| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 118069000 | Cooling | 11 |
| 20100122654 | THERMALLY CONTROLLED FLUIDIC SELF-ASSEMBLY - Methods and apparatuses are provided for assembling a structure on a support having a pattern of binding sites. In accordance with the method, a first fluid is provided on the surface of the support with the first fluid being of a type that that increases viscosity when cooled, the first fluid having first micro-components suspended therein each adapted to engage the binding sites. First fluid proximate to selected binding sites is cooled to increase the viscosity of the responsive fluid proximate to the selected binding sites so that the first micro-components suspended in the first fluid are inhibited from engaging the selected binding sites. | 05-20-2010 |
| 20100192844 | Apparatus and method for treating substrate - An apparatus and method for treating a substrate are provided. The apparatus includes a load port, an index module, a first buffer module, a coating/developing module, a second buffer module, a pre/post-exposure treatment module, and an interface module, which are sequentially arranged in a direction. The coating/developing module includes a coating module and a developing module, which are arranged in different layers. The pre/post-exposure treatment module includes a pre-treatment module and a post-treatment module, which are disposed at different layers. The pre-treatment module coats a protective layer on the wafer before an exposure process. The post-treatment module performs a wafer cleaning process and a post-exposure bake process after the exposure process. A robot for transferring the wafer is disposed in each of the pre-treatment and post-treatment modules. | 08-05-2010 |
| 20100206222 | Mask adhesion unit and deposition apparatus using the same - A mask adhesion unit for a deposition apparatus includes a magnetic assembly, a cap plate spaced apart from the magnetic assembly, and a magnetic control unit between edges of the magnetic assembly, and the cap plate. A deposition apparatus using the same is capable of adhering a substrate and a mask assembly together using the mask adhesion unit to improve deposition precision, while preventing deformation of a slit of the mask assembly. | 08-19-2010 |
| 20100326351 | APPARATUS AND METHOD FOR HEATING SUBSTRATE AND COATING AND DEVELOPING SYSTEM - A substrate heating apparatus includes a top plate arranged above a hot plate so that a vertical space is formed between the hot plate and the top plate. The top plate has an evacuated internal chamber serving as a vacuum insulating layer that suppresses heat transfer from a first surface of the top plate facing the hot plate to a second surface of the top plate opposite to the first surface. When heating the substrate, a gas flow flowing through the space between the hot plate and the top plate is generated. | 12-30-2010 |
| 20110094440 | APPARATUSES USEFUL IN PRINTING, FIXING DEVICES AND METHODS OF PREHEATING SUBSTRATES IN APPARATUSES USEFUL IN PRINTING - Apparatuses useful in printing, fixing devices and methods of preheating substrates in apparatuses useful in printing are provided. An exemplary embodiment of the apparatuses useful in printing includes a first member including a first surface; a second member including a second surface forming a nip with the first surface; a substrate cooler disposed downstream from the nip to receive a first substrate exiting the nip, the substrate cooler removing heat from the first substrate by conduction; a substrate pre-heater disposed upstream from the nip; and a first heat transfer system for transferring heat from the substrate cooler to the substrate pre-heater. The substrate pre-heater applies the heat to conductively pre-heat a second substrate before the second substrate enters the nip. | 04-28-2011 |
| 20120097095 | Thermal Method to Control Underfill Flow in Semiconductor Devices - Apparatus for assembling a semiconductor device has a plate with body and a surface heatable to a controlled a temperature profile from location to location across the plate. Mesas at same temperature of plate protrude from the surface are configured to support a portion of the substrate. Movable capillaries have openings for blowing cooled gas onto selected locations of the assembly. At least one movable syringe movable has an opening for dispensing a polymer precursor. | 04-26-2012 |
| 20120285375 | APPARATUS FOR TREATING THIN FILM LAYERS DURING PHOTOVOLTAIC MODULE MANUFACTURE - Systems and processes for treatment of a cadmium telluride thin film photovoltaic device are generally provided. The systems can include a treatment system and a conveyor system. The treatment system includes a preheating section, a treatment chamber, and an anneal oven that are integrally interconnected within the treatment system. The conveyor system is operably disposed within the treatment system and configured for transporting substrates in a serial arrangement into and through the preheat section, into and through the treatment chamber, and into and through the anneal oven at a controlled speed. The treatment chamber is configured for applying a material to a thin film on a surface of the substrate and the anneal oven is configured to heat the substrate to an annealing temperature as the substrates are continuously conveyed by the conveyor system through the treatment chamber. | 11-15-2012 |
| 20140261164 | Methods and apparatuses for roll-on coating - Coating rollers accepting liquid media provide liquid chemicals to substrates for depositing a thin coating layer on the flat substrates, such as semiconductors or panels. The liquid media is cooled to a life-preserving temperature while shielded from the thermal energy heating the substrates to prevent degrading the liquid media. Physical barrier or temperature barrier can be established in vicinities of the rollers to further limit exposing the liquid media to high temperature. | 09-18-2014 |
| 20160067731 | COATING SYSTEM HAVING A COOLING DEVICE - The invention relates to a coating system for coating components with a coating medium, in particular a painting system for painting motor vehicle bodywork components with a paint, comprising at least one pneumatic pump with a feed air connection for feeding in a feed air stream for mechanically powering the pump and comprising an exhaust air connection for conducting away a depressurised, cold exhaust air stream and with a heating-sensitive component of the coating system. The coating system according to the invention also comprises a cooling device for cooling the heating-sensitive component of the coating system by means of the exhaust air stream of the pump. | 03-10-2016 |
| 20160068946 | DEPOSITION DEVICE AND DEPOSITION METHOD USING SAME - A deposition device includes: a cooling unit that cools workpieces; a rotating table main body that rotates around a vertical axis, this rotating table main body having a cooling unit placement portion on which the cooling unit is placed and workpiece placement portions which are arranged so as to surround the periphery of the cooling unit placement portion and on which the workpieces are placed respectively; a lifting mechanism that lifts and lowers the cooling unit, inside the space, between a first position in which the cooling unit is placed on the rotating table main body and a second position in which the cooling unit is spaced upward from the rotating table main body and faces side surfaces of the workpieces placed on the workpiece placement portions; and refrigerant piping attached to the chamber and detachably connected to the cooling unit to supply the refrigerant to the cooling unit. | 03-10-2016 |
| 20160184758 | REMOVAL OF DUST IN UREA FINISHING - Disclosed is a method for the removal of urea dust from the off- gas of a finishing section ( | 06-30-2016 |
