| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 134033000 | Centrifugal force and/or rotated work body | 75 |
| 20080210264 | Turbine Cleaning - Depending on the actual operating situation and the composition of the fuels used for driving the internal combustion engine, contamination of the moving blades, of the guide device and of the turbine casing parts occurs sooner or later in the exhaust gas turbine. According to the invention, a small quantity of cleaning fluid is fed continuously or cyclically into the exhaust gas flow of an exhaust gas turbine and is directed onto the components to be cleaned. The small quantity of cleaning fluid can be fed in with unchanged operation of the internal combustion engine, such that the exhaust gas turbine can be cleaned or kept clean within the entire operating range of the internal combustion engine. Fluctuations in the power output of the internal combustion engine on account of requisite cleaning of the exhaust gas turbine therefore do not occur. Furthermore, the formation of thermostress cracks in the critical turbine casing parts is largely avoided. | 09-04-2008 |
| 20080216873 | SYSTEM AND DEVICES FOR COLLECTING AND TREATING WASTE WATER FROM ENGINE WASHING - The present invention relates to the field of washing engines, particularly using washing liquids such as water and detergent or water only, and more specifically to systems, apparatus and a mobile cart comprising such a system for collecting and treating the waste water from engine washing operations. The system comprises a collecting device for collecting waste liquid during a washing operation of the engine and a treatment device for treating waste liquid collected during said washing operation. According to an embodiment, the system is arranged on a mobile cart ( | 09-11-2008 |
| 20080223412 | Substrate support member and apparatus and method for treating substrate with the same - A substrate support unit supplies a swirl flow to a substrate to rotate and float the substrate from a chuck plate during a process. A process is performed while rotating and floating the substrate. Thus, the substrate is supported and rotates at a process speed while floating form the chuck plate with a non-contact manner. | 09-18-2008 |
| 20080230091 | Rotisserie skewer, basket and parts cleaning assembly - A rotisserie skewer, basket and parts cleaning assembly is provided. The assembly is located within a wash tank that includes a jet nozzle to expel a stream of fluid into said wash tank. The assembly is rotatably mounted within the wash tank and is capable of holding parts for cleaning. | 09-25-2008 |
| 20080276972 | WASH CYCLE FOR OXIDIZING AGENTS - A wash cycle for a clothes washer, the clothes washer having a wash zone defined within a rotating drum having an outer wall, for receiving a load of fabric. The steps include dispensing a volume of a first wash liquor to the wash zone, rotating the drum to move the fabric load toward the outer wall and recirculating the first wash liquor through the fabric load and wash zone, all during a first period of time. The fabric load is then flexed during a second period of time. The cycle continues with the steps of dispensing a volume of a second, different wash liquor to the wash zone, rotating the drum to move the fabric load toward the outer wall and recirculating the second liquor through the fabric load and wash zone during a third period of time. One of the two wash liquors is an oxidizing agent wash liquor. Then the remainder of the wash cycle is completed. | 11-13-2008 |
| 20090056765 | SINGLE TYPE SUBSTRATE TREATING APPARATUS AND CLEANING METHOD THEREOF - Provided is a single type substrate treating apparatus and a cleaning method the substrate treating apparatus. A cleaning process is periodically performed on a substrate support member after a series of repeated substrate treating processes is performed to remove contaminants remaining on the substrate support member and minimize thermal deformation of the substrate support member due to a high temperature chemical solution. | 03-05-2009 |
| 20090056766 | Substrate processing apparatus and method - In a substrate processing apparatus, a control section is preset to perform a chemical liquid process by use of a chemical liquid after a rinsing process by use of a rinsing liquid. The control section first executes a step of rotating a substrate at a rotational speed not lower than that used in the rinsing process and supplying the chemical liquid onto the substrate, thereby performing cleaning inside a drain cup by the chemical liquid, while discarding, through a waste line, liquid received by the drain cup. The control section then executes a step of rotating the substrate at a decreased rotational speed for the chemical liquid process and supplying the chemical liquid onto the substrate, thereby performing the chemical liquid process on the substrate, while collecting, through a collection line, liquid received by the drain cup. | 03-05-2009 |
| 20090065030 | Washer and method of performing spinning operation - A washer and a method of performing a spinning operation are disclosed. The washer includes a tub which stores clothes to be washed, and a motor which rotates the tub. It also includes a microprocessor which generates a pump driving signal having duty ratios to power on and off a drain pump during at least one preliminary and a main sub-cycles of a selected spinning operation. The method of performing the spinning operation includes accelerating, decelerating, and maintaining a certain speed during the at least one preliminary sub-cycle of the spinning operation. However, the main sub-cycle includes accelerating and maintaining another certain speed. According to the principles of the present invention, the washer and the method of performing the spinning operation prevent the drain pump from not only overheating but also creating power loss. | 03-12-2009 |
| 20090090395 | METHOD OF REMOVING PARTICLES FROM WAFER - A method of removing particles from a wafer is provided. The method is adopted after a process for removing unreactive metal of a salicide process or after a salicide process and having oxide residue remaining on a wafer or after a chemical vapor deposition (CVD) process that resulted with particles on a wafer. The method includes performing at least two cycles (stages) of intermediate rinse process. Each cycle of the intermediate rinse process includes conducting a procedure of rotating the wafer at a high speed first, and then conducting a procedure of rotating the wafer at a low speed. | 04-09-2009 |
| 20090139549 | Immersion Cleaner for Print Rollers - What is contemplated is a printing cylinder washer having a removable or portable drive assembly, or a series of portable drive assemblies of different lengths to accommodate different sizes of print rollers. The drive assemblies have a drive mechanism enabled by a dynamic flow of cleaning solution within the washer reservoir. What is also contemplated is the use of an elevation system, an agitation platform, under-immersion spray bars, an ultrasonic wave cleaning system, and a hatch or door equipped with a thermal breaker in conjunction with the hydro-driven portable drive assembly. What is also contemplated is a method of washing printing rollers within the above-described printing cylinder washer by aligning a nozzle with the drive assembly. | 06-04-2009 |
| 20090159100 | TWO-PIECE MAGNETICALLY COUPLED SUBSTRATE ROLLER USED IN MEGASONIC CLEANING PROCESS - Mechanisms which rotate semiconductor substrates while immersed in wet chemicals are often complex due to a need to prevent leakage of the chemicals. Wear of the mechanisms necessitates replacement, entailing significant maintenance costs. A two-part semiconductor substrate roller is disclosed which consists of a rotary power coupler and an inexpensive replaceable roller component which attaches to the rotary power coupler in a simple manner. An external rotary power source turns the rotary power coupler through a mechanism that prevents leakage of the wet chemicals from the processing equipment. The replaceable roller component may be attached to the rotary power coupler by any of several mechanisms. The cost of the replaceable roller component is less than 10 percent of the cost of the rotary power coupler. A method of replacing the replaceable roller component and a method of processing semiconductor substrates using the instant invention are also disclosed. | 06-25-2009 |
| 20090205684 | SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, AND STORAGE MEDIUM - A substrate processing apparatus capable of reducing a supply amount of low humidity is disclosed. The substrate processing apparatus includes a chamber, a spin chuck, a gas discharging head, a driving device, a processing liquid supply nozzle, an IPA supply | 08-20-2009 |
| 20090293918 | FRAME FOR CLEANING PAINT ROLLERS AND METHOD - A frame for supporting a paint roller during a cleaning function includes a first support for preventing migration of the paint roller in an axial direction, which first support is fixedly mounted on a shaft engagable with a chuck of an electric drill or crank to impart rotation to the frame and a second support axially displaced from the first support to serve as a mounting supporting an interior surface of the paint roller. | 12-03-2009 |
| 20090293919 | METHOD FOR CLEANING SEMICONDUCTOR WAFER - A semiconductor wafer is cleaned by supplying a given cleaning solution to a central position of a front surface and/or a back surface of a semiconductor wafer while rotating the wafer, wherein the cleaning is conducted so as to form a water film having a thickness of 5-10 μm on a whole surface of the wafer with the cleaning solution. | 12-03-2009 |
| 20100147335 | LIQUID PROCESSING APPARATUS, LIQUID PROCESSING METHOD, AND STORAGE MEDIUM - A liquid processing apparatus includes: a hollow holding plate to hold an object to be processed; a hollow outer rotary shaft fixedly joined to the holding plate; a lift pin plate having a lift pin to support the object; an inner rotary shaft fixedly joined to the lift pin plate; and a lifting member to raise and lower the lift pin plate to locate the lift pin plate on an upper position and a lower position. Inside the inner rotary shaft, there is disposed a cleaning-liquid supply part to supply a cleaning liquid to the object to be processed. An outer rotary drive part is joined to the outer rotary shaft, the outer rotary drive part being configured to rotate the outer rotary shaft. An inner rotary drive part is joined to the inner rotary shaft, the inner rotary drive part being configured to rotate the inner rotary shaft. | 06-17-2010 |
| 20100163078 | SPINNER AND METHOD OF CLEANING SUBSTRATE USING THE SPINNER - A method includes spinning a semiconductor wafer about an axis normal to a major surface of the wafer. The wafer is translated in a direction parallel to the major surface with an oscillatory motion, while spinning the wafer. A material is sprayed from first and second nozzles or orifices at respective first and second locations on the major surface of the wafer simultaneously while spinning the wafer and translating the wafer. | 07-01-2010 |
| 20100200023 | DEVICE AND METHOD FOR CLEANING THE CORE ENGINE OF A JET ENGINE - The object of the invention is a device for cleaning the core engine of a jet engine, having a supply unit, which provides the cleaning medium, a nozzle unit, which is configured for feeding the cleaning medium into the core engine, and a line connection between the supply unit and the nozzle unit. The invention provides that the nozzle unit has a means for the rotationally fixed connection to the fan shaft of the jet engine, and that a rotary coupling is provided between the nozzle unit and the line connection. The object of the invention is further an arrangement of such a device and a turbo fan jet engine, and a method for cleaning the core engine of a jet engine using the device. | 08-12-2010 |
| 20100263691 | PAINT ROLLER CLEANING SYSTEM AND METHOD - The present invention relates to a system and method for cleaning a paint roller. The system according to the present invention includes: a roller holder; an attachment shaft, where the attachment shaft securely attaches to the roller holder; and a means to rotate the attachment shaft and spindle holder assembly at variable speeds. The means to rotate includes a hand held power tool. | 10-21-2010 |
| 20100300494 | FILTER CARTRIDGE, AND DEVICE AND METHOD FOR CLEANING A FILTER CARTRIDGE - A reusable filter cartridge having a symmetrical structure, the reusable filter cartridge comprising a tubular outer pipe having perforations arranged therein. A tubular inner pipe having perforations is arranged therein, and has a smaller diameter than the diameter of the outer pipe such that an annulus is formed between the outer and inner pipes. A filtering media is disposed in the annulus between the outer and inner pipes. A first and second lid is provided, each being secured at opposite ends of the outer and inner pipes; one of the lids having a central opening therein for water to flow out of or into the inner pipe. The reusable filter cartridge further comprises a coupling arrangement for coupling the filter cartridge with a rotating element of a cleaning device so that the filter media can be cleaned by rotation of the filter cartridge around its axis inside the cleaning device. The invention further includes a cleaning device for cleaning a reusable filter cartridge and a method for cleaning a used filter cartridge. | 12-02-2010 |
| 20100307539 | SUBSTRATE LIQUID PROCESSING APPARATUS, SUBSTRATE LIQUID PROCESSING METHOD, AND STORAGE MEDIUM HAVING SUBSTRATE LIQUID PROCESSING PROGRAM STORED THEREIN - A substrate liquid cleaning process is disclosed by utilizing a substrate liquid processing apparatus having, inter alia, a rotating mechanism that rotates a substrate to be cleaned, a peripheral edge cleaning mechanism that cleans the peripheral edge of the substrate by a rotating cleaning body, and a cleaning solution supply mechanism that supplies the cleaning solution to the substrate. The substrate liquid cleaning process is performed by contacting the rotating cleaning body to a peripheral edge of a rotating substrate while supplying a cleaning solution. The rotational direction of the substrate and the cleaning body is set to be an opposite direction so that the proceeding direction of the substrate and the cleaning body becomes the same at a contacting portion where the substrate and the cleaning body are contacted. A rotational speed ratio of the substrate and the cleaning body is set to be about 1:1˜3.5:1. | 12-09-2010 |
| 20100313915 | SUBSTRATE CLEANING METHOD AND SUBSTRATE CLEANING APPARATUS - The substrate cleaning method of and the substrate cleaning apparatus for removing contaminants such as particles adhering to a surface of a substrate attain a high throughput and effectively remove the particles and the like. To clean the back surface Wb of the substrate W, DIW cooled down to a temperature near its freezing point and cooling gas which is at a lower temperature than the freezing point of the DIW are discharged toward the center of the lower surface of the substrate which rotates. When thus cooled DIW flows along the back surface Wb of the substrate W, the particles and the like adhering to the substrate are removed. | 12-16-2010 |
| 20110048469 | LIQUID PROCESSING APPARATUS AND LIQUID PROCESSING METHOD - Disclosed is a liquid processing apparatus and a liquid processing method that can prevent a processing liquid from being left on a lift pin after a drying-out process of a substrate, thereby preventing the processing liquid from being attached to the back surface of the substrate after the liquid processing. The liquid processing apparatus of the present disclosure includes a holding plate that supports a substrate, a lift pin plate provided above the holding plate having a lift pin that supports the wafer from a lower side, and a processing liquid supply unit that supplies the processing liquid to the back surface of the wafer. The processing liquid supply unit is provided with a head part configured to close a penetrating hole of the lift pin plate. The processing liquid supply unit and the lift pin plate are configured to be elevated with respect to the holding plate. | 03-03-2011 |
| 20110108071 | MOTOR-BASE ASSEMBLY CLEANING - An apparatus and associated method are provided for treating a workpiece with a cryogenic impingement fluid. A fixture supports the workpiece in an upright position and operably connects an electrical component of the workpiece to a power source in the supported position. A cryogenic impingement fluid applicator sprays a stream of the cryogenic impingement fluid against the supported workpiece and laterally moves the stream in accordance with a predetermined path. A shield deflects the stream of cryogenic impingement fluid to prevent the stream from contacting at least a part of the workpiece as the stream is moved along the predetermined path. | 05-12-2011 |
| 20110146729 | DEVICE AND METHOD FOR CLEANING THE CORE ENGINE OF A JET POWER PLANT - The object of the invention is a device for cleaning the core engine of a jet engine, having a supply unit, which provides the cleaning medium, a nozzle unit, which is configured for feeding the cleaning medium into the core engine, and a line connection ( | 06-23-2011 |
| 20110240067 | SUBSTRATE TREATMENT APPARATUS AND SUBSTRATE TREATMENT METHOD - A substrate treatment apparatus includes: substrate holding unit which horizontally holds a substrate; a rotating unit which rotates the substrate held by the substrate holding unit about a vertical axis; and a first nozzle having a first opposing face to be opposed to a region of a lower surface of the substrate inward of a peripheral portion of the substrate in spaced relation to the lower surface of the substrate during rotation of the substrate by the rotating unit and a treatment liquid spout provided in the first opposing face for filling a space defined between the lower surface of the substrate and the first opposing face with a treatment liquid spouted from the treatment liquid spout to keep the space in a liquid filled state. | 10-06-2011 |
| 20110297190 | METHOD FOR PROCESSING PROCESS-TARGET OBJECT - Provided is a method including the steps of: carrying out a storage process by causing a processing jig, which has a supply opening for supplying a first processing liquid, to be positioned such that a storage space section into which the supply opening is open is sandwiched by the processing jig and the process-target surface, and by storing the first processing liquid in the storage space section; and carrying out a rotation process by supplying the first processing liquid onto the process-target surface from the supply opening, while supplying a second processing liquid onto the outer peripheral part, in a state where the process-target object is being rotated, in the step for carrying out the rotation process, the processing jig being moved along a direction which is not a direction along which the process-target object is being rotated. | 12-08-2011 |
| 20110297191 | HIGH THROUGHPUT ROOT WASHING METHOD, APPARATUS, AND SYSTEM - The present invention provides a method, apparatus, and system for efficient, high throughput, consistent cleaning of soil from the root system of a plant. In one embodiment, the method generally comprises positioning a plant adjacent a sprayer assembly having at least one nozzle angled so as to impact the root system at a predetermined position, providing a stream of water from a reservoir through the nozzle of the sprayer assembly, and rotating at least one of the root system and the nozzle relative to the other to remove the soil from the root system. The present invention further describes a recycling system adapted to recycle water expended during the cleaning process to minimize losses and to capture and return dislodged soil to the field from which the plant is extracted. | 12-08-2011 |
| 20120006362 | SUBSTRATE CLEANING DEVICE AND SUBSTRATE CLEANING METHOD - A substrate cleaning device and a substrate cleaning method reduces liquid drops remaining on a substrate to prevent the irregular heating of the substrate by a heating process due to liquid drops or water marks remaining on the substrate. A cleaning liquid is poured through a cleaning liquid pouring nozzle onto the surface of a substrate such that a region onto which the cleaning liquid is poured moves from a central part toward the circumference of the substrate. A gas is jetted radially outward at a region on the surface of the substrate behind a region onto which the cleaning liquid is poured with respect to the rotating direction of the substrate. The gas forces a liquid film of the cleaning liquid flowing on the surface of the substrate to flow in a circumferential direction and a radially outward direction. | 01-12-2012 |
| 20120017948 | MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE - Suppressed is damage of a semiconductor wafer due to charging of a cleaning liquid used in a single wafer type wafer cleaning step. | 01-26-2012 |
| 20120042911 | CLEANING DEVICE AND CLEANING METHOD USING SAME - A cleaning device includes a rotary platform and a cleaning assembly. The rotary platform is used for rotating a workpiece. The cleaning assembly faces the rotary platform and is used for spraying cleaning fluid on the workpiece for a period of time to clean the workpiece and then spraying drying gas on the workpiece to dry the workpiece during the rotary platform rotates the workpiece. | 02-23-2012 |
| 20120090648 | CLEANING METHOD FOR SEMICONDUCTOR WAFER AND CLEANING DEVICE FOR SEMICONDUCTOR WAFER - A cleaning method of a semiconductor wafer includes the following steps. A semiconductor wafer is provided. A cleaning solution is sprayed to the semiconductor wafer. The semiconductor wafer is driven to spin along a first direction for a first time. The semiconductor wafer is driven to spin along a second direction for a second time. The cleaning method can effectively clean the semiconductor wafer. A cleaning device for cleaning a semiconductor wafer is also provided. | 04-19-2012 |
| 20120090649 | SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD - A substrate processing apparatus includes a substrate holding unit that horizontally holds a substrate in non-contact with a major surface of the substrate, a processing liquid supply unit that supplies a processing liquid to the major surface of the substrate held by the substrate holding unit, and a hydrophilic surface placing unit that places an annular hydrophilic surface along a peripheral portion of the major surface of the substrate held by the substrate holding unit such that the hydrophilic surface comes into contact with a liquid film of the processing liquid held on the major surface of the substrate. | 04-19-2012 |
| 20120118333 | APPARATUS FOR CLEANING PAINT ROLLERS AND BRUSHES - An apparatus is provided for cleaning paint rollers and/or brushes. It comprises a roller cover/brush holder that may be coupled to a drill or other power tool, and a container and cap assembly. Advantageously, the container accommodates the holder and a roller cover or paintbrush with a minimal effective volume of cleanser. The cap closes and substantially seals the container to contain spray or spillage during high-speed rotation of the holder within the container. In use, the container is filled with cleanser, such as soapy water, and the roller is spun for several minutes. The container is drained, then refilled with rinse water and the process is repeated as needed. The roller or brush may be spun dry after cleaning, or between wash and rinse cycles. The apparatus provides effective cleaning with a reduced volume of water or cleanser and requires minimal clean-up. | 05-17-2012 |
| 20120125376 | WET PROCESSING APPARATUS AND WET PROCESSING METHOD - A wet processing apparatus holds on a stage a substrate to be processed and carries out a wet treatment by rotating the stage. The substrate is held by the stage, with the center of the substrate being offset from the rotation center of the stage, using a Bernoulli chuck which causes an inert gas to flow to a back surface of the substrate, so that the substrate is eccentrically rotated along with the rotation of the stage. A first gas supply passage which is used for the Bernoulli chuck is provided at a rotation shaft portion in the stage and the stage is also provided with second gas supply passages which communicate with the first gas supply passage to thereby introduce the inert gas to the back surface of the substrate. The second gas supply passages are axisymmetric with respect to a central axis of the substrate. | 05-24-2012 |
| 20120138104 | Filter Cleaning System and Method - A filter cleaning system for cleaning a filter element is provided. The filter cleaning system includes a set of pulse nozzles and a compressed air supply, which rotate together during a cleaning cycle to release pulse blasts at predetermined time intervals to clean the filter element. | 06-07-2012 |
| 20120160277 | Liquid Processing Apparatus and Liquid Processing Method - Disclosed are a liquid processing apparatus and a liquid processing method that can improve substitutability of an atmosphere in a processing chamber to prevent an atmosphere with, for example, a chemical liquid which is scattered during liquid-processing of a substrate from remaining in the processing chamber. In the liquid processing apparatus, an arm standby unit is installed adjacent to a processing chamber and an arm retreating from the processing chamber stands by in the arm standby unit. An elevating/descending cup peripheral case having a cylindrical shape is disposed around a cup in the processing chamber and when the cup peripheral case is disposed at an upper location, a region inside the cup peripheral case is isolated from the outside. An opening through which the arm passes is installed on the cup peripheral case. | 06-28-2012 |
| 20120160278 | LIQUID TREATMENT APPARATUS AND METHOD - Disclosed is a liquid treatment apparatus for processing a lower surface of the substrate. The apparatus includes a first nozzle disposed below a lower surface of the substrate retained by the substrate retaining unit to eject a treatment liquid towards the lower surface of the substrate, the first nozzle having a plurality of first ejection ports, which are arrayed from a position opposing a central portion of the substrate retained by the substrate retaining unit to a position opposing a peripheral portion of the substrate retained by the substrate retaining unit. An ejecting direction of the treatment liquid ejected from the first ejection port is inclined towards a rotation direction of the substrate rotated by the rotational driving unit. | 06-28-2012 |
| 20120167924 | CLEANING DEVICE AND A CLEANING METHOD OF A FIXED ABRASIVES POLISHING PAD - A device for cleaning a fixed abrasive polishing pad includes a main body having a surface facing the polishing pad, an inlet coupled to an end of the main body and configured to supply a cleaning liquid, an inject orifice coupled to the inlet for injecting the cleaning liquid and being provided on the surface of the main body, an outlet coupled to the end of the main body, and a recycle orifice coupled to the outlet, and being provided on the surface of the main body. | 07-05-2012 |
| 20120222707 | NOZZLE, SUBSTRATE PROCESSING APPARATUS, AND SUBSTRATE PROCESSING METHOD - A nozzle for discharging droplets of a processing liquid for processing a substrate has a main body including a supply port, a drain port, a processing liquid flow passageway connecting the supply port and the drain port, and a plurality of discharge ports from which the processing liquid is discharged. The processing liquid flow passageway includes a plurality of branch flow channels, which branch out between the supply port and the drain port and collect together between the supply port and the drain port. The plurality of discharge ports form a plurality of columns respectively corresponding to the plurality of branch flow channels; and are aligned along and connected to the corresponding branch flow channels. A piezo element applies vibration to the processing liquid flowing through the plurality of branch flow channels. | 09-06-2012 |
| 20120234361 | Non-Chemical, Non-Optical Edge Bead Removal Process - A method for removing the edge bead from a substrate by applying an impinging stream of a medium that is not a solvent for the material to be removed. The medium is applied to the periphery of the substrate with sufficient force to remove the material. Also an apparatus to perform the inventive method. | 09-20-2012 |
| 20120234362 | SUBSTRATE CLEANING METHOD AND SUBSTRATE CLEANING APPARATUS - A substrate cleaning method that includes: a step in which, while a substrate holder is being continuously rotated, a to-be-discharged position of the cleaning liquid on the substrate is changed to an eccentric position deviated from the central part of the substrate, and a gas is discharged from a gas nozzle to the central part of the substrate so as to form a dried area of the cleaning liquid under a condition in which a shortest distance between an edge of a cleaning liquid flow output from the cleaning-liquid nozzle and an edge of a gas flow output from the gas nozzle is set between 9 mm and 15 mm. | 09-20-2012 |
| 20120260954 | AIR FILTER CLEANER - In accordance with one aspect of the present exemplary embodiment, a portable air filter cleaning device is provided. The device comprises a support frame including at least two legs and a rotatable air filter receiving frame defining a perimeter. The rotatable air filter receiving frame is supported by the support frame. A tube having a first end adapted to receive a water line and a second end including a plurality of outlets is also provided. The second end of the tube is oriented to direct water from the outlets toward the air filter receiving frame perimeter so that water ejected from the outlets impacts a washable air filter mounted upon the air filter receiving frame and causes rotation thereof. | 10-18-2012 |
| 20120273011 | METHOD OF CLEANING SUBSTRATE PROCESSING APPARATUS - A spin base is caused to rotate at a number of revolutions of from 250 rmp to 350 rpm (first number of revolutions), and at the same time, a cleaning solution is supplied to a holding surface of a spin base while the upper end of a processing cup is placed below the holding surface. Thus, an outer upper surface of the processing cup is cleaned with the cleaning solution scattered from the holding surface. Then, the spin base is caused to rotate at a number of revolutions of from 350 rpm to 450 rpm (second number of revolutions) higher than the first number of revolutions, and at the same time, a cleaning solution is supplied onto the holding surface. Thus, a partition plate outside the processing cup is cleaned with the cleaning solution scattered from the rotating holding surface. | 11-01-2012 |
| 20120298148 | Buffing Pad Washer for Use with Multiple Types of Power Drivers - A cleaning apparatus for a power driven buffing pad includes a wash plate mounted in a cleaning solution reservoir that provides agitating and cleaning contact with the pad mounted on an operating driver. The wash plate can be reciprocated vertically by the operator against a biasing arrangement to operate a pump to deliver cleaning solution from the reservoir to the face of the pad in contact with the wash plate. | 11-29-2012 |
| 20120298149 | METHOD AND APPARATUS FOR LIQUID TREATMENT OF WAFER SHAPED ARTICLES - An apparatus for treating a wafer-shaped article, comprises a spin chuck for holding a wafer-shaped article in a predetermined orientation, at least one upper nozzle for dispensing a treatment fluid onto an upwardly facing surface of a wafer-shaped article when positioned on the spin chuck, and at least one lower nozzle arm comprising a series of lower nozzles extending from a central region of the spin chuck to a peripheral region of the spin chuck. The series of nozzles comprises a smaller nozzle in a central region of the spin chuck and a larger nozzle in a peripheral region of the spin chuck. In the method according to the invention, a heated liquid is supplied through the series of nozzles so as to supply more heat to peripheral regions of a wafer than to central regions. | 11-29-2012 |
| 20120318304 | SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING UNIT - A substrate processing method includes jetting at least one fluid from a fluid nozzle toward a rotating substrate surface while moving the fluid nozzle from a center toward a periphery of the rotating substrate. The fluid nozzle is moved from the center of the substrate to a predetermined point at a constant initial movement speed. The fluid nozzle is subsequently moved from the predetermined point at a movement speed V(r) which satisfies the following relational expression: V(r)×r | 12-20-2012 |
| 20120318305 | Device and Method for Controllably Cooling Metal Billets to be Hot Extruded - A method for carrying out a controlled cooling thermal processing of aluminium billets or other metal materials to be extruded, characterized in that said billets, at a temperature of about 560° C., are arranged one at a time on a horizontally arranged cradle, including locking jaws, said cradle, with a billet arranged therein, being rotatively driven through 90° about a horizontal pivot pin thereby performing a partial controlled immersion, at one end portion thereof, into a water basin having a temperature equal to or slightly larger than an environment temperature. | 12-20-2012 |
| 20130074878 | WAFER SCRUBBER - A wafer scrubber is disclosed, including a chamber, and a holder connecting to a spindle disposed in the chamber, wherein the holder supports a wafer, and the wafer spins to remove water on the wafer, and a mashed inner cup comprising a plurality of through holes disposed between the holder and a wall of the chamber, wherein the mashed inner cup receives water from a surface of the wafer and rotates around the spindle to release the water through the through holes. | 03-28-2013 |
| 20130220382 | SUBSTRATE PROCESSING METHOD - There is provided a substrate processing method which can keep a surface of a substrate, which has hydrophobic properties, completely wet with a processing liquid during liquid processing, thereby preventing the formation of watermarks on the surface of the substrate. The substrate processing method for processing a substrate by supplying a processing liquid to a central portion of a surface of the substrate rotating horizontally, includes: determining the rotational speed of the substrate and the flow rate of the processing liquid when supplied to the surface of the substrate from a relationship between the rotational speed of the substrate and the flow rate of the processing liquid when supplied to the surface of the substrate, said relationship being dependent on the contact angle of the processing liquid with respect to the surface of the substrate and being capable of preventing partial draining of the processing liquid held on the surface of the substrate or partial drying of the surface of the substrate; and supplying the processing liquid to the central portion of the surface of the substrate at the determined flow rate while rotating the substrate at the determined rotational speed. | 08-29-2013 |
| 20130233356 | PROCESS AND APPARATUS FOR TREATING SURFACES OF WAFER-SHAPED ARTICLES - An apparatus and method for processing wafer-shaped articles comprises an array of nozzles that are stationary in use, and are individually controlled to simulate the action of a moving boom arm without the actual need for such an arm. Preferably three such arrays are provided, for dispensing three different types of liquid at various process stages. The computer control of the nozzle valves may cause only one nozzle of each array to be open at any given time, or may cause a pair of adjacent nozzles to be open simultaneously. | 09-12-2013 |
| 20130284212 | METHOD FOR PROCESSING A SUBSTRATE AND APPARATUS FOR PERFORMING THE SAME - An apparatus for processing substrate includes a spin chuck, a first nozzle and a second nozzle. The spin chuck fixes and spins the substrate on which a photoresist layer is formed. The first nozzle is disposed over the spin chuck and provides a treatment liquid on the substrate so as to remove the photoresist layer. The second nozzle is disposed over the spin chuck and provides a mist including deionized water or hydrogen peroxide on the substrate to make contact with the treatment liquid so as to increase a temperature of the treatment liquid. Therefore, efficiency of removing the photoresist layer may be improved. | 10-31-2013 |
| 20130319476 | LIQUID TREATMENT APPARATUS AND LIQUID TREATMENT METHOD - A liquid treatment apparatus includes a substrate holding member ( | 12-05-2013 |
| 20140166055 | APPARATUS AND METHOD OF CLEANING WAFERS - An apparatus for cleaning wafers includes a chamber, a rotatable substrate holder inside the chamber, a nozzle above the rotatable substrate holder, a cover facing downward and fluidly coupled with the nozzle. The rotatable substrate holder is configured to mount one or more semiconductor wafers on the rotatable substrate holder. The nozzle is configured to spray a cleaning medium onto the one or more semiconductor wafers. The cover is of a shape having a top edge with a top cross-sectional area and a bottom edge with a bottom cross-sectional area. | 06-19-2014 |
| 20140166056 | ASEPTIC, HIGH PRESSURE WATER CLEANING CHAMBER - There are disclosed systems and methods of debriding tissue. In an embodiment, a system includes a bone tube having an opening sized to receive a bone with tissue disposed thereon, the opening of the bone tube sized to exclude entry of an operator's hand; a spray nozzle configured to emit a water jet into the bone tube; and an outlet from the bone tube. In another embodiment, a method includes assembling a sterile debridement system; placing a sterile mesh bag over a bone tube having an opening sized to receive a bone with tissue disposed thereon, the opening of the bone tube sized to exclude entry of an operator's hand; inserting one end of a bone into the bone tube; actuating a spray nozzle directed into the bone tube, and the water jet configured to debride tissue from the bone within the bone tube. Other embodiments are also disclosed. | 06-19-2014 |
| 20140182631 | CLEANING JIG AND CLEANING METHOD FOR CLEANING SUBSTRATE PROCESSING APPARATUS, AND SUBSTRATE PROCESSING SYSTEM - Disclosed is a method of cleaning components of a substrate processing apparatus The components of the substrate processing apparatus are cleaned by using a first cleaning jig including a disk-shaped lower member, and a disk-shaped upper member connected to the lower member and forming a gap between the upper member and the lower member. The lower member of the first cleaning jig is held by the substrate holding unit to rotate the first cleaning jig. The cleaning liquid is ejected toward the first cleaning jig from a bottom side of the first cleaning jig while the first cleaning jig is rotated. The cleaning liquid flows out toward outside of the first cleaning jig via the gap between the upper member and the lower member by a centrifugal force, and the components of the substrate processing apparatus are cleaned by the cleaning liquid that has flowed out. | 07-03-2014 |
| 20140182632 | SUBSTRATE CLEANING APPARATUS AND SUBSTRATE CLEANING METHOD - A substrate cleaning apparatus cleans a surface of a substrate such as a semiconductor wafer in a non-contact state by using two-fluid jet cleaning. The substrate cleaning apparatus includes a substrate holding mechanism configured to hold and rotate the substrate, with the front surface facing downward, in a horizontal state, and a two-fluid nozzle configured to jet a two-fluid jet flow, comprising a gas and a liquid, upwardly toward the front surface of the substrate held by the substrate holding mechanism. | 07-03-2014 |
| 20140230860 | METHODS AND APPARATUS FOR WETTING PRETREATMENT FOR THROUGH RESIST METAL PLATING - Disclosed are pre-wetting apparatus designs and methods for cleaning solid contaminants from substrates prior to through resist deposition of metal. In some embodiments, a pre-wetting apparatus includes a process chamber having a substrate holder, and at least one nozzle located directly above the wafer substrate and configured to deliver pre-wetting liquid (e.g., degassed deionized water) onto the substrate at a grazing angle of between about 5 and 45 degrees. In some embodiments the nozzle is a fan nozzle configured to deliver the liquid to the center of the substrate, such that the liquid first impacts the substrate in the vicinity of the center and then flows over the center of the substrate. In some embodiments the substrate is rotated unidirectionally or bidirectionally during pre-wetting with multiple accelerations and decelerations, which facilitate removal of contaminants. | 08-21-2014 |
| 20140251387 | METHOD AND APPARATUS FOR CLEANING A FILTER - A filter cleaning device includes a cleaning chamber operable to receive a gas filter to be cleaned, the cleaning chamber having an inlet through which a gas flow can be admitted and an outlet for gas flow leaving the cleaning chamber, the inlet and outlet being arranged such that the airflow is forced to pass through at least a part of the filter when inserted, the filter cleaning device further comprising a mechanical agitation arrangement operable, in one mode of operation, to generate a linear oscillation along an axis of the filter when inserted and, in another mode of operation, to rotate the filter about an axis of rotation. | 09-11-2014 |
| 20140261571 | SUBSTRATE CLEANING AND DRYING METHOD AND SUBSTRATE DEVELOPING METHOD - Provided is a substrate cleaning and drying method, including a cleaning step of cleaning a developed substrate by supplying a cleaning liquid to the substrate; a puddle-forming step of forming a puddle of the cleaning liquid on the substrate; a film-thinning step of thinning a film thickness of the cleaning liquid on the substrate; and a drying step of drying the substrate by spinning the substrate and generating outward airflow and inward airflow between the outward airflow and the substrate, the outward airflow covering a portion above the substrate and the inward airflow causing removal of the cleaning liquid on the substrate. | 09-18-2014 |
| 20140261572 | SUBSTRATE TREATMENT APPARATUS AND SUBSTRATE TREATMENT METHOD - The inventive substrate treatment apparatus includes a change controlling unit which changes at least one of a protection liquid application position relative to a liquid droplet nozzle and a protection liquid incident angle relative to the liquid droplet nozzle, the protection liquid application position being a position at which the protection liquid is applied on an upper surface of the substrate, the protection liquid incident angle being an angle at which the protection liquid is incident on the liquid application position; wherein the change controlling unit controls the liquid application position and the incident angle in a first condition when the spraying region is located on an upper surface center portion of the substrate, and controls the liquid application position and the incident angle in a second condition when the spraying region is located on an upper surface peripheral portion of the substrate. | 09-18-2014 |
| 20140290703 | SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD - A substrate processing apparatus includes a substrate supporting part for supporting a substrate in a horizontal state, an upper nozzle for discharging deionized water as a cleaning solution toward a center portion of an upper surface of the substrate, and a substrate rotating mechanism for rotating the substrate supporting part together with the substrate around a central axis directed in a vertical direction. In the substrate processing apparatus, the plurality of discharge ports are provided in the upper nozzle, and the flow rate of the deionized water to be supplied onto the center portion of the substrate from the upper nozzle can be ensured, with the flow rate of the deionized water from each discharge port reduced. It is thereby possible to perform appropriate cleaning of the upper surface of the substrate while suppressing electrification at the center portion of the substrate. | 10-02-2014 |
| 20140299163 | SUBSTRATE PROCESSING METHOD - A substrate processing method which can reduce electrostatic charge of a substrate surface is disclosed. The substrate processing method includes: performing a first processing step of supplying a liquid containing pure water onto a substrate while rotating the substrate; and then performing a second processing step of supplying the liquid onto the substrate, while rotating the substrate, under a condition in which a rate of increase in a surface potential of the substrate is lower than that in the first processing step. | 10-09-2014 |
| 20140311532 | SUBSTRATE PROCESSING APPARATUS AND PROCESSED SUBSTRATE MANUFACTURING METHOD - A substrate processing apparatus has a substrate rotating device | 10-23-2014 |
| 20140332036 | DEVICE AND METHOD FOR TREATING SUBSTRATE SURFACES - A device and method for treatment of a substrate treatment surface of a substrate with a fluid by immersion of the substrate treatment surface into the fluid, The device includes:
| 11-13-2014 |
| 20140352738 | ZERO LAG DISPENSE APPARATUS - A liquid dispenser for a wafer processing system includes a supply tube with an inlet at one end and an outlet at the other end. Attached to the supply tube at the outlet end is a liquid reservoir. The liquid reservoir has a dispensing plate that has an outlet for dispensing liquid onto a wafer. There is also a dispensing valve for controlling the dispensing of the liquid. | 12-04-2014 |
| 20140360536 | SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD AND COMPUTER-READABLE STORAGE MEDIUM RECORDING THEREIN SUBSTRATE PROCESSING PROGRAM - A throughput in processing a substrate can be improved and a running cost thereof can be reduced. A substrate processing apparatus | 12-11-2014 |
| 20150068560 | APPARATUS AND METHOD FOR SCANNING AN OBJECT THROUGH A FLUID SPRAY - An apparatus for treating the surface of a microelectronic workpiece via impingement of the surface with at least one fluid and a method for operating the apparatus are described. In particular, the apparatus includes a treatment chamber defining an interior space to treat the microelectronic workpiece with at least one fluid within the treatment chamber, and a movable chuck that supports the workpiece within the treatment chamber. The apparatus further includes a workpiece translational drive system configured to translate the movable chuck between a workpiece load position and at least one processing position at which the workpiece is treated with the at least one fluid using at least one nozzle connected to at least one fluid supply, and a workpiece rotational drive system configured to rotate the microelectronic workpiece. | 03-12-2015 |
| 20150090303 | SYSTEM AND METHOD FOR CONFORMAL CLEANING - A system includes a plurality of nozzles, a pump configured to pump a fluid through the nozzles, and a manifold configured to arrange the plurality of nozzles to substantially match a shape of a workpiece. Each nozzle of the plurality of nozzles is configured to impinge upon a section of the workpiece with the fluid. | 04-02-2015 |
| 20150311096 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND CLEANING PROCESSING SYSTEM - A method of manufacturing a semiconductor device by performing a plurality of substrate cleaning steps including a process for supplying a chemical solution on a substrate transported into a cleaning apparatus, a process for rotating the substrate, and a process for unloading the substrate from the cleaning apparatus is provided. In the plurality of cleaning steps, a dropping start position of the chemical solution on the substrate is set in a region on the substrate where the semiconductor device has been formed, and the dropping start position is changed at least once. | 10-29-2015 |
| 20150348806 | CLEANING APPARATUS AND CLEANING METHOD - A washing device includes: a plurality of spindles which holds a substrate and rotates the substrate about a central axis of the substrate as a rotary axis; and a single tube nozzle which discharges a washing liquid toward an upper surface of the substrate, wherein the single tube nozzle discharges the washing liquid so that the washing liquid lands in front of the center of the substrate and the landed washing liquid flows on the upper surface of the substrate toward the center of the substrate. A liquid flow on the upper surface of the substrate after landing of the washing liquid discharged from the single tube nozzle passes through the center of the substrate. | 12-03-2015 |
| 20160016206 | METHOD OF CLEANING SUBSTRATE PROCESSING APPARATUS - A spin base is caused to rotate at a number of revolutions of from 250 rmp to 350 rpm (first number of revolutions), and at the same time, a cleaning solution is supplied through a discharge head to a holding surface of a spin base while the upper end of a processing cup surrounding the spin base is placed below the holding surface. Thus, an outer upper surface of the processing cup is cleaned with the cleaning solution scattered from the holding surface. Then, the spin base is caused to rotate at a number of revolutions of from 350 rpm to 450 rpm (second number of revolutions) higher than the first number of revolutions, and at the same time, a cleaning solution is supplied through the discharge head onto the holding surface. Thus, a partition plate outside the processing cup is cleaned with the cleaning solution scattered from the rotating holding surface. | 01-21-2016 |
| 20160093517 | SUBSTRATE LIQUID PROCESSING METHOD, SUBSTRATE LIQUID PROCESSING APPARATUS, AND RECORDING MEDIUM - Disclosed is a substrate liquid processing method. The method includes: supplying a first processing liquid to a central portion of a substrate at a first flow rate by a first nozzle while rotating the substrate using a substrate holding unit; supplying a second processing liquid to a location between the central portion and an outer circumferential end of the substrate by a second nozzle while supplying the first processing liquid to the central portion of the substrate at the first flow rate; and changing the flow rate of the first processing liquid supplied from the first nozzle to a second flow rate lower than the first flow rate, so as to continue forming of the liquid film on the overall surface of the substrate while supplying the second processing liquid by the second nozzle to the substrate that is formed with a liquid film on the overall surface thereof. | 03-31-2016 |
| 20160111302 | Systems and Methods for Wet Processing Substrates with Rotating Splash Shield - Embodiments provided herein provide systems and methods for wet processing substrates with a rotating splash shield. The systems include a fluid dispenser configured to dispense a processing fluid. A substrate support configured to support and rotate a substrate is also included. The substrate support is disposed such that the processing fluid dispensed by the fluid dispenser flows onto the substrate. A splash shield is positioned on at least one side of the substrate support and is configured to rotate. The splash shield has an upper portion extending above an upper surface of the substrate and a lower portion extending below a lower surface of the substrate. | 04-21-2016 |
| 20160118241 | SUBSTRATE TREATING APPARATUS AND SUBSTRATE CLEANING METHOD - Disclosed is a substrate treating apparatus. The substrate treating apparatus includes a housing defining a space for treating a substrate therein, a spin head supporting and rotating the substrate in the housing, a spray unit including a first nozzle member for spraying a first treating solution on the substrate placed on the spin head, and a controller controlling the spray unit. The controller sprays the first treating solution while moving the first nozzle member between edge and center regions of the substrate and above the substrate. The controller differently adjusts a first height at which the first treating solution is sprayed on the edge region of the substrate and a second height at which the first treating solution is sprayed on the center region of the substrate. | 04-28-2016 |
| 20160133487 | MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE - Suppressed is damage of a semiconductor wafer due to charging of a cleaning liquid used in a single wafer type wafer cleaning step. | 05-12-2016 |
