| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 148024000 | Metallic | 58 |
| 20080230152 | PASTE FOR FORMING AN INTERCONNECT AND INTERCONNECT FORMED FROM THE PASTE - A paste for forming interconnects that includes a quantity of metallic binder particles, a quantity of metallic filler particles, and a quantity of flux. | 09-25-2008 |
| 20090007989 | METAL BATH FLUX AND METHOD TO TREAT METAL BATH FLUX AND METHOD TO PRODUCE A METAL BATH FLUX - A metal bath flux as well as a method for the treatment of a metal bath and a method for the production of includes at least two separate solid components having a first component and a second component. With the separate solid components, it is possible to supply them to the bath together, and nevertheless to allow them to become effective at different points in time or at different locations by taking advantage of their different melting points or their different grain sizes. | 01-08-2009 |
| 20090014092 | PROCESS FOR PRODUCING A SOLDER PREFORM HAVING HIGH-MELTING METAL PARTICLES DISPERSED THEREIN - [Problems] A conventional process for producing a solder preform in which a predetermined amount of high-melting metal particles are directly put into molten solder and stirred, requires a long time for dispersing the high-melting metal particles by stirring. Therefore, in the conventional method for producing a solder preform, dissolution of the high-melting metal particles into the molten solder occurred during stirring, and their particle diameters became small. If a semiconductor chip and a substrate are soldered with a solder preform containing metal particles having such decreased diameters, the space between portions being soldered becomes narrow, and a sufficient bonding strength is not obtained. | 01-15-2009 |
| 20090014093 | FILLER METAL WITH FLUX FOR BRAZING AND SOLDERING AND METHOD OF MAKING AND USING SAME | 01-15-2009 |
| 20090032139 | TIN POWDER, MANUFACTURING METHOD OF TIN POWDER AND CONDUCTIVE PASTE CONTAINING TIN POWDER - Object of the invention is to provide a tin powder containing fine tin particles which performs fine pitch wiring circuit easily, excellent in filling the minute diameter via holes, and exhibits low temperature fusibility. In order to achieve the object, a copper powder slurry is prepared by adding a copper powder in water with agitation and a tin solution for deposition by substitution is prepared by adding an acid to an aqueous mixture solution containing a stannous salt and thiourea. Then the copper powder slurry and the tin solution for deposition by substitution are mixed with agitation in a certain ratio of tin in the solution against to copper in the slurry to deposit tin by substitution on the surface of the copper powder. As a result, the tin powder of the present invention is obtained. | 02-05-2009 |
| 20090050239 | BRAZING FLUX POWDER FOR ALUMINUM-BASED MATERIAL AND PRODUCTION METHOD OF FLUX POWDER - It is aimed at providing a brazing flux powder, which exhibits an excellent spreadability in case of brazing of an Mg-containing aluminum-based material, which is non-corrosive and is thus excellent in safety, which is relatively inexpensive and is thus economically excellent, and which can be used in a wide and general manner. There is provided an improvement in a flux powder containing therein KAlF | 02-26-2009 |
| 20090107584 | SOLDER AND METHODS OF MAKING SOLDER - Solder compositions and methods of forming solders are provided. The solder compositions exhibit desirable melting characteristics. In addition, the solder compositions may be useful in joining heat sensitive components such as sensors, system-in-package, memory, and MEMS devices. | 04-30-2009 |
| 20090120534 | Preflux Composition - The present invention relates to a preflux composition having excellent heat-resistance suited for the formation of a film on the surface of copper or copper alloy, and more precisely, a preflux composition having enhanced heat-resistance, compared with the conventional preflux composition, and capable of selectively coating a copper plating circuit. The preflux composition with high heat-resistance of the present invention is characteristically composed of 0.1-5 weight part of benzimidazole derivative, 0.5-20 weight part of organic acid or inorganic acid, 0.001-1 weight part of iron compound, 0.001-1.5 weight part of chelating agent, 0.0001-1 weight part of nickel compound and 0.01-1 weight part of iodine compound for 100 weight part of water. | 05-14-2009 |
| 20090139608 | Conductive Filler and Solder Material - There is provided a conductive filler with high heat resistance which can be melt-bonded under reflow heat treatment conditions for a lead-free solder and, after the bonding, does not melt under the same heat treatment conditions. The conductive filler is characterized in that, as measured by differential scanning calorimetry, it has at least one metastable metal alloy phase observed as an exothermic peak and has at least one melting point observed as an endothermic peak in each of the 210 to 240° C. range and the 300 to 450° C. range, and that the filler, upon heat treatment at 246° C., gives a bonded object which has, as measured by differential scanning calorimetry, no melting point observed as an endothermic peak in the 210 to 240° C. range or has a melting endotherm calculated from an endothermic peak area in the 210 to 240° C. range, the melting endotherm being 90% or less of the melting endotherm of the filler before bonding calculated from an endothermic peak area in the 210 to 240° C. range. | 06-04-2009 |
| 20090165893 | PASTE COMPOSITION FOR ALUMINUM BRAZING - A paste composition for aluminum brazing of the invention contains 40 to 65% by weight of a metal powder for brazing (a), 5 to 35% by weight of a fluoride type flux (b), 1 to 10% by weight of a methacrylic acid ester type polymer (c), and 10 to 40% by weight of an organic solvent (d); and the component (d) is a hydrocarbon type organic solvent having no aromatic ring and no hydroxyl group and the composition is in a paste-like state having a viscosity of 6,000 to 200,000 mPa·s at 23° C. and accordingly, the storage stability and applicability (practically, discharge property and pressure stability by using a dispenser) and brazing property can be improved in good balance. | 07-02-2009 |
| 20090266446 | NICKEL BRAZE ALLOY COMPOSITION - A nickel braze alloy composition includes a blend of a first nickel alloy and a second nickel alloy. The first nickel alloy includes about 4.75 wt %-10.5 wt % of chromium, about 5.5 wt %-6.7 wt % of aluminum, up to about 13 wt % cobalt, about 3.75 wt %-9.0 wt % of tantalum, about 1.3 wt %-2.25 wt % of molybdenum, about 3.0 wt %-6.8 wt % of tungsten, about 2.6 wt %-3.25 wt % of rhenium, up to about 0.02 wt % of boron, about 0.05 wt %-2.0 wt % of hafnium, up to about 0.14 wt % of carbon, up to about 0.35 wt % of zirconium, and a balance of nickel. The second nickel alloy includes about 21.25 wt %-22.75 wt % of chromium, about 5.7 wt %-6.3 wt % of aluminum, about 11.5 wt %-12.5 wt % of cobalt, about 5.7 wt %-6.3 wt % of silicon, boron in an amount no greater than 1.0 wt %, and a balance of nickel. | 10-29-2009 |
| 20090266447 | OPTIMIZATION OF METALLURGICAL PROPERTIES OF A SOLDER JOINT - Semiconductor packaging techniques are provided which optimize metallurgical properties of a joint using dissimilar solders. A solder composition for Controlled Collapse Chip Connection processing includes a combination of a tin based lead free solder component designed for a chip and a second solder component designed for a laminate. The total concentration of module Ag after reflow is less than 1.9% by weight. A method of manufacturing a solder component is also provided. | 10-29-2009 |
| 20090301606 | Lead-free solder paste - In a conventional Sn—Zn based lead-free solder, Zn crystallized to a large size of several tens of micrometers, and it was difficult to suppress the formation of coarse crystallizates and to increase the bonding strength without changing the soldering temperature. There were alloys which improved strength by the addition of a minute amount of a Group 1B metal, but the alloys had an increased melting temperature so that reflow could not be performed with the same temperature profile as for Sn—Pb, so the alloys had advantages and disadvantages. | 12-10-2009 |
| 20090301607 | Solder Paste and Solder Joint - The invention provides a solder paste which has a solidus temperature of 255° C. or above and is improved in the wettability between Bi and Cu or Ag electrode to attain approximately equivalent wettability to those of Pb-containing high-temperature solders even in low-temperature soldering. The solder paste comprises a metal powder component consisting of Bi or a Bi alloy, a solidus temperature lowering metal for Bi, and a solid-phase metal capable of forming an intermetallic compound with the solidus temperature lowering metal, and a flux component. | 12-10-2009 |
| 20090308496 | Flux for lead-free solder and soldering Method - A soldering flux which is suitable as a no-clean post flux in flow soldering and which can prevent the formation of whiskers which tends to occur when soldering electronic parts to a printed circuit board using a lead-free solder (such as Sn-3.0Ag-0.5Cu) having a higher Sn content and a higher melting point than the eutectic solder contains, in addition to a rosin as a base resin and an activator, 0.2-4 mass % of at least one compound selected from acid phosphate esters and derivatives thereof. The formation of whiskers can be more effectively prevented by carrying out soldering in a nitrogen atmosphere. | 12-17-2009 |
| 20090320960 | Solder composition - A solder composition containing a lead-free SnZn alloy and a solder flux that contains at least an epoxy resin and an organic carboxylic acid. The organic carboxylic acid is dispersed in the solder composition as a solid at room temperature, and has a molecular weight of from 100 to 200 g/mol. | 12-31-2009 |
| 20100096043 | High Temperature Solder Materials - A solder material is formed utilizing a transient liquid phase sintering process, where a precursor material is first formed. The precursor material comprises a plurality of metal particles including a first metal having a first melting point temperature and a second metal having a second melting point temperature, the first melting point temperature being greater than the second melting point temperature. The precursor material is heated to a process temperature (T | 04-22-2010 |
| 20100116376 | ANTI-TOMBSTONING LEAD FREE ALLOYS FOR SURFACE MOUNT REFLOW SOLDERING - A lead-free solder alloy composition comprising tin, silver and copper, and a process for reflow soldering for minimizing tombstoning frequency are disclosed. In one particular exemplary embodiment, the lead-free Sn—Ag—Cu solder alloys for minimizing the tombstoning effect of the present disclosure display high mass fraction during melting and prolonged melting as shown by a widened DSC peaks, that allows for a balanced surface tension on both ends of the chip component to develop. In accordance with further aspects of this exemplary embodiment, the alloys display a mass fraction of solid during melting greater than 20% and a DSC peak width greater than 8° C. using a 5° C./min scan rate. In accordance with further aspects of this exemplary embodiment, the alloy comprises on a weight basis Ag 1-4.5%, Cu 0.3-1% balanced with Sn. | 05-13-2010 |
| 20100126631 | CARBON NANOTUBES SOLDER COMPOSITE FOR HIGH PERFORMANCE INTERCONNECT - An embodiment of the present invention is an interconnect technique. Carbon nanotubes (CNTs) are prepared. A CNT-solder composite paste is formed containing the CNTs and solder with a pre-defined volume fraction. | 05-27-2010 |
| 20100175790 | New Flux Composition and Process For Use Thereof - The invention relates to a composition of matter comprising a soldering flux, wherein the flux consists essentially of a combination of a fluxing agent and a solvent, and wherein the fluxing agent comprises a keto acid such as levulinic acid or acetylbutyric acid. The flux may also comprises an ester acid, or comprises a mixture of the keto acid with the ester acid. The solvent comprises a mixture of a tacky solvent with a non-tacky solvent. The invention also relates to a process comprising soldering at least two surfaces together, each of which comprises a metal area to which solder can adhere by employing the following steps in any order: applying solder to at least one of the metal areas, aligning the metal areas so that they are superimposed over one another, heating at least one of the areas to a temperature that comprises at least the melting temperature of the solder. The last step comprises joining the superimposed areas to one another. The process employs the flux composition operatively associated with the solder, and in one embodiment the invention comprises a mixture of the flux composition with powdered solder. In another embodiment, the process comprises IMS, C4 and C4NP processes and the solder comprises a lead free solder. The invention also comprises a product produced by the foregoing process or processes. | 07-15-2010 |
| 20100243107 | MATERIAL AND METHOD OF MANUFACTURING OF A SOLDER JOINT WITH HIGH THERMAL CONDUCTIVITY AND HIGH ELECTRICAL CONDUCTIVITY - A solder composition for forming a solder joint. The composition includes a powder material including a solid metal matrix material and a filler material. The solid metal matrix material includes one or more of tin-silver-copper (Sn—Ag—Cu), tin-copper (Sn—Cu), tin-copper-nickel (Sn—Cu—Ni), tin-silver (Sn—Ag), tin-silver-bismuth (Sn—Ag—Bi), tin-bismuth-indium (Sn—Bi—In), tin-gold (Au—Sn), tin-zinc (Sn—Zn), tin-zinc-bismuth (Sn—Zn—Bi), tin-bismuth-silver (Sn—Bi—Ag), tin (Sn), tin-indium (Sn—In), indium (In), indium-silver (In—Ag), and tin-lead (Sn—Pb). The filler material includes one or more of copper (Cu), gold (Au), nickel (Ni), nickel-gold (Ni—Au), carbon, silver (Ag), aluminum (Al), molybdenum (Mo), nickel (Ni) or nickel-gold (Ni—Au) coated carbon, the platinum group metals (PGM's), and their alloys | 09-30-2010 |
| 20100252144 | SOLDERING FLUX AND SOLDER PASTE COMPOSITION - There is provided a soldering flux in which the volatilized amount in reflow is reduced to enable soldering with a smaller environmental load while suppressing the stickiness of the flux residue and ensuring a high reliability. A solder paste composition using the same is also provided. The soldering flux comprises a base resin, an activating agent, and a solvent, wherein the solvent comprises an oil component having an iodine value of 120 to 170. Preferably, the content of the oil component is 22 to 80% by weight relative to the whole flux. Also, the oil component preferably contains at least one of drying oil and semidrying oil, and more preferably contains one or more kinds selected from tung oil, poppy-seed oil, walnut oil, safflower oil, sunflower oil, and soy bean oil. The solder paste composition comprises the soldering flux described above and a solder alloy powder. | 10-07-2010 |
| 20110048582 | Ti-Based Brazing Filler Metal and Method for Producing the Same - A Ti-based brazing filler material comprising in mixture a Zr-containing alloy powder comprising 30 to 90% by mass of one or two of Cu and Ni, the balance being Zr and unavoidable impurities and a Ti-based powder comprising 0 to 50% by mass of one or two of Cu and Ni, the balance being Ti and unavoidable impurities, wherein the weight ratio of the Zr-containing alloy powder to the Ti-based powder is 8:2 to 4:6. This Ti-based brazing filler material can achieve good brazing and can exhibit excellent effects in the production of aerospace instruments, medical instruments, frames of glasses, heat-exchangers made from titanium. | 03-03-2011 |
| 20110220247 | FLUX COMPOSITION AND SOLDERING PASTE COMPOSITION - Disclosed herein are a flux and a soldering paste based on the flux. The flux is free from a change in viscosity with age, “skinned surface,” and “rough and crumbling,” and is excellent in printability and solderability. The flux contains, as elements, a resin, a thixo agent, an activator, a solvent and glucopyranosylamine type nanotube. The soldering paste further contains a solder powder. Preferably, the solder powder is free from lead. | 09-15-2011 |
| 20110265913 | THERMALLY DECOMPOSABLE POLYMER COATED METAL POWDERS - The present invention relates to polymer coated metal powders, such as metal powders used in the formation of solder alloys and pastes. The metal powders are coated with curable compositions of cyanoacrylates. The present invention relates to polymer coated metal powders, such as metal powders used in the formation of solder alloys and pastes. The metal powders are coated with curable compositions of cyanoacrylates, and once cured the coating on the metal powder is a cyanoacrylate polymer. | 11-03-2011 |
| 20120018048 | CREAM SOLDER AND METHOD OF SOLDERING ELECTRONIC PART - A cream solder obtained by kneading an Sn—Ag—Cu alloy together with a flux, wherein the Sn—Ag—Cu alloy includes a mixture of a first powdery alloy and a second powdery alloy, the first powdery alloy is represented by an Sn—Ag phase diagram having a solid-liquid coexistence region and has a given silver amount which is larger than that in the eutectic composition (3.5 wt. % silver), and the second powdery alloy has a silver amount which is that in the eutectic composition (3.5 wt. % silver) or which is close to that in the eutectic composition and is smaller than that in the first powdery alloy. This cream solder has excellent strength and thermal stability, and satisfactory bonding properties. It is based on an inexpensive Sn—Ag—Cu solder alloy. It is suitable for use as a high-temperature-side lead-free solder material conformable to temperature gradation bonding. Also provided is a method of soldering. | 01-26-2012 |
| 20120042990 | ORGANIC ACID- OR LATENT ORGANIC ACID-FUNCTIONALIZED POLYMER-COATED METAL POWDERS FOR SOLDER PASTES - The present invention relates to organic acid- or latent organic acid-functionalized polymer-coated metal powders, such as metal powders used as appropriate in the formation of solder alloys, spheres and pastes. | 02-23-2012 |
| 20120055586 | VARIABLE MELTING POINT SOLDERS - The present invention relates to variable melting point solder formulations. The solder is comprised of at least one base metal or base metal alloy, preferably alloyed with at least one melting point depressant metal, such that the solidus point of the solder composition is reduced to an initial solidus temperature. Said base metal or base metal alloy, alloyed with at least one melting point depressant metal is mixed with at least one additive metal or additive metal alloy. When heated to a process temperature above said initial solidus temperature, a reaction occurs between the melting point depressant metal, and the additive metal, such that solidification occurs at the process temperature via the formation of intermetallic phases, effectively increasing the solidus of the base metal, and of the overall solder. | 03-08-2012 |
| 20120175020 | LOW SILVER SOLDER ALLOY AND SOLDER PASTE COMPOSITION - A low silver solder alloy of the present invention comprises 0.05-2.0% by mass of silver; 1.0% by mass or less of copper; 3.0% by mass or less of antimony; 2.0% by mass or less of bismuth; 4.0% by mass or less of indium; 0.2% by mass or less of nickel; 0.1% by mass or less of germanium; 0.5% by mass or less of cobalt (provided that none of the copper, the antimony, the bismuth, the indium, the nickel, the germanium, and the cobalt is 0% by mass); and the residue is tin. According to the present invention, the long-term reliable low silver solder alloy is provided, wherein the low silver solder alloy permits the cost reduction by decreasing the Ag content, and has the excellent stretch, melting point, and strength, and also has the high fatigue resistance (thermal fatigue resistance). | 07-12-2012 |
| 20130042946 | SOLDER PASTE COMPOSITION, A SOLDER PASTE AND A SOLDERING FLUX - The present invention relates to a solder paste composition, a solder paste and a soldering flux. The soldering flux comprises a resin, a thixotropic agent, an activator, a solvent as well as a long-chain thiol and/or an organic chelating agent. | 02-21-2013 |
| 20130098506 | LEAD-FREE SOLDER PASTE - As electronic equipment has become smaller in size, printed circuit boards which cannot be subjected to cleaning have been developed, and a no-clean lead-free solder paste is becoming necessary. In order for a solder paste not to require cleaning, it is necessary that the color of the residue be transparent and that the residue be non-tacky. A maleated rosin, which is a rosin suited for no-clean paste, has a high acid value so it is not suitable for a flux for lead-free solder. As a means of suppressing a reaction between a flux containing a maleated rosin and a Sn—Ag—Cu based solder alloy powder, a Sn—Ag—Cu—Sb based solder alloy powder is used which adds 1-8 mass % of Sb to a Sn—Ag—Cu based solder alloy. As a result, it is possible to provide a solder paste which has the excellent effect that the solder paste does not easily undergo changes over time and | 04-25-2013 |
| 20130160895 | SOLDER PASTE FOR PASTING ELECTRONIC PART ON PRINTED CIRCUIT BOARD - A solder paste includes alloy powder, conductive adhesive, and flux. The mass ratio of the alloy powder to the conductive adhesive is in the range of about 3:1 to 5:1. The mass ratio of the alloy powder to the flux is in the range of about 8:1 to 10:1. The alloy powder includes tin. The weight percentage of the tin in the alloy powder is in the range of about 37.8%˜46.2%. | 06-27-2013 |
| 20130186519 | SOLDERING PASTE AND FLUX - The object of the present invention is to provide a solder paste that enables to form a surface mounting structure for electronic components that exhibits crack resistance in a solder joint section even in 100 heat-shock cycles at −40° C. to 150° C. as required for use in the vicinity of engines for vehicular applications. A flux including an amine halogen salt and a dicarboxylic acid is kneaded with a Sn—Ag—Bi—In alloy powder. As a result, a solder paste exhibiting long continuous printability, little occurrence of solder balls, and excellent joining ability with no cracking in 100 heat-shock cycles at −40° C. to 150° C. is obtained. | 07-25-2013 |
| 20130199673 | PROCESS TO PREPARE METAL NANOPARTICLES OR METAL OXIDE NANOPARTICLES - The invention is directed to a process to prepare metal nanoparticles or metal oxide nanoparticles by applying a cathodic potential as an alternating current (ac) voltage to a solid starting metal object which solid metal object is in contact with a liquid electrolyte comprising a stabilising cation. The invention is also directed to the use of the nanoparticles as a catalyst. | 08-08-2013 |
| 20130276937 | LEAD-FREE SOLDER FLUX AND LEAD-FREE SOLDER PASTE - A principal object of the present invention is to provide a flux which can be used to produce a lead-free solder paste which is excellent in viscosity stability and exhibits excellent wettability at the time of soldering even in atmospheric air. The flux is a lead-free solder flux having a bromine atom concentration of 400 to 20000 ppm based on 0.1 g of the flux and comprising 0.01 to 0.7% by weight of an amine compound (a) represented by the general formula (1): H | 10-24-2013 |
| 20130327444 | Solder paste for bonding micro components - A solder paste for soldering micro components which suppress electro-migration is provided. The solder paste comprising: a powdered Pb-free soldering alloy comprising Cu of 0.1˜3.0 wt. % and In of 0.5˜8.0 wt. % simultaneously in addition to Sn; and a pasty or liquid flux; the powdered Pb-free soldering alloy and the pasty or liquid flux being mixed; whereby effectively suppressing electro-migration occurring at a solder bonding portion. It is possible to add Ag, Sb, Ni, Co, Fe, Mn and Cr as a strength improvement element, Bi and Zn as a melting point drop element and P, Ga and Ge as an anti-oxidant element to the powdered Pb-free soldering alloy. | 12-12-2013 |
| 20140053954 | FLUX FOR SOLDERING AND SOLDER PASTE COMPOSITION - The present invention is a flux for soldering, containing a base resin and an activating agent, in which the base resin contains a thermoplastic acrylic resin obtained by polymerizing a monomer component containing a long chain alkyl(meth)acrylate, the long chain alkyl moiety of the long chain alkyl(meth)acrylate has a branched structure having 12 to 23 carbon atoms, and the acrylic resin has a weight average molecular weight of 30000 or less. A solder paste composition of the present invention improves wettability, storage stability and crack resistance in residue portions, and printability for fine portions without adhering to a squeegee when printed. | 02-27-2014 |
| 20140083567 | SOLDERING PASTE FLUX AND SOLDERING PASTE - The present invention relates to a soldering paste flux, and the soldering paste flux includes (A) a thermosetting prepolymer, (B) a polyfunctional epoxy monomer or oligomer having three or more functional groups in a molecule, (C) a carboxylic acid having a melting point of 80 to 170° C., and (D) a cyanate ester having two or more cyanato groups in a molecule. | 03-27-2014 |
| 20140130940 | Solder Paste - To provide solder paste that can be filled in minute apertures. | 05-15-2014 |
| 20140137988 | FLUX - To provide flux which can suppress occurrence of the migration certainly on a soldered portion on which residue of flux is formed. | 05-22-2014 |
| 20140150929 | COMPOSITION OF SOLID-CONTAINING PASTE - Solder paste compositions and methods for applying solder paste. The solder paste includes lubricating additives to the flux to decrease friction and the changes of metal to metal contact between the surfaces of the solder balls and other surfaces that the solder balls come into contact with. The solder paste also includes solder balls of different average sizes, that improves the desirable liquid like properties of the granular paste while further reducing viscosity. As such, the solder paste is used in current screen printing solder paste application methods without the risk of clogging or agglomeration of solder paste particles on surfaces. The solder paste is also used in jetting or dispensing solder paste application methods without the risk of clogging or agglomeration within the cylinders/containers or apertures and nozzles that are used within such methods. | 06-05-2014 |
| 20140158255 | TOUGHENED SOLDER FOR DOWNHOLE APPLICATIONS, METHODS OF MANUFACTURE THEREOF AND ARTICLES COMPRISING THE SAME - Disclosed herein is a solder composition comprising a metal or a metal alloy; and an electrically conductive high temperature polymeric composition; where the electrically conductive high temperature polymeric composition is dispersed homogeneously in the metal; and where the electrically conductive high temperature polymeric composition has a higher glass transition temperature or a melting point than the flow temperature of the metal or metal alloy. Disclosed herein too is a method comprising mixing an electrically conductive high temperature polymeric composition with a metal or a metal alloy to form the solder composition; where the electrically conductive high temperature polymeric composition is dispersed homogeneously in the metal; and where the electrically conductive high temperature polymeric composition has a higher glass transition temperature or a melting point than the flow temperature of the metal or metal alloy. | 06-12-2014 |
| 20140174605 | SOLDER POWDER, AND SOLDER PASTE USING SOLDER POWDER - In solder powder having an average particle size of 5 μm or less and constituted by a center core and a covering layer covering the center core, wherein the center core consists of an intermetallic compound of silver and tin, or silver and the intermetallic compound of silver and tin, the covering layer consists of tin, and an intermediate layer which consists of an intermetallic compound of copper and tin is interposed between the center core and the covering layer so that at least a part of the center core is covered thereby. | 06-26-2014 |
| 20140182746 | DI- OR POLY-FUNCTIONAL ELECTRON DEFICIENT OLEFINS COATED METAL POWDERS FOR SOLDER PASTE - The present invention relates to cured products of di- or poly-functional electron deficient olefins coated onto at least a portion of a surface of metal powders, such as metal powders used as appropriate in the formation of solder alloys, spheres and pastes. | 07-03-2014 |
| 20140332116 | SOLDER PASTE - A solder paste includes a flux and powder mixed with the flux, where the powder includes first powder and second powder mixed with each other. The first powder may be a tin (Sn) and at least one metal dissolved in the tin (Sn), and the second powder may be a copper (Cu) powder, the surface of which is coated with silver (Ag). | 11-13-2014 |
| 20140345750 | BRAZING PRE-FLUX COATING WITH IMPROVED CORROSION PERFORMANCE - Pre-flux coating for the manufacturing of components by brazing, in particular manufacturing of heat exchangers of aluminium components including one or more fluxes and filler material. The coating is composed of one ore more fluxes in the form of potassium aluminum fluoride K1-3AIF4.6, potassium trifluoro zincate, KZnF3, lithium aluminum fluoride Li3AIF6, filler material in the form of metallic Si particles, Al—Si particles and/or potassium fluoro silicate K2S1F6, and additive in the form of alumminium oxide and/or other suitable oxide or material forming a post braze ceramic layer, and further including solvent and binder containing at least 10% by weight of a synthetic resin which is based, as its main constituent, on methacrylate homopolymer or methacrylate copolymer. | 11-27-2014 |
| 20150027589 | Solder Paste - A solder paste which solves any nozzle clogging that suddenly occurs in a case of being used in a discharging method and which also realizes residue-free because flux is decomposed by heating during soldering. In the solder paste produced by mixing solder powders with the flux, the flux is flux containing polyalkyl-methacrylate of not less than 1.0 mass % and less than 2.0 mass % as methacrylate polymer of an amount such that it prevents the solder powders from being sedimented at ordinary temperature and it is decomposed or evaporated in the process of heating during the soldering, and containing stearic acid amide of not less than 5.0 mass % and less than 15.0 mass %, as viscosity modifier, wherein viscosity is 50 through 150 Pa·s. It is preferable that the content of flux in the solder paste is not less than 11 mass % and less than 13 mass %. | 01-29-2015 |
| 20150059928 | Flux and Solder Paste - Provided is flux which is capable of suppressing increase in the viscosity of solder paste during its storage and is also capable of improving the fusibility of a solder alloy. | 03-05-2015 |
| 20150075676 | BASE RESIN FOR SOLDERING FLUX, SOLDERING FLUX AND SOLDER PASTE - The object of the present invention is to provide a soldering-flux-oriented novel base resin that enhances the fluidity of a soldering flux and both the visco-stability and adhesion of a solder paste, while improving the color tone and anti-crack property of the flux residue. The present invention is directed to a base resin for a soldering flux, the base resin comprising a rosin (A) containing at least 15 wt % of a pimarane-type resin acid (a-1), at least 1 wt % of a labdane-type resin acid (a-2), and at least 50 wt % of an abietane-type resin acid that has no conjugated double bond (a-3). | 03-19-2015 |
| 20150090367 | FLUX FOR SOLDERING AND SOLDER PASTE COMPOSITION - A flux for soldering includes a base resin, a solvent, and an activating agent. The base resin contains a rosin. An amount of the rosin to be incorporated is from 0% by weight to 30% by weight with respect to a total amount of the base resin. The activating agent includes a compound having a plurality of carboxyl groups on a cyclohexyl structure represented by a general formula (1). | 04-02-2015 |
| 20150306711 | BRAZING COMPOSITIONS AND USES THEREOF - Described herein are compositions for use in the brazing of metal substrates, methods of making and using these compositions are also described herein. Heat exchangers often have a distributor tube whose external surface is provided with cooling fins. The distributor tube is typically a steel tube coated with a metal having good heat conduction, such as aluminum. The cooling fins themselves also generally comprise aluminum because of its good heat conductivity and low weight. | 10-29-2015 |
| 20150343569 | SN-AG-CU-BASED SOLDER POWDER AND SOLDER PASTE USING SAID POWDER - The present invention is directed to an Sn—Ag—Cu-based solder powder which comprises solder powder having an average particle size of 5 μm or less, and a dried material of a solution of hydroxybenzoic acid or an ester thereof having a melting point of 250° C. or lower being attached onto a surface of the solder powder as an additive, wherein the additive is preferably salicylic acid, ethyl 3,4-dihydroxybenzoate or ethyl 3,5-dihydroxybenzoate, an attached amount of the additive is preferably 0.01 to 1.0 part by mass based on 100 parts by mass of the total amount of the components of tin, silver and copper contained in the solder powder, a content of the silver is 0.1 to 10% by mass when the total amount of the components of tin, silver and copper is made 100% by mass, a content of the copper is 0.1 to 2.0% by mass when the total amount of the components of tin, silver and copper is made 100% by mass, and a remainder being tin. | 12-03-2015 |
| 20150343571 | FLUX AND SOLDER PASTE - A soldering flux of the present invention contains, as a base resin, an acrylic resin (A) having an acid value of 0 to 70, and an acrylic resin (B) having an acid value of 30 to 230. The acrylic resin (A) is obtained by polymerization of a monomer mixture containing alkyl(meth)acrylate having an alkyl group having carbon atoms of 12 to 23. The acrylic resin (B) is obtained by polymerization of a monomer mixture containing alkyl(meth)acrylate having an alkyl group having carbon atoms of 6 to 10. The acid value of the acrylic resin (B) is higher than the acid value of the acrylic resin (A), and a difference between these two resins is 15 or more. | 12-03-2015 |
| 20160052092 | AQUEOUS ALUMINUM BRAZING COMPOSITION - An aqueous aluminum brazing composition contains, as a binder resin, a water-soluble/dispersible polyurethane resin that exhibits a residual ratio of 60% by mass or less in a 400° C. heating environment and exhibits a residual ratio of 1.0% by mass or less in a 520° C. heating environment. | 02-25-2016 |
| 20160082512 | SINTER PASTE WITH PARTIALLY OXIDIZED METAL PARTICLES - A sinterable mixture and method of producing the mixture are provided containing: (a) metal particles and (b) an organic compound represented by Formula I: R | 03-24-2016 |
| 20160121432 | COMPOSITION FOR METAL BONDING - Provided is a composition for metal bonding, especially a bonding composition containing metal particles, which is capable of achieving high bonding strength by bonding at a relatively low temperature without the application of a pressure, and which has heat resistance and is thus not susceptible to decrease in the bonding strength due to decomposition or deterioration of a resin component when the service temperature thereof is increased. A bonding composition which is characterized by containing two or more kinds of metal particles having different average particle diameters, an organic component and a dispersant, and which is also characterized in that the particle diameter ratio of the average particle diameter (DS) of metal particles (S) that have the smallest average particle diameter to the average particle diameter (DL) of metal particles (L) that have the largest average particle diameter, namely DS/DL is from 1×10-4 to 0.5. | 05-05-2016 |
| 20160158897 | Solder Paste - A solder paste whereby metal does not flow out of a joint during a second or subsequent reflow heating stage. The solder paste exhibits high joint strength at room temperature and at high temperatures, excels in terms of temporal stability, exhibits minimal void formation, and can form highly cohesive joints. The solder paste comprises a powdered metal component and a flux component, the powdered metal component comprising: a powdered intermetallic compound that comprises copper and tin and has metal barrier layers covering the surfaces thereof and a solder powder including tin as a main component. Neither the powdered intermetallic compound nor the solder powder contains a copper-only phase, inhibiting the elution of copper ions into the flux. | 06-09-2016 |
| 20160167178 | WELDING ACTIVATED FLUX FOR STRUCTURAL ALLOY STEELS | 06-16-2016 |
