| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 125160010 | Reciprocating | 33 |
| 20080257329 | Multiware Sawing Machine For The Cutting Of Material In Block Form - The sawing machine according to the invention comprises a double portal structure ( | 10-23-2008 |
| 20090071461 | SYSTEM AND METHOD FOR CUTTING GRANITE OR SIMILAR MATERIALS - Improved methods including providing a frame saw system having multiple blades for cutting slabs of masonry materials. The improved methods allow for cutting masonry materials into slabs having surface small deviations. A process for cutting masonry blocks of granite, marble, rock, and the like, also includes positioning a support structure of a unifying material perpendicularly across the blade of the frame saw, wherein the support structure is adhered to at least one of the blades for keeping the blades in fixed relative positions, subjecting the block to a sawing operation using the frame saw, and at least substantially removing the support structure as the blades become submerged in the block. | 03-19-2009 |
| 20100078005 | SYSTEM AND METHOD FOR CUTTING GRANITE OR SIMILAR MATERIALS - An improved frame saw system has multiple blades for cutting slabs of masonry materials. The improved systems and methods allow for cutting masonry materials into slabs having surface small deviations. A frame saw system may include a support structure of unifying material bonded to at least one of the blades for keeping the blades in fixed relative positions. The support structure may be removable from the frame saw system as the blades are engaged in a swinging motion cutting into the block. In addition, a process for cutting masonry blocks of granite, marble, rock, and the like, includes pretreating the surface of the block with a skim coat to fill surface irregularities prior to cutting operations. A frame saw system may contain one or more spacers between the saw blades wherein a compressive force is applied across the blades connected to a frame to reduce deflection of the blades while cutting. | 04-01-2010 |
| 20100163009 | MULTI-WIRE SAW AND METHOD FOR CUTTING INGOT - To provide a multi-wire saw that, at the start of cutting of an ingot, prevents a wire from being displaced in grooves of guide rollers due to the wire being lifted. A wire is wound around a plurality of wire guide rollers to be positioned in a feeding direction of an ingot, and in this state, a wire-lifting restraining member that is a body of rotation and restrains the wire from being lifted by being brought into contact with the wire is disposed near the wire guide rollers. | 07-01-2010 |
| 20100180879 | BLOCK-CUTTING GANGSAW FOR CUTTING GRANITE OR OTHER HARD MATERIALS, AND CORRESPONDING CUTTING METHOD - Block-cutting gangsaw with vertical frame for cutting granite or other hard materials, comprising a blade-holding frame ( | 07-22-2010 |
| 20100252017 | METHOD FOR SLICING WORKPIECE BY USING WIRE SAW AND WIRE SAW - The present invention is a wire saw in which a wire for slicing is wound around a plurality of rollers to form a wire row; the wire for slicing is driven axially in a reciprocating direction; a workpiece is sliced simultaneously at a plurality of points arranged in an axial direction by feeding the workpiece against the wire row with the workpiece cut into while a slurry is supplied to the wire for slicing; the wire saw controlling in such a manner that the workpiece is extracted while the wire is caused to travel at a speed of 2 m/min or less at the time of extracting the workpiece from the wire row after slicing the workpiece. As a result, there is provided a wire saw in which the workpiece sliced with the wire row of the wire saw can be extracted from the wire row with a simple structure without a negative influence on its slicing surface. | 10-07-2010 |
| 20110083655 | MOUNTING PLATE FOR A WIRE SAWING DEVICE, WIRE SAWING DEVICE COMPRISING THE SAME, AND WIRE SAWING PROCESS CARRIED OUT BY THE DEVICE - The device ( | 04-14-2011 |
| 20110088678 | METHOD FOR RESUMING OPERATION OF WIRE SAW AND WIRE SAW - The present invention is a method for resuming operation of a wire saw comprising the steps of: slicing the workpiece while measuring and recording a displacement amount in an axial direction of each of the grooved rollers and a temperature of the workpiece during the slicing of the workpiece; suspending the slicing of the workpiece; adjusting the displacement amount in an axial direction of each of the grooved rollers and the temperature of the workpiece by supplying temperature-adjusting mediums separately temperature-controlled to the grooved rollers and the workpiece so as to be equal to the displacement amount and temperature recorded upon suspending the slicing of the workpiece respectively, after the suspending, before resuming the slicing of the workpiece; and thereafter resuming the slicing. As a result, there is provided a method for resuming operation of a wire saw and the wire saw that can suppress deterioration of nano-topography of each sliced wafer after processing and can resume to complete the slicing without generation of quality problems of a product wafer, even when the slicing of the workpiece is suspended halfway due to breaking of the wire and the like during the slicing of the workpiece, such as a semiconductor ingot, with the wire saw. | 04-21-2011 |
| 20110192388 | METHOD FOR SLICING A MULTIPLICITY OF WAFERS FROM A CRYSTAL COMPOSED OF SEMICONDUCTOR MATERIAL - A method for slicing a plurality of wafers from a crystal includes providing a crystal of semiconductor material having a longitudinal axis, a cross section and at least one pulling edge. The crystal is fixed on a table and guided through a wire gang defined by sawing wire so as to form the wafers. The guiding is provided by a relative movement between the table and the wire gang such that entry sawing or exit sawing using the sawing wire occurs in a vicinity of the at least one pulling edge of the crystal. | 08-11-2011 |
| 20160107334 | STONE CUTTING DEVICE - A stone cutting device configured to cut a workpiece with a plurality of cutting tools by swinging the cutting tools within a predetermined angle range. Each of the cutting tools includes: a blade extending in a length direction of the workpiece; and at least one cutting tip disposed on an end of the blade and protruding from the blade in a width direction of the blade so as to cut the workpiece while being reciprocated in a swinging motion. The stone cutting device includes a frame unit configured to combine and reciprocate the cutting tools and individually adjust tension in each of the cutting tools. The frame unit includes an actuator applying tension to the cutting tools so as to apply a load of 8 tons to 27 tons to each of the cutting tools. | 04-21-2016 |
| 125160020 | Having saw with supply and take-up means | 20 |
| 20090032006 | Wire saw process - This invention provides a method for increasing the cutting performance of a wire saw, in cutting a substrate, by increasing the association of the abrasive particles in the cutting slurry and the cutting wire, the enhancement being caused by the use of thickening agents in the cutting slurry or by increasing the attraction of the abrasive particles to the cutting wire. | 02-05-2009 |
| 20090064982 | WORKPIECE MOUNTING AND METHOD FOR WIRE SAWING - A method and a device for cutting a workpiece in a wire saw is described, wherein a workpiece is fixed in a wire saw by means of a mounting beam. In the method according to the invention, the generation of a mark or a step on the cutting area along the cutting slit at the transition from the workpiece to the mounting beam is moved further to the edge of the cutting area or is avoided entirely. Therefor, the workpiece is held during the cutting operation in the wire saw by a mounting beam such that while one of the two piercing points lies on the surface of the workpiece and while simultaneously the other of the two piercing points lies on the surface of the mounting beam, the piercing point lying on the surface of the workpiece is the entry side piercing point. | 03-12-2009 |
| 20090320819 | CARBON NANOTUBE FIBER WIRE FOR WAFER SLICING - A wire saw for cutting hard materials includes a carbon nanotube fiber wire spun from carbon nanotubes. The carbon nanotube fiber wire may be made from a plurality of fibers, each fiber being spun from carbon nanotubes, the fibers being twisted together to form the wire. Furthermore, the wire may also include diamond particles, silicon carbide particles and/or extra carbon nanotubes to enhance the abrasive properties of the wire. A method is provided for slicing a silicon boule including: linearly translating a carbon nanotube fiber wire between rotating drums while maintaining the wire under tension; using a fixture, moving the silicon boule onto the moving tensioned wire, whereby the wire cuts into the silicon; delivering lubricating fluid to the surface of the silicon where contact is made with the wire; and collecting the lubricating fluid after it leaves the surface of the silicon. | 12-31-2009 |
| 20100006082 | WIRE SLICING SYSTEM - A wire slicing system and method for using it include one or more of the following features: arrangements and/or operations that relate to handling the wire; apparatus and methods that relate to wire tensioning; equipment and techniques for manipulating the workpiece; arrangements and/or operations designed for cooling and swarf (debris) removal; controls and/or automation that can be used in conjunction with these features. | 01-14-2010 |
| 20100037880 | SLURRY FOR SLICING SILICON INGOT AND METHOD FOR SLICING SILICON INGOT USING THE SAME - The invention is a slurry for slicing a silicon ingot, containing a basic material, such as an alkali metal hydroxide, abrasive powder and water, in which the slurry contains the basic material in an amount of from 2 to 6% by mass and glycerin in an amount of from 25 to 55% by mass, based on a total mass of components of the slurry excluding the abrasive powder. | 02-18-2010 |
| 20100089377 | SLICING METHOD AND WIRE SAW APPARATUS - The invention is directed to a method for slicing an ingot in the form of a wafer by winding a wire around a plurality of grooved rollers and pressing the wire against the ingot while making the wire travel and supplying slicing slurry to the grooved rollers, in which when the ingot is sliced, an amount of displacement of the ingot changing in an axial direction is measured and an amount of axial displacement of the grooved rollers is controlled so as to correspond to the measured amount of axial displacement of the ingot, and thereby, the ingot is sliced while controlling a relative position of the wire relative to an entire length of the ingot changing in the axial direction. As a result, a slicing method and a wire saw apparatus are provided that can perform slicing in such a way that a Bow or a Warp in a wafer obtained by slicing can be reduced, for example, by controlling a slicing path built into an ingot so that, in particular, the slicing path becomes flattened. | 04-15-2010 |
| 20100126488 | METHOD AND APPARATUS FOR CUTTING WAFERS BY WIRE SAWING - A method and apparatus of cutting wafers by wire sawing is disclosed. In one embodiment, a wire sawing apparatus includes a horizontal ingot feeding wire slicing apparatus which includes a vertical wire web, in which sawing wires of the vertical wire web are located substantially in a vertical plane and move in a substantially vertical direction, a top outlet located in top position with respect to a work piece for applying fluid during sawing, and a chute located substantially below the work piece for receiving the fluid, wherein the work piece is impelled against the vertical wire web by horizontal movement and the fluid moves in a vertical direction against and into the work piece. The wire sawing apparatus further includes a frame for holding the horizontal ingot feeding wire slicing apparatus, and a control panel for operating the wire sawing apparatus. | 05-27-2010 |
| 20100126489 | IN-SITU WAFER PROCESSING SYSTEM AND METHOD - An integrated wafer processing system and a method thereof is disclosed. In one embodiment, a wafer stack of sliced wafers includes a base, and a plurality of sliced wafers extending outwardly from the base, where the plurality of sliced wafers are obtained by slicing a portion of a work piece, where the base is an uncut portion which is the remaining portion of the work piece or a plate attached by welding to the plurality of sliced wafers and where the work piece is mono-crystalline or multi-crystalline silicon. Further, the wafer stack of sliced wafers are treated in-situ in cleaning and wet chemical tanks for processes such as damage etching, texturization and oxide etching and also treated in-situ in high temperature furnaces for processes such as diffusion and anti-reflection coating. | 05-27-2010 |
| 20100180880 | Method of improving nanotopography of surface of wafer and wire saw apparatus - The present invention provides a method of improving nanotopography of a surface of a wafer sliced from an ingot by using a wire saw apparatus, including improving straightness of feed of a work feed table which is included in the wire saw apparatus and used for feeding the ingot to a wire row formed by winding a wire around a plurality of rollers, and also provides a wire saw apparatus for slicing an ingot to manufacture a wafer, including: a wire row formed by winding a wire around a plurality of rollers; a work feed table for holding and feeding the ingot to the wire row; and a linear-motion guide for linearly guiding the work feed table, wherein a component having a wavelength of 20 to 200 mm in straightness of feed of the work feed table satisfies a PV value ≦1.0 μm. As a result, there are provided the method of eliminating slice waviness having periodicity to improve the nanotopography of the surface of the wafer and the wire saw apparatus. | 07-22-2010 |
| 20100206285 | WIRE SAW APPARATUS - A wire saw apparatus having: a wire wound around grooved rollers and axially travels in a reciprocating direction; a nozzle for supplying a slurry; and a work-feeding mechanism feeding a work toward the wire, and slicing into wafers by pressing and feeding the work against the wire traveling in a reciprocating direction while a slurry is supplied to the wire through the nozzle. A work-holding portion holds the work through a pad plate adhered to the work and a work plate, plate-shaped or block-shaped slurry-splash-blocking members are arranged in the direction of a right angle to a row of the wire wound around the grooved rollers below the work-holding portion and on both the wire cut-in side and a wire cut-out side. | 08-19-2010 |
| 20110048396 | WIRE SAW DEVICE - An object of the present invention is to provide at a relatively cheap price a wire saw device capable of effectively preventing slurry from splashing onto the top surface of a work and effectively suppressing increase in nanotopography and Warp. The wire saw device | 03-03-2011 |
| 20110126813 | MULTI-WIRE WAFER CUTTING APPARATUS AND METHOD - A multi-wire slurry-free wafer cutting apparatus along with a method for optimizing saw operation is disclosed that includes a cutting wire impregnated with a plurality of cutting particles wrapped multiple times around two or more wire guides to form a multi-wire web. A drive mechanism drives the web across an ingot at an optimum speed determined by setting a multi-wire web speed to an initial speed, detecting vibration of the web, identifying the web speed having a lowest vibration, and operating the drive mechanism at that speed as optimum. A cleansing fluid is applied to the multi-wire web that includes a major portion of water and a minor portion of surfactant which cleans the cutting wire and keeps the cut particles free of oxidation. One or more cleansing fluid applicators are configured to apply the cleansing fluid to the multi-wire web close to the ingot in a laminar flow. | 06-02-2011 |
| 20110132345 | WIRE SAW DEVICE AND METHOD FOR OPERATING SAME - A wire saw device for sawing semiconductor material is provided, the wire saw device comprising a wire guide device ( | 06-09-2011 |
| 20120298090 | METHOD OF CUTTING WORKPIECE WITH WIRE SAW, AND WIRE SAW - The present invention provides a method of cutting a workpiece efficiently with high accuracy by utilizing tension adjusters to approximate tension in a wire in a wire saw to a predetermined target tension while effectively reducing only tension in a winder-side wire. The method comprises a forward-driven cutting step of cutting a workpiece while moving a wire forward, a first switching step of reversing a driving direction of the wire, a backward-driven cutting step of cutting the workpiece while moving the wire backward, and a second switching step of reversing a driving direction of the wire and returning to the forward-driven cutting step, the steps being repeated in this order. In both switching steps, only tension in a winder-side wire is reduced by tension manipulators. A reduction in target wire tension therefor is performed after completion of deceleration of the wire in each switching step. | 11-29-2012 |
| 20120298091 | WIRE SAW - The present invention provides a wire saw which cuts a workpiece using a cutting wire and is capable of adjusting wire tension with high responsiveness. The wire saw includes first and second workpiece cutting units | 11-29-2012 |
| 20130333682 | METHOD FOR SIMULTANEOUSLY SLICING A MULTIPLICITY OF WAFERS FROM A CYLINDRICAL WORKPIECE - A method for simultaneously slicing a multiplicity of wafers from a substantially circular-cylindrical workpiece that is connected to a sawing strip includes executing a relative movement between the workpiece and a wire gang of a wire saw with the aid of a forward feed device with a defined forward feed rate so as to slice the wafers. The forward feed rate is varied through the course of the method and includes being set to a value v | 12-19-2013 |
| 20140144420 | METHOD FOR RESUMING A WIRE SAWING PROCESS OF A WORKPIECE AFTER AN UNPLANNED INTERRUPTION - A method resumes an interrupted process for sawing a workpiece into wafers using a wire saw that includes advancing a wire web into existing sawing kerfs of the workpiece with a forward movement of the sawing wire with a first speed in the presence of a liquid sawing medium until the wire web or workpiece has reached a position corresponding to the interruption of the wire sawing process. The sawing wire is moved in defined time intervals by a forward movement of a particular length with a second speed and a backward movement of another length with a third speed, where the backward length is less than the forward length and the forward and backward movement correspond to a cycle. The wire length that is unwound during the forward movements is increased until the length during the forward movement corresponds to the length of the forward movement before the interruption. | 05-29-2014 |
| 20140150766 | ABRASIVE ARTICLE AND METHOD OF FORMING - A method of conducting a cutting operation on a workpiece including providing an abrasive article having a substrate having an elongated body, a tacking layer overlying the substrate, and a first type of abrasive particle contained in the tacking layer, the method further including moving the abrasive article and a workpiece relative to each other, the workpiece including a material selected from the group consisting of a ceramic, a semiconductive material, an insulating material, a glass, a natural material, organic material, and a combination thereof. | 06-05-2014 |
| 20140318522 | METHOD FOR SLICING WORKPIECE - A method for slicing a workpiece includes: imparting axial reciprocating motion to a wire wound around a plurality of grooved rollers, the wire including bonded abrasive grains; and pressing the workpiece against the reciprocating wire and feeding the workpiece while supplying a machining liquid to the wire to slice the workpiece into wafers, wherein the workpiece is sliced while repeating a process in which the workpiece is fed in a feed direction by a feed amount of 5 mm or more but no more than 30 mm and then reversed in a direction opposite to the feed direction by a reverse amount which is equal to or more than a quarter of the feed amount, less than the feed amount, and equal to or less than 1/15 of a length of the workpiece in the feed direction. The method can improve the quality of sliced workpiece, particularly nanotopography. | 10-30-2014 |
| 20150298228 | WIRE MANAGEMENT SYSTEM - The invention relates to a wire management system ( | 10-22-2015 |
| 125160030 | Lever-operated saw | 1 |
| 20160082619 | CUTTING TOOL AND CUTTING APPARATUS COMPRISING SAME - A cutting tool and a cutting apparatus including a cutting tool. The cutting tool includes: a blade extending and reciprocating in a length direction of a workpiece for cutting the workpiece; at least one cutting tip provided on an end of the blade and protruding in a width direction of the blade for cutting the workpiece while contacting the workpiece; and an auxiliary cutting structure provided on at least one side of the blade and corresponding to a width of the cutting tip to prevent the blade from wobbling in a slot formed by the cutting tip. The cutting apparatus includes: a frame unit disposed at both sides of a workpiece in a cutting direction of the workpiece; and the cutting tool, the cutting tool configured to cut the workpiece while being reciprocated by power transmitted from a driving unit disposed on a side of the frame unit. | 03-24-2016 |
| 125017000 | Saw racks | 1 |
| 20110253121 | WORKPIECE FOR FRAME GANG SAW, METHOD FOR CUTTING THE WORKPIECE, AND PRODUCT CUT BY THE METHOD - There is provided a method of cutting or drilling workpiece including stone such as marble and granite, brick, concrete and asphalt, using a frame gang saw. There are provided a workpiece cut by a frame gang saw that includes one or a plurality of blades having multiple cutting tips or that includes a blade without including a cutting tip; a method of cutting the workpiece by using a frame gang saw; and a product provided by the cutting method. The workpiece is provided to include one or more grooves into which at least a portion of at least one cutting tip among the multiple cutting tips or at least a portion of the blade without a cutting tip is inserted and which is formed in a surface thereof. Here, an initial cutting time on a workpiece may be shortened to greatly improve productivity and the quality of a product and a lifespan of a frame gang saw blade may be improved by significantly decreasing deflection in the blade. | 10-20-2011 |
| 125018000 | Saw blades | 1 |
| 20090090344 | MONOFILAMENT METAL SAW WIRE - Monofilament metal saw wire for a wire saw, wherein the saw wire being provided with a plurality of crimps. The crimps are arranged in at least two different planes, such that, when measured, between measuring rods of a micrometer, over a length comprising crimps in at least two different planes, a circumscribed enveloping D diameter of the saw wire is between 1.05 and 1.50 times a diameter d of the saw wire itself. | 04-09-2009 |
