Class / Patent application number | Description | Number of patent applications / Date published |
118720000 | Having means to expose a portion of a substrate to coating medium | 65 |
20080202421 | MASK AND SUBSTRATE ALIGNMENT FOR SOLDER BUMP PROCESS - A system for of aligning a mask to a substrate comprising: a fixture for holding the mask and the substrate in fixed positions relative to each other; means for holding the substrate, the means for holding the substrate protruding through openings in a table and the fixture, the means for holding fixedly mounted on a stage, the stage moveable in first and second directions and rotatable about an axis relative to the table; means for affixing the fixture containing the mask and the substrate to the table; means for controlling the means for temporarily affixing so as to generate a uniform force around a perimeter of the fixture to effectuate the temporarily affixing; means for aligning the mask to the substrate, the means for aligning controlling movement of the stage in the first and second directions and rotation about the axis; and means for fastening the fixture together. | 08-28-2008 |
20090145358 | DEPOSITION MATERIAL SUPPLYING MODULE AND THIN FILM DEPOSITION SYSTEM HAVING THE SAME - A deposition material supplying module includes a canister configured to define a storage space in which a deposition material is stored, a material flow controller provided with at least one groove receiving the deposition material supplied from the canister and adapted to rotate, and a carrier gas supplying unit configured to supply carrier gas to the material flow controller. The deposition material is filled in the groove and a fixed amount of the deposition material is supplied into the process chamber using the deposition material flow controller. Therefore, it is easy to control an amount of the deposition material supplied to the process chamber and the reliability on the fixed-quantity supply can be improved. | 06-11-2009 |
20090159005 | COATINGS FOR SEMICONDUCTOR PROCESSING EQUIPMENT - Systems and methods of coatings for semiconductor processing equipment. A semiconductor substrate processing system includes an enclosure for containing a semiconductor processing gas. The enclosure has an interior surface that is at least partially coated with a Silicon carbide coating to a desired thickness. The enclosure may be inlet piping for conveying the semiconductor processing gas to a processing chamber for processing the semiconductor substrate, a processing chamber and/or an exhaust flume for conveying used semiconductor processing gas away from a processing chamber. The interior surface may include additional coatings comprising Silicon and/or diamond like Carbon. | 06-25-2009 |
20090217872 | BACKSIDE COATING PREVENTION DEVICE, COATING CHAMBER DEVICE FOR COATING PLATE-SHAPED SUBSTRATES, AND METHOD OF COATING - A backside coating prevention device adapted for a coating chamber for coating plate-shaped substrates, said coating chamber comprising a plurality of walls, a coating material source for dispensing coating material into the coating chamber, a substrate support, a front side of the substrate support facing the coating material source, the substrate support being adapted for supporting on the front side one or more plate-shaped substrates each having a substrate front side and thereby defining a substrate front plane, wherein said backside coating prevention device comprises two or more screens, the screens being provided at least two of the walls of the coating chamber, each screen having a protruding member protruding from the respective wall. | 09-03-2009 |
20100058985 | Photoresist supply apparatus and photoresist supply method - Provided is a photoresist supply apparatus. The photoresist supply apparatus includes a discharge nozzle, a metering pump, a trap tank, a bottle, and a first drain line. The discharge nozzle discharges a photoresist onto a wafer. The metering pump supplies the photoresist of a fixed quantity into the discharge nozzle. The trap tank temporarily stores the photoresist to be supplied from the metering pump to the discharge nozzle. The bottle contains the photoresist stored in the trap tank. The bubble discernment member determines whether bubbles exist in the standby photoresist to be supplied from the pump to the discharge nozzle. The first drain line connects the pump to a waste liquid tank to drain the standby photoresist from the pump to the waste liquid tank when the bubble discernment member checks the bubbles. | 03-11-2010 |
20100170439 | VAPOR DEPOSITION APPARATUS - Contamination of organic EL device is prevented. After a colored layer of the first color is formed, a positioning device moves relatively a substrate and a mask inside the same vacuum chamber, and an opening of the mask is moved to a position above the region where a colored layer of the next color is to be formed. As a result, since the colored layers of two or more colors can be formed without changing the mask and the moving distance of the substrate during deposition becomes short, dust is not generated and contamination of the organic EL device is prevented. | 07-08-2010 |
20100224128 | SEMICONDUCTOR MANUFACTURING APPARATUS - Provided is a semiconductor manufacturing apparatus in which the density of plasma generating in a reaction chamber can be uniformly maintained. The semiconductor manufacturing apparatus comprises a process chamber configured to process a substrate, a plurality of electrodes installed outside the process chamber for generating plasma, and an adjusting unit disposed between the process chamber and the electrodes for adjusting density of plasma generating in the process chamber. | 09-09-2010 |
20110088622 | THIN FILM DEPOSITION APPARATUS - A thin film deposition apparatus can be simply applied to produce large-sized display devices on a mass scale and improves manufacturing yield. The thin film deposition apparatus for forming a thin film on a substrate includes: a deposition source that discharges a deposition material; a deposition source nozzle unit disposed at a side of the deposition source and including a plurality of deposition source nozzles arranged in a first direction; and a patterning slit sheet disposed opposite to the deposition source nozzle unit and including a plurality of patterning slits arranged in the first direction; wherein each of the patterning slits includes a plurality of sub-slits. | 04-21-2011 |
20110107968 | SEMICONDUCTOR MANUFACTURING APPARATUS - A semiconductor manufacturing apparatus includes: a reaction chamber for providing an airtight process space; a boat for loading/unloading a pair of semiconductor substrates into/from the reaction chamber, wherein the boat includes susceptors and rotary tables to be rotatably supported by a plurality of supporting rollers, each semiconductor substrate being mounted onto each susceptor and each susceptor being mounted onto each rotary table, respectively; heaters, arranged at backsides of the semiconductor substrates, for performing an epitaxial process in the reaction chamber; a process gas nozzle, installed to encircle an upper fringe of the semiconductor substrates; an exhaust gas nozzle, installed to encircle a lower fringe of the semiconductor substrates; and a purge gas nozzle for supplying a purge gas capable of preventing an outer wall of the process gas nozzle from being deposited, wherein the purge gas nozzle is arranged near to the process gas nozzle. | 05-12-2011 |
20110297087 | VACUUM METALLIZATION DEVICE WITH MEANS TO CREATE METAL-FREE AREAS - A system for vacuum deposition of a coating on a web material (N), includes: a feed path of the web material in a vacuum environment; along the feed path, a process roller ( | 12-08-2011 |
20120174865 | DEPOSITION SOURCE AND ORGANIC LAYER DEPOSITION APPARATUS INCLUDING THE SAME - A deposition source and an organic layer deposition apparatus that may be simply applied to the manufacture of large-sized display apparatuses on a mass scale and may prevent or substantially prevent deposition source nozzles from being blocked during deposition of a deposition material, thereby improving manufacturing yield and deposition efficiency. A deposition source includes a first deposition source including a plurality of first deposition source nozzles, and a second deposition source including a plurality of second deposition source nozzles wherein the plurality of first deposition source nozzles and the plurality of second deposition source nozzles are tilted toward each other. | 07-12-2012 |
20130042810 | Method and System for Mask Handling in High Productivity Chamber - A structure for independently supporting a wafer and a mask in a processing chamber is provided. The structure includes a set of extensions for supporting the wafer and a set of extensions supporting the mask. The set of extensions for the wafer and the set of extensions for the mask enable independent movement of the wafer and the mask. In one embodiment, the extensions are affixed to an annular ring which is capable of moving in a vertical direction within the processing chamber. A processing chamber, a mask, and a method for combinatorially processing a substrate are also provided. | 02-21-2013 |
20130068160 | EVAPORATION DEVICE AND EVAPORATION APPARATUS - An evaporation device and an evaporation apparatus applying the same are adapted to performing evaporation process to an object to be coated. The evaporation device includes a tape carrier and a mask. The tape carrier has a heating region. The object to be coated is located over the heating region and is adapted to move along a feeding direction. The tape carrier is adapted to carry a coating material to pass through the heating region. The coating material is heated in the heating region and evaporated. The mask having an opening between the heating region and the object to be coated is disposed in the periphery of the heating region. The evaporated coating material is adapted to pass through the opening and coated on the object. | 03-21-2013 |
20130104801 | MASK FOR USE IN EVAPORATION COATING DEVICE | 05-02-2013 |
20130167773 | Combinatorial Processing Using High Deposition Rate Sputtering - Apparatuses and methods for high-deposition-rate sputtering for depositing layers onto a substrate are disclosed. The apparatuses generally comprise a process chamber; one or more sputtering sources disposed within the process chamber, wherein each sputtering source comprises a sputtering target; a substrate support disposed within the process chamber; a shield positioned between the sputtering sources and the substrate, the shield comprising an aperture positioned under each sputtering source; and a transport system connected to the substrate support capable of positioning the substrate such that one of a plurality of site-isolated regions on the substrate can be exposed to sputtered material through the aperture positioned under each of the sputtering sources; wherein the spacing between the sputtering target and the substrate is less than 100 mm. The apparatus enables high deposition rate sputtering onto site-isolated regions on the substrate. | 07-04-2013 |
20130186335 | VAPOR DEPOSITION APPARATUS - A vapor deposition apparatus ( | 07-25-2013 |
20130213301 | MASK PATTERN FORMING METHOD, FINE PATTERN FORMING METHOD, AND FILM DEPOSITION APPARATUS - In a mask pattern forming method, a resist film is formed over a thin film, the resist film is processed into resist patterns having a predetermined pitch by photolithography, slimming of the resist patterns is performed, and an oxide film is formed on the thin film and the resist patterns after an end of the slimming step in a film deposition apparatus by supplying a source gas and an oxygen radical or an oxygen-containing gas. In the mask pattern forming method, the slimming and the oxide film forming are continuously performed in the film deposition apparatus. | 08-22-2013 |
20130228124 | SUBSTRATE SUPPORT WITH CERAMIC INSULATION - Embodiments of the present invention generally relates to substrate supports for use in a plasma processing chamber. The substrate supports, which are metallic, have ceramic inserts to prevent arcing between the substrate support and the shadow frame used to protect the edges of the substrate support during processing. In large area substrate processing chambers, the shadow frame may comprise multiple pieces. The individual pieces may be coupled together, but spaced slightly apart by a gap to permit thermal expansion. Ceramic inserts are positioned on the substrate support so that when a shadow frame is positioned adjacent thereto, the ceramic inserts are located adjacent the gaps in the shadow frame. The ceramic inserts adjacent the gap prevent and/or reduce the arcing because the gaps are located over electrically insulating material rather than electrically conductive material. | 09-05-2013 |
20130263782 | FLIP EDGE SHADOW FRAME - Device for processing a substrate are described herein. An apparatus for controlling deposition on a substrate can include a chamber comprising a shadow frame support, a substrate support comprising a substrate supporting surface, a shadow frame with a shadow frame body including a first support surface, a second support surface opposite the first surface, and a detachable lip connected with the shadow frame body. The detachable lip can include a support connection, a first lip surface facing the substrate, a second lip surface opposite the first lip surface, a first edge positioned over the first support surface, and a second edge opposite the first edge to contact the substrate. | 10-10-2013 |
20130276701 | DEPOSITION DEVICE, AND COLLECTION DEVICE | 10-24-2013 |
20130291796 | CRUCIBLE AND DEPOSITION APPARATUS - A crucible ( | 11-07-2013 |
20130319331 | VAPOR DEPOSITION PARTICLE PROJECTION DEVICE AND VAPOR DEPOSITION DEVICE - A vapor deposition particle injection device ( | 12-05-2013 |
20130340680 | VAPOR DEPOSITION PARTICLE PROJECTION DEVICE AND VAPOR DEPOSITION DEVICE - The vapor deposition particle injecting device ( | 12-26-2013 |
20140033980 | DEPOSITION APPARATUS - A deposition apparatus includes a deposition source unit that has a crucible heating a deposition material filled therein to vaporize the deposition material and a plurality of nozzles spraying the vaporized deposition material, a substrate disposed to face the nozzles, a blind plate disposed between the deposition source unit and the substrate and including a plurality of first openings to guide a traveling direction of the deposition material sprayed from the nozzles, a mask disposed between the substrate and the blind plate and including a plurality of second openings to provide a path through which the deposition material passing through the first openings of the blind plate is deposited on the substrate, and a heater unit that heats the blind plate at a predetermined temperature to vaporize the deposition material stacked up on the blind plate. | 02-06-2014 |
20140041586 | Masking Device for Vapor Deposition of Organic Material of Organic Electroluminescent Diode - The present invention provides a masking device for vapor deposition of organic material of an organic electroluminescent diode, including a mask frame and a plurality of divide shallow masks mounted on the mask frame. Gaps are formed between the divide shallow masks. The gap formed between two adjacent ones of the divide shallow masks is identical. The mask frame is rectangular in shape and has a central portion forming a receiving opening. The number of the divide shallow masks is determined according to width of the receiving opening of the mask frame and widths of the divide shallow masks. The overall width of all the divide shallow masks plus the widths of the gaps therebetween is greater than or equal to the width of the receiving opening. This arrangement helps realizing size enlargement of mask for vapor deposition of the diode and also facilitates vapor deposition of the organic material. | 02-13-2014 |
20140041587 | Masking Device for Vapor Deposition of Organic Material of Organic Electroluminescent Diode - The present invention provides a masking device for vapor deposition of organic material of an organic electroluminescent diode, which includes a mask frame, cover plates arranged at opposite end edges of the mask frame to face toward a vapor deposition side, and a mask positioned on the cover plates. The mask frame is rectangular in shape and has a central portion forming a rectangular receiving opening, whereby size of the receiving opening is variable through adjustment made on positions of the cover plates. The mask forms a plurality of openings that is uniformly distributed thereon. The masking device includes a mask that shows a uniform distribution of mass so as to avoid inconsistent timing of attraction of various zones of the mask during magnetic attraction of the mask and thus positional shift of pixel caused thereby. | 02-13-2014 |
20140053778 | ION IMPLANTATION APPARATUS - A hybrid ion implantation apparatus that is equipped with shaping masks that shape the two edges of a ribbon-like ion beam IB in the short-side direction, a profiler that measures the current distribution in the long-side direction of the ion beam IB shaped by the shaping masks, and an electron beam supply unit that supplies an electron beam EB across the entire region in the long-side direction of the ion beam IB prior to its shaping by the shaping masks, wherein the electron beam supply unit varies the supply dose of the electron beam EB at each location in the long-side direction of the ion beam IB according to results of measurements by the profiler. | 02-27-2014 |
20140116337 | APPARATUS OF DEPOSITING ORGANIC MATERIAL - In an aspect, an organic material deposition apparatus including a process chamber, a first transfer rail, a second transfer rail, at least one mask assembly, at least one substrate assembly, and at least one deposition source unit is provided. The first and second transfer rails may be located in the process chamber, and the second transfer rail may be located on and spaced apart from the first transfer rail. | 05-01-2014 |
20140174355 | PLASMA CVD APPARATUS AND VACUUM TREATMENT APPARATUS - In one embodiment of the invention, a protective film formation chamber for forming a carbon protective film on a magnetic film includes: a gas introduction part which introduces a source gas to a vacuum vessel; a discharge electrode having a discharge surface at a position facing a substrate conveyed to a predetermined position in the vacuum vessel; a plasma formation part which applies voltage between the discharge surface and the substrate conveyed to the predetermined position; a permanent magnet being provided on a back side of the discharge surface and having a first magnet and a second magnet provided such that their magnetic poles facing the discharge surface are opposite to each other; and a no-erosion-portion mask being provided in parallel to the discharge surface and covering an area of the discharge surface surrounding a portion facing the permanent magnet. | 06-26-2014 |
20140261177 | APPARATUS FOR GAS INJECTION IN A PHYSICAL VAPOR DEPOSITION CHAMBER - Apparatus for physical vapor deposition are provided herein. In some embodiments, a shield for use in a physical vapor deposition chamber, comprises an annular one-piece body having an inner volume, a top opening and a bottom opening, wherein a bottom of the annular one-piece body includes an inner upwardly extending u-shaped portion, an annular groove formed in an inner wall of the one-piece body, and a plurality of gas distribution vents disposed along the annular feature and formed through the one-piece body, wherein the plurality of gas distribution vents are spaced apart from each other to distribute gases into the inner volume in a desired pattern. | 09-18-2014 |
20140331932 | Method and Apparatus for Organic Vapor Printing - In one embodiment, the disclosure relates to providing a first gas stream carrying vaporized material and depositing the vaporized material onto a substrate by directing a plurality of gas streams containing the vaporized material to a substrate, forming an gas curtain around the material to condense on the target print area. In another embodiment, heat is used to regulate the flow of the material and the thickness of the deposited layer. | 11-13-2014 |
20140352616 | CRUCIBLE APPARATUS AND DEPOSITION APPARATUS WITH THE SAME - A crucible apparatus comprises: a crucible having an opening, the crucible being configured to store an organic material; a heating device surrounding the exterior of the crucible, the heating device being configured to provide heat to the crucible; at least one thermal ball configured to deliver the heat provided by the heating device to the organic material within the crucible so as to sublimate the organic material; and at least one spray nozzle disposed at the opening of the crucible and configured to spray the sublimated organic material. | 12-04-2014 |
20150047563 | PATTERNED PROCESSING KITS FOR MATERIAL PROCESSING - Systems and methods are provided for material processing. An example apparatus includes a process-kit component containing a first groove and a second groove. The first groove and the second groove are disposed to form a pattern on a surface of the process-kit component. The process-kit component is configured to be placed into a chamber to reduce material deposition on one or more parts of the chamber during material processing. | 02-19-2015 |
20150144061 | Combinatorial Plasma Enhanced Deposition Techniques - Combinatorial plasma enhanced deposition techniques are described, including designating multiple regions of a substrate, providing a precursor to at least a first region of the multiple regions, and providing a plasma to the first region to deposit a first material on the first region formed using the first precursor, wherein the first material is different from a second material formed on a second region of the substrate. | 05-28-2015 |
20150368784 | THIN FILM DEPOSITION APPARATUS - A thin film deposition apparatus used to produce large substrates on a mass scale and improve manufacturing yield. The thin film deposition apparatus includes a deposition source; a first nozzle disposed at a side of the deposition source and including a plurality of first slits arranged in a first direction; a second nozzle disposed opposite to the first nozzle and including a plurality of second slits arranged in the first direction; and a barrier wall assembly including a plurality of barrier walls arranged in the first direction so as to partition a space between the first nozzle and the second nozzle. | 12-24-2015 |
20160115580 | DEPOSITION MASK AND METHOD FOR PRODUCING DEPOSITION MASK - A deposition mask is provided. The deposition mask including: a resin film | 04-28-2016 |
20160122861 | RESTRICTING PLATE UNIT, VAPOR DEPOSITION UNIT, AND VAPOR DEPOSITION DEVICE - A vapor deposition unit ( | 05-05-2016 |
20160163983 | MULTIPLE-SURFACE IMPOSITION VAPOR DEPOSITION MASK - A method for producing a multiple-surface imposition vapor deposition mask enhances definition and reduces weight even when a size is increased. Each of multiple masks in an open space in a frame is configured by a metal mask having a slit, and a resin mask that is positioned on a front surface of the metal mask and has openings corresponding to a pattern to be produced by vapor deposition arranged by lengthwise and crosswise in a plurality of rows. In formation of the plurality of masks, after each of the metal masks and a resin film material for producing the resin mask are attached to the frame, the resin film material is processed, and the openings corresponding to the pattern to be produced by vapor deposition are formed in a plurality of rows lengthwise and crosswise, whereby the multiple-surface imposition vapor deposition mask of the above described configuration is produced. | 06-09-2016 |
20160201185 | MASK DEVICE AND METHOD FOR ASSEMBLING THE SAME | 07-14-2016 |
20180023183 | MASK FRAME ASSEMBLY INCLUDING PATTERN POSITION ADJUSTING MECHANISM AND PATTERN POSITION ADJUSTING METHOD USING THE MASK FRAME ASSEMBLY | 01-25-2018 |
20220136093 | MASK, MASK FABRICATION METHOD, AND MASK ASSEMBLY - A mask, a mask assembly, and a method of fabricating a mask are disclosed herein. The mask comprises a polymer film in which at least one cell region and at least one peripheral region are defined, the at least one peripheral region surrounding the at least one cell region, a conductive layer disposed on the polymer film and including a metal, an inorganic layer disposed between the polymer film and the conductive layer and including a silicon-based inorganic material, and holes that penetrate the polymer film, the conductive layer, and the inorganic layer and overlap the at least one cell region in a plan view. | 05-05-2022 |
20220136094 | MASK STRUCTURE FOR DEPOSITION DEVICE, DEPOSITION DEVICE, AND OPERATION METHOD THEREOF - A mask structure for a deposition device includes first segments and second segments. The first segments are arranged in a direction surrounding a central axis and separated from one another. The second segments are disposed above the first segments. Each of the second segments overlaps two of the first segments adjacent to each other in a vertical direction parallel to an extending direction of the central axis. A deposition device includes a process chamber, a stage, and the mask structure. The stage is at least partially disposed in the process chamber and includes a holding structure of a substrate. The mask structure is disposed in the process chamber, located over the stage, and covers a peripheral region of the substrate to be held on the stage. An operation method of the deposition device includes horizontally adjusting positions of the first segments and the second segments respectively between different deposition processes. | 05-05-2022 |
118721000 | Substrate contacting mask | 23 |
20100000468 | METHOD AND DEVICE TO PREVENT COATING A DOVETAIL OF A TURBINE AIRFOIL - A method and masking assembly for masking a dovetail portion of a turbine blade during coating of an airfoil portion of the blade. The masking assembly comprises at least two masking members, each having an exterior surface and an oppositely-disposed undulatory surface complementary to one of oppositely-disposed undulatory surfaces of the dovetail portion. By mating the masking members, the undulatory surfaces thereof define an interior cavity within the masking assembly that accommodates the dovetail portion, and the undulatory surfaces of the masking members contact the undulatory surfaces of the dovetail portion to entrap the dovetail portion within the interior cavity of the masking assembly. | 01-07-2010 |
20100050941 | ROLL-TO-ROLL TYPE THIN FILM PATTERN FORMING APPARATUS - An apparatus for forming a thin film pattern according to an aspect of the invention may include: a vacuum chamber including a mask loading part and a film forming part having a window openable or closable with respect to the mask loading part; an unwinding roll and a winding roll disposed in the film forming part and running a sheet; a source containing unit accommodating a deposition source and mounted such that the deposition source is evaporated to deposit a thin film on the sheet located on the evaporation area; at least one mask having a pattern defining a pattern of the thin film to be deposited on the sheet, and arranged in the mask loading part; a mask moving unit moving the at least one mask arranged in the mask loading part toward a deposition position of the film forming part or moving the mask in a reverse direction; and a shutter unit selectively preventing a movement of the deposition source evaporated toward the mask from the source containing unit. | 03-04-2010 |
20100192856 | Mask assembly and deposition and apparatus for a flat panel display using the same - A mask assembly includes a mask frame, the mask frame having an opening and a frame surrounding the opening, a pattern mask on the mask frame, the pattern mask including a pattern portion having at least one pattern overlapping the opening and a welding portion attached to the frame, and at least one support bar crossing the opening and attached to the pattern mask. | 08-05-2010 |
20100282165 | PRODUCTION OF ADJUSTMENT STRUCTURES FOR A STRUCTURED LAYER DEPOSITION ON A MICROSYSTEM TECHNOLOGY WAFER - The invention relates to a method for selective material deposition for sensitive structures in micro systems technology for producing mechanical adjustment structures ( | 11-11-2010 |
20110067630 | Mask assembly, deposition apparatus for flat panel displays including the same, and associated methods - A mask assembly, a deposition apparatus for flat panel displays including the same, and associated methods, the mask assembly including an open mask having a plurality of first openings, and a pattern mask coupled to the open mask, the pattern mask having a plurality of second openings disposed within an area bounded by the first openings, wherein the open mask is formed of a material having a thermal expansion coefficient that is lower than a thermal expansion coefficient of the pattern mask. | 03-24-2011 |
20110094445 | APPARATUS FOR MANUFACTURING THIN-FILM SOLAR CELL - An apparatus for manufacturing a thin film solar cell of the present invention includes a film forming chamber in which a film is formed on a film formation face of a substrate using a CVD method; an electrode unit including a cathode unit having cathodes to which voltages are to be applied arranged on both sides thereof, and a pair of anodes each of which is arranged to face a different one of the cathodes, at a separation distance therefrom; a mask for covering a peripheral edge portion of the substrate; and a discharge duct installed around the cathode unit. A film formation space is formed between the cathode unit and the substrate installed on the side of the anode, an evacuation passage is formed between the mask and the cathode unit, the discharge duct and the film formation space are connected together via the evacuation passage, and a film forming gas introduced into the film formation space is evacuated from the discharge duct through the evacuation passage. | 04-28-2011 |
20110146575 | EVAPORATION SOURCE AND DEPOSITION APPARATUS HAVING THE SAME - An evaporation source is disclosed. In one embodiment, the evaporation source includes: i) a crucible being open on one side thereof and configured to store a deposition material and ii) a nozzle section located on the open side of the crucible and comprising a plurality of nozzles, wherein each of the nozzles has a sidewall configured to spray the deposition material therethrough, wherein the side wall has an inclined portion. The evaporation source also includes i) a heater configured to heat the crucible and ii) a housing configured to accommodate the crucible, the nozzle section, and the heater, wherein the nozzle section has a maximum spray angle less than about 60°. | 06-23-2011 |
20110308459 | CVD APPARATUS - A CVD apparatus is provided that can remarkably improve the quality and productivity of susceptors without causing increase in production cost or increase in size of the apparatus. The CVD apparatus is for forming a SiC film on a surface of a carbonaceous substrate ( | 12-22-2011 |
20120204794 | Mask Holding Device Capable of Changing Magnetic Means and Deposition Equipment Using the Same - A mask holding device has a replaceable magnetic means, and a deposition apparatus for an organic light emitting device includes the mask holding device. The mask holding device is provided with magnets, and the magnets can be replaced as required so as to change the magnetic force of the mask holding device. | 08-16-2012 |
20140020628 | SHADOW MASK MODULE AND ORGANIC VAPOR DEPOSITION APPARATUS AND THERMAL EVAPORATION APPARATUS USING THE SAME - The present invention provides a shadow mask module and an organic vapor deposition apparatus and a thermal evaporation apparatus using the same. The shadow mask module is disposed between a gas outlet and a substrate, and includes a pixel mask and a thermal resist mask. The pixel mask is disposed between the gas outlet and the substrate, and includes a plurality of first openings. The thermal resist mask is disposed between the gas outlet and the pixel mask, and includes a plurality of second openings. Each second opening is disposed corresponding to at least one of the first openings. | 01-23-2014 |
20140209025 | DEPOSITION MASK AND DEPOSITION APPARATUS HAVING THE SAME - A deposition apparatus includes a deposition chamber, a deposition source, and a deposition mask. The deposition source is disposed in the deposition chamber and provides a deposition material to a deposition substrate. The deposition mask includes a body portion and a carbon layer. The carbon layer is disposed on a first surface making contact with the deposition mask and includes at least one of carbon nanotube or graphene. | 07-31-2014 |
20140245956 | CVD APPARATUS, METHOD OF MANUFACTURING SUSCEPTOR USING THE CVD APPARATUS, AND SUSCEPTOR - A masking portion (recessed portion) | 09-04-2014 |
20140251216 | FLIP EDGE SHADOW FRAME - Device for processing a substrate are described herein. An apparatus for controlling deposition on a substrate can include a chamber comprising a shadow frame support, a substrate support comprising a substrate supporting surface, a shadow frame with a shadow frame body including a first support surface, a second support surface opposite the first surface, and a detachable lip connected with the shadow frame body. The detachable lip can include a support connection, a first lip surface facing the substrate, a second lip surface opposite the first lip surface, a first edge positioned over the first support surface, and a second edge opposite the first edge to contact the substrate. | 09-11-2014 |
20140338599 | EVAPORATOR AND THIN FILM DEPOSITION SYSTEM INCLUDING THE SAME - The present invention relates to an evaporator and a thin film deposition system including the same. The evaporator according to an exemplary embodiment of the present invention includes a container including an evaporation space, a heater configured to heat the container, an inflow part configured to spray a liquid raw material into the evaporation space, and a rotor disposed in the evaporation space, the rotor configured to evaporate the liquid raw material. | 11-20-2014 |
20150047564 | CHEMICAL VAPOR DEPOSITION DEVICE - A chemical vapor deposition device includes a support member configured to support a lower surface of a substrate; a shadow frame configured to cover an edge portion of an upper surface of the substrate; and a jacket having a purge gas supply opening configured to supply a purge gas such that the purge gas exits the purge gas supply opening from a location below the lower surface of the substrate. The jacket is adjacent to a portion of the shadow frame and configured to cover a portion of the lower surface of the substrate. An exhaust unit is located at the jacket or is between the jacket and the shadow frame. | 02-19-2015 |
20150083045 | MASK FIXING DEVICE AND DEPOSITION APPARATUS HAVING THE SAME - A mask fixing device is disclosed. In one aspect, the mask fixing device includes a plate and a magnetic assembly. The magnetic assembly faces a mask such that a substrate is interposed therebetween and generates a magnetic force to fix the mask to the substrate. The plate holds the magnetic assembly and faces the substrate. The magnetic assembly includes a plurality of first and second magnetic members respectively having first and second magnetic poles. The first magnetic members and the second magnetic members are alternately arranged. | 03-26-2015 |
20150101536 | MASK ASSEMBLY AND DEPOSITION APPARATUS USING THE SAME FOR FLAT PANEL DISPLAY - A mask assembly includes a mask frame including an opening and a frame enclosing the opening, a pattern mask including a pattern part in which at least one pattern is disposed thereon and a coupling part coupled to the frame, a supporter crossing the opening and coupled to the pattern mask, and a fixing pin coupling the pattern mask and the supporter to each other. At least one of the pattern mask and the supporter has a fixing part including a plurality of holes, and the fixing pin is disposed in the fixing part and at least one end of the fixing pin has a “T” shape to fix the pattern mask and the supporter to each other. | 04-16-2015 |
20150114293 | THIN-FILM DEPOSITING APPARATUS - A thin-film depositing apparatus including a mask, and a chucking unit for adhering the mask to a surface of a substrate, wherein the chucking unit includes a plurality of magnet units that contact another surface of the substrate by independently rising or falling by using their weight and thus are magnetically combined with the mask. | 04-30-2015 |
20160064769 | SYSTEM FOR FABRICATING AN ELECTRICAL STORAGE CELL - A system for fabricating an electrical storage cell including an imaging head for applying collimated ultraviolet radiation on a masked positioned on top of a photopolymer substrate, wherein the patterned mask comprises masked regions and unmasked regions; wherein areas of the photopolymer underneath of the unmasked regions are solidified or cross linked and areas of the photopolymer underneath the masked are not solidified or cross linked; a developer for developing the imaged substrate; water jets for cleaning solidified or cross linked material from the substrate to form perforated holes; a deposition device for forming a thin film over the substrate surface area so as to define an anode; a deposition device for forming solid electrolyte disposed over the anode; and a deposition device for forming a cathode by depositing a thin film over the perforated holes. | 03-03-2016 |
20180025926 | SUBSTRATE PROCESSING APPARATUS | 01-25-2018 |
20190144986 | MASK PLATE, MASK PLATE ASSEMBLY INCLUDING MASK PLATE AND METHOD FOR MANUFACTURING SAME | 05-16-2019 |
20190144988 | METHOD FOR MANUFACTURING DEPOSITION MASK AND DEPOSITION MASK | 05-16-2019 |
20190144989 | VAPOR DEPOSITION METAL MASK, VAPOR DEPOSITION METAL MASK PRODUCTION METHOD, AND DISPLAY DEVICE PRODUCTION METHOD | 05-16-2019 |