| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 106003000 | Polishes | 12 |
| 20090038504 | POLISHING SLURRY FOR IONIC MATERIALS - A polishing slurry is disclosed, which is to be used for polishing an ionic material, the polishing slurry including a dispersant which is to form a nonionic adsorbing layer on a surface of the ionic material. The dispersant may be selected by separately preparing first and second solutions containing first and second different dispersants, immersing test pieces each made of said ionic material into the first and second solutions, respectively, comparing a step between an etched portion and a non-etched portion of the test piece immersed in the first solution with a step between an etched portion and a non-etched portion of the test piece immersed in the second solution, and selecting the dispersant used in the solution in which the test piece having the smaller step is immersed. | 02-12-2009 |
| 20120132103 | FLUORINE-CONTAINING COMPOUND, FLUORINE-CONTAINING SURFACTANT AND COMPOSITIONS CONTAINING SAME - A fluorine-containing compound exhibiting excellent surface tension-reducing ability despite the absence of perfluoroalkyl group having a chain length of 8 or more which had been the cause of the PFOS and PFOA problems and use of a fluorine material with low environmental load is provided. Also provided are a fluorine-containing surfactant and a composition thereof, an aqueous resin emulsion and a floor polish composition containing such surfactant. The fluorine-containing compound is represented by the following formula (1): | 05-31-2012 |
| 106005000 | Carbohydrate or derivative containing | 2 |
| 20120152148 | NON-BUFFING WAX EMULSION COMPOSITION - Disclosed herein is a composition comprising a formula emulsion wherein the formula emulsion comprises a cationic or amphoteric surfactant, a wax emulsion, a thickener, and at least two silicone oils having different viscosities, wherein the composition is free of abrasives and organic solvents. The weighted average viscosity of the silicone oils is 2200 to 2400 centistokes (cSt). | 06-21-2012 |
| 20190144712 | FREEZE-THAW STABLE WATER-IN-OIL EMULSION CLEANER AND/OR POLISH COMPOSITIONS | 05-16-2019 |
| 106006000 | Natural resin or derivative containing | 4 |
| 20080210120 | HEAT RELEASABLE COMPOSITE COATINGS AND RELATED METHODS - Disclosed are heat releasable multi-component composite coatings. These coatings include an under coating and an over coating deposited over at least a portion of the under coating. The under coating is deposited from a coating composition that includes a film-forming resin and thermally expandable capsules having an average diameter of 5 to 25 μm. The over coating layer has a 60 degree gloss of no more than 60 gloss units. | 09-04-2008 |
| 20190144713 | ALIPHATIC UV CURED POLYURETHANE OPTICAL ENDPOINT DETECTION WINDOWS WITH HIGH UV TRANSPARENCY FOR CMP POLISHING PADS | 05-16-2019 |
| 106007000 | With fatty oil | 2 |
| 20090211486 | Use of solvents derived from renewable resources, paints and coating including them, method for preparing them - The invention relates to application of solvent(s) to a product including at least one binder, wherein the product is a paint or coating formulation and the solvent is a compound of renewable vegetable origin, notably agricultural origin. It also relates to a paint or coating including at least one binder and one solvent, wherein the solvent is of renewable vegetable origin. Formulations are given. | 08-27-2009 |
| 20090249975 | Molecular De-Airentrainer Compositions And Methods Of Use Of Same - The invention relates to molecular de-airentrainer compositions comprising at least one ethoxylated ether amine and at least one acetylenic alkoxylate. The molecular de-airentrainer compositions are useful in controlling the air content of a superplasticizing mixture. The molecular de-airentrainer of the invention are useful in a variety of applications, including the preparation of cementitious mixtures, coatings and pressure sensitive adhesives. | 10-08-2009 |
| 106010000 | Wax, bituminous material or tarry residue containing | 3 |
| 20090114117 | Leveling agent and water-based floor-polishing composition comprising the leveling agent - A leveling agent for water-based floor polishes which contains a nonionic surfactant, characterized in that the nonionic surfactant is at least one member selected from the group consisting of compounds represented by the general formula (1): R | 05-07-2009 |
| 20110132227 | NANO GEL WAX - An aqueous gel wax formulation includes a cationic wax microemulsion and an anionically charged polishing agent having a particle size less than about 200 nanometers and optimally a quaternary ammonium substituted silicone and an amino functional silicone. The components combine to form a gel wax formulation which can be applied without buffing. | 06-09-2011 |
| 20160060463 | Pastes Containing Solvent - The invention relates to paste preparations containing 0.5-30% w/w chemically unmodified rice bran wax, —0.5-30% w/w paraffin wax, selected from the group of macrocrystalline and microcrystalline paraffins and Fischer-Tropsch paraffins, —optionally up to a maximum of 10% w/w polyethylene wax, —optionally up to a maximum of 10% w/w native or chemically modified recent or fossil vegetable waxes and—organic solvents to make up to 100% w/w. | 03-03-2016 |
| 106011000 | Hydrocarbon containing | 1 |
| 20100101448 | Polishing Slurry for Copper Films - A slurry for use in a chemical mechanical planarization process for a wafer comprises a chemical portion and a mechanical portion. The chemical portion comprises a surfactant that forms a layer over a metallic layer of the wafer to decreasing dishing to less than an average of 843 Å reduce the static etch rate of the metallic layer. The mechanical portion comprises an abrasive agent to assist in the planarization of the metallic layer of the wafer. In another embodiment, a slurry for polishing a copper layer formed over a first layer is disclosed. The slurry comprises an abrasive agent; and a surfactant comprising at least one non-ionic surfactant to reduce the static etch rate of the copper layer. The shelf life of the slurry exceeds 90 days. | 04-29-2010 |
