| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 148432000 | Copper base | 14 |
| 20080251162 | COPPER ALLOY AND METHOD FOR ITS MANUFACTURE - The invention relates to a copper alloy having high recrystallization temperature and good conductivity used in brazed heat exchangers which alloy consists of 0.1 to 0.3% in weight chromium. The invention also relates to a method for the manufacturing of the alloy which method consists of the following steps: casting, cold working, annealing and another cold working before brazing. | 10-16-2008 |
| 20090133784 | COPPER ALLOY THIN FILMS, COPPER ALLOY SPUTTERING TARGETS AND FLAT PANEL DISPLAYS - A Cu alloy thin film contains Fe and P with the balance being substantially Cu, in which the contents of Fe and P satisfy all the following conditions (1) to (3), and in which Fe | 05-28-2009 |
| 20090173414 | Rolled Copper Foil and Manufacturing Method of Rolled Copper Foil - A rolled copper foil, according to the present invention, obtained after a final cold rolling step but before recrystallization annealing includes a group of crystal grains which exhibits four-fold symmetry in results obtained by X-ray diffraction (XRD) pole figure measurement with respect to a rolled surface. In the XRD pole figure measurement, at least four peaks of a {220} | 07-09-2009 |
| 20090272466 | Ultrahigh-Purity Copper and Process for Producing the Same, and Bonding Wire Comprising Ultrahigh-Purity Copper - Provided is ultrahigh purity copper having a hardness of 40 Hv or less, and a purity of 8N or higher (provided that this excludes the gas components of O, C, N, H, S and P). With this ultrahigh purity copper, the respective elements of O, S and P as gas components are 1 wtppm or less. Also provided is a manufacturing method of ultrahigh purity copper based on two-step electrolysis using an electrolytic solution comprised of copper nitrate solution, including the procedures of adding hydrochloric acid in an electrolytic solution comprised of copper nitrate solution; circulating the electrolytic solution; and performing two-step electrolysis while eliminating impurities with a filter upon temporarily setting the circulating electrolytic solution to a temperature of 10° C. or less. The present invention provides a copper material that is compatible with the thinning (wire drawing) of the above, and is capable of efficiently manufacturing ultrahigh purity copper having a purity of 8N (99.999999 wt %) or higher, providing the obtained ultrahigh purity copper, and providing a bonding wire for use in a semiconductor element that can be thinned. | 11-05-2009 |
| 20100101687 | High strength copper alloy for electronic parts and electronic parts - A copper base alloy for electronic parts containing 2.0 to 4.0 mass % of Ti and 0.05 to 0.50 mass % of one or more of Fe, Co, Ni, Si, Cr, V, Nb, Zr, B and P, wherein the content of other impurity elements is 0.010 mass % or less in total, and the content of each of C and O is 0.010 mass % or less. This copper base alloy can be used without heat treatment after its press working into a part of a connector or the like; or can be also used in a state in which the alloy is subjected to a specific heat treatment so as to be improved in spring characteristics after its press working. | 04-29-2010 |
| 20140290805 | COPPER ALLOY AND COPPER ALLOY FORMING MATERIAL - Copper alloys according to first to third aspects contain Mg at a content of 3.3% by atom to 6.9% by atom, with the balance substantially being Cu and unavoidable impurities, wherein an oxygen content is in a range of 500 ppm by atom or less, and either one or both of the following conditions (a) and (b) are satisfied: (a) when a Mg content is set to X % by atom, an electrical conductivity σ (% IACS) satisfies the following Expression (1), σ≦{1.7241/(−0.0347×X | 10-02-2014 |
| 148433000 | Tin containing | 6 |
| 20090014097 | COPPER ALLOY CASTING HAVING EXCELLENT MACHINABILITY, STRENGTH, WEAR RESISTANCE AND CORROSION RESISTANCE AND METHOD OF CASTING THE SAME - A copper alloy casting with excellent machinability, strength, wear resistance and corrosion resistance contains Sn: 0.5 to 15 mass %; Zr: 0.001 to 0.049 mass %; P: 0.01 to 0.35 mass %; one or more elements selected from Pb: 0.01 to 15 mass %, Bi: 0.01 to 15 mass %, Se: 0.01 to 1.2 mass %, and Te: 0.05 to 1.2 mass %; and Cu: 73 mass % or more serving as a remainder. In this case, f | 01-15-2009 |
| 20090320964 | HEAT RESISTANCE COPPER ALLOY MATERIALS - The present invention discloses a heat resistance copper alloy material characterized in that said copper alloy material comprises 0.15 to 0.33 mass percent of Co, 0.041 to 0.089 mass percent of P, 0.02 to 0.25 mass percent of Sn, 0.01 to 0.40 mass percent of Zn and the remaining mass percent of Cu and inevitable impurities, wherein each content of Co, P, Sn and Zn satisfies the relationships 2.4≦([Co]−0.02)/[P]≦5.2 and 0.20≦[Co]+0.5 [P]+0.9 [Sn]+0.1 [Zn]≦0.54, wherein [Co], [P], [Sn] and [Zn] are said mass percents of Co, P, Sn and Zn content, respectively; and said copper alloy material is a pipe, plate, bar, wire or worked material obtained by working said pipe, plate, bar or wire material into predetermined shapes. | 12-31-2009 |
| 20110017358 | COPPER ALLOY MATERIAL FOR ELECTRICAL/ELECTRONIC EQUIPMENTS, AND ELECTRICAL/ELECTRONIC PART - A copper alloy material for an electrical/electronic equipment, containing Ni not less than 2.0 mass % and less than 3.3 mass %, having a content of Si within the range of 2.8 to 3.8 in terms of a mass ratio of Ni and Si (Ni/Si), and containing Mg 0.01 to 0.2 mass %, Sn 0.05 to 1.5 mass %, and Zn 0.2 to 1.5 mass %, with the balance of Cu and inevitable impurities, wherein when a test piece with thickness t of 0.20 mm and width w of 2.0 mm is subjected to 180°-bending with bending radius R (mm), a value of the minimum bending radius R causing no cracks is 0 mm to 0.1 mm; and, an electrical/electronic part obtained by working the same. | 01-27-2011 |
| 20110056591 | BRASS ALLOY POWDER, BRASS ALLOY EXTRUDED MATERIAL, AND METHOD FOR PRODUCING THE BRASS ALLOY EXTRUDED MATERIAL - Brass alloy powder has a brass composition formed by a mixed phase of α-phase and β-phase, and contains 0.5 to 5.0 mass % of chromium. The chromium includes a component that is solid-solved in a mother phase of brass, and a component that is precipitated at crystal grain boundaries. | 03-10-2011 |
| 20110174417 | HIGH STRENGTH AND HIGH CONDUCTIVITY COPPER ALLOY PIPE, ROD, OR WIRE - A high strength and high conductivity copper alloy pipe, rod, or wire is composed of an alloy composition containing 0.13 to 0.33 mass % of Co, 0.044 to 0.097 mass % of P, 0.005 to 0.80 mass % of Sn, and 0.00005 to 0.0050 mass % of O, wherein a content [Co] mass % of Co and a content [P] mass % of P satisfy a relationship of 2.9≦([Co]−0.007)/([P]−0.008)≦6.1, and the remainder includes Cu and inevitable impurities. The high strength and high conductivity copper alloy pipe, rod, or wire is produced by a process including a hot extruding process. Strength and conductivity of the high strength and high conductivity copper pipe, rod, or wire are improved by uniform precipitation of a compound of Co and P and by solid solution of Sn. | 07-21-2011 |
| 20130276938 | COPPER/ZINC ALLOYS HAVING LOW LEVELS OF LEAD AND GOOD MACHINABILITY - The free-cutting copper alloy according to the present invention contains a greatly reduced amount of lead in comparison with conventional free-cutting copper alloys, but provides industrially satisfactory machinability. The free-cutting alloys comprise 69 to 79 percent, by weight, of copper, 2.0 to 4.0 percent, by weight, of silicon, 0.02 to 0.4 percent, by weight, of lead, and the remaining percent, by weight, of zinc. | 10-24-2013 |
| 148435000 | Nickel containing | 2 |
| 20080277032 | COPPER, COPPER ALLOY, AND MANUFACTURING METHOD THEREFOR - Copper and copper alloy comprises: a structure having fine crystal grains with grain size of 1 μm or less after a final cold rolling with a reduction η, wherein η is expressed in the following formula and satisfying η≧3; and an elongation of 2% or more in a tensile test. | 11-13-2008 |
| 20110005644 | COPPER ALLOY MATERIAL FOR ELECTRIC/ELECTRONIC PARTS - A copper alloy material for an electric/electronic part, containing Co 0.5 to 2.5 mass % and Si 0.1 to 1.0 mass %, at a ratio of Co/Si of 3 to 5 in terms of mass ratio, with the balance of Cu and inevitable impurities, which is obtained by subjecting to a solution treatment at a temperature (° C.) from 800° C. to 960° C. and lower than −122.77X | 01-13-2011 |
