| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 134250400 | Manufactured articles | 9 |
| 20080223411 | Substrate processing apparatus and substrate processing method - A substrate processing apparatus of a simplified structure, which is capable of decreasing an amount of a process liquid to be used, and of restraining change in temperature of the process liquid is provided. The substrate processing apparatus includes: a processing unit that holds one substrate and processes the substrate held by the processing unit; a processing bath capable of simultaneously accommodating a plurality of substrates, the processing bath storing a process liquid into which a substrate is immersed so as to be processed, the process liquid being circulatingly supplied to the processing bath; and a transfer unit that simultaneously transfers substrates whose number is less than the number of substrate that can be accommodated in the processing bath. The transfer unit transfers, at least, to the processing bath in which the process liquid is stored. A substrate is processed with the use of at least one of the processing unit and the processing bath. | 09-18-2008 |
| 20100006124 | SINGLE WAFER DRYER AND DRYING METHODS - In a first aspect, a module is provided that is adapted to process a wafer. The module includes a processing portion having one or more features such as (1) a rotatable wafer support for rotating an input wafer from a first orientation wherein the wafer is in line with a load port to a second orientation wherein the wafer is in line with an unload port; (2) a catcher adapted to contact and travel passively with a wafer as it is unloaded from the processing portion; (3) an enclosed output portion adapted to create a laminar air flow from one side thereof to the other; (4) an output portion having a plurality of wafer receivers; (5) submerged fluid nozzles; and/or (6) drying gas flow deflectors, etc. Other aspects include methods of wafer processing. | 01-14-2010 |
| 20100024847 | SEMICONDUCTOR WAFER CLEANING WITH DILUTE ACIDS - In a method for cleaning wafers using ultra-dilute acids, the wafers are placed into a rotor in a process chamber. As the rotor spins, the wafers are with de-ionized water and ultra-dilute hydrofluoric acid. Ozone gas is introduced into the process chamber. The wafers are then sprayed with an ultra-dilute solution of hydrochloric acid. Ozone gas is purged from the chamber. The wafers are then rinsed and dried. The ultra-dilute acids may be used in water to acid concentrations on the order of about 1000-2400:1. | 02-04-2010 |
| 20100071726 | METHOD AND SYSTEM OF DRYING A MICROELECTRONIC TOPOGRAPHY - Drying a microelectronic topography. At least some of the illustrative embodiments are methods that include placing a microelectronic topography inside a process chamber, providing a non-aqueous liquid to the process chamber until at least 90% of the volume of the process chamber contains the non-aqueous liquid, pressurizing the process chamber by way of a fluid different than the non-aqueous liquid, ceasing activity with respect to the process chamber until the non-aqueous liquid and fluid form a mixture that is substantially homogenous, venting the process chamber while simultaneously providing the fluid to the process chamber, and venting the process chamber in a manner which prevents formation of liquid in the process chamber. | 03-25-2010 |
| 20100275955 | METHOD AND DEVICE FOR STERILIZING AND WASHING CAP - A chute type sterilizing and washing device for a cap, in which deformation of a cap is prevented by relaxing integral pressure acting on a synthetic resin cap in the chute, and sterilization and washing can be carried out efficiently by reducing the impact of hot water on germ-free water jetted at the upstream side on the hot water or germ-free water at the downstream side. The chute ( | 11-04-2010 |
| 20100300491 | WAFER CLEANING WITH IMMERSED STREAM OR SPRAY NOZZLE - Several methods of removing contaminant particles from a surface of a substrate are disclosed herein. In one embodiment, the method includes directing an incompressible fluid spray onto a surface of a substrate to remove contaminant particles from the surface. In an embodiment, the surface of the substrate and the nozzle are both immersed in an incompressible fluid. The fluid can flow across the surface of the substrate to remove the contaminant particles from the area. The fluid spray can be positioned normal to the substrate surface, or can be positioned at an angle relative to the substrate surface. | 12-02-2010 |
| 20120042910 | LIFTING AND DRYING DEVICE AND METHOD OF MANUFACTURING MAGNETIC RECORDING MEDIUM SUBSTRATE OR MAGNETIC RECORDING MEDIUM USING THE SAME - Provided is a lifting and drying device for cleaning substrates by immersing one or more disk-like substrates with a central hole into a cleaning liquid disposed in a cleaning tank and lifting and drying the substrates, the lifting and drying device including: a hanger mechanism that is inserted through the central hole of the substrates and supports a plurality of the substrates while being hung thereon; an elevation mechanism that elevates the hanger mechanism between a position where the substrates are immersed into the cleaning liquid inside the cleaning tank and a position where the substrates are lifted from the cleaning tank; and an ejection mechanism that is disposed in the cleaning tank and ejects the cleaning liquid from the downside of the hanger mechanism toward the substrate. | 02-23-2012 |
| 20130061880 | Continual Flow Pin Washer - A multi-chambered deposition pin wash station is provided. The wash station includes a lower chamber and an upper drain basin connected by a plurality of wash tubes. Cleaning fluid is provided to the lower chamber and passes through the cleaning tubes into the upper drain basin. The cleaning tubes are adapted to clean a single deposition pin with a single tube per wash cycle. | 03-14-2013 |
| 20160199979 | BASE PLATE ASSEMBLY TRANSFER MECHANISM AND METHODS | 07-14-2016 |
