| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 118665000 | Condition of coated material | 11 |
| 20090031951 | PROGRAMMED HIGH SPEED DEPOSITION OF AMORPHOUS, NANOCRYSTALLINE, MICROCRYSTALLINE, OR POLYCRYSTALLINE MATERIALS HAVING LOW INTRINSIC DEFECT DENSITY - A method and apparatus for the unusually high rate deposition of thin film materials on a stationary or continuous substrate. The method includes the in situ generation of a neutral-enriched deposition medium that is conducive to the formation of thin film materials having a low intrinsic defect concentration at any speed. In one embodiment, the deposition medium is created by forming a plasma from an energy transferring gas; combining the plasma with a precursor gas to form a set of activated species that include ions, ion-radicals, and neutrals; and selectively excluding the species that promote the formation of defects to form the deposition medium. In another embodiment, the deposition medium is created by mixing an energy transferring gas and a precursor gas, forming a plasma from the mixture to form a set of activated species, and selectively excluding the species that promote the formation of defects. The apparatus has a control for the entire manufacturing process that includes a diagnostic element and a feedback control element to permit process programming to achieve and maintain the optimal distribution of one or more preferred species throughout the deposition process. | 02-05-2009 |
| 20090145357 | RAPID PROTOTYPING APPARATUS - Apparatus for producing an object by sequentially forming thin layers of a construction material one on top of the other responsive to data defining the object, the apparatus comprising: a plurality of printing heads each having a surface formed with a plurality of output orifices and controllable to dispense the construction material through each orifice independently of the other orifices; a shuttle to which the printing heads are mounted; a support surface; and a controller adapted to control the shuttle to move back and forth over the support surface and as the shuttle moves to control the printing heads to dispense the construction material through each of their respective orifices responsive to the data to form a first layer on the support surface and thereafter, sequentially the other layers; wherein each printing head is dismountable from the shuttle and replaceable independently of the other printing heads. | 06-11-2009 |
| 20100224127 | Dynamic Film Thickness Control System/Method and its Utilization - A dynamic film thickness control system/method and its utilization consisting of a minimum of one mask plate arranged between a substrate and a vapor source. A film thickness control device is utilized for real-time control over deposited film thickness and gradually moves the mask plate according to the film thickness control value acquired by the film thickness control device, enabling the mask plate to mask film zones on the said substrate to achieve the film thickness of a design objective. When the required zones of deposition are masked, the deposition of a particular film layer is completed. | 09-09-2010 |
| 20110017135 | TOMIC LAYER FILM FORMING APPARATUS - An atomic layer film forming apparatus includes a plurality of gas supply pipes ( | 01-27-2011 |
| 20110083605 | RESIN APPLICATION AND INFUSION SYSTEM - An application and infusion system for applying a resin to one or more fiber tows and for infusing the fiber tows with the resin, wherein each of the fiber tows is moving at a respective fiber speed. The application and infusion system includes a deposition and infusion system comprising one or more nozzles configured to deposit the resin on a respective one of the fiber tows. The system further includes a controller configured to control a flow rate of the resin through each of the nozzles relative to the fiber speed of the respective ones of the fiber tows. Other aspects of the application and infusion system are also provided. | 04-14-2011 |
| 20110094444 | PAINTING STATION COMPRISING A MEASURING CELL FOR MEASURING THE LAYER THICKNESS - A painting station, e.g., for serially painting components such as motor vehicles, is disclosed. A painting station may include at least one painting cell in which components are coated, e.g., with a paint, that has a certain layer thickness. At least one measuring cell is provided for measuring the layer thickness of the paint, e.g., with a radiation source, a radiation detector, and a conveying path along which the components to be coated are conveyed through the painting and measuring cells. The radiation source may emit light in the visible wavelength range. | 04-28-2011 |
| 20110203522 | METHOD AND SYSTEM FOR DYNAMIC IN-SITU PHOSPHOR MIXING AND JETTING - A system and method for depositing a phosphor composition onto a light emitting device improves manufacturing yield, simplifies conventional processes, and decreases costs. For example, a method of dispensing a phosphor composition onto a light emitting device includes dispensing a portion of the phosphor composition onto the light emitting device utilizing a plurality of colored phosphor dispensers each for dispensing a respective type of phosphor. Power is applied to the light emitting device to emit light, and a characteristic the light emitted by the light emitting device is detected. Phosphor mixing and phosphor dispensing are dynamically controlled. Therefore the color characteristics of phosphor dispensed on LEDs are consistent. The system and method may also reduce the difference between detected characteristic of the light and a desired characteristic of the light. | 08-25-2011 |
| 20110247552 | APPARATUS FOR COATING A FILM ON A SUBSTRATE - An apparatus for coating a film on a substrate are presented. According to principle of the invention, firstly, a control device controls a first coating device to spray a coating solution onto the substrate. Then, a sensor monitors viscosity data of the coating solution presented between the first coating device and the substrate during movement of the first coating device and sends the viscosity data to the control device, or the sensor monitors viscosity data of the coating solution coated on the substrate and sends the viscosity data to the control device. Lastly, the control device controls a second coating device to spray a coating solution onto the substrate after the first coating device according to signals about the viscosity data from the control device. | 10-13-2011 |
| 20120012056 | APPARATUS FOR PROCESSING COATING MATERIAL AND EVAPORATION DEPOSITION DEVICE HAVING SAME - An apparatus for processing coating material includes a crucible having a receptacle for receiving coating material, a drive member having a drive shaft, a cover coupled to the drive shaft, and a monitor system including a light source and a camera module. The cover includes a flat surface, a slot defined in the flat surface, a first through hole and a second through hole respectively communicating with opposite ends of the slot. The drive shaft drives the cover to rotate between a closed position where the cover covers the receptacle, and the flat surface presses and flattens the coating material, and an open position where the cover is moved away from the receptacle. The light source is for emitting light through the first through hole to illuminate the coating material. The camera module is for capturing images of the illuminated coating material through the second through hole. | 01-19-2012 |
| 20140202383 | WAFER PROCESSING SYSTEM USING MULTI-ZONE CHUCK - A wafer processing system includes at least one metrology chamber, a process chamber, and a controller. The at least one metrology chamber is configured to measure a thickness of a first layer on a back side of a wafer. The process chamber is configured to perform a treatment on a front side of the wafer. The front side is opposite the back side. The process chamber includes therein a multi-zone chuck. The multi-zone chuck is configured to support the back side of the wafer. The multi-zone chuck has a plurality of zones with controllable clamping forces for securing the wafer to the multi-zone chuck. The controller is coupled to the metrology chamber and the multi-zone chuck. The controller is configured to control the clamping forces in the corresponding zones in accordance with measured values of the thickness of the first layer in the corresponding zones. | 07-24-2014 |
| 20150114289 | Coating equipment for composite membrane without diffusion pump and its thickness gauge for both thick and thin coatings - A coating equipment for composite membrane without diffusion pump and its thickness gauge for both thick and thin coatings comprises a coating equipment for composite membrane without diffusion pump and a thickness gauge for both thick and thin coatings. A vacuum pump system of the coating equipment for composite membrane without diffusion pump is a roots-type pump system. Compared to conventional diffusion pumps, roots-type pump have advantages of low energy consumption, stable performance, good vacuum-pumping effect, short starting time, etc. | 04-30-2015 |
