| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 125021000 | Endless | 87 |
| 20090064983 | Methods, Wires, and Apparatus for Slicing Hard Materials - Methods, wires, and apparatus for use in cutting (e.g., slicing) hard, brittle materials is provided. The wire can be a super-abrasive wire that includes a wire core and super-abrasive particles bonded to the wire core via a metal bonding layer. This wire, or another type of wire, can be used to slice workpieces useful for producing wafers. The workpieces can be aligned within a holder to produce wafers using the device and methods presently provided. The holder rotates about its central axis, which translates to workpieces moving in orbit around this axis. A single abrasive wire, or multiple turns of wire stretched tightly between wire guides, is then contacted with the rotating holder to slice the workpieces. | 03-12-2009 |
| 20090120422 | Electrodeposited wire tool - A plating layer | 05-14-2009 |
| 20090126712 | Stone Saw Blade - A stone saw blade ( | 05-21-2009 |
| 20090126713 | Slurry composition containing non-ionic polymer and method for use - A wiresaw cutting fluid composition of the present invention comprises about 25 to about 75% by weight of a particulate abrasive suspended in an aqueous carrier containing a polymeric viscosity modifier that comprises a polymer including a majority of non-ionic monomer units (preferably 100 mol % non-ionic monomer units), has a number average molecular weight (M | 05-21-2009 |
| 20090288651 | MULTIWIRE SAWING MACHINE FOR THE CUTTING OF MATERIAL IN BLOCK FORM - The sawing machine comprises a guide pulley composed of a plurality of wheels of the same diameter, coaxial and mutually juxtaposed side by side in a pack on a corresponding shaft or the like | 11-26-2009 |
| 20100037881 | Slicing method - The present invention provides a slicing method comprising winding a wire around a plurality of grooved rollers and pressing the wire against an ingot to be sliced into wafers while supplying a slurry for slicing to the grooved rollers and causing the wire to travel, wherein a supply temperature of the slurry for slicing is controlled, and slicing is performed in such a manner that the supply temperature of the slurry for slicing and a temperature of the ingot become at least 30° C. or above at end of slicing the ingot. As a result, there is provided the slicing method that can alleviate precipitous cooling of an ingot in the time close to end of slicing the ingot and thereby suppress production of a nano-topography when slicing the ingot by using a wire saw. | 02-18-2010 |
| 20100043769 | WIRE SAW AND METHOD FOR PRODUCING A WIRE SAW - A wire saw (S) for separating a plurality of ceramic components ( | 02-25-2010 |
| 20100051009 | WIRE MONITORING - A sawing device for sawing silicon blocks comprises at least one cutting element for sawing silicon blocks, the cutting element being drivable by means of a drive device, at least one guide device, with the at least one cutting element being alignable along a predetermined path by means of the at least one guide device, and at least one monitoring device for monitoring the position of the at least one cutting element. | 03-04-2010 |
| 20100071681 | APPARATUS FOR CUTTING A STONE WHILE IN THE GROUND AND METHOD FOR MANUFACTURE - Embodiments of stone cutting apparatus may include at least one sheave, which is coupled to a stone cutting belt to drivingly engage the stone cutting belt. Belt may include an endless cable, numerous abrasive segments disposed along the length of the cable, and a flexible belt body encapsulating the cable, and extending into the abrasive segments and between the abrasive segments. The abrasive segments may include a diamond top portion, a metal bottom portion, a first side, a second side, a first end and a second end. At least one bore in each abrasive segment, extending from the first and through the second end, is adapted to house the cable. The perimeter of the bore may be formed by the top diamond portion, the metal bottom portion and the interface between the diamond and metal portions of the abrasive segment. In another embodiment, each abrasive segment may further include a cutting portion and a mounting portion. The cutting portion faces a stone to be cut, and may project above the main belt body. The mounting portion is located opposite the cutting portion, and has a top, a middle, and a tongue. The tongue is made of metal and generally V-shaped. The tongue is adapted to extend into an outer circumference of the sheave, thus allowing the sheave to drivingly engage the abrasive segment. Methods of manufacturing a stone cutting belt are also disclosed. | 03-25-2010 |
| 20100126490 | METHOD AND APPARATUS FOR CUTTING AND CLEANING WAFERS IN A WIRE SAW - A method and apparatus of cutting and cleaning wafers in a wire saw is disclosed. In one embodiment, a wire sawing apparatus includes a horizontal ingot feeding wire slicing apparatus which includes a vertical wire web, in which sawing wires of the vertical wire web are located substantially in a vertical plane and move in a substantially vertical direction, a first top outlet and a second top outlet located in a top position with respect to a work piece for applying fluids during sawing, and at least one chute located substantially below the work piece for receiving the fluids, wherein the work piece is impelled against the vertical wire web by horizontal movement and the fluids flow in a vertical direction against and into the work piece for slicing and cleaning wafers. | 05-27-2010 |
| 20100163010 | SLICING METHOD AND A WIRE SAW APPARATUS - The present invention is a slicing method and a wire saw apparatus including winding a wire around a plurality of grooved rollers and pressing the wire against an ingot to be sliced into wafers while supplying a slurry for slicing to the grooved rollers and causing the wire to travel in a reciprocating direction, in which the ingot is sliced with controlling a temperature of the ingot by supplying a slurry for adjusting an ingot temperature to the ingot independently from the slurry for slicing while the slurry for adjusting an ingot temperature is supplied to the ingot only at the exit side of the wire caused to travel in the reciprocating direction. As a result, there is provided a method and a wire saw apparatus in which rapid cooling of an ingot especially in a time close to end of slicing of the ingot can be alleviated, consequently degradation of a nano-topography can be suppressed, and further high-quality wafers having a uniform thickness can be sliced when slicing the ingot by using a wire saw. | 07-01-2010 |
| 20100170495 | METHOD AND SYSTEM FOR MANUFACTURING WAFER-LIKE SLICES FROM A SUBSTRATE MATERIAL - The present invention relates to a method and a system for manufacturing wafer-like slices from a body of a substrate material, especially for use in the manufacture of semiconductor devices. | 07-08-2010 |
| 20100206286 | Cutting Chain - A cutting chain for cutting concrete and other similar materials having wear and stretch resistant features. In one embodiment, the cutting chain can include chain links having a debris trap for hindering the entry of debris onto bearing surfaces. In one embodiment, side links and a center link can have cooperating members forming a maze-like debris trap and can include a lubricant and/or other barrier material. In a particular arrangement, side links can have annular ribs which can be partially received in annular grooves on a center link to create the maze-like debris trap. In another embodiment, the cutting chain can include chain links having anti-rotation structures to hinder rotation of the fastener relative to the side links. In a particular arrangement, side links can have a protrusion or slot for cooperating with a complementary mating slot or protrusion on the fastener. In another particular arrangement, the side links can have ridges in the fastener receive hole for penetrating the shaft of the fastener to resist rotation thereof. | 08-19-2010 |
| 20100212650 | CUTTING MACHINE FOR BLOCKS OF NATURAL STONE AND SIMILAR INTO SLABS WITH DIAMOND WIRES - A machine for cutting blocks of natural or similar types of stone includes a plurality of diamond-wire loops, wound about an assembly for the support and transmission of the cutting motion to said diamond-wire loops and at least one assembly for supporting, tensioning and guiding the diamond-wire loops; said assemblies move vertically in unison on the structure of the machine; and presents said supporting, tensioning and guiding assembly comprising a set of pulleys for the support and return of each diamond-wire loop, which are mounted and registered, for wire tensioning, on a movable tensioning means whose registration movement is actuated by a tensioning control means, independently of the movable tensioning means of contiguous diamond wires. In its preferred embodiment, the machine also presents an assembly for the support and transmission of the cutting motion to the said diamond-wire loops which includes a wide-diameter wheel about which a belt is wound that is provided with races for housing the diamond-wire loops and which is tensioned by means of a tensioning wheel. | 08-26-2010 |
| 20100258103 | METHOD FOR SLICING WORKPIECE BY USING WIRE SAW AND WIRE SAW - The present invention is a wire saw in which a wire is wound around a plurality of grooved rollers, the workpiece is sliced into wafers by causing the wire to travel and pressing the workpiece against the wire while a slurry is supplied to the grooved rollers, the wire saw controlling in such a manner that the workpiece is sliced while a supply temperature of the slurry is increased from the start to the end of slicing the workpiece. As a result, there is provided a wire saw in which Warp of the workpiece to be sliced can be improved by suppressing a decrease in a temperature of the workpiece in the vicinity of the slicing end portion of the workpiece and by making an increase in displacement of the grooved roller during slicing straight, that is, by making the slicing trajectory depicted in the workpiece close to a straight line. | 10-14-2010 |
| 20100300423 | Compound semiconductor substrate production method - A method of making a compound semiconductor substrate includes providing a GaN compound semiconductor single crystal ingot, and cutting the ingot with a cutter to form a GaN single crystal substrate. The cutting is performed while controlling a temperature in a contact portion between the ingot and the cutter to be not more than 160° C. such that a cut surface of the GaN single crystal substrate has an arithmetical mean waviness (Wa) not more than 9 μm. | 12-02-2010 |
| 20110061639 | AGGREGATE CUTTING SAW CHAIN - Embodiments of the disclosure provide an aggregate cutting saw chain having a pitch in the range of approximately 0.440 to approximately 0.450. Embodiments also include tie straps and/or other components having fluid distribution features. | 03-17-2011 |
| 20110094490 | Method for The Manufacture of Reinforced Diamond-Coated Cables and Cable Obtained Using Such Method - The method relates to the manufacture of a reinforced diamond-coated cable for cutting structures and materials of steel, concrete, steel and concrete, stone materials or the like, in which such diamond-coated cable comprises a plurality of outer strands ( | 04-28-2011 |
| 20110100346 | ABRASIVE GRAIN POWDER - Abrasive grain powder, in particular intended for machining silicon ingots, such that the granulometric fraction D | 05-05-2011 |
| 20110100347 | Wire and Methodology for Cutting Materials With Wire - Wire for cutting feedstock and a method for cutting feedstock with the wire. The wire may include an iron based alloy comprising at least 35 at % iron, nickel and/or cobalt in the range of about 7 to 50 at %, at least one non-metal or metalloid selected from the group consisting of boron, carbon, silicon, phosphorus, and/or nitrogen present in the range of about 1 to 35 at %, and one metal selected from the group consisting of copper, titanium, molybdenum, aluminum, and/or chromium present in the range of about 0 to 25 at %, wherein the wire has an aspect ratio of greater than one and exhibits metallic and/or crystalline phases of less than 500 nm in size. | 05-05-2011 |
| 20110100348 | Mounting Plate For A Wire Sawing Device, Wire Sawing Device Comprising The Same, And Wire Sawing Process Carried Out By The Device - The device ( | 05-05-2011 |
| 20110120441 | WIRE SAWING DEVICE - The wire saw for sawing a work piece, e.g. to make silicon wafers for electronic applications, has two or more sawing fields ( | 05-26-2011 |
| 20110126814 | BAND SAW CUTTING APPARATUS AND INGOT CUTTING METHOD - The present invention is a band saw cutting apparatus including: a cutting table on which an ingot is horizontally placed; an endless-belt blade provided in a tensioned state between pulleys, the blade having a blade-abrasive-grain portion and a blade base; and a coolant spraying opening for spraying a coolant on the blade, the band saw cutting apparatus cutting the ingot by relatively feeding the blade from above to below, the blade being driven to rotate by rotating the pulleys, wherein the pulleys is configured to be rotatable about an axis thereof in both directions, and a direction of driving to rotate the blade can be changed to cut the ingot. As a result, there is provided a band saw cutting apparatus and an ingot cutting method that can stably secure the quality of the ingot to be cut, increase the lifetime of the blade, and improve the productivity. | 06-02-2011 |
| 20110174285 | INGOT CUTTING APPARATUS AND INGOT CUTTING METHOD - An ingot cutting apparatus having at least one coolant pocket storing the coolant to be supplied to the blade, wherein the blade-abrasive-grain portion is brought into contact with the coolant stored in the at least one coolant pocket by causing the blade-abrasive-grain portion of the blade to travel through a groove portion provided at an upper portion of the at least one coolant pocket while driving to rotate the blade so that the coolant is supplied to the blade. | 07-21-2011 |
| 20110192389 | ENVIRONMENTALLY-FRIENDLY CUTTING APPARATUS USING A WIRE SAW, AND CUTTING METHOD USING SAME - The present invention relates to an apparatus and to a method for cutting a concrete structure using a diamond wire saw. More particularly, the present invention relates to an environmentally-friendly cutting apparatus using a wire saw and to a cutting method using the same, capable of completely collecting concrete sludge and dust generated during the cutting of the concrete structure without deteriorating work efficiency, and specially controlling the sludge generated during underwater cutting in an efficient manner to prevent environmental contamination. The cutting apparatus of the present invention comprises a jig case and a sealing cover unit for sealing the cut surface of a target structure for cutting, a wire saw, and a jig for changing the direction (a set of pulleys for guiding the wire saw), thus perfectly preventing dust and sludge generated during cutting of the structure from being exposed to the air or water to prevent environmental contamination. Further, the present invention is advantageous as it prevents the wire saw and the jig for changing direction from being outwardly exposed, which may otherwise cause injury to workers during cutting, thus improving the safety of cutting work. Further, the present invention collects sludge generated during the cutting of the structure, enables the collected sludge to settle in a settling tank, and enables purified upper water to be supplied to the sealing cover unit from a water purifying channel and be reused as a coolant for cooling the frictional heat on the cut surface, thus preventing environmental contamination and saving resources. | 08-11-2011 |
| 20110240001 | WIRESAW APPARATUS AND METHOD FOR CONTINUOUS REMOVAL OF MAGNETIC IMPURITIES DURING WIRESAW CUTTING - The invention provides a method and apparatus for removing magnetic or magnetized contaminants from a wiresaw cutting slurry during a wiresaw cutting process. The apparatus comprises a recirculating slurry dispensing system that defines the slurry flow pathway. The recirculating dispensing slurry system comprises a magnetic separator for removing magnetic or magnetizable contaminants from the slurry, wherein the purified slurry is discharged back into recirculation within the recirculating slurry dispensing system. | 10-06-2011 |
| 20110240002 | CUTTING FLUID COMPOSITION FOR WIRESAWING - The present invention provides an aqueous wiresaw cutting fluid composition that reduces the amount of hydrogen produced during a wiresaw cutting process. The composition is comprised of an aqueous carrier, a particulate abrasive, a thickening agent, and a hydrogen suppression agent. | 10-06-2011 |
| 20110253122 | SAW DRIVE ARRANGEMENT | 10-20-2011 |
| 20110303210 | WIRESAW CUTTING METHOD - The present invention provides a wiresaw cutting method comprising cutting a workpiece with a wiresaw while applying an aqueous cutting fluid to the wiresaw from a recirculating reservoir of cutting fluid, monitoring at least one of a chemical property, a physical property, or both, and adjusting the chemical composition of the cutting fluid while cutting the workpiece to maintain the property being monitored. The present invention additionally provides an apparatus to perform the inventive method. | 12-15-2011 |
| 20120006312 | SELF-CLEANING WIRESAW APPARATUS AND METHOD - The present invention provides a self-cleaning wiresaw cutting apparatus including a cleaning mechanism adapted to clean the components of the wiresaw before, during, or after a cutting process or to humidify the cutting region of the apparatus. The apparatus contains at least one dispenser adapted to dispense an aqueous fluid onto various components of the wiresaw. | 01-12-2012 |
| 20120085333 | APPARATUS AND METHOD FOR SAWING SINGLE CRYSTAL INGOT - Provided are an apparatus and a method for sawing a single crystal ingot. The apparatus includes a wire saw sawing an ingot, a roller driving the wire saw, and a bath containing a liquid cooling the ingot before sawing the ingot. | 04-12-2012 |
| 20120138040 | CUTTING BELT WITH DRIVE LUGS - Belt for cutting solid aggregate material such as natural or synthetic stone, include a main belt body comprised of a flexible material and having outer and inner loop surfaces. Multiple drive lugs project from the inner loop surface toward the interior of the loop, and each lug has a belt drive surface generally transverse to the main belt body. Multiple abrasive segments containing diamond particles are partially embedded in the main belt body, so that they form a part of the outer surface of the main belt body. Methods of manufacturing and using the cutting belt are also disclosed. | 06-07-2012 |
| 20120180773 | WALL SAW AND INTERCHANGABLE ASSEMBLIES FOR WALL SAWS - An interchangeable concrete cutting chain-saw cutting assembly ( | 07-19-2012 |
| 20120186571 | Aqueous Cutting Fluid for Use with a Diamond Wiresaw - Water-based cutting fluids for use with diamond wiresaws that are used for cutting or otherwise treating hard brittle materials, e.g., silicon ingots, comprise:
| 07-26-2012 |
| 20120186572 | SILICON WAFER SAWING FLUID AND PROCESS FOR USE THEREOF - A process is provided in which a metal chelating agent is dissolved in an aqueous or glycol-based cooling fluid to form a chelating solution with a chelating agent concentration. A silicon boule is cut with a saw to detach a silicon wafer from the boule while the interface between the silicon boule and the saw is bathed with the chelating solution during the cutting. | 07-26-2012 |
| 20120192848 | METHOD OF SLICING SILICON INGOT USING WIRE SAW AND WIRE SAW - To provide a method of slicing a silicon ingot for slicing a silicon ingot using a bonded abrasive wire saw, which can reduce the consumption of the bonded abrasive wire required for the slicing process as much as possible, thereby greatly reducing the manufacturing cost and to provide a wire saw used for this method. In the method of slicing a silicon ingot using a wire saw, while a bonded abrasive wire helically wound at a constant pitch around peripheral surfaces of a plurality of rollers is run with a coolant being supplied onto the wire, and while the coolant is also supplied to a side portion of the silicon ingot to be cut where the wire passes in slicing of the silicon ingot; the silicon ingot is moved relative to the wire, thereby slicing the silicon ingot to form a plurality of silicon wafers. | 08-02-2012 |
| 20120210993 | SAWING ROPE - A sawing rope ( | 08-23-2012 |
| 20120216787 | SAW WIRE - A saw wire includes a steel wire ( | 08-30-2012 |
| 20120240914 | METHOD FOR SLICING WAFERS FROM A WORKPIECE - A method for slicing wafers from a workpiece includes providing wire guide rolls each having a grooved coating with a specific thickness and providing rings at opposing ends of a first of the coatings of a respective wire guide roll. The rings are fixed exclusively to the first coating. A sawing wire including wire sections disposed in a parallel fashion is tensioned between the wire guide rolls. The wire sections of the sawing wire are moved relative to the workpiece so as to perform a sawing operation. A change in length of the first coating, brought about by a temperature change, is measured by measuring distances between sensors and the rings. The wire guide rolls are cooled in a manner dependent on the measured distances. | 09-27-2012 |
| 20120240915 | METHOD FOR SLICING WAFERS FROM A WORKPIECE - A method for slicing wafers from a workpiece includes providing wire guide rolls that each have a grooved coating with a specific thickness, providing a fixed bearing respectively associated with each wire guide roll and providing a sawing wire including wire sections disposed in a parallel fashion. The wire sections are tensioned between the wire guide rolls and are moved relative to the workpiece so as to perform a sawing operation. The wire guide rolls cooled and the fixed bearings are cooled independently of the wire guide rolls. | 09-27-2012 |
| 20120255535 | METHOD FOR CUTTING WORKPIECE WITH WIRE SAW - A method for cutting a workpiece with a wire saw includes running at least one saw wire in a lateral direction. A first abrasive grain slurry is supplied to the saw wire on two points that are separated by a predetermined distance in a lateral direction. Cutting of the workpiece is started by moving at least one of the workpiece and the saw wire relative to the other and bringing the workpiece into contact with the saw wire from above at a location between the two points on the saw wire where the first abrasive grain slurry is supplied. A second abrasive grain slurry is supplied to a part of an area where the saw wire meshes with the workpiece. | 10-11-2012 |
| 20120272942 | WIRE SAW - The invention relates to a wire saw having a saw wire drive sheave ( | 11-01-2012 |
| 20120272943 | DIAMOND WIRE SAW DEVICE - A diamond wire saw device including a diamond sawing wire. At least two diamond sawing wires are arranged in the front and back of a cutting working surface along a cutting feed direction, or at least two groups of the diamond sawing wires are arranged in the front and back of more than one parallel cutting working surface. The diamond sawing wires in the same group are parallel to one another to form a layer of cutting mesh surface. The diameter of a latter diamond sawing wire or a latter group of diamond sawing wires is equal to or greater than that of a former diamond sawing wire or a former group of diamond sawing wires. | 11-01-2012 |
| 20120272944 | WIRE SAW WORK PIECE SUPPORT DEVICE, SUPPORT SPACER AND METHOD OF SAWING USING SAME - A wire saw work piece support device ( | 11-01-2012 |
| 20130061841 | SAW WIRE AND METHOD OF MANUFACTURING GROUP III NITRIDE CRYSTAL SUBSTRATE USING THE SAME - A method of manufacturing a group III nitride crystal substrate slices a group III nitride crystal body with a saw wire which includes a steel wire having a carbon concentration of 0.90-0.95 mass %, a silicon concentration of 0.12-0.32 mass %, a manganese concentration of 0.40-0.90 mass %, a phosphorus concentration of 0.025 mass % or less, a sulfur concentration of 0.025 mass % or less, and a copper concentration of 0.20 mass % or less, and has a diameter of not less than 0.07 mm and less than 0.16 mm, a tensile strength at break of higher than 4200 N/mm | 03-14-2013 |
| 20130061842 | SINGLE-LAYERED WINDING OF SAWING WIRE WITH FIXEDLY BONDED ABRASIVE GRAIN FOR WIRE SAWS FOR SLICING WAFERS FROM A WORKPIECE - Wire spools used for multiple wire saws for slicing one or more wafers from a workpiece composed of semiconductor material using a wire web including parallel wire sections coated with bonded abrasive grain. The wire spools include a first wire spool configured as a dispensing spool and a second wire spool configured as a receiver spool. A sawing wire coated with bonded abrasive grain runs from the first wire spool via at least one deflection roll to the wire web and from the wire web via at least one deflection roll to the second wire spool. The sawing wire enters into guide grooves of the deflection rolls at an alignment angle α | 03-14-2013 |
| 20130068209 | METHODS, WIRES, AND APPARATUS FOR SLICING HARD MATERIALS - Methods, wires, and apparatus for use in cutting (e.g., slicing) hard, brittle materials is provided. The wire can be a super-abrasive wire that includes a wire core and super-abrasive particles bonded to the wire core via a metal bonding layer. This wire, or another type of wire, can be used to slice workpieces useful for producing wafers. The workpieces can be aligned within a holder to produce wafers using the device and methods presently provided. The holder rotates about its central axis, which translates to workpieces moving in orbit around this axis. A single abrasive wire, or multiple turns of wire stretched tightly between wire guides, is then contacted with the rotating holder to slice the workpieces. | 03-21-2013 |
| 20130074820 | Fret Saw Including a Cutting Wire Provided with Fixed Abrasive Grains each Including a Core Coated with a Hard Film - A fret saw includes a cutting wire and fixed abrasive grains provided on the cutting wire by electroplating. Each of the fixed abrasive grains includes a core and a hard film coated on the core. The core is 1 to 60 micrometers in diameter. The core is made of a material selected from the group consisting of a Ti metal and a Ti alloy. The hard film is 1 to 40 micrometers thick. The hard film covers about 30% to 90% of the surface of the core. | 03-28-2013 |
| 20130092143 | METHODS, WIRES, AND APPARATUS FOR SLICING HARD MATERIALS - Methods, wires, and apparatus for use in cutting (e.g., slicing) hard, brittle materials is provided. The wire can be a super-abrasive wire that includes a wire core and super-abrasive particles bonded to the wire core via a metal bonding layer. This wire, or another type of wire, can be used to slice workpieces useful for producing wafers. The workpieces can be aligned within a holder to produce wafers using the device and methods presently provided. The holder rotates about its central axis, which translates to workpieces moving in orbit around this axis. A single abrasive wire, or multiple turns of wire stretched tightly between wire guides, is then contacted with the rotating holder to slice the workpieces. | 04-18-2013 |
| 20130174828 | Systems and Methods For Controlling Surface Profiles Of Wafers Sliced In A Wire Saw - Systems and methods are disclosed for controlling the surface profiles of wafers cut in a wire saw machine. The systems and methods described herein are generally operable to alter the nanotopology of wafers sliced from an ingot by controlling the shape of the wafers. The shape of the wafers is altered by changing the temperature and/or flow rate of a temperature-controlling fluid that comes in contact with the ingot. Different feedback systems can be used to determine the temperature of the fluid necessary to generate wafers having the desired shape and/or nanotopology. | 07-11-2013 |
| 20130174829 | Methods For Mounting An Ingot On A Wire Saw - Methods are disclosed for determining mounting locations of ingots on a wire saw machine. The methods include measuring a test surface of a test wafer previously sliced by the wire saw machine from a test ingot to calibrate the system. A magnitude and a direction of an irregularity of the measured test surface of the test wafer is then determined. The mounting location is then determined for another ingot to be mounted on the ingot holder based on at least one of the magnitude and direction of the irregularity of the measured test surface of the test wafer. | 07-11-2013 |
| 20130206126 | APPARATUS AND METHOD FOR SIMULTANEOUSLY SLICING A MULTIPLICITY OF SLICES FROM A WORKPIECE - A method and apparatus are used to simultaneously slice a multiplicity of slices from a workpiece. The workpiece is held with a feed device so as to position an axis of the workpiece parallel to axes of wire guide rolls of a wire saw and is moved from above through a web of the wire saw. A slurry is supplied as abrasive to wire sections of the web while the wire sections are moved relative to the workpiece. The relative movement guides the wire sections from an entry side to an exit side through the workpiece. A coolant is sprayed from the side and below through nozzles into slicing gaps in the workpiece. The nozzles are arranged below the web parallel to the axes of the wire guide rolls. The coolant is sprayed into the slicing gaps through a nozzle situated opposite the entry side of the respective wire section. | 08-15-2013 |
| 20130269673 | Cutting chain for a hand-operated implement and hand-operated implement - A cutting chain for a hand-operated implement for cutting metal and mineral materials such as a stone cutter has central connecting links which are connected to one another by lateral connecting links. The central connecting links comprise first central connecting links which each have a drive tooth. The cutting chain has two central connecting links with drive teeth shaped differently to the drive teeth on the first central connecting links; or located a different distance from the leading drive teeth; or having no drive teeth. A hand-operated implement for cutting mineral materials has a drive motor which drives the cutting chain around a guide bar by a drive sprocket. The cutting chain is guided round part of the circumference of the drive sprocket and round a nose sprocket on the guide bar. The drive sprocket or nose sprocket have different first and second areas matched to the cutting chain. | 10-17-2013 |
| 20130284160 | METHOD FOR MANUFACTURING HEXAGONAL SEMICONDUCTOR PLATE CRYSTAL - A method of efficiently manufacturing a hexagonal semiconductor plate crystal with small warpage is provided. The method of manufacturing a hexagonal semiconductor plate crystal is a method of manufacturing a hexagonal semiconductor plate crystal by cutting a hexagonal semiconductor crystal using a crystal cutting wire, wherein the hexagonal semiconductor crystal is cut by causing the crystal cutting wire to move relative to the hexagonal semiconductor crystal so as to satisfy the conditions of 25°<α≦90° and β=90°±5° where α represents an angle formed by the c axis of the hexagonal semiconductor crystal and the normal line of the crystal face cut out by the wire and β represents an angle formed by a reference axis, which is obtained by perpendicularly projecting the c axis of the hexagonal semiconductor crystal to the crystal face cut out by the wire, and a cutting direction. | 10-31-2013 |
| 20130306047 | WALL OR FLOOR CHAINSAW - A chain bar unit for a wall saw is presented herein. The chain bar unit can include a bar configured to receive a circulating chain or wire around a perimeter of the bar. The chain bar unit also can include a driving gear for driving the chain or wire around the bar, the driving gear configured to be coupled to an output shaft of the wall saw. The chain bar unit further includes the bar being tapered from an end proximate to the driving gear to a distal end having a distal end radius, wherein a width of the bar at the proximate end, is at least two times the distal end radius of the distal end. | 11-21-2013 |
| 20130319392 | Hand-operated implement comprising a cutting chain for cutting mineral and metal materials - A hand-operated implement has a guide bar on which is fitted a cutting chain for cutting mineral and metal materials. The cutting chain is driven around the guide bar by a chain sprocket. The chain sprocket is arranged in a chain sprocket chamber which is delimited by a chain sprocket cover. A cutting element has an outer side facing a sidewall of the chain sprocket cover which lies in a first notional plane. The distance between the sidewall and the first notional plane measured perpendicular to the first notional plane and centrally between the top of the cutting element and the peripheral wall is less than approximately 0.8 cm over at least 30% of the section between a second notional plane containing the central axis of a fixing bolt on the guide bar and the exit opening at which the cutting chain leaves the chain sprocket chamber. | 12-05-2013 |
| 20130327308 | APPARATUS FOR SLICING INGOT - Provided is an apparatus for slicing an ingot. The apparatus for slicing the ingot includes a mounting part on which the ingot is mounted, a wire saw disposed under the mounting part, a slurry supply part supplying slurry from an upper side of the wire saw, and a slurry blocking part disposed on the mounting part. The slurry blocking part includes a fixing part coupled to one side of the mounting part and a slurry collection part to which a central portion thereof is coupled to a lower portion of the fixing part. | 12-12-2013 |
| 20140000579 | SAWING BEAD | 01-02-2014 |
| 20140000580 | METHOD FOR RESUMING OPERATION OF WIRE SAW AND WIRE SAW | 01-02-2014 |
| 20140083407 | WAFER SAWING SYSTEM - A wafer sawing system and a method of sawing an ingot in a wafer sawing system are described. The system includes an ingot input module, an ingot output module, two or more wire sawing chambers that each comprise: two wire guide cylinders, at least one wire disposed across both of the wire guide cylinders, a support table that is configured to receive a single ingot, and an ingot positioning system that is configured to urge the single ingot disposed on the support table against the at least one wire, and a robot that is configured to transfer the single ingot between the ingot input module, at least one of the two or more wire sawing chambers and the ingot output chamber. | 03-27-2014 |
| 20140090631 | Cutting Chain - A cutting chain for cutting concrete and other similar materials having wear and stretch resistant features. In one embodiment, the cutting chain can include chain links having a debris trap for hindering the entry of debris onto bearing surfaces. In one embodiment, side links and a center link can have cooperating members forming a maze-like debris trap and can include a lubricant and/or other barrier material. In a particular arrangement, side links can have annular ribs which can be partially received in annular grooves on a center link to create the maze-like debris trap. In another embodiment, the cutting chain can include chain links having anti-rotation structures to hinder rotation of the fastener relative to the side links. In a particular arrangement, side links can have a protrusion or slot for cooperating with a complementary mating slot or protrusion on the fastener. In another particular arrangement, the side links can have ridges in the fastener receive hole for penetrating the shaft of the fastener to resist rotation thereof. | 04-03-2014 |
| 20140144421 | CUTTING MACHINE AND METHOD OF CUTTING - A cutting machine for cutting an ingot; the cutting machine comprising a carrier configured to attach the ingot thereonto, a plurality of wires configured to cut the ingot, and a container configured to flow water onto the plurality of wires and the ingot during cutting and to submerge cut portions of the ingot in water in the container without submerging the plurality of wires. | 05-29-2014 |
| 20140165988 | RESIN-COATED SAW WIRE AND CUT ARTICLE - Provided is a resin-coated saw wire that, when used to cut a workpiece, has a shallow depth of a damaged layer and can give a cut article having a smooth surface. The resin-coated saw wire is used in cutting of the workpiece using a sawing machine and includes a steel wire and a resin coating covering the steel wire surface. The resin coating contains substantially no abrasive grain, has a hardness at 120° C. of 0.07 GPa or more, and has a hardness controlled so as to prevent abrasive grains from coming into the resin coating, which abrasive grains are sprayed during workpiece cutting. | 06-19-2014 |
| 20140190465 | SYSTEM AND METHOD FOR DIVIDING SILICON BLOCKS - The invention relates to a method for dividing silicon blocks, including the following steps: providing a cuboidal silicon block, dividing the silicon block into at least two bars in a first dividing step, turning the bars in a turning step by 90° respectively around a rotational axis perpendicular to the longitudinal direction of the block and dividing the bars into silicon ingots in a second dividing step. | 07-10-2014 |
| 20140246005 | METHOD FOR MANUFACTURING AN ELECTRODEPOSITED DIAMOND WIRE SAW USING PATTERNED NON-CONDUCTIVE MATERIALS - The present invention relates to an electrodeposited diamond wire saw using patterned non-conductive materials in which non-conductive materials are pre-patterned along the outer circumference of a wire on which diamond grit should not be rubbed, before the diamond grit is upset, in order to efficiently improve the manufacturing process, and to a method for manufacturing same. According to one preferred embodiment of the invention, the method for manufacturing an electrodeposited diamond wire saw includes: printing a masking solution on the outer circumference of a wire in a plurality of directions when the wire is inserted for patterning; and upsetting diamond grit on the remaining regions of the outer circumference of the wire, with the exception of the patterned region. | 09-04-2014 |
| 20140261368 | BANDSAW CUTTING APPARTUS AND METHOD FOR CUTTING INGOT - The present invention provides a bandsaw cutting apparatus including an actuator configured to move static pressure pads forward and backward in a rotating direction of a blade, and a controller configured to control a movement distance and a movement speed of the static pressure pads to be moved by the actuator, wherein the ingot is cut by feeding the blade relatively downward toward and below the ingot while a rotating blade is guided with static pressure pads, and the movement of the static pressure pads is controlled with the controller. The apparatus can stably suppress a displacement of the blade during cutting, thereby cutting the ingot into blocks or sample wafers for crystal quality evaluation stably with good quality cut surface at a higher cutting rate and extending the lifetime of the blade. | 09-18-2014 |
| 20140311472 | Abrasive Article and Method of Forming - An abrasive article including a substrate as an elongated member, a first layer overlying the substrate, abrasive particles overlying the first layer, fillets connecting the first layer and the abrasive particles, a bonding layer overlying the abrasive particles, the first layer and the fillets, and the fillets have a fillet characteristic relative to an abrasive application, the fillet characteristic selected from the group consisting of tacking factor (t | 10-23-2014 |
| 20150040884 | FIXED ABRASIVE GRAIN WIRE SAW, ITS MANUFACTURING METHOD, AND METHOD OF CUTTING WORKPIECE BY USING IT - A fixed abrasive grain wire saw that can improve precision of a cut plane of a workpiece and grinding efficiency and can prolong product life, a method of manufacturing the fixed abrasive grain wire saw, and a method of machining a workpiece by the fixed abrasive grain wire-saw. To fasten abrasive grains to an outer circumferential surface of a metal core wire, a plurality of transfer rollers, in each of which many tiny holes filled with an adhesive are formed, are used to transfer the adhesive to the outer circumferential surface of the core wire to form, on the outer circumferential surface, a plurality of rows of punctiform adhesive layers that are linearly arrayed in the axial direction at regular intervals. The abrasive grains are tentatively fastened to the adhesive layers, after which the abrasive grains are permanently fastened with a metal plated layer formed by electrolytic deposition. | 02-12-2015 |
| 20150053196 | DEVICE AND METHOD FOR CUTTING A STONE BLOCK - A device for cutting a block of stone that includes a support bar including a monolithic metallic plate, and a number of fluid ports attached to the plate. The device also includes a wear bar that is secured to the monolithic metallic plate and a lower longitudinal slot, and a cutting belt positioned in the lower longitudinal slot of the wear bar and including a downward-facing cutting surface to cut the block of stone. A method of cutting the stone block is also disclosed. | 02-26-2015 |
| 20150083104 | METHOD FOR SIMULTANEOUSLY CUTTING A MULTIPLICITY OF WAFERS FROM A WORKPIECE - A method for simultaneously cutting a multiplicity of wafers from a cylindrical workpiece having an axis and a notch applied parallel to the axis in a lateral surface of the workpiece includes applying a cut-in beam on the workpiece where the cut-in beam has a head end and a foot end. The head end is inserted into the notch of the workpiece. The workpiece is held with a feed device so as to position an axis of the work piece parallel to the axes of cylindrical wire guide rollers of a wire saw. The cut-in beam is moved through a planar wire web, where the planar wire web has sections of wire arranged parallel to one another and perpendicular to the axes of the wire guide roller. The wire sections are moved the longitudinal wire direction in the presence of abrasives. | 03-26-2015 |
| 20150144120 | FIXED ABRASIVE SAWING WIRE WITH CUBO-OCTAHEDRAL DIAMOND PARTICLES - The invention a fixed abrasive sawing wire comprising diamond particles held in a metallic retention layer on a steel wire. The steel wire has a diameter less than 300 μιη. More than half of the diamond particles ( | 05-28-2015 |
| 20150290728 | WIRE SAW APPARATUS AND CUT-MACHINING METHOD - A wire saw apparatus | 10-15-2015 |
| 20150298353 | SLEEVE FOR A SAWING BEAD OBTAINED BY METAL INJECTION MOULDING - Metal sleeves are used as carriers for the abrasive layer of sawing beads. Such sawing beads are threaded on a steel cord and are separated by a polymer thus forming a sawing cord for sawing of hard and brittle materials such as stone or concrete. These metal sleeves have a large influence on the overall performance as well as on the cost of the sawing cord. The inventors propose the method of metal injection moulding to make the metal sleeves in large quantities with an optimised geometry which is not possible with the current methods for making the metal sleeves. Over and above the inventive sleeves are particularly well suited for application of the abrasive layer by means of laser cladding. Beads made by laser cladding on the inventive metal sleeves as well as sawing cords comprising such beads are therefore part of the invention. | 10-22-2015 |
| 20150314484 | METHOD FOR SIMULTANEOUSLY CUTTING A MULTIPLICITY OF SLICES OF PARTICULARLY UNIFORM THICKNESS FROM A WORKPIECE - A method for simultaneously cutting a multiplicity of slices from a cylindrical workpiece, along strictly convex cutting faces, by supplying a suspension of hard substances in a carrier liquid, as cutting medium, to wire portions, while the wire portions, having a longitudinal tension, define a relative motion to the workpiece as a result of wire guide roller rotation with continual alternation between a first direction of rotation and a second direction of rotation, which is opposite to the first direction of rotation, wherein, during the rotation in the first direction, the wire is moved a first length, and during the rotation in the second direction, the wire is moved a second length, and the second length is shorter than the first, and at the cutting operation start a first longitudinal wire tension is greater than a second longitudinal tension at the end. | 11-05-2015 |
| 20150328702 | DIAMOND WIRE SAW PREVENTING ROTATION OF BEADS - A diamond wire saw preventing rotation of beads. A plurality of diamond beads are strung on a steel wire rope, the beads are combined with and fixed to the steel wire rope by injecting a rubber and plastic material, two sides of a substrate pipe of the diamond beads are pressed into a polygonal pipe mouth structure and the pipe mouth is wrapped by the rubber and plastic material, so that the diamond beads cannot rotate easily. In addition, concave lines or convex lines are disposed on inner walls of the diamond beads in the direction of the steel wire rope. The concave lines or the convex lines are embedded into the rubber and plastic material by injecting, the rubber and plastic material, and the holding force and the friction force of the diamond beads are improved. | 11-19-2015 |
| 20150328800 | METHOD OF RESUMING OPERATION OF WIRE SAW - A method of resuming operation of a wire saw in which slicing of a workpiece is suspended due to a wire break, including processes of: imparting axial reciprocating motion to a wire while supplying a new line of the wire; and slicing the workpiece into wafers by moving the workpiece downwardly to press the workpiece against the reciprocating wire while supplying a slicing slurry to the wire, the method includes: repairing the broken wire after suspending the slicing of the workpiece before resuming the slicing of the workpiece; and preparing for the slicing in that a diameter of the repaired wire at a position at which the workpiece is to be sliced is matched to the diameter of the wire just before occurrence of the wire break. The method can inhibit the formation of grooves in wafers sliced after the resumption and reduce low-quality production wafers. | 11-19-2015 |
| 20150375317 | WIRE SAW - Provided is a wire saw ( | 12-31-2015 |
| 20160031118 | WALL SAW AND INTERCHANGEABLE ASSEMBLIES FOR WALL SAWS - An interchangeable concrete cutting chainsaw cutting assembly adapted for installation upon a drive assembly in exchange for a removed, different type cutting head assembly. The chainsaw cutting assembly includes a housing that has fasteners that releasably attach the housing to a drive assembly in an installed configuration. A ration transmission has a plurality of interconnected rotation member, each rotatable member having a mounting shaft positioned at a fixed location on the housing by a bearing assembly. The driven member has a receiver that interconnects with a driveshaft of the driver assembly in the installed configuration whereby the driven member is rotated by the drive assembly. The cutting chain drive member operatively interconnected with a drive sprocket whereby rotation of the cutting chain drive member rotates the drive sprocket. The chainsaw cutting assembly is pivotable relative to the drive assembly. | 02-04-2016 |
| 20160039115 | SAWING BEADS AND METHOD FOR MAKING THE SAME - A method to make sawing beads by means of laser cladding is disclosed whereby metal matrix powder is molten by means of a laser beam on a rotating sleeve while diamonds are thrown in the molten metal pool. By carefully controlling the temperature of the molten metal pool at or above 1150° C. for less than 200 ms the internal graphitisation of the diamonds can be limited. Although some of the diamonds in the sawing bead show internal graphitisation it is demonstrated by the inventors that a sawing cord using the bead obtained by the method has an above standard sawing performance. | 02-11-2016 |
| 20160082533 | Abrasive Sawing Wire, Production Method Thereof And Use Of Same - An abrasive wire including a steel core and a coating including a binder and abrasive particles, the binder being formed by at least one iron alloy layer containing, by weight percent in relation to the weight of the binder: between 0 and 3% oxygen, advantageously between 0 and 2%; and between 0.3% and 9% of at least one element selected from the group including carbon, boron an phosphorous. | 03-24-2016 |
| 20160102265 | Polyalkylene Glycol-Grafted Polycarboxylate Suspension and Dispersing Agent for Cutting Fluids and Slurries - Cutting fluids for brittle materials, e.g., silicon ingot, comprise, in weight percent:
| 04-14-2016 |
| 20160121413 | Abrasive Sawing Wire, Production Method Thereof And Use Of Same - An abrasive wire including a steel core and an outer coating including a binder and abrasive particles, the binder being formed by at least one nickel-cobalt alloy layer having a cobalt content of between 20 wt.-% and 85 wt.-% in relation to the weight of the Ni/Co alloy. | 05-05-2016 |
| 20160122897 | METHOD FOR PRODUCING A SILICON INGOT HAVING SYMMETRICAL GRAIN BOUNDARIES - A method for producing a silicon ingot, provided with symmetrical grain boundaries, including at least steps made of: (i) providing crucible with longitudinal axis, bottom of which includes a paving formed from monocrystalline cuboid silicon seeds with a square or rectangular base and arranged contiguously, the paving, when viewed according to axis, being in shape of a grid of orthogonal directions (x) and (y) parallel to edges of seeds; and (ii) proceeding with controlled solidification of silicon by growth on seeds in a growth direction collinear to axis; wherein paving in step (i) is produced from identical silicon seeds, with two seeds contiguous in direction (x) being images of each other by turning axis (y) and two seeds contiguous in direction (y) being images of each other by turning axis (x), and misorientation 2θ between crystalline arrays of two contiguous seeds being greater than 4°. | 05-05-2016 |
| 20160176069 | METHOD FOR SLICING INGOT AND WIRE SAW | 06-23-2016 |
| 20160184909 | SYSTEMS AND METHODS FOR MANUFACTURING DIAMOND COATED WIRES - A method for designing a diamond coated wire for use in a wafer slicing system includes adjusting an initial diamond size distribution until an intermediate diamond size distribution is generated, wherein the intermediate diamond size distribution has a corresponding simulated penetration thickness value less than or equal a predetermined penetration thickness value, and wherein penetration thickness is a parameter proportional to a depth of subsurface damage that would occur when slicing an ingot using a diamond coated wire having an associated diamond size distribution. The method may include adjusting the intermediate diamond size distribution until a final diamond size distribution is generated, wherein the final diamond size distribution has a maximum diamond grit size that is substantially equal to a predetermined maximum diamond grit size, and manufacturing the diamond coated wire such that the diamond coated wire has a plurality of diamond grits that fit the final diamond size distribution. | 06-30-2016 |
| 20160250776 | METHOD FOR SLICING WORKPIECE | 09-01-2016 |
| 20220134600 | METHOD FOR CUTTING SILICON ROD AND APPARATUS FOR DIMAOND MULTI-WIRE CUTTING - Provided are a method for cutting silicon rod and an apparatus for diamond multi-wire cutting, the method for cutting silicon rod includes: using a cooling pipe to supply cutting fluid to the diamond wire, and using the diamond wire to cut the silicon rod, wherein the distance between the supply position of the cutting fluid and the periphery of the silicon rod is 10-20 mm; or adjusting the new wire running amount and/or feed speed at different positions of the crystal cross section during the cutting process. | 05-05-2022 |
