| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 106100050 | Metal-depositing composition or substrate-sensitizing compositions for metal-depositing compositions | 45 |
| 20080236441 | AQUEOUS ELETRODEPOSITION OF MAGNETIC COBALT-SAMARIUM ALLOYS - Disclosed are methods and compositions for aqueous electrodeposition of rare earth-transitiona metal alloys (e.g., samarium-cobalt alloys). Also disclosed are nanostructured magnetic coatings comprising a magnetic alloy of a rare earth metal (e.g., samarium) and a transition metal (e.g., cobalt). This abstract is intended as a scanning tool for purposes of searching in the particular art and is not intended to be limiting of the present invention. | 10-02-2008 |
| 20100199882 | Electroless Pure Palladium Plating Solution - An electroless pure palladium plating solution capable of forming pure palladium plating films having less plating film variations is provided. The electroless pure palladium plating solution comprises an aqueous solution containing (a) 0.001 to 0.5 mol/liter of a water-soluble palladium compound, (b) 0.005 to 10 mol/liter of at least two members selected from the group consisting of aliphatic carboxylic acids and water-soluble salts thereof, (c) 0.005 to 10 mol/liter of phosphoric acid and/or a phosphate, and (d) 0.005 to 10 mol/liter of sulfuric acid and/or a sulfate. | 08-12-2010 |
| 20110120343 | Group 3a ink and methods of making and using same - A Group 3a ink, comprising, as initial components: a polyamine solvent; a Group 3a material/organic complex; and, a reducing agent; wherein the molar concentration of the reducing agent exceeds the molar concentration of the Group 3a material/organic complex; wherein the Group 3a ink is a stable dispersion and wherein the Group 3a ink is hydrazine and hydrazinium free. Also provided are methods of preparing the Group 3a ink and of using the Group 3a ink to deposit a Group 3a material on a substrate for use in a variety of semiconductor applications, such as metallization of silicon devices in VLSI technology, the growth of semiconducting III-V alloys, thin film transistors (TFTs), light emitting diodes (LEDs); and infrared detectors. | 05-26-2011 |
| 20110315046 | METHOD FOR FABRICATING COMPOSITE POWDERS - A method of fabricating a composite powder includes forming a plurality of loose particles having discrete regions of a first material and discrete regions of a second material that is different than the first material. At least one of the first material and the second material includes a chemical precursor to a third, different material. | 12-29-2011 |
| 20140026782 | SILVER INK COMPOSITION - The present invention relates to a silver ink composition comprising: silver complexes obtained by reacting one or more silver compounds selected from chemical formula 1 with one or more ammonium carbamate-based compounds or ammonium carbonate-based compounds selected from chemical formula 2 to chemical formula 4; and oxime-based compounds. | 01-30-2014 |
| 20140109793 | METHOD OF SUPPLYING Zn-Al ALLOY TO MOLTEN ZINC POT, METHOD OF ADJUSTING CONCENTRATION OF Al IN MOLTEN ZINC BATH, AND APPARATUS FOR SUPPLYING Zn-Al ALLOY TO MOLTEN ZINC POT - A method of supplying a Zn—Al alloy to a molten zinc pot which accommodates a molten zinc bath in a hot dip galvanizing line, includes: supplying the Zn—Al alloy from a supply portion provided at a lower portion of an insertion guide having a pipe shape, in which the supply portion is immersed between an inner wall of the molten zinc pot on a downstream side in a travelling direction of a steel sheet and a front support roll installed in the molten zinc bath at a depth within ±400 mm from a lower end of the front support roll, and an inside of the insertion guide is pressurized by inert gas to prevent the molten zinc bath from advancing to the inside of the insertion guide. | 04-24-2014 |
| 20140230688 | METHOD FOR PRODUCING ELECTRODE COVERED WITH SODIUM METAL - A current collector is covered with sodium metal through: (1) applying a sodium dispersion containing sodium metal and at least one substance selected from the group consisting of an imide salt and a binder, on a current collector in an inert gas environment (with an oxygen concentration of not more than 0.01% and a dew point of not more than −10° C.), followed by heating and drying; (2) pressure bonding a piece of solid sodium metal having a surface which exhibits a metallic luster onto a current collector in the aforementioned inert gas environment; (3) vapor-depositing sodium metal on a current collector in a reduced pressure environment; or (4) immersing a current collector having a surface fired at a temperature ranging from 150 to 300° C. in molten sodium metal after removing a coating film which is generated on a surface and formed from impurities, in the aforementioned inert gas environment. | 08-21-2014 |
| 20150033980 | METHODS AND MATERIALS FOR ANCHORING GAPFILL METALS - One aspect of the present invention includes a method of fabricating an electronic device. According to one embodiment, the method comprises providing a substrate having dielectric oxide surface areas adjacent to electrically conductive surface areas, chemically bonding an anchor compound with the dielectric oxide surface areas so as to form an anchor layer, initiating the growth of a metal using the electrically conductive surface areas and growing the metal so that the anchor layer also bonds with the metal. The anchor compound has at least one functional group capable of forming a chemical bond with the oxide surface and has at least one functional group capable of forming a chemical bond with the metal. Another aspect of the present invention is an electronic device. A third aspect of the present invention is a solution comprising the anchor compound. | 02-05-2015 |
| 106100180 | Metal-depositing composition contains elemental metal of Group IB (Cu, Ag, Au) | 6 |
| 20080257200 | COMPOSITIONS AND COATINGS INCLUDING QUASICRYSTALS - Composite coating compositions, composite metallic coatings derived from these compositions, and methods of forming the composite coating compositions and composite metallic coatings, wherein the compositions and coatings comprise particles of at least one quasicrystalline metal alloy and at least one elemental metal. The methods include electrocodepositing suspended quasicrystalline metal alloy particles and dissolved metal ions onto a substrate. Preferably, the substrate is disposed in an aqueous bath containing at least one dissolved metal ion species and at least one suspended quasicrystalline metal alloy powder species. The compositions and coatings enhance the wear, friction, hardness, corrosion, and non-stick characteristics of the substrate. | 10-23-2008 |
| 20080257201 | Fabrication of Electrically Active Films Based on Multiple Layers - A continuous film of desired electrical characteristics is obtained by successively printing and annealing two or more dispersions of prefabricated nanoparticles. | 10-23-2008 |
| 20100071587 | ORGANOMETALLIC PRECURSOR FOR METAL FILM OR PATTERN AND METAL FILM OR PATTERN USING THE PRECURSOR - Provided are an organometallic precursor, wherein a carboxyhydrazide compound is coordinated to a central metal, and a metal film or pattern using the precursor. By using the organometallic precursor, highly pure metal films or patterns can be obtained through a simple low-temperature process. | 03-25-2010 |
| 106100190 | Elemental metal is Ag | 3 |
| 20080308001 | METALLIC COLLOIDAL SOLUTION AND INKJET-USE METALLIC INK - A metallic colloidal solution (a) includes a water-based dispersion medium that is easy in handling with regard to safety and environment and metallic particles having a uniform particle diameter and being excellent in properties such as conductivity and (b) has properties suitable for various printing methods and ink-applying methods. In addition, an inkjet-use metallic ink incorporating the metallic colloidal solution has properties suitable for the inkjet printing method. The metallic particles are deposited by reducing metallic ions in water and have a primary-particle diameter of at most 200 nm. The dispersion medium is made of a mixed solvent of water and a water-soluble organic solvent. The metallic particles are dispersed in the dispersion medium under the presence of a dispersant having a molecular weight of 200 to 30,000. | 12-18-2008 |
| 20100116168 | Alkalescent Chemical Silver Plating Solution - An alkalescent chemical silver electroless plating solution, which comprises: 0.01˜20 g/L silver ion or silver complex ion, 0.1˜150 g/L amine complexing agent, 0.1˜150 g/L amino acids complexing agent, and 0.1˜150 g/L polyhydroxy acids complexing agent. The alkalescent chemical silver plating solution provided by the present invention is able to overcome problems existing in acidic chemical silver plating processes commonly used at present. These problems include gnawing and corrosion of copper wires, lateral corrosion and difficulty of plating silver in blind holes, presence of solder ball voids and low strength of soldering. The silver layer plated by said silver plating solution possesses characteristics of high corrosion resistance, low contact resistance, no electromigration, high welding strength, and avoidance of bubbles produced in the solder when the plating pieces are being welded. | 05-13-2010 |
| 20160145734 | PROTECTION FILM AND METHOD FOR DEPOSITING THE SAME - A protection film and a method for depositing the protection film are provided. The method is used to form a protection film having low resistivity on a substrate. In the method, at first, a mixing operation is performed to mix a plurality of metal gases. The metal gases consist of silver, magnesium, and aluminum, or consist of silver, copper, and aluminum, or consist of copper, Nickel, and aluminum. The metal gases have two or more atom sizes. Thereafter, a depositing operation is performed to deposit an amorphous metal film on the substrate by using the mixed metal gases. The atoms of the amorphous metal film are arranged in a short-range order. Then an annealing treatment is performed to anneal the amorphous metal film to form a meta-stable metal film having averagely distributed grains to be used as the protection film. | 05-26-2016 |
| 106100210 | Metal composition contains elemental noble metal of Group VIII (Ru, Rh, Pd, Os, Ir, Pt) | 2 |
| 20090133603 | ELECTROLESS PALLADIUM PLATING BATH AND ELECTROLESS PALLADIUM PLATING METHOD - Disclosed is an electroless palladium plating bath containing a palladium compound, at least one complexing agent selected from ammonia and amine compounds, at least one reducing agent selected from phosphinic acid and phosphinates, and at least one unsaturated carboxylic acid compound selected from unsaturated carboxylic acids, unsaturated carboxylic acid anhydrides, unsaturated carboxylates and unsaturated carboxylic acid derivatives. Such an electroless palladium plating bath has high bath stability, and decomposition of the bath hardly occurs. Consequently, the electroless palladium plating bath of the present invention has a longer bath life than conventional electroless palladium plating baths. In addition, this electroless palladium plating bath enables to obtain excellent solder bonding characteristics and wire bonding characteristics since it does not affect plating film characteristics even when it is used for a long time. | 05-28-2009 |
| 20100095865 | PRECURSOR COMPOSITIONS FOR ALD/CVD OF GROUP II RUTHENATE THIN FILMS - Precursor compositions useful for atomic layer deposition (ALD) and chemical vapor deposition (CVD) of strontium ruthenium oxide (SrRuO | 04-22-2010 |
| 106100220 | Metal-depositing composition contains mixtures of metal compounds other than solely as Group IA metal compounds, e.g., electroless | 19 |
| 20090064892 | Electroless nickel plating liquid - An object is to provide an electroless nickel plating liquid capable of forming an underbarrier metal for metal bumps or solder bumps by electroless nickel plating with a uniform film thickness on silicon wafers composed of multiple IC chips. | 03-12-2009 |
| 20090194001 | ORGANIC ACID CHROMIUM (III) SALT AQUEOUS SOLUTION AND PROCESS OF PRODUCING THE SAME - An aqueous solution containing an organic acid chromium (III) salt represented by general formula: Cr | 08-06-2009 |
| 20100107927 | ELECTROLESS DEPOSITION PROCESS ON A SILICON CONTACT - Embodiments as described herein provide methods for depositing a material on a substrate during electroless deposition processes, as well as compositions of the electroless deposition solutions. In one embodiment, the substrate contains a contact aperture having an exposed silicon contact surface. In another embodiment, the substrate contains a contact aperture having an exposed silicide contact surface. The apertures are filled with a metal contact material by exposing the substrate to an electroless deposition process. The metal contact material may contain a cobalt material, a nickel material, or alloys thereof. Prior to filling the apertures, the substrate may be exposed to a variety of pretreatment processes, such as preclean processes and activations processes. A preclean process may remove organic residues, native oxides, and other contaminants during a wet clean process or a plasma etch process. Embodiments of the process also provide the deposition of additional layers, such as a capping layer. | 05-06-2010 |
| 20110094410 | REGENERATION APPARATUS AND REGENERATION METHOD FOR ELECTROLESS PLATING - A regeneration apparatus for an electroless plating solution, which includes a sensor for measuring the formation rate of phosphorous acid formed in a plating tank in response to a plating treatment, a split device for taking out a plating solution in the plating tank to transfer the plating solution to a first processing tank, a sensor for measuring the concentration of the phosphorous acid contained in the plating solution taken out, an addition device for supplying calcium carbonate or calcium hydroxide, an amount of which is required for producing a calcium phosphite from the phosphorous acid contained in the plating solution, to the first processing tank, a separation device for separating and removing the calcium phosphite produced in the first processing tank from the plating solution, and a return pump for transferring the plating solution from which the calcium phosphite has been separated and removed to the plating tank. | 04-28-2011 |
| 20110192316 | ELECTROLESS PLATING SOLUTION FOR PROVIDING SOLAR CELL ELECTRODE - An electroless nickel plating solution for solar cell electrode, which comprises SiN | 08-11-2011 |
| 20120325109 | Formation of A Zinc Passivation Layer on Titanium or Titanium Alloys Used in - Embodiments of the current invention describe methods of processing a semiconductor substrate that include applying a zincating solution to the semiconductor substrate to form a zinc passivation layer on the titanium-containing layer, the zincating solution comprising a zinc salt, FeCl | 12-27-2012 |
| 20120325110 | MULTI-STAGE PRE-TREATMENT METHOD FOR METAL COMPONENTS HAVING ZINC AND IRON SURFACES - The invention relates to an acidic, aqueous, chromium-free composition (A) for the anti-corrosive treatment of steel and/or galvanized steel surfaces comprising metal ions (M) selected from ions at least of the elements nickel, cobalt, molybdenum, iron or tin and a multi-stage method applying the composition (A) for the anti-corrosive pre-treatment of metal components which have steel and/or galvanized steel surfaces. The invention further relates to metal surfaces of zinc or iron having a passive layer system comprising at least 30 mg/m | 12-27-2012 |
| 20140083322 | METHOD OF REMOVING IMPURITIES FROM PLATING LIQUID - Impurities are removed from tin plating liquids by adding additives containing aromatic organic sulfonic acids or salts thereof to the tin plating liquids containing nonionic surface active agents and thiourea or thiourea compounds and producing a precipitate by cooling. | 03-27-2014 |
| 20150027342 | CHEMICAL CONVERSION AGENT AND CHEMICAL CONVERSION COATING FILM - A chemical conversion agent which is capable of providing, for example, an aluminum-based metal material with excellent corrosion resistance and moisture resistance, while also providing the aluminum-based metal material with excellent adhesion with a laminate film, excellent hydrofluoric acid resistance, and excellent alkali resistance. The chemical conversion agent has (1) a mass concentration of zirconium of 5-5,000 ppm by mass; (2) a mass concentration of titanium is 5-5,000 ppm by mass; (3) a mass concentration of vanadium is 10-1,000 ppm by mass; (4) a mass concentration of a metal stabilizer is 5-5,000 ppm by mass; and (5) the pH is 2-6. | 01-29-2015 |
| 106100230 | At least one metal is a Group IB (Cu, Ag, Au) metal | 7 |
| 20080223253 | ELECTROLESS COPPER PLATING SOLUTION, METHOD OF PRODUCING THE SAME AND ELECTROLESS COPPER PLATING METHOD - Disclosed herein is an electroless copper plating solution, including a copper salt, a completing agent, a reductant and a pH adjuster, in which the plating solution includes a 2,2-dipyridyl acid solution and the hydrogen ion concentration (pH) thereof is about 11.5 to about 13.0, a method of producing the same, and an electroless copper plating method. According to the plating solution of the present invention, an electroless copper plating film having stable and improved adhesivity and low electrical resistance can be obtained. Further, display devices including a metal pattern formed with the electroless copper plating solution can improve the reliability and price competitiveness of products prepared therefrom. | 09-18-2008 |
| 20080302267 | COMPOSITIONS AND PROCESSES FOR DEPOSITION OF METAL IONS ONTO SURFACES OF CONDUCTIVE SUBSTRATES - The present invention provides compositions and processes for preparing metallic ions for deposition on and/or into conductive substrates, such as metals, to substantially eliminate friction from metal to metal contact. It is used in the aqueous embodiment to form new metal surfaces on all metal substrates. The processes form stable aqueous solutions of metal and metalloid ions that can be adsorbed or absorbed on and/or into conductive substrates. The aqueous solutions consist of ammonium alkali metal phosphate salts, and/or ammonium alkali metal sulfate salts mixed with a water soluble metal or metalloid salt from Group I through Group VIII of the periodic table of elements. The aqueous solutions allow for a nano deposition of the metal ions on and/or into the surfaces of conductive substrates. The surfaces created by the deposited metal ions will provide metal passivation and substantially eliminate friction in metal-to-metal contact without the use of hydrocarbon based lubricants. | 12-11-2008 |
| 20090095198 | ELECTROLESS DEPOSITION FROM NON-AQUEOUS SOLUTIONS - A non-aqueous electroless copper plating solution that includes an anhydrous copper salt component, an anhydrous cobalt salt component, a non-aqueous complexing agent, and a non-aqueous solvent is provided. | 04-16-2009 |
| 20100154673 | COMPOSITIONS AND PROCESSES FOR DEPOSITION OF METAL IONS ONTO SURFACES OF CONDUCTIVE SUBSTRATES - The present invention provides compositions and processes for preparing metallic ions for deposition on and/or into conductive substrates, such as metals, to substantially eliminate friction from metal to metal contact. It is used in the aqueous embodiment to form new metal surfaces on all metal substrates. The processes form stable aqueous solutions of metal and metalloid ions that can be adsorbed or absorbed on and/or into conductive substrates. The aqueous solutions consist of ammonium alkali metal phosphate salts, and/or ammonium alkali metal sulfate salts mixed with a water soluble metal or metalloid salt from Group I through Group VIII of the periodic table of elements. The aqueous solutions allow for a nano deposition of the metal ions on and/or into the surfaces of conductive substrates. The surfaces created by the deposited metal ions will provide metal passivation and substantially eliminate friction in metal-to-metal contact without the use of hydrocarbon based lubricants. | 06-24-2010 |
| 20120152147 | Electroless Deposition from Non-Aqueous Solutions - A non-aqueous electroless copper plating solution that includes an anhydrous copper salt component, an anhydrous cobalt salt component, a non-aqueous complexing agent, and a non-aqueous solvent is provided. | 06-21-2012 |
| 20150075405 | COPPER PLATING SOLUTION AND METHOD FOR PREPARING THE SAME - A copper plating solution and a method for preparing a copper plating solution are provided. The copper plating solution comprises: a copper salt, a complexing agent, a stabilizer, a reducing agent, a surfactant, a hydroxyl-terminated polyoxypropylene ether, and a sodium trisulfide-isothiourea-propane sulfonate. | 03-19-2015 |
| 20150345024 | METHOD FOR REGENERATING PLATING SOLUTION - The problem addressed by the present invention is to provide a method for facilitating the regenerating a waste plating solution as a plating solution. This method for regenerating an acidic waste plating solution containing, as ions, Fe and at least one plating metal element selected from the group consisting of Cu, Ni, Zn, Co, and Mn by removing Fe therefrom is characterized in having an addition step in which phytic acid is added to the waste plating solution to yield a phytic-acid-containing solution in which Fe ions are precipitated, and a removal step in which the precipitate is removed from the phytic-acid-containing solution to yield a regenerated plating solution. | 12-03-2015 |
| 106100240 | At least one metal is a noble metal of a Group VIII (Ru, Rh, Pd, Os, Ir, Pt) metal | 3 |
| 20090044720 | ELECTROLESS PALLADIUM PLATING SOLUTION - [Object] To provide, an electroless palladium plating solution capable of forming a pure palladium plating film directly on an electroless nickel plating film without (pre)treatment such as substituted palladium plating treatment or the like, which pure palladium plating film has good adhesion and small variations in plating film thickness. | 02-19-2009 |
| 20120118196 | ELECTROLESS PALLADIUM PLATING SOLUTION - Disclosed is an electroless palladium plating solution which can form a plating layer having excellent soldering properties onto electronic components and the like and excellent wire bonding properties. The electroless palladium plating solution comprises a palladium compound, an amine compound, an inorganic sulfur compound and a reducing agent, wherein a combination of hypophosphorous acid or a hypophosphorous acid compound and formic acid or a formic acid compound is used as the reducing agent, and wherein the palladium compound, the amine compound, the inorganic sulfur compound, the hypophosphorous acid compound, and formic acid or the formic acid compound are contained in amounts of 0.001 to 0.1 mole/l, 0.05 to 5 mole/l, 0.01 to 0.1 mole/l, 0.05 to 1.0 mole/l and 0.001 to 0.1 mole/l, respectively. The electroless palladium plating solution is characterized by having excellent soldering properties and excellent wire bonding properties. | 05-17-2012 |
| 20130340648 | Electroless Deposition of Platinum on Copper - Embodiments of the current invention describe a method of plating platinum selectively on a copper film using a self-initiated electroless process. In particular, platinum films are plated onto very thin copper films having a thickness of less than 300 angstroms. The electroless plating solution and the resulting structure are also described. This process has applications in the semiconductor processing of logic devices, memory devices, and photovoltaic devices. | 12-26-2013 |
| 106100250 | Metal-depositing composition contains polyvalent metal compound | 10 |
| 20110162556 | CHROMIUM (III)-CONTAINING AQUEOUS SOLUTION AND PROCESS FOR PRODUCING THE SAME - It is intended to provide a chromium (III)-containing aqueous solution which has widely adjustable molar ratios of various acid radicals to Cr and is useful as a source of trivalent chromium or a supplementary source of trivalent chromium for the bath in the surface treatment of various metals. Specifically, the chromium (III)-containing aqueous solution is characterized by containing a complex chromium (III) salt which is produced by performing chromic acid reduction reaction in the simultaneous or sequential presence of two or more acids selected from an inorganic acid other than chromic acid and an organic acid. Furthermore, it is intended to provide a process for producing a chromium (III)-containing aqueous solution by performing chromic acid reduction reaction by the contact of chromic acid with an acid other than chromic acid and/or an organic reducing agent in a water solvent, characterized in that the chromic acid reduction reaction is performed in the simultaneous or sequential presence of at least two or more acids selected as the acid other than chromic acid from an inorganic acid and an organic acid. | 07-07-2011 |
| 20110168051 | CHROMIUM (III) CARBONATE AND PROCESS FOR PRODUCING THE SAME - The chromium (III) carbonate of the present invention exhibits a light blue color in a solid state. This chromium (III) carbonate has an L* value of 50 to 70, an a* value of −4 to −2, and a b* value of −10 to −7, which are represented by the L*a*b* color system (JIS Z8729). This chromium (III) carbonate is preferably completely dissolved within 30 minutes when the chromium (III) carbonate is added, in an amount corresponding to a Cr content of 1 g, to 1 liter of an aqueous solution of hydrochloric acid having a pH of 0.2 at a temperature of 25° C. This chromium (III) carbonate is preferably obtained by contacting an aqueous solution of carbonate and an aqueous solution containing trivalent chromium at a pH of 6 to 12 under the condition of a reaction liquid temperature of 0° C. or more and less than 50° C. Also, preferably, after production of the chromium (III) carbonate, filtration is performed, and the chromium (III) carbonate is washed with water until the conductivity of the filtrate is 5 mS/cm or less. | 07-14-2011 |
| 20150013566 | METAL MATERIAL WITH A BISMUTH FILM ATTACHED AND METHOD FOR PRODUCING SAME, SURFACE TREATMENT LIQUID USED IN SAID METHOD, AND CATIONIC ELECTRODEPOSITION COATED METAL MATERIAL AND METHOD FOR PRODUCING SAME - A metal material is provided with a bismuth coating which enables the subsequent coating to be accomplished at a high throwing power, and has excellent corrosion resistance, coating adhesion and is able to be produced with reduced damage to the environment. The metal material has a surface and a bismuth-containing layer deposited on at least a part of the surface of the metal material, wherein the percentage of bismuth atoms in the number of atoms in the surface layer of the metal material with a bismuth coating is at least 10%. | 01-15-2015 |
| 106100260 | Group IB (Cu, Au) metal | 3 |
| 20090007814 | COMPOSITE ELECTROLESS PLATING - This invention is directed to a process for electrolessly metallizing an article, as well as to a plating bath and the subsequent plated substrate. The process comprises contacting the surface of an article with an electroless metallizing bath which may be essentially free of toxic and/or heavy metals. | 01-08-2009 |
| 20140290530 | METAL COMPOUND, METHOD FOR PREPARING THE SAME, SELECTIVE METALLIZATION OF SURFACE OF SUBSTRATE WITH THE METAL COMPOUND - The present disclosure provides a metal compound. The metal compound is represented by a formula (I): Cu | 10-02-2014 |
| 20160040296 | ELECTROLESS GOLD PLATING LIQUID - The present invention relates to an electroless gold plating liquid, which may form gold plating without corrosion of a base metal by performing substitution and reduction reactions in the same bath, and satisfy both weldability of lead-free soldering and wire bonding characteristics, and has excellent stability such that a gold deposition rate may be continuously maintained. | 02-11-2016 |
| 106100270 | Group VIII metal | 3 |
| 20120103229 | AQUEOUS SOLUTION CONTAINING DIVALENT IRON IONS - An object of the present invention is to provide an aqueous solution containing divalent iron ions having improved storage stability such that oxidation over time of divalent iron ions in the aqueous solution containing divalent iron ions to trivalent iron ions is suppressed and occurrence of the precipitation of iron (III) hydroxide is prevented for long periods. The present invention relates to an aqueous solution containing divalent iron ions having improved storage stability characterized in that it comprises divalent iron ions and a hydroxylamine salt as a reducing agent and has a pH of 3.0 or lower. The pH is preferably 2.2 or lower and more preferably 1.2 or lower. | 05-03-2012 |
| 20140150689 | ELECTROLESS NICKEL PLATING BATH COMPOSITION - The present invention relates to an aqueous plating bath composition for depositing a nickel phosphorous alloy having a phosphorous content in the range of 5 to 12 wt. %. The plating bath comprises a sulfur-containing organic stabilizing agent. | 06-05-2014 |
| 106100280 | Group VIII noble metal (Ru, Rh, Pd, Os, Ir, Pt) | 1 |
| 20120192758 | ELECTROLESS PLATING PRETREATMENT AGENT, ELECTROLESS PLATING METHOD USING SAME, AND ELECTROLESS PLATED OBJECT - It is an object of the present invention to provide an electroless plating pretreatment agent that can retain stably Pd(II) over a long period of time in an organic solvent, an electroless plating method using the same that is capable of forming an electroless plated film having excellent adhesion, and an electroless plated object. The object is achieved by an electroless plating pretreatment agent comprising an organic palladium compound and a coordination compound having a functional group with a metal-capturing capability dissolved in an organic solvent, the coordination compound being selected from the group consisting of the imidazole analogs, polyethyleneamines, ethyleneimines and polyethyleneimines. | 08-02-2012 |
| 106100290 | Group IIB (Zn, Cd, Hg) metal | 1 |
| 20150096461 | METHOD FOR REGENERATING SOLUTION FOR NITRIC ACID ACTIVATION TREATMENT OF ZINC-PLATED METAL MEMBER SURFACE, AND REGENERATION TREATMENT APPARATUS USING THE SAME - Provided is a method for regenerating a nitric acid active treatment solution comprising: adding a zinc ion-aggregating agent to a nitric acid active treatment solution for a surface of a zinc-based material plated metal member, the nitric acid active treatment solution containing zinc ions, to thereby aggregate the zinc ions in the solution as an insoluble salt; and separating and removing the insoluble salt. This regeneration method is employed instead of methods conventionally and widely conducted in zinc-based plating on a steel material such as the exchange of the entire amount of the nitric acid active treatment solution after a lapse of a certain time, and is a method for regenerating a nitric acid active treatment solution, comprising: depositing and removing zinc ions which come to be mixed in the nitric acid active treatment solution during a zinc-based plating process on a steel material, so that the quality of a trivalent chromium chemical conversion treatment can be controlled at a constant level through simplification and cost reduction of a plating control step, and the waste nitric acid can be reduced as much as possible. | 04-09-2015 |
