurality of lead conductor pattern layers also overlaps each other to form lead conductors. One lead conductor pattern layer is disposed per a predetermined number of conductor pattern layers for the coil. An end of each lead conductor pattern layer is in contact with the corresponding conductor pattern layer for the coil. In other words, the thickness of the lead conductors is less than the thickness of the conductors for the coil. | 05-05-2011 |
| 20110180198 | CONDUCTIVE PASTE AND A METHOD FOR PRODUCING ELECTRONIC COMPONENT - A purpose of the present invention is to provide a conductive paste which is capable to prevent the structural defect and to provide a method for producing electronic components including an internal electrode layer formed by the conductive paste. | 07-28-2011 |
| 20110209813 | PROCESS FOR PRODUCING GLASS MEMBER PROVIDED WITH SEALING MATERIAL LAYER AND PROCESS FOR PRODUCING ELECTRONIC DEVICE - Laser sealing property and reliability of a glass panel are increased by suppressing cracks, fractures, separation and the like of glass substrates and a sealing material layer at the time of laser sealing. | 09-01-2011 |
| 20110272081 | METHOD OF MAKING A FUEL CELL DEVICE - A method of making a fuel cell device comprises forming a green stacked structure to provide an internal active section of intervening green layers of ceramic material separating anode layers from cathode layers and sacrificial layers of organic material adjacent each of the anode and cathode layers opposite the intervening green layers, and a non-active section of the green layers substantially surrounding the active section. The sacrificial layers are sized to provide internal gas passages in the active section for feeding gases to the internal anodes and cathodes, and the sacrificial layers are coupled to edges of the structure to couple each of the internal gas passages to an inlet and an outlet of the device. The green stacked structure is heated to bake out the organic material to form the passages and to sinter together the green layers in the active and non-active sections. | 11-10-2011 |
| 20110277912 | CERAMIC LAMINATE AND METHOD OF MANUFACTURING CERAMIC SINTERED BODY - There are provided a method of manufacturing a ceramic sintered body. A method of manufacturing a ceramic sintered body according to one aspect of the invention may include: preparing at least one ceramic sheet having first ceramic particles and glass particles; preparing at least one constraining sheet having second ceramic particles having a smaller particle size than the glass particles and the first ceramic particles; forming a ceramic laminate by alternating the ceramic sheet and the constraining sheet while the ceramic sheet and the constraining sheet are in contact with each other; and sintering the ceramic laminate so that components, which do not react with the first ceramic particles, from the glass particle are moved into the constraining sheet to sinter the constraining sheet when the ceramic sheet is sintered. | 11-17-2011 |
| 20110277913 | Method for Producing a Multilayer Element - A ceramic multilayer element can be produced by pressing together a plurality of ceramic multilayer segments. Each multilayer segment includes a stack of a plurality of ceramic layers that are pressed together. | 11-17-2011 |
| 20110303347 | METHOD FOR MANUFACTURING SURFACE MOUNTING CRYSTAL RESONATOR - A method for manufacturing a surface mounting crystal resonator is provided, in which the bonding strength of low melting point glass is increased and the productivity is also increased. The surface mounting crystal resonator includes a set of container components having at least a crystal sheet | 12-15-2011 |
| 20120024461 | ELECTROLYTE SUPPORTED CELL DESIGNED FOR LONGER LIFE AND HIGHER POWER - A solid oxide fuel cell (SOFC) includes a cathode electrode, an anode electrode, and a solid oxide electrolyte located between the anode electrode and the cathode electrode. The cathode electrode is a porous ceramic layer infiltrated with a cathode catalyst material, and the anode electrode is a porous ceramic layer infiltrated with an anode catalyst material, and the electrolyte is a ceramic layer having a lower porosity than the anode and the cathode electrodes. A ceramic reinforcing region may be located adjacent to the riser opening in the electrolyte. | 02-02-2012 |
| 20120043010 | Method for Solid Oxide Fuel Cell Fabrication - A method of making a solid oxide fuel cell (SOFC) includes forming a first sublayer of a first electrode on a first side of a planar solid oxide electrolyte and drying the first sublayer of the first electrode. The method also includes forming a second sublayer of the first electrode on the dried first sublayer of the first electrode prior to firing the first sublayer of the first electrode, firing the first and second sublayers of the first electrode during the same first firing step, and forming a second electrode on a second side of the solid oxide electrolyte. | 02-23-2012 |
| 20120055610 | CERAMIC SUBSTRATE, METHOD OF MANUFACTURING THE SAME, AND ELECTRICAL DEVICE USING THE SAME - Provided are a ceramic substrate, a method of manufacturing the same, and an electrical device using the same. A ceramic substrate includes a first laminated body, a second laminated body and an adhesive part. The first laminated body includes a predetermined electrode formed therein. The second laminated body is laminated on and electrically connected to the first laminated body. Also, the adhesive part is intervened between the first laminated body and the second laminated body to adhere the first and second laminated bodies through interfacial reaction. | 03-08-2012 |
| 20120061002 | METHOD OF MANUFACTURING MULTILAYER CERAMIC SUBSTRATES - In a method of manufacturing a multilayer ceramic substrate, first and second sheet stacks are formed by pressurizing a plurality of unsintered ceramic sheets, respectively. A hole is formed to penetrate through the second sheet stack. A third preliminary sheet stack is formed by positioning the second sheet stack on the first sheet stack. First and second thin films are formed at top and bottom of the third preliminary sheet stack, respectively. A third sheet stack is formed by pressurizing the first and the second thin films and the third preliminary sheet stack. The first and the second thin films are removed from the third sheet stack, thereby forming a preliminary multilayer ceramic substrate. The preliminary multilayer ceramic substrate is sintered. Accordingly, the reliability and stability of the manufacturing process for the multilayer ceramic substrate is sufficiently improved with reduced cost due to the flat molds and thin films. | 03-15-2012 |
| 20120085481 | METHOD FOR MANUFACTURING CERAMIC MULTI-LAYERED INTERCONNECTION SUBSTRATE - A ceramic multi-layered interconnection substrate can be manufactured by using a stack including a plurality of ceramic layers with division grooves in the uppermost layer, at least one intermediate layer, and the lowermost layer. The substrate can be manufactured by forming division grooves in respective green sheets other than the uppermost and lowermost ones at adjacent package boundaries, pressing them to be stacked, forming division grooves in the uppermost and lowermost sheets at the adjacent package boundaries, firing them to be ceramic layers, and breaking the ceramic layers along the division grooves to separate individual packages, thus preventing failure and preventing the generation of burrs, chips, and the like. | 04-12-2012 |
| 20120186723 | Ti3SiC2 BASED MATERIAL, ELECTRODE, SPARK PLUG AND MANUFACTURING METHOD THEREOF - The present invention provides a Ti | 07-26-2012 |
| 20120199270 | METHOD OF MANUFACTURING A MULTI-LAYER CERAMIC SUBSTRATE USING A CONSTRAINING GREEN SHEET - Provided are a method of manufacturing a multi-layer ceramic substrate. The method includes preparing a non-sintered ceramic laminated structure formed of a plurality of ceramic green sheets; preparing one or more constraining green sheets comprising a first constraining layer formed of a first inorganic powder having a first particle diameter and a second constraining layer formed of a second inorganic powder having a second particle diameter larger than the first particle diameter; disposing the constraining green sheets on the top and the bottom of the ceramic laminated structure; and firing the ceramic laminated structure at a predetermined firing temperature. | 08-09-2012 |
| 20120216941 | METHOD FOR PRODUCING PEROVSKITE TYPE COMPOSITE OXIDE - A method is provided which includes a reaction step of reacting at least titanium oxide, a calcium compound, and barium hydroxide in a slurry solution so as to produce a perovskite-type composite oxide. The perovskite-type composite oxide is represented by (Ba | 08-30-2012 |
| 20120234462 | MANUFACTURING METHOD FOR MONOLITHIC CERAMIC ELECTRONIC COMPONENT - In a manufacturing method for a monolithic ceramic electronic component, a plurality of green chips arrayed in row and column directions which are obtained after cutting a mother block are spaced apart from each other and then tumbled, thereby uniformly making the side surface of each of the green chips an open surface. Thereafter, an adhesive is applied to the side surface. Then, by placing a side surface ceramic green sheet on an affixation elastic body, and pressing the side surface of the green chips against the side surface ceramic green sheet, the side surface ceramic green sheet is punched and stuck to the side surface. | 09-20-2012 |
| 20120234463 | MULTILAYER CERAMIC ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF - A multilayer ceramic electronic component includes dummy conductor patterns on a ceramic green sheet laminated in an earlier stage of the lamination and sheet-by-sheet crimping process that have widths that are less than the widths of dummy conductor patterns on a ceramic green sheet laminated in a later stage of the lamination and sheet-by-sheet crimping process. | 09-20-2012 |
| 20120247647 | METHOD OF SUCTION OF OBJECT TO BE WORKED UPON SUCTION UNIT AND METHOD OF MANUFACTURE OF CERAMIC CAPACITOR - In the method for allowing a work object ( | 10-04-2012 |
| 20120267037 | METHOD FOR PRODUCING MULTILAYER CERAMIC SUBSTRATE - In a method for producing a multilayer ceramic substrate by a non-shrinkage process, even when a total area of surface electrodes on a first principal surface side is smaller than that on a second principal surface side, a favorable balance in terms of a time period from softening to crystallization of glass is achieved between the first principal surface side and the second principal surface side, thereby allowing all base material layers to be densified and prevented from causing cracks or warpage, even when the crystallization temperature is lowered to prevent production of a reaction layer. The crystallization temperature of a glass material included in a second base material layer defining a second principal surface with a larger total area of surface electrodes is less than that of a glass material included in a first base material layer defining a first principal surface. | 10-25-2012 |
| 20130000820 | CAPACITOR TO BE INCORPORATED IN WIRING SUBSTRATE, METHOD FOR MANUFACTURING THE CAPACITOR, AND WIRING SUBSTRATE - A wiring substrate in which a capacitor is provided, the capacitor comprising a capacitor body including a plurality of dielectric layers and internal electrode layers provided between the different dielectric layers, wherein said capacitor body has, in at least one side face of said capacitor body, recesses extending in a thickness direction of said capacitor body from at least one of a first principal face of said capacitor body and a second principal face positioned on the side opposite to the first principal face. | 01-03-2013 |
| 20130008586 | CIRCUIT SUBSTRATE, CIRCUIT MODULE AND METHOD FOR MANUFACTURING THE CIRCUIT SUBSTRATE - A thin circuit substrate and a circuit module are arranged such that the circuit module includes an IC mounted on a circuit substrate, the IC includes an IC body and an solder bump located on a mounting surface of the IC body, and the circuit substrate includes a substrate including a recess formed by recessing a portion of a mounting surface of the substrate on which the IC is to be mounted, and a terminal protruding from the mounting surface of the substrate. The terminal is to be electrically connected to the solder bump. | 01-10-2013 |
| 20130056133 | METHOD FOR MANUFACTURING MULTILAYER CERAMIC ELECTRONIC COMPONENT - A method for manufacturing a multilayer ceramic electronic component significantly reduces and prevents swelling or distortion when a conductive paste is applied to a green ceramic element body. A ceramic green sheet used in the method satisfies 180.56≦A/B wherein A is a polymerization degree of an organic binder contained in the ceramic green sheet, and B is a volume content of a plasticizer contained in the ceramic green sheet. | 03-07-2013 |
| 20130112338 | METHOD OF MANUFACTURING MULTILAYER CERAMIC CAPACITOR - There is provided a method of manufacturing a multilayer ceramic capacitor including: laminating ceramic green sheets having internal electrodes printed thereon to form a ceramic laminated body; cutting the ceramic laminated body; applying slurry including a ceramic powder to the ceramic laminated body; and drying the slurry applied to the ceramic laminated body. According to an embodiment of the present invention, cracks generated in a manufacturing process of the multilayer ceramic capacitor may be removed, such that the multilayer ceramic capacitor may have excellent reliability. | 05-09-2013 |
| 20130220515 | Multi-Layer Piezoelectric Element, Ejection Apparatus Using the Same and Fuel Ejection System - To provide a multi-layer piezoelectric element which is easy to be fabricated and which exhibits excellent durability, even when it is driven continuously for a long time under high electric field and high pressure. | 08-29-2013 |
| 20130255854 | MANUFACTURING METHOD OF HONEYCOMB STRUCTURE - The manufacturing method of the honeycomb structure includes a step of coating a surface of each of releasing sheets with a paste for an electrode, to prepare electrode forming sheets in which the releasing sheets are provided with electrode paste films; a formed honeycomb body with the electrode forming sheets forming step of attaching the electrode forming sheets to a side surface of a tubular formed ceramic honeycomb body which is the curved surface to prepare a formed honeycomb body with the electrode forming sheets; and a honeycomb structure forming step of firing the formed honeycomb body, or removing releasing sheets from the formed honeycomb body to form the formed honeycomb body with the pastes for the electrodes, and then firing the formed honeycomb body with the pastes for the electrodes, to obtain a honeycomb structure having a side surface provided with the electrodes. | 10-03-2013 |
| 20130269859 | Multi-Layer Electronic Component and Method for Manufacturing the Same - A multi-layer electronic component that can be repetitively operated under high voltage, high temperature and high humidity is provided. | 10-17-2013 |
| 20130276955 | MANUFACTURING METHOD FOR MONOLITHIC CERAMIC ELECTRONIC COMPONENT - In a manufacturing method for a monolithic ceramic electronic component, a ceramic paste is applied by using an application plate to a side surface of each of a plurality of green chips arrayed in row and column directions which are obtained after cutting a mother block. In the applying step, the ceramic paste is transferred to the side surface by moving the green chips and the application plate relative to each other in the direction in which the side surface extends while separating the green chips from the application plate, in a state where the ceramic paste is connected to both the green chips and the application plate. | 10-24-2013 |
| 20130340920 | MANUFACTURING METHOD FOR MONOLITHIC CERAMIC ELECTRONIC COMPONENT - In a manufacturing method for a monolithic ceramic electronic component, a plurality of green chips arrayed in row and column directions which are obtained after cutting a mother block are spaced apart from each other and then tumbled, thereby uniformly making the side surface of each of the green chips an open surface. Thereafter, an adhesive is applied to the side surface. Then, by placing a side surface ceramic green sheet on an affixation elastic body, and pressing the side surface of the green chips against the side surface ceramic green sheet, the side surface ceramic green sheet is punched and stuck to the side surface. | 12-26-2013 |
| 20140060723 | SOLID STATE BATTERY FABRICATION - Embodiments of the invention generally relate to solid state battery structures, such as Li-ion batteries, methods of fabrication and tools for fabricating the batteries. One or more electrodes and the separator may each be cast using a green tape approach wherein a mixture of active material, conductive additive, polymer binder and/or solid electrolyte are molded or extruded in a roll to roll or segmented sheet/disk process to make green tape, green disks or green sheets. A method of fabricating a solid state battery may include: preparing and/or providing a green sheet of positive electrode material; preparing and/or providing a green sheet of separator material; laminating together the green sheet of positive electrode material and the green sheet of separator material to form a laminated green stack; and sintering the laminated green stack to form a sintered stack comprising a positive electrode and a separator. | 03-06-2014 |
| 20140096890 | METHOD FOR MANUFACTURING LAMINATED CERAMIC ELECTRONIC COMPONENT - A method for manufacturing a laminated ceramic electronic component, which includes the steps of preparing a laminate chip having opposed end edges of internal electrodes exposed at opposed side surfaces of the laminate chip; forming a first insulator section and a second insulator section, respectively, on opposed side surfaces of the laminate chip by pressing against a metal plate with a volume of grooves filled with a paste, and swinging the metal plate in any direction when pulling the laminate chip away from the metal plate; and firing the laminate chip with the first insulator section and second insulator section formed thereon. The paste has a viscosity of 500 Pa·s to 2500 Pa·s, and a content C (vol %) of an inorganic solid satisfies a predetermined condition. | 04-10-2014 |
| 20140216631 | METHOD FOR PRODUCING ELECTRODE ASSEMBLY - A method for producing an electrode assembly includes: obtaining a porous active material molded body by molding a constituent material containing a lithium multiple oxide in the form of particles by compression, and then performing a heat treatment at a temperature of 850° C. or higher and lower than the melting point of the used lithium multiple oxide; forming a solid electrolyte layer by applying a liquid containing a constituent material of an inorganic solid electrolyte to the surface of the active material molded body including the inside of each pore of the active material molded body, and then performing a heat treatment; and bonding a current collector to the active material molded body exposed from the solid electrolyte layer. | 08-07-2014 |
| 20140216632 | METHOD FOR PRODUCING ACTIVE MATERIAL MOLDED BODY, ACTIVE MATERIAL MOLDED BODY, METHOD FOR PRODUCING LITHIUM BATTERY, AND LITHIUM BATTERY - A method for producing an active material molded body includes molding a constituent material containing LiCoO | 08-07-2014 |
| 20140238578 | METHOD FOR MANUFACTURING MONOLITHIC CERAMIC ELECTRONIC COMPONENT - In a method for manufacturing a monolithic ceramic electronic component, electrically conductive paste layers are formed such that each of the electrically conductive paste layers includes a plurality of electrically conductive paste portions isolated from each other and each of the plurality of electrically conductive paste portions includes a first portion configured to constitute a facing portion and a second portion which includes a portion configured to constitute a lead portion and which is disposed astride a cut line. | 08-28-2014 |
| 20140261971 | Method of manufacturing Multilayer Piezoelectric Devices - A process that permits existing thick film printing technology to be utilized with existing conductive adhesives to form multi-layer dielectric devices, more specifically to form multi-layer ferroelectric devices, and more specifically to form multilayer piezoelectric devices. A conductive paste is applied to a first surface of a piezoelectric element in a desired pattern. The disclosed process utilizes conductive paste, which replaces the usual adhesive requirement for bonding while still acting as the conductive layer between the individual elements of the stacked sintered substrates. An isolating filler paste is applied to the first surface of the piezoelectric element in a manner that electrically isolates the conductive pattern as to enable multiple distinct, possibly unequal, regions of electric potential. This paste also may assist bonding and will prevent shorting between the electrically non-equivalent regions of the overall electrode pattern. Multiple substrates are stacked, dried and fired as described herein to form multilayer piezoelectric devices. | 09-18-2014 |
| 20140338817 | ALL SOLID STATE SECONDARY BATTERY - This is to provide an all solid state secondary battery which can be produced by an industrially employable method capable of mass-production and has excellent secondary battery characteristics. | 11-20-2014 |
| 20150047767 | ALL-SOLID-STATE LITHIUM-ION SECONDARY BATTERY AND PRODUCTION METHOD THEREOF - A method of producing an all-solid-state lithium-ion secondary battery including forming primary sintered bodies of an anode, a cathode, and a solid electrolyte layer; disposing the primary sintered body of the solid electrolyte layer between the primary sintered bodies of the anode and the cathode; forming a laminate of the primary sintered bodies and at least one of a first intermediate layer disposed between the anode and the solid electrolyte layer, and a second intermediate layer disposed between the cathode and the solid electrolyte layer; and firing the laminate to obtain a sintered body including an anode, a solid electrolyte layer, and a cathode, and at least one of a first intermediate layer and a second intermediate layer. In the resulting all-solid-state lithium-ion secondary battery, the first and second intermediate layers have a particle size that is smaller than that of the anode, cathode, and solid electrolyte layer. | 02-19-2015 |
| 20150129112 | SHOWER HEAD ASSEMBLY, PLASMA PROCESSING APPARATUS AND METHOD FOR MANUFACTURING A SHOWER HEAD ASSEMBLY - A shower head assembly includes an electrode plate, and a laminate base that is constituted of ceramic sheets and provided to hold the electrode plate. The laminate base includes no bonding surface between the ceramic sheets. The laminate base includes a first gas diffusion space formed in its central area and a second gas diffusion space formed in its peripheral area. A first heater electrode layer is provided above the first gas diffusion space, and a second heater electrode layer is provided above the second gas diffusion space. A first coolant passage is formed above the first gas diffusion space, and a second coolant passage is formed above the second gas diffusion space. A first gas supply passage is connected to the first gas diffusion space, and a second gas supply passage is connected to the second gas diffusion space. | 05-14-2015 |
| 20150144252 | HIGH SPEED DIFFERENTIAL WIRING IN GLASS CERAMIC MCMS - The embodiments of the present invention relate generally to the fabrication of integrated circuits, and more particularly to a structure and method for fabricating differential wiring patterns in multilayer glass-ceramic (MLC) modules. A structure and method of forming a MLC having layers with staggered, or offset, pairs of lines formed directly on one another are disclosed. In addition, a structure and method of forming a MLC having layers with staggered, or offset, pairs of lines that periodically reverse polarity are disclosed. | 05-28-2015 |
| 156890130 | Elemental carbon containing (e.g., graphite, etc.) | 1 |
| 20140374005 | FORMATION OF CONDUCTIVE CIRCUIT - A conductive circuit is formed using a substantially solvent-free, liquid, addition curable, conductive circuit-forming ink composition comprising (A) an organopolysiloxane having at least two silicon-bonded alkenyl groups, (B) an organohydrogenpolysiloxane having at least two SiH groups, (C) conductive particles, (D) a thixotropic agent, and (E) a hydrosilylation catalyst. The ink composition is printed on a metal electrode to form a green circuit pattern layer, which is fired and cured for thereby forming a conductive circuit and bonding the conductive circuit to the metal electrode. | 12-25-2014 |
| 156890140 | Inorganic titanate compound containing | 3 |
| 20080236723 | Production method of dielectric ceramic composition and production method of electronic device - A production method of a dielectric ceramic composition at least including a main component including a dielectric oxide having perovskite-type crystal structure expressed by a formula ABO | 10-02-2008 |
| 20100038014 | METHOD FOR PRODUCING LAMINATED DIELECTRIC MATERIAL - To provide a method for producing a laminated dielectric material using a stabilized glass. | 02-18-2010 |
| 20140102619 | NANO COMPLEX OXIDE DOPED DIELECTRIC CERAMIC MATERIAL, PREPARATION METHOD THEREOF AND MULTILAYER CERAMIC CAPACITORS MADE FROM THE SAME - The present invention provides a nano complex oxide doped dielectric ceramic material used for a multilayer ceramic capacitor using a base metal as a material of internal electrodes. The doped dielectric ceramic material comprises barium titanate and a nano complex oxide dopant, wherein the molar ratio of the barium titanate to the nano complex oxide dopant is in the range of (90˜98):(2˜10), the average particle size of the barium titanate is 50˜300 nm and the nano complex oxide dopant has the following formula (1): w A+x B+y C+z D. The present invention also provides processes for preparing the nano complex oxide doped dielectric ceramic material and ultrafine-grained and temperature-stable multilayer ceramic capacitors using the nano complex oxide doped dielectric ceramic material as the material of dielectric layers. | 04-17-2014 |
| 156890160 | Elemental metal or alloy containing | 10 |
| 20080314502 | METHOD FOR PROVIDING HERMETIC ELECTRICAL FEEDTHROUGH - A method for fabricating the hermetic electrical feedthrough. The method comprises providing a ceramic sheet having an upper surface and a lower surface, forming at least one via hole in said ceramic sheet extending from said upper surface to said lower surface, inserting a conductive thickfilm paste into said via hole, laminating the ceramic sheet with paste filled via hole between an upper ceramic sheet and a lower ceramic sheet to form a laminated ceramic substrate, firing the laminated ceramic substrate to a temperature to sinter the laminated ceramic substrate and cause the paste filled via hole to form metalized via and cause the laminated ceramic substrate to form a hermetic seal around said metalized via, and removing the upper ceramic sheet and the lower ceramic sheet material from the fired laminated ceramic substrate to expose an upper and a lower surface of the metalized via. | 12-25-2008 |
| 20090194223 | LOW-TEMPERATURE SINTERING OF LANTHANUM STRONTIUM MANGANITE-BASED CONTACT PASTES FOR SOFCS - A method for forming electrical connections between parts of a fuel cell that includes subjecting a contact paste positioned between the parts to alternating flows of gasses having varying high and low partial pressures of oxygen. This method demonstrates the ability to form conductive interconnections that have sufficient mechanical stability because these pastes can be cured at a temperature less than the temperatures of the surrounding materials thus allowing desired portions to be cured while allowing other portions such as the glass or ceramic portions to maintain their desired mechanical and electrical properties. | 08-06-2009 |
| 20130068373 | PASTE AND METHOD FOR CONNECTING ELECTRONIC COMPONENT TO SUBSTRATE - A paste may be used to connect at least one electronic component to at least one substrate through contact regions, wherein at least one of the contact regions contains a non-noble metal. The paste contains (a) metal particles, (b) at least one activator that bears at least two carboxylic acid units in the molecule, and (c) a dispersion medium. A method for connecting at least one electronic component to at least one substrate through the contact regions includes steps of providing a substrate having a first contact region and an electronic component having a second contact region; providing the above paste; generating a structure, wherein the first contact region of the substrate contacts the second contact region of the electronic component through the paste; and sintering the structure while producing a module including at least the substrate and the electronic component connected to each other through the sintered paste. | 03-21-2013 |
| 20150007925 | HIGH-STRENGTH STRUCTURAL ELEMENTS USING METAL FOAM FOR PORTABLE INFORMATION HANDLING SYSTEMS - Methods for manufacturing a metal foam and a metal foam reinforced back plate may be used to provide high-strength and low weight structural elements in portable information handling systems. A method for manufacturing a metal foam may include selectively adding iridium oxide and ceramic particulate to a light-metal allow to create desired mechanical properties of the metal foam. | 01-08-2015 |
| 20150306669 | METHOD FOR CONNECTING AT LEAST TWO COMPONENTS USING A SINTERING PROCESS - The invention relates to a method for connecting at least two components ( | 10-29-2015 |
| 156890170 | Silver containing | 3 |
| 20090294021 | PROCESS FOR MAKING A CERAMIC COMPOSITE DEVICE - An electrical power generating device having a plurality of ceramic composite cells, each cell having a cathode and an anode. A thermal shell in which the ceramic composite cells are stacked or arranged in electrical series and gas parallel surrounded by shock absorbing and insulating materials, respectively, is preferably included. Also provided are an exhaust fan, thermocouple sensors, a fuel supply, a programmable computer controller with user interface, and a container supporting the assembly and having passageways for providing air ingress and egress to the device, and power output terminals for the electrical power from the device. | 12-03-2009 |
| 20140345779 | MANUFACTURING METHOD FOR MONOLITHIC CERAMIC ELECTRONIC COMPONENT - In a manufacturing method for a monolithic ceramic electronic component, a plurality of green chips arrayed in row and column directions which are obtained after cutting a mother block are spaced apart from each other and then tumbled, thereby uniformly making the side surface of each of the green chips an open surface. Thereafter, an adhesive is applied to the side surface. Then, by placing a side surface ceramic green sheet on an affixation elastic body, and pressing the side surface of the green chips against the side surface ceramic green sheet, the side surface ceramic green sheet is punched and stuck to the side surface. | 11-27-2014 |
| 20160042871 | CERAMIC ELECTRONIC COMPONENT AND METHOD FOR PRODUCING THE SAME - A ceramic body is prepared that includes an inner electrode disposed inside the ceramic body and in which an end portion of the inner electrode is led to a surface of the ceramic body. An electrode layer is formed on the surface of the ceramic body so as to cover the end portion of the inner electrode, the electrode layer containing a resin, a first metal filler that contains a first metal component, and a second metal filler that contains a second metal component having a higher melting point than the first metal component. A heating step of heating the electrode layer is performed to form an electrode including a metal layer that is located on the surface of the ceramic body and that contains the first and second metal components and a metal contained in the inner electrode. | 02-11-2016 |
| 156890180 | Copper containing | 2 |
| 20150380165 | Laminated Ceramic Capacitor - A method of manufacturing a ceramic capacitor component that includes preparing a laminate body including first to third green sheets by stacking the first green sheets before applying conductive paste, stacking the second green sheets with conductive paste applied thereon on the first green sheets, and stacking the third green sheets before applying conductive paste on the second green sheets; preparing fourth green sheets from a raw material that does not contain V | 12-31-2015 |
| 20160013073 | METHOD FOR MANUFACTURING BONDED BODY AND METHOD FOR MANUFACTURING POWER-MODULE SUBSTRATE | 01-14-2016 |
