| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 073827000 | Bond test | 28 |
| 20080202254 | APPARATUS AND METHOD FOR EVALUATING PEEL ADHESION - An apparatus for evaluating the peel adhesion of a test specimen to a substrate. The apparatus includes a base plate having a surface for receiving the substrate; a substrate clamping plate for securing the substrate to the substrate receiving surface of the base plate; a test specimen clamping mechanism, the test specimen clamping mechanism having a first end for securing a first end of the test specimen thereto and a second end; and a pivotable linkage, the pivotable linkage having a first end for connecting to the second end of the test specimen clamping mechanism and a second end pivotably mounted to an adaptor, the adaptor in communication with a source of tensile force, wherein the source of tensile force is applied through or via the adaptor to draw the pivotable linkage and test specimen clamping mechanism away from the base plate and peel the test specimen away from the substrate. Also disclosed is a method for evaluating the peel adhesion of a test specimen to a substrate. | 08-28-2008 |
| 20080257059 | High Speed Pull Test Device and Method - A device and method for tensile testing of the bond strength of an electrically conductive ball adhered to a substrate. A ball is gripped and moved at a speed in a direction substantially orthogonal to the plane of adherence. The substrate is abruptly halted by an abutment to impose a sudden load on the ball/substrate interface. Breaking force is measured by conventional means. During the test the substrate is lightly urged toward the ball to eliminate unwanted tensile forces. | 10-23-2008 |
| 20080276718 | METHOD AND DEVICE FOR DETECTING A MATERIAL - A method and device is provided for detecting a predetermined material. The device includes a first inner layer having first and second surfaces and a volume responsive to a first predetermined stimuli. A second inner layer has first and second surfaces. An adhesive bonds at least a portion of the first surface of the first inner layer to the first surface of the second inner layer with a bonding force. A change in the volume of the first layer generates an elastic force on the adhesive material. As a result, the first inner layer delaminates from the second inner layer in response to the elastic force overcoming the bonding force. | 11-13-2008 |
| 20080302190 | Method and Device for Testing the Strength of a Connection Using Centrifugal Force - The invention relates to a method for examining the resistance of a connection between two bodies, whereby one of the bodies only has a small mass. A correspondingly directed force is exerted upon the connection until disconnection thereof. The force used is the centrifugal force which acts at a distance from a rotational axis in a concentric manner about said rotated connection. Said method is particularly advantageous if the body having a small mass is a coating which is applied to the other body. In order to obtain a sufficiently high centrifugal force, an examining stamp is applied to the body having the small mass and/or the coating on the side oriented away from the connection. The adhesion between the body and/or the coating and the examining stamp is greater than between both of the bodies and/or the coating and the other body. | 12-11-2008 |
| 20090056469 | APPARATUS AND METHOD FOR DETERMINING FAILURE MODE IN A SHEAR OR PULL TEST DEVICE - A method and apparatus for determining a mode of failure of a bond between an electrically conductive ball deposit and a substrate when breaking the ball deposit off of the substrate. The method and apparatus utilize tool force and displacement values to plot a force/displacement curve. The force/displacement curve is used to calculate the energy necessary to break the ball deposit off of the substrate. The energy value of a portion of a force/displacement curve is selected by reference to a peak force. In one preferred embodiment, this energy value is compared with a predetermined reference energy value to indicate a mode of failure. The peak force is preferably the maximum peak force, hi the preferred embodiment, the method and apparatus distinguish between a ductile failure mode and a brittle failure mode. | 03-05-2009 |
| 20100050780 | Tuft gripping strength test method and apparatus for carpet primary backing mats - A test method for measuring yarn and tuft or loop gripping strength characteristics and capability of tufted nonwoven primary backing mats for making tufted carpets, the tufted primary backing mat having no additional binder or adhesive on the backside of the mat prior to making tufted carpet is disclosed. The test apparatus and test method can be used for quality control purposes and for evaluation of experimental or new candidates for primary backing mats for making interim tufted products for carpets that are more resistant to tuft or loop defects. Revealed is a new and critical Quality Knee characteristic of primary backing mats that is crucial for minimizing tuft or loop defects during the tufting process and also the force magnitude on the yarn necessary to pop the tuft completely out of the primary backing mat sample. | 03-04-2010 |
| 20100218615 | APPARATUS AND METHOD FOR DETERMINING FAILURE MODE IN A SHEAR OR PULL TEST DEVICE - A method and apparatus for determining a mode of failure of a bond between an electrically conductive ball deposit and a substrate when breaking the ball deposit off of the substrate. The method and apparatus utilize tool force and displacement values to plot a force/displacement curve. The force/displacement curve is used to calculate the energy necessary to break the ball deposit off of the substrate. The energy value of a portion of a force/displacement curve is selected by reference to a peak force. In one preferred embodiment, this energy value is compared with a predetermined reference energy value to indicate a mode of failure. The peak force is preferably the maximum peak force, in the preferred embodiment, the method and apparatus distinguish between a ductile failure mode and a brittle failure mode. | 09-02-2010 |
| 20100307259 | APPARATUS AND METHOD FOR DETERMINING THE TENSILE BOND STRENGTH OF A DENTAL MATERIAL - An apparatus and method for determining the tensile strength of dental materials utilizing a mould. The dental material is placed in the mould and is adhered to a surface. The mould containing the dental material is then engaged with a pulling device which subjects the mould to a measured force to disengage the dental material from the surface. This provides a measure of the tensile strength of the dental material. | 12-09-2010 |
| 20110067499 | Method and Template for Producing a Tensile Test Coupon - A method and template enable the testing of fusion joints of plastic pipes to be conducted by a single operator in the field at the welding site by the efficient and precise extraction from the joints to be tested of a number of high quality tensile coupons. The coupons are tested to failure in a field-suitable, well controlled, self contained, tensile testing apparatus. A narrowing bow-tie-like pattern of the coupon ensures that the failure of the coupon in the tensile test will occur at the narrowest section of the coupon. The template can be visually aligned with the joint to ensure that it is the joint that will be tested. | 03-24-2011 |
| 20110067500 | Method and template for producing a tensile test coupon - A method and template enable the testing of fusion joints of plastic pipes to be conducted by a single operator in the field at the welding site by the efficient and precise extraction from the joints to be tested of a number of high quality tensile coupons. The coupons are tested to failure in a field-suitable, well controlled, self contained, tensile testing apparatus. A narrowing bow-tie-like pattern of the coupon ensures that the failure of the coupon in the tensile test will occur at the narrowest section of the coupon. The template can be visually aligned with the joint to ensure that it is the joint that will be tested. | 03-24-2011 |
| 20110079088 | HIGH SPEED PULL TEST DEVICE AND METHOD - A device and method for tensile testing of the bond strength of an electrically conductive ball adhered to a substrate. A ball is gripped and moved at a speed in a direction substantially orthogonal to the plane of adherence. The substrate is abruptly halted by an abutment to impose a sudden load on the ball/substrate interface. During the test the substrate is lightly urged toward the ball to eliminate unwanted tensile forces | 04-07-2011 |
| 20110277555 | SYSTEM AND METHOD FOR TESTING OF BONDS OF A SEMICONDUCTOR ASSEMBLY - An apparatus applies a pull test to a bond of a semi-conductor assembly, the bond including a ball or a bump of solder. The apparatus includes a probe having a longitudinal axis; a heater for heating a tip of the probe; a holder for supporting the probe; an actuation device for moving the holder and the probe up and down; and a pull force applier for applying a pull force on the holder along the longitudinal axis of the probe. A force measuring system measures a force applied to the probe during the pull test to determine the strength of the bond. | 11-17-2011 |
| 20110277556 | SYSTEM AND METHOD FOR TESTING OF BONDS OF A SEMICONDUCTOR ASSEMBLY - An apparatus applies a pull test to a bond of a semi-conductor assembly, the bond including a ball or a bump of solder. The apparatus includes a probe including a straight, thermally conductive pin; a heater for heating a tip of the probe; a holder for supporting the probe and including a clamping mechanism that is configured to provide a clamping force on the probe; an actuation device for moving the holder and the probe up and down; and a pull force applier for applying a pull force on the holder. A force measuring system measures a force applied to the probe during the pull test to determine the strength of the bond. | 11-17-2011 |
| 20120247221 | TENSION TESTING DEVICE - A tension testing device for use in a tension test for evaluating the strength of bond between a body and a pin of an electronic device includes a base, a tensiometer, a hanger, and a clamp. The base includes a supporting member and a carrying member, wherein the tensiometer is carried by the carrying member and includes a pulling portion. The hanger is coupled to the pulling portion for underpinning the body and project the pin in the direction of the base. The clamp is disposed on the base, positioned beside the hanger, for clamping the pin. The tension testing device protects the electronic device against test-induced deformation, dispenses with an intricate step of the welding and unwelding of the pin and a test lead, precludes a tension test-induced component of force, manifests ease of use, ensures test stability, and enhances test efficiency and reliability. | 10-04-2012 |
| 20130000415 | FRACTURE ANALYSIS METHOD, DEVICE, AND PROGRAM FOR SPOT WELDED PORTION, AND COMPUTER-READABLE RECORDING MEDIUM - Maximum allowable load values of a welded portion in respective fracture modes of a load fracture, a moment fracture, and a nugget interior fracture are found based on at least one of a sheet thickness t, a tensile strength TS, an elongation El, and a chemical composition of a nugget portion in each of spot-welded steel sheets, a nugget diameter d of a welded portion, an effective width B of the welded portion determined by a distance between adjacent welded portions, edges or ridge lines, and a sectional height H. Then, according to these fracture modes, an allowable load value at every moment after the maximum allowable load value of the welded portion is reached is found, and a displacement or a time at which the allowable load value becomes 0, that is, at which a complete fracture occurs is found, thereby finding a fracture limit. | 01-03-2013 |
| 20130247683 | Device for measuring the surface energy of materials - The present invention is a device for measuring the surface energy of a material. The device includes a pulling mechanism and a clamp. A film, including an adhesive side, is attached to a surface to be measured. The film is clamped to surface energy measuring device. The device is placed flush on the surface. A pulling mechanism is pulled until a triangular piece of film tears and is removed from the surface. The device is then lifted off of the surface and a measurement is made at the pre-calibrated marking nearest the tip of the triangle torn into film. | 09-26-2013 |
| 20130319129 | MOLD COMPOUND COMPATIBILITY TEST SYSTEM AND METHODS THEREOF - A technique for testing the compatibility of an encapsulation material and a wire bond included at an unencapsulated assembly. The technique includes immersing the assembly in an encapsulating compound extract. The assembly includes a semiconductor die and a bonding wire affixed to a metalized pad of the semiconductor die by the wire bond. After the immersing, a mechanical strength of the wire bond is determined. | 12-05-2013 |
| 20140116151 | OPTICAL FIBERS - An optical fiber, which is less likely to increase its transmission loss even when it is exposed to a high-humidity environment or immersed in water, is provided. The optical fiber comprises a glass fiber and at least two coating layers (a soft layer and a hard layer) coated at the circumference of the glass fiber, wherein the limit-adhesion strength between the glass fiber and the coating layer under a hot and humid environment is 0.5N/10 nm or more. Preferably, the glass-transition temperature of the hard layer is less than 90° C. | 05-01-2014 |
| 20140157908 | TAPE TEST REMOVAL DEVICE - A tape test removal device has an elongated housing having a first end and a second end; a shuttle which slides along a longitudinal axis of the housing and is disposed within the housing; a biasing member adjacent the first end of the housing and positioned adjacent the shuttle member; the biasing member is secured in a first, compressed conformation; and a clip extending from the shuttle to hold a portion of a tape to be tested. | 06-12-2014 |
| 20140190269 | BOND STRENGTH TESTER WITH SWITCHABLE BACKLASH CONTROL - A testing apparatus for testing the strength of a material connection to a substrate. A drive mechanism couples a test tool mount to a main body and allows for relative movement between the test tool mount and the main body in an axial direction. A biasing element is coupled between the main body and the test tool mount, that, in operation, biases the test tool mount relative to the main body in an axial direction. The biasing element is switchable between a first state in which the test tool mount is biased either toward or away from the substrate and another state in which the biasing element provides one of: no biasing force to the test tool mount toward or away from the substrate, or a biasing force in a direction opposite to the direction of bias applied in the first state. | 07-10-2014 |
| 20140326074 | METHODS AND SYSTEMS FOR RAPIDLY TESTING ADHESION - Adhesion testing systems, methods of fabrication, and methods of testing are disclosed. Test systems include test coupons with non-metallic test adherends. Test coupons are configured to test bonds to the non-metallic test adherends under peeling stress and/or shearing stress. Test methods are simplified and rapid as compared to standard adhesion tests and include methods of accelerated environmental testing. Test methods also are adapted for qualitative and quantitative measurement of bond performance. | 11-06-2014 |
| 20150143916 | PROTECTION OF LASER BOND INSPECTION OPTICAL COMPONENTS - Methods, systems, and apparatuses are disclosed for the protection of optical components used during laser bond inspection. In one embodiment, an optic surface wetting enhancement is provided on a protective optic to assist in forming a substantially flat film of transparent liquid from transparent liquid applied to a surface of a protective optic. A flat film of transparent liquid on a surface of a protective optic may be used to retain debris and effluent backscatter produced during a laser bond inspection process. | 05-28-2015 |
| 20150330884 | PEELING APPARATUS AND METHOD FOR SEPARATING WELDED LAYERS - An apparatus and method for separating welded multi-layered samples has a slotted engine-driven spindle that twists and pulls a layer from the sample, breaking the welds as the layer winds around the spindle. The sample is held between two clamps and a tensioning cylinder pulls a movable first clamp against the second stationery clamp. Sensors may sense the force required to break the welds and the data may be stored and analyzed in a computer. | 11-19-2015 |
| 20150355062 | METHOD FOR CONTROLLING TENSILE STRESS DURING EVALUATION OF A BOND BETWEEN STRUCTURES - A system and methods are provided for evaluating a bond between structures. The system includes an assembly of at least two bonded structures. The assembly has a front surface, a back surface, a thickness, and a bond disposed between the front surface and the back surface. At least one delay component is attached to the front surface of the assembly having a body having a front face, a back face, and a thickness. The system further includes a laser source capable of depositing laser energy onto a front face of the delay component, where a first portion of the laser energy is absorbed by the front face of the delay component to generate a first compression wave that propagates through the body of the delay component. A second portion of the laser energy is absorbed by the back face of the component to generate a second compression wave that reflects off of the back surface of the assembly to produce a tensile wave that stresses the bond. | 12-10-2015 |
| 20160003722 | SYSTEMS AND METHODS FOR DETERMINING ADHESIVE STRENGTH - Embodiments of the invention include systems and methods for determining adhesive strength of a sample label. For example, the present invention relates to a novel approach for examining the resistance to peel force required to remove a pressure sensitive adhesive (PSA) label from its intended substrate. This approach is encompassed by systems and methods which rely on the creation of one or any combination of at least four test strip types traced and cut from a label adhered to its intended substrate. The test strips may be oriented in at least three ways: along the machine direction of the label's face stock, along the cross direction of the label's face stock, and along an angle diagonal to the intersection of the machine and cross directions of the label's face stock, where the angle does not equal 0°, 90°, 180°, 270°, or 360°. The test strips may be peeled in reference to the position along the label and to and from which they extend. | 01-07-2016 |
| 20160033388 | METHOD FOR TESTING THE FRACTURE TOUGHNESS OF AN ADHESIVE JOINT TO BE FORMED - A method for testing the fracture toughness of an adhesive joint to be formed between two components made of fiber-reinforced plastic, by forming a test joint between two sample elements and applying a tensile load onto this test joint until a pre-defined value is reached. One of these sample elements is formed by one of the components of the joint to be formed, and the tensile load acts on the other sample element. | 02-04-2016 |
| 20160153880 | METHOD AND SYSTEM FOR PULL TESTING OF WIRE BONDS | 06-02-2016 |
| 20170234784 | COATING BOND TEST METHOD AND METHOD OF MAKING A SPECIMEN FOR TESTING BOND STRENGTH OF A COATING | 08-17-2017 |
